Plastic encapsulated electronic module with leads (PI)
CN309581668SActive Publication Date: 2025-11-04SHANGHAI JARI INFORAMTION SCI & TECH
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Patent Information
- Application Number
- CN202430667906.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-23
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2039-10-23
Smart Images
Figure 000006_ABST
Abstract
1. The name of the design product: plastic package electronic module with pin (PI). 2. The use of the design product: PI plastic package module with double-sided plastic package, small volume and light weight. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1. 5. The rear view has been shown in other views, and the rear view is omitted.
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