Wafer inspection machine
CN309997995SActive Publication Date: 2026-05-26长川科技(苏州)有限公司
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- 长川科技(苏州)有限公司
- Filing Date
- 2025-10-14
- Publication Date
- 2026-05-26
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product in this design: Wafer Inspection Machine. 2. Purpose of this design: For the inspection of surface defects, morphology, and internal defects in wafers. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.
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