Folded portion of lead frame

CN309956680SActive Publication Date: 2026-05-01HARBIN HEG TECHNOLOGY DEVELOPMENT LTD CO +1
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
HARBIN HEG TECHNOLOGY DEVELOPMENT LTD CO
Filing Date
2025-10-22
Publication Date
2026-05-01

Smart Images

  • Figure 000007_ABST
    Figure 000007_ABST
Patent Text Reader

Abstract

1. Name of the product in this design: Folded part of the lead frame. 2. Purpose of this design: The overall purpose of this design is to mount a chip and connect it to the chip to enable communication of the chip's functional pins; the purpose of the protected part is to shield electromagnetic signals. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the key design points: Design 1 3D view. 5. Design 1 is designated as the basic design. 6. Other matters requiring explanation: This design involves partial design, and the part that is claimed for protection in this application is the part shown in red. The parts other than red are not claimed for protection; the color of the product involved in this design is not claimed for protection.
Need to check novelty before this filing date? Find Prior Art