heat sink

CN310007716SActive Publication Date: 2026-05-29EVOC HI-TECH HLDG GRP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
EVOC HI-TECH HLDG GRP CO LTD
Filing Date
2025-09-28
Publication Date
2026-05-29

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Abstract

1. The name of the design product: radiator. 2. The use of the design product: installed in electronic equipment, radiating the circuit board. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: perspective view 1.
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