Semiconductor heat sink (cell phone back clip)
CN309964469SActive Publication Date: 2026-05-05曾银平
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- 曾银平
- Filing Date
- 2025-11-07
- Publication Date
- 2026-05-05
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product in this design: Semiconductor heat sink (mobile phone back clip). 2. Purpose of this design: A heat dissipation product used to cool down mobile phones. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D rendering 1.
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