Semiconductor heat sink (iron mesh type)

CN309929574SActive Publication Date: 2026-04-17曾银平
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
曾银平
Filing Date
2025-09-18
Publication Date
2026-04-17

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Abstract

1. Name of the product in this design: Semiconductor Heat Sink (Mesh Type). 2. Purpose of this design: A heat dissipation product for cooling mobile phones and tablets. 3. The key design feature of this product is its shape. 4. The picture or photo that best illustrates the key design points: Design 1 3D diagram 1. 5. Design 1 is designated as the basic design.
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