Upper portion of semiconductor manufacturing adhesive sheet

Abstract

1. The name of the design product: the upper part of the semiconductor manufacturing adhesive sheet. 2. The use of the design product: used as an adhesive sheet in semiconductor manufacturing, when used, the PET release film is peeled off, and the semiconductor wafer is adhered to the bonding layer; the use of the partial design: the adhesive sheet is reinforced and supported, in addition, the PET release film is cut at the edge along the substrate, and the preformed bonding layer is placed directly on the PET release film, compared with the traditional method of cutting the bonding layer on the PET release film, waste is reduced and productivity is improved. 3. The design points of the design product: the shape shown in the partial design. 4. The picture or photo that best shows the design points: front view. 5. Other circumstances that need to be explained: in the drawings, numbers 1-4 represent the substrate, PET release film, adhesive layer, and bonding layer, respectively, among which the substrate, PET release film, and adhesive layer are transparent components. In addition, the left and right sides of the product are continuous without a limited boundary.

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