Integrated circuit package form (DFN2020-8L)
CN309868559SActive Publication Date: 2026-03-24SHENZHEN MILLER SEMICON TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-10
- Publication Date
- 2026-03-24
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Figure 000007_ABST
Abstract
1. The name of the design product: integrated circuit package form (DFN2020-8L). 2. The use of the design product: for packaging chips. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: design 1 perspective view. 5. Design 1 is designated as the basic design.
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