Device for controlling the supply power to a conductive support of a catalyst device

Abstract

In a device for controlling the power supply to a conductive porous support of a catalyst device for emission control, a moisture detection device determines whether moisture is contained in and / or on the conductive porous support. A power control device regulates the power supply to the conductive porous support such that, when moisture is determined to be contained in and / or on the conductive porous support, the power supply value is lower than the power supply value when moisture is determined not to be contained in and / or on the conductive porous support.

Description

CROSS-REFERENCE TO RELATED REGISTRATIONS

[0001] The present application is based on Japanese patent application 2010-103575, which was filed on April 28, 2010. This application claims priority from the Japanese patent application, so that the descriptions therein are incorporated in their entirety by reference. TECHNICAL AREA

[0002] The present invention relates to devices for controlling a supply of power or a supply power to a conductive carrier of an electrically heated catalyst device, which is to be used for cleaning engine emissions. BACKGROUND

[0003] Engine emission control is one of the important technologies incorporated into modern motor vehicles. To clean exhaust emissions from the exhaust pipe of an internal combustion engine, a catalytic converter is typically installed within the exhaust pipe. Catalytic converters, each consisting of a catalyst and a metal support that carries it, are characterized by the fact that they are activated when their temperature is greater than or equal to an activation temperature and that they oxidize specific components in the exhaust emissions. Thus, if the temperature of a catalytic converter installed in the exhaust pipe is lower than its corresponding activation temperature, for example, during engine start-up, the catalytic converter must be heated as soon as possible to activate it.As an example of how a catalyst device is heated, US patent application No. 5,758,492, which corresponds to Japanese examined patent publication No. 3602614, discloses an electrically heated catalyst device, simply referred to as an “EHC device”, which supplies current to the metal support of the EHC device in order to heat the metal support. SUMMARY

[0004] The inventors have discovered that there is a problem in cases where a conductive ceramic support is used, for example, a conductive porous support instead of the metal support in an EHC device.

[0005] Specifically, ceramics are a porous material with many very small holes (pores) in and on its surface. If a conductive ceramic substrate were abruptly heated, with moisture present in some of its pores, thermal expansion of the moisture would occur without any means of escape; that is, a "bumping" or "bumping" of the moisture would occur (see reference symbol). 21x in Fig. 4) This could create a risk of damage to the ceramic substrate.

[0006] In particular, although the EHC device can be supplied with energy to increase the temperature of the ceramic support before engine start-up, the energy supplied to the ceramic support can heat it without the moisture being expelled through the exhaust emissions. This can result in the liquid remaining in some pores. Thus, the greater the degree of heating of the ceramic support, the more likely it is that impact will occur during the boiling process of the liquid.

[0007] In view of the aforementioned circumstances, one embodiment of the present invention attempts to provide devices for controlling a supply power to a conductive porous support of an electrically heated catalyst device; these devices are designed to solve the aforementioned problems.

[0008] Specifically, an alternative embodiment of the present disclosure aims to provide devices capable of reducing the risk of liquid impact occurring in and / or on the conductive porous support.

[0009] According to one embodiment of the present disclosure, a device for controlling the feed rate to a conductive porous support of a catalyst device for purifying an emission is provided. The conductive porous support carries a catalyst of the catalyst device. The conductive porous support is supplied with energy to heat the catalyst. The device includes a moisture detection device for determining whether moisture is contained in and / or on the conductive porous support.The device includes a power control device for controlling the power supply to the conductive porous carrier for powering the conductive porous carrier, such that a value of the power supply to the conductive porous carrier, when it is determined that moisture is contained in and / or on the conductive porous carrier, is lower than a value of the power supply to the conductive porous carrier, when it is determined that moisture is not contained in and / or on the conductive porous carrier.

