End of photosensitive film

Abstract

1. Name of the designed product: end of photosensitive film 2. Use of the designed product: photosensitive film for forming circuit on wiring board such as semiconductor package substrate, the partial design is used for the end of photosensitive film with inclined step portion, the photosensitive film is wound from the inclined step portion, so that no step is formed between the initial layer and the upper layer. 3. Design points of the designed product: the shape shown in the partial design. 4. Picture or photo best showing the design points: enlarged view of E. 5. Other circumstances needing explanation Other explanation: the dotted line indicates the boundary between the claimed part and the unclaimed part, and the numbers 1 and 2 in the figure respectively represent the photosensitive film and the step portion.

Images