Modular threaded gland (MTG-058)

Abstract

1. The name of the design product: combined cover (MTG-058). 2. The use of the design product: used in the heat dissipation fixing device of MOSFET field effect transistor, IGBT insulated gate bipolar transistor, various IC semiconductor electronic chip and other power components, the MOS tube or IGBT chip is pressed and attached to the radiator or ceramic sheet for heat dissipation and cooling. 3. The design points of the design product: in shape. 4. The picture or photo that can best show the design points: perspective view 1. 5. The rear view is symmetrical with the front view, and the rear view is omitted.

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