Vertical copper busbars and their housings for double-sided ORV3 mating interfaces
CN309926736SActive Publication Date: 2026-04-17TYCO ELECTRONICS (SHANGHAI) CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- TYCO ELECTRONICS (SHANGHAI) CO LTD
- Filing Date
- 2025-03-18
- Publication Date
- 2026-04-17
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Figure 000008_ABST
Abstract
1. Name of the product in this design: Vertical copper busbar and housing for double-sided ORV3 mating interface. 2. Application of this design: This design is used in Open Rack V3 racks. The vertical copper busbars of the double-sided ORV3 mating interface are used to provide power to the equipment in the rack, and the housing of the vertical copper busbars of the double-sided ORV3 mating interface is used to connect to the rack. 3. The key design features of this product are the shapes shown by the solid lines in each view. 4. The picture or photo that best illustrates the key design points: Design 1 3D diagram 1. 5. Design 1 is designated as the basic design. 6. Other situations requiring explanation: Parallel double-dotted lines in the view are intended to indicate the indefinite length of the product.
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