Jacket with detachable temperature control semiconductor
CN309662492SActive Publication Date: 2025-12-12SHANGHAI GARMENT GRP IMP & EXP
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Patent Information
- Application Number
- CN202530193768.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-11
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2040-04-11
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Figure 000002_ABST
Abstract
1. The name of the design product: with detachable temperature control semiconductor jacket. 2. The use of the design product: for wearing. 3. The design points of the design product: in shape, in the back of the product. 4. The picture or photo that best indicates the design points: rear view. 5. The design product is a thin product, omitting left, right, down, and up views. 6. Other circumstances that need to be explained: the area indicated by A in the rear view is a detachable shielding piece; the area indicated by B is a pocket.
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