System-in-package module
CN309703211SActive Publication Date: 2025-12-26MOMENTA (SUZHOU) TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202530303161.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-28
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2040-05-28
Smart Images
Figure 000007_ABST
Abstract
1. Name of the design product: system-in-package module. 2. Use of the design product: as a system-in-package module for vehicle, for integrating system-on-chip, memory, power chip, etc. on a small printed circuit board assembly. 3. Design points of the design product: in shape. 4. Picture or photo best indicating the design points: perspective view.
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