Folded portion of lead frame
CN309949662SActive Publication Date: 2026-04-28HARBIN HEG TECHNOLOGY DEVELOPMENT LTD CO +1
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- HARBIN HEG TECHNOLOGY DEVELOPMENT LTD CO
- Filing Date
- 2025-10-22
- Publication Date
- 2026-04-28
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Figure 000007_ABST
Abstract
1. The name of the design product: the folding part of the lead frame. 2. The use of the design product: the overall use of the design product is to install a chip and realize the communication of the functional pins of the chip by connecting with the chip; the use of the part to be protected is to shield electromagnetic signals. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: design 1 perspective view. 5. Design 1 is designated as the basic design. 6. Other circumstances that need to be explained: the design product involves partial appearance design, the part to be protected in the application is the part shown in red, the part other than red is not the part to be protected; the design product does not require protection of color.
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