Leaded plastic-encapsulated electronic module (DCM)
CN309575596SActive Publication Date: 2025-10-31SHANGHAI JARI INFORAMTION SCI & TECH
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Patent Information
- Application Number
- CN202430661537.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-21
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2039-10-21
Smart Images
Figure 000001_ABST
Abstract
1. Name of the product in this design: Leaded plastic-encapsulated electronic module (DCM). 2. Application of this design: A DCM molded module with double-sided plastic sealing, small size, and light weight. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1. 5. The rear view has already been shown in other views, so the rear view is omitted.
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