Die bonder (mini LED six-probe head die bonder)
CN309741941SActive Publication Date: 2026-01-20SHENZHEN XINYICHANG TECH CO LTD
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Patent Information
- Application Number
- CN202530327101.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-09
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2040-06-09
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: die bonder (Mini LED six-pin head die bonder). 2. The use of the design product: a device for pasting chips onto a packaging substrate and performing fixing, connecting and packaging. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1.
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