Pressure bonding tool head for electronic components

Abstract

1. The name of this design product: Electronic component pressure bonding tool head. 2. Purpose of the product with this design: Precision pressure bonding tool heads used in the manufacture of electrical interconnection components of electronic equipment in semiconductor packaging dust-free workshops, lithium battery / PCM module production lines, and microelectronic device assembly lines. In particular, the geometric pressing end at the bottom of the tool head can be used to accurately position and apply pressure to micro-scale connection points, maintain uniform pressure distribution to ensure deformation-free bonding of the foil, and efficiently transfer temperature to the pressing interface under heating scenarios. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the key points of the design: Design 1E status diagram. 5. Designate Design 1 as the base design. 6. Other situations that need explanation Other explanations: The state diagram of part A of Design 1 is a partial state diagram of the main view of Design 1; the state diagram of part B of Design 1 is a partial state diagram of the rear view of Design 1; the state diagram of part C of Design 1 is a partial state diagram of the left view of Design 1; the state diagram of part D of Design 1 is a partial state diagram of the right view of Design 1; the state diagram of part E of Design 1 is a partial state diagram of the stereoscopic view of Design 1; the state diagram of part A of Design 2 is a partial state diagram of the main view of Design 2; the state diagram of part B of Design 2 is a partial state diagram of the rear view of Design 2; the state diagram of part C of Design 2 is a partial state diagram of the left view of Design 2; the state diagram of part D of Design 2 is a partial state diagram of the right view of Design 2; the state diagram of part E of Design 2 is a stereoscopic view of Design 2. The partial state diagram of the figure; the state diagram of part A of design 3 is the partial state diagram of the left view of design 3; the state diagram of part B of design 3 is the partial state diagram of the right view of design 3; the state diagram of part C of design 3 is the partial state diagram of the top view of design 3; the state diagram of part D of design 3 is the partial state diagram of the bottom view of design 3; the state diagram of part E of design 3 is the partial state diagram of the stereoscopic view of design 3; the state diagram of part A of design 4 is the partial state diagram of the main view of design 4; the state diagram of part B of design 4 is the partial state diagram of the rear view of design 4; the state diagram of part C of design 4 is the partial state diagram of the left view of design 4; the state diagram of part D of design 4 is the partial state diagram of the right view of design 4; the state diagram of part E of design 4 is the partial state diagram of the stereoscopic view of design 4.

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