[0010] According to an alternative embodiment of the present invention, a computer program product is provided for a device for controlling the feed rate to a conductive porous support of a catalyst device for purifying an emission. The conductive porous support carries a catalyst of the catalyst device, and the conductive porous support is supplied with energy to heat the catalyst. The computer program product comprises a computer-accessible medium and a set of computer program instructions contained on the computer-accessible medium. The instructions include a first instruction for determining whether moisture is contained in and / or on the conductive porous support.The instructions include a second instruction for controlling the power supply to the conductive porous support for powering the conductive porous support, such that a power supply value to the conductive porous support, when it is determined that moisture is contained in and / or on the conductive porous support, is lower than a power supply value to the conductive porous support, when it is determined that moisture is not contained in and / or on the conductive porous support.

[0011] The inventors have discovered that if there is no local heating in the conductive carrier, the first parameter is related to the second parameter. Since the second parameter is related to the temperature of the conductive carrier, the diagnostic device according to one embodiment of the present disclosure and the computer program product according to the alternative embodiment of the present disclosure can determine the temperature state of the conductive carrier based on a comparison between the first and second parameters, such as the difference between them.

[0012] The aforementioned and / or further features and / or advantages of various embodiments of the present invention will become more apparent in light of the following description in conjunction with the accompanying drawing. Different embodiments of the present invention may include or exclude different features and / or advantages, where applicable. Additionally, different embodiments of the present disclosure may combine one or more features from other embodiments, where applicable. The descriptions of features and / or advantages of specific embodiments should not be construed as limiting other embodiments or the claims. BRIEF DESCRIPTION OF THE DRAWING

[0013] Further embodiments of the present disclosure will become apparent from the following description of exemplary embodiments with reference to the accompanying drawing. The drawing shows:

[0014] Fig. 1 a schematic structural representation of a power supply system for supplying power to an electrically heated catalyst device (EHC device) arranged in an exhaust pipe of an internal combustion engine, according to the first embodiment of the present disclosure,

[0015] Fig. 2 an enlarged perspective view of the in Fig. 1 illustrated EHC device,

[0016] Fig. 3 an equivalent circuit diagram of the power supply system and the ceramic support of the EHC device according to the first embodiment,

[0017] Fig. 4 An enlarged axial end view of the ceramic support when viewed in the direction of arrow IV, which points in Fig. 2 is illustrated,

[0018] Fig. 5 a flowchart that schematically illustrates a sequence of operations of the CPU of a control device according to a power control program according to the first embodiment,

[0019] Fig. 6 a time-lapse diagram that schematically illustrates the transitions of the temperature of the ceramic support and the magnitude of a power input to the ceramic support as a function of the state of a shock flag, while the CPU executes the power control program according to the first embodiment,

[0020] Fig. 7 a flowchart that schematically illustrates a sequence of operations of the CPU of the control device according to a power control program according to the second embodiment of the present disclosure,

[0021] Fig. 8 a time-lapse diagram that schematically illustrates the temperature transitions of the ceramic support, the rate of temperature change and the magnitude of the power input to the ceramic support as a function of the shock flag state, while the CPU executes the power control program according to the second embodiment,

[0022] Fig. 9 a time-lapse diagram schematically illustrating the transitions of the temperature of the ceramic support, the rate of change of a current supplied to the ceramic support, and the magnitude of a power supply to the ceramic support as a function of the state of the shock flag, while the CPU executes the power control program according to the third embodiment of the present invention, and

[0023] Fig. 10 a time sequence diagram that schematically illustrates the transitions of the temperature of the ceramic support, the rate of a resistance change of the ceramic support and the magnitude of a power supply to the ceramic support as a function of the state of the shock flag, while the CPU executes the power control program according to the fourth embodiment of the present disclosure. DETAILED DESCRIPTION OF THE EXAMPLES OF EXECUTION

[0024] Exemplary embodiments of the present disclosure are described below with reference to the accompanying drawing. Identical reference numerals are used in the drawing to identify corresponding identical components. First embodiment

[0025] With reference to Fig. 1 is an internal combustion engine 10 with an exhaust pipe 11 , an electrically heated catalyst device (EHC device) 20 and a power supply system PS for supplying power to the EHC device 20 Illustrated. A device for controlling the feed rate to the EHC device. 20 According to the first embodiment of the present disclosure, for example, the PS is designed as a part of the power supply system; this device may below be referred to as a “power supply control device”.

