Fully automatic semiconductor die bonder
CN309468858SActive Publication Date: 2025-08-29XIN DE MING KE JI (SHEN ZHEN) YOU XIAN GONG SI
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Patent Information
- Application Number
- CN202530009866.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-08
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2040-01-08
Smart Images
Figure 000007_ABST
Abstract
1. The name of the product under this design: Fully automatic semiconductor die bonder. 2. Purpose of this design product: Used in semiconductor packaging processes to fix semiconductor chips to a substrate or carrier. 3. The design highlights of this design product are shape and pattern. 4. The picture or photo that best illustrates the design points: Stereoscopic drawing 1.
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