Semiconductor plastic packaging press
CN309106951SActive Publication Date: 2025-02-11TONGLING UNIV
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Patent Information
- Application Number
- CN202430209448.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-15
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2039-04-15
Smart Images
Figure 000007_ABST
Abstract
1. The name of the product of this design: semiconductor plastic packaging press. 2. Purpose of this design product: This design product is used to package integrated circuit chips. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: Stereoscopic diagram 1.
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