[0026] A gasoline-powered internal combustion engine is used as an example. The gasoline-powered internal combustion engine, which is simply referred to as a power engine, 10 is installed in a motor vehicle. The motor vehicle has a (not shown) drive engine built into it. The engine 10 and the drive motor work together as the drive source of the motor vehicle.

[0027] Specifically, the power machine works 10 to compress an air-fuel mixture through the piston in each cylinder using intake air and to burn the compressed air-fuel mixture in each cylinder. This converts the fuel energy into mechanical energy, such as rotational energy, to move the piston back and forth in each cylinder, thus driving a (not shown) crankshaft of the engine. 10The rotation of the crankshaft is transmitted to drive wheels via a drivetrain installed in the motor vehicle, in order to propel the motor vehicle.

[0028] The drive motor works to turn the crankshaft when it is supplied with energy.

[0029] In the exhaust pipe 11 the power machine 10 are the EHC devices 20 and a three-way catalytic converter 30 provided. The EHC device 20 is downstream of the power engine 10 arranged, and the three-way catalyst 30 is downstream of the EHC device 20 arranged. The EHC device 20 is characterized in that it is activated with an associated temperature that is greater than or equal to a predetermined activation temperature, wherein the EHC device 20in the activated state hydrocarbons (HC) in exhaust emissions from the engine 10 through the exhaust pipe 11 It oxidizes and reduces carbon monoxide (CO) and nitrogen oxides (NOx) in the exhaust emissions to purify the HC, CO, and NOx. The three-way catalytic converter works in a similar way. 30 characterized in that it is activated at an associated temperature which is greater than or equal to a predetermined activation temperature, wherein the three-way catalyst 30 In the activated state, HC is present in the exhaust emissions through the exhaust pipe. 11 oxidized and CO and NOx in the exhaust emissions are reduced to purify the HC, CO and NOx.

[0030] For example, the EHC device 20 smaller in size than the three-way catalytic converter 30 , to reduce the time required for the EHC device 20required to reach the activation temperature.

[0031] Fig. Figure 2 shows an enlarged perspective view of an example of the EHC device setup. 20 The EHC device 20 comprises an essentially cylindrical ceramic support 21 with a conductivity.

[0032] The PS power supply system comprises a pair of positive and negative electrodes. 22 and 23 , a source of power 24 and a control device 25 The positive electrode 22 is located on part of the outer circumferential surface of the ceramic support 21 attached, and the negative electrode 23 is located on another part of the outer circumferential surface of the ceramic support. 21 It is appropriate that they are positioned opposite the positive electrode. 22 with gaps in between.

[0033] The power source24 is electrically connected to the positive and negative electrodes 22 and 23 connected via appropriate conductors (wires). As described in Fig. As illustrated in Figure 3, the motor vehicle according to the first embodiment includes a battery, such as a rechargeable lithium battery, 24b to power the drive motor. The power source 24 is designed to accept a connection voltage of, for example, approximately 400 volts (V) across the positive and negative terminals. 22 and 23 to create the power source 24 It also includes a switch. 24a , which is located at the conductor between the battery 24b and the positive connection 22 is arranged. The switch 24 It can be controlled with the control device 25 connected and designed according to instructions from the control device 25to be sent, to open or to close.

[0034] That is, when the connection voltage is applied across the positive and negative electrodes 22 and 23 When connected, currents flow from the positive electrode. 22 about the ceramic support 21 to the negative electrode 23 (see reference numbers I1 to I5 in Fig. 2) This causes the ceramic carrier 21 , to heat up, whereby the temperature increases.

[0035] The power source 24 It also includes a current sensor. 24c to measure a supply current from the battery 24b to the ceramic carrier 21 The current sensor 24c is electrically connected to the control device 25 connected, with the current value being measured by the current sensor 24c The measurement is taken, and this is then transferred to the control device. 25 is issued.

[0036] Generally, conductive ceramics are produced by adding conductive material to the ceramic material. A non-uniform distribution of the conductive material, a non-uniform density distribution of the ceramic material, and / or a non-uniform thickness of the conductive ceramic can cause different resistance zones within the conductive ceramic.

