Folded portion of lead frame
CN309956680SActive Publication Date: 2026-05-01HARBIN HEG TECHNOLOGY DEVELOPMENT LTD CO +1
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- HARBIN HEG TECHNOLOGY DEVELOPMENT LTD CO
- Filing Date
- 2025-10-22
- Publication Date
- 2026-05-01
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Figure 000007_ABST
Abstract
1. Name of the product in this design: Folded part of the lead frame. 2. Purpose of this design: The overall purpose of this design is to mount a chip and connect it to the chip to enable communication of the chip's functional pins; the purpose of the protected part is to shield electromagnetic signals. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the key design points: Design 1 3D view. 5. Design 1 is designated as the basic design. 6. Other matters requiring explanation: This design involves partial design, and the part that is claimed for protection in this application is the part shown in red. The parts other than red are not claimed for protection; the color of the product involved in this design is not claimed for protection.
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