Integrated circuit package (DFN1006-2L)
CN309239907SActive Publication Date: 2025-04-15ZHONGKE HUAYI (TIANJIN) TECH CO LTD
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Patent Information
- Application Number
- CN202430588799.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-14
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2039-09-14
Smart Images
Figure 000003_ABST
Abstract
1. Name of the product of this design: Integrated circuit package (DFN1006‑2L). 2. Purpose of this design product: used for chip packaging. 3. The design key point of this appearance design product lies in the combination of shape and pattern. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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