Top heat dissipation packaging structure
CN309962728SActive Publication Date: 2026-05-05SHANGHAI HESTIA POWER INC
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SHANGHAI HESTIA POWER INC
- Filing Date
- 2025-10-29
- Publication Date
- 2026-05-05
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Figure 000008_ABST
Abstract
1. Name of this product design: Top heat dissipation encapsulation structure. 2. Application of this design: heat dissipation packaging structure for power devices. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D rendering 2.
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