[0037] For at least these reasons, the conductive ceramic substrate consists of 21 from a multitude of identically shaped unit sections with different resistance values. For example, if the electrically conductive path of the ceramic carrier 21 between the positive and negative electrodes 22 and 23 consists of five unit sections in the direction of the current with different resistance values, forming the electrical connection between the positive and negative electrodes 22 and 23about the ceramic support 21 expressed as an equivalent circuit, which in Fig. Figure 3 illustrates five resistors R1 to R5 with different resistance values ​​between the positive and negative electrodes. 22 and 23 are connected in parallel to each other.

[0038] Reference numbers “I1 to I5”, which are in Fig. Figure 2 illustrates currents flowing individually through the respective resistors R1 to R5. For example, if the resistance value of resistor R1 is the lowest of the five resistors R1 to R5, the current I1 will be the highest of all currents I1 to I5. This causes the heat quantity of the unit section of the ceramic carrier to change. 21, which corresponds to resistance R1, is enlarged more than any other unit section; this unit section, which corresponds to resistance R1 with the highest resistance value, is hereinafter referred to as a lower resistance section. 21p designated. However, if the size of a feed rate to the ceramic support 21 The relatively low heat generation occurs in the locally heated section. 21p due to local heating compared to heat transfer from the locally heated section 21p The temperature difference to another section is not as large. Therefore, a significant temperature increase can occur in the locally heated section. 21p be prevented.

[0039] A battery control device BC, which is installed in the motor vehicle, is operational to regulate the battery's connection voltage. 24b to measure the amount or size of charge in the battery 24bto control based on the measured connection voltage. The battery control device BC is also operational to control the control device. 25 to supply the measured connection voltage.

[0040] The control device 25 is designed, for example, as a normal microcomputer circuit, which consists, for example, of a CPU 25a , a storage medium 25b , which includes a ROM (read-only memory), such as a rewritable ROM, a RAM (random access memory), and the like, an I / O interface (input and output), buses, etc. The CPU 25a , the storage medium 25b and the I / O interfaces are communicatively connected to each other via the buses. The storage medium 25bIt stores various programs in advance, including a learning program PR1 and a temperature calculation program PR2, which are described below.

[0041] The control device is specific. 25 , i.e., the associated CPU 25a , operational, to operate based on the measured current value from the current sensor 24 is entered, and the measured connection voltage, which is entered by the battery control device BC, a resistance R of the electrically conductive path of the ceramic carrier. 21 between the positive and negative electrodes 22 and 23 to calculate; the resistance R is equivalent to the combined resistance of the resistance values ​​of resistors R1 to R5. The resistance R of the electrically conductive path of the ceramic support. 21 between the positive and negative electrodes 22 and 23is also referred to as a “resistance R of the ceramic support”. 21 " designated.

[0042] It should be noted that the temperature T of the ceramic support 21 and the resistance R of the electrically conductive path of the ceramic support 21 between the positive and negative electrodes 22 and 23 exhibit an interaction between themselves; this interaction is referred to as an “RT characteristic curve” of the ceramic support. 21 designated. In the first embodiment, the storage medium stores 25b This includes a mapping or characteristic curve M1, which is designed, for example, as a data table, a program and / or an equation; this mapping M1 represents the RT characteristic curve between a variable of the temperature T of the ceramic support. 21 and a variable of the resistance R of the electrically conductive path of the ceramic support 21between the positive and negative electrodes 22 and 23 Figure M1 may have been determined based on data obtained through tests and / or simulations using the power supply system PS, the power machine. 10 and the EHC device 20 or related equivalent computer models.

[0043] The CPU is specific. 25a the control device 25 operational, to refer to Figure M1 using a calculated value of the resistance R of the ceramic support 21 as a key reference in order to determine a value of the temperature T of the ceramic support based on a result of the reference. 21 to extract the resistance R corresponding to the calculated value of this resistance. In the first embodiment, the RT characteristic of the ceramic support is 21an NTC characteristic (negative temperature coefficient characteristic) in which an electrical resistance of the ceramic support 21 with a temperature increase, it decreases. In other words, the ceramic support 21 for example, made from a SiC (silicon carbide) material that exhibits such an NTC characteristic.

