Conductive connection module (ST-YYL)
CN309581231SActive Publication Date: 2025-11-04ZHONGSHAN DEEP INNOVATION ELECTRONIC TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202530159745.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-28
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2040-03-28
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: conductive connection module (ST-YYL). 2. The use of the design product: for realizing the conductive connection on the surface of the wall and the ceiling. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: perspective view 1.
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