X-ray inspection apparatus (AX8200L)

Abstract

1. Name of the product in this design: X-ray inspection equipment (AX8200L). 2. Application of this design: This design is used for testing BGA, CSP, flip chip, semiconductor, packaged components, electronic connector modules, ceramic products, aerospace components, photovoltaic industry, battery industry and other special industries on large circuit boards. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

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