Memory module heatsink
CN309645552SActive Publication Date: 2025-12-02LEXAR ELECTRONICS (SHENZHEN) CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202530219849.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-22
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2040-04-22
Smart Images
Figure 000008_ABST
Abstract
1. Name of this product design: Heatsink for memory modules. 2. Purpose of this product design: The heatsink is used to dissipate heat from the memory module. 3. The key design feature of this product is the shape of the heat dissipation heat sink. 4. The image or photograph that best illustrates the design's key points: 3D view 1. 5. Other situations requiring explanation: The dotted lines in the figure represent the parts of this design that are not claimed.
Need to check novelty before this filing date? Find Prior Art