Plastic package power module (with heat dissipation substrate)
CN309745626SActive Publication Date: 2026-01-23STARPOWER SEMICON LTD
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Patent Information
- Application Number
- CN202530379675.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-30
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2040-06-30
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Figure 000007_ABST
Abstract
1. The name of the design product: plastic power module (with heat dissipation substrate). 2. The use of the design product: mainly used for electronic parts of cars. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1. 5. Other circumstances that need to be explained: A part of the enlarged view is the enlarged view of the front view A part; B part of the enlarged view is the enlarged view of the bottom view B part.
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