Conductive adhesive test mold
CN309244205SActive Publication Date: 2025-04-18梁希港
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Patent Information
- Application Number
- CN202430430360.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-10
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2039-07-10
Smart Images
Figure 000017_ABST
Abstract
1. The name of this design product: conductive adhesive test mold. 2. Purpose of this design product: This design product is used for silicone molds. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design key points: 3D image of component 3.
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