Modular gland (MTG-063 series)

Abstract

1. The name of the design product: combined cover (MTG-063 series). 2. The use of the design product: used in the heat dissipation fixing device of MOSFET field effect transistor, IGBT insulated gate bipolar transistor, various IC semiconductor electronic chip and other power components, the MOS tube or IGBT chip is pressed and attached to the radiator or ceramic sheet for heat dissipation and cooling. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: design 1 perspective view 1. 5. Design 1 rear view is symmetrical with design 1 front view, omit design 1 rear view; design 2 rear view is symmetrical with design 2 front view, omit design 2 rear view. 6. Design 1 is designated as the basic design.

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