Semiconductor package push-pull force tester
CN309546067SActive Publication Date: 2025-10-17SHENZHEN DERUIYIN PRECISION TECH CO LTD
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Patent Information
- Application Number
- CN202430829660.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2039-12-27
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: semiconductor package push-pull force tester. 2. The use of the design product: used for testing the adhesion of semiconductor package, is the quality control equipment of semiconductor package. 3. The design points of the design product: in shape. 4. The picture or photo that can best show the design points: perspective view.
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