Chip package
CN309819340SActive Publication Date: 2026-02-27SHANGHAI RONGDI IND CO LTD
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Patent Information
- Application Number
- CN202530388898.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-03
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2040-07-03
Smart Images
Figure 000005_ABST
Abstract
1. Name of the design product: chip package. 2. Use of the design product: the product is used for chip package. 3. Design points of the design product: in shape. 4. Picture or photo that best shows the design points: front view.
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