Underfloor heating board
CN309938908SActive Publication Date: 2026-04-21河南欧菲克新材料有限公司
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- 河南欧菲克新材料有限公司
- Filing Date
- 2025-08-25
- Publication Date
- 2026-04-21
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Figure 000007_ABST
Abstract
1. Name of the product in this design: Underfloor heating board. 2. Application of this design: Laying, wiring, and installation of underfloor heating panels and pipes. 3. The key design features of this product are the combination of shape and pattern. 4. The image or photograph that best illustrates the design's key points: 3D view 1.
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