[0044] Fig. Figure 4 shows an enlarged axial end view of the ceramic support. 21 , when viewed in the direction of arrow IV, which points in Fig. 2 is illustrated.

[0045] As it is in the Fig. 2 and Fig. As illustrated in Figure 4, the ceramic support 21 essentially a honeycomb shape with a honeycomb wall 21c on, which have many channels (flow cells) 21a it forms; these channels 21a are in the direction of the exhaust gas emissions flowing through the exhaust pipe 11 arranged. That is, the honeycomb wall21c of the ceramic support 21 defines the channels 21a On the inner surface of the honeycomb wall 21c , which belong to a corresponding channel 21a Opposite, a catalyst layer is formed. 21b For example, it is supported by coating. The ceramic substrate 21 It allows the exhaust emissions to pass through the channels 21a pass through. While the exhaust emissions pass through the channels 21a As harmful components in the exhaust emissions pass through the catalyst layers, they are removed. 21b oxidized or reduced, so that the exhaust emissions are cleaned to escape from the exhaust pipe 21a to be issued.

[0046] It should be noted that ceramic is a porous material with a multitude of very small holes (pores) within it. When the ceramic substrate 21If the ceramic substrate were abruptly heated with moisture trapped in some of its pores, a thermal expansion of the moisture would occur. 21 without any possibility of escape, i.e., a “bumping” or “bumping” of the moisture would occur (see reference symbol). 21x in Fig. 4) This could potentially pose a risk of damage to part of the wall. 21c , which the channels 21a forms, cause; this part corresponds to some pores into which the moisture is filled.

[0047] In particular, although the EHC device 20 can be supplied with energy to maintain the temperature of the ceramic support 21 to increase the energy supply of the ceramic carrier before starting a power engine. 21 the ceramic carrier 21Heating without the moisture being blown out through exhaust emissions can result in moisture remaining in some pores. Therefore, the greater the heating of the ceramic substrate, the more... 21 The more [unclear], the more likely it is that moisture will be introduced.

[0048] In view of the aforementioned circumstances, the control device 25 The power supply system PS is configured to execute power control according to the power control program PR1 in order to: determine whether moisture is present in the ceramic carrier 21 This includes a supply capacity to the ceramic support. 21 to reduce, if it is determined that moisture is present in the ceramic substrate 21 This includes, in comparison to a feed rate to the ceramic support. 21 , if it is determined that there is no moisture in the ceramic substrate 21is included.

[0049] Fig. Figure 5 shows a flowchart that schematically illustrates the sequence of operations of the CPU. 25a , while one focus is on determining whether moisture is present in the ceramic substrate 21 This is illustrated by the power control program PR1. In other words, the power supply system PS serves as the device for controlling the supply power to the ceramic substrate. 21 .

[0050] The CPU 25a The power control program PR1 repeatedly runs in a preset cycle during a catalyst warm-up phase initiated by the CPU. 25a is requested when the temperature of the catalyst layers 21b , i.e., the temperature of the ceramic support 21 lower than the activation temperature of the catalyst layers 21bThat is, if it is determined that a catalyst warm-up request is occurring, the CPU 25a programmed, the switch 24a to turn on in order to draw power from the power source 24 to the ceramic carrier 21 the EHC device 20 to supply without waiting for the engine to start.

[0051] In other words, a different catalyst warm-up approach can increase the temperature of the exhaust emissions from the engine. 10 to warm up the catalyst layers 21b can only be carried out through the high-temperature exhaust emissions while the engine 10 is activated. In contrast, catalyst warm-up, which uses the power supply system PS, can be performed before engine start-up. Thus, the catalyst warm-up requirement can be independent of the engine's operating conditions. 10 appear.

[0052] When the power control program PR1 is started, the CPU determines 25a In step S10, the CPU checks whether the temperature value Tnow at that time is greater than or equal to a preset evaporation temperature T1, such as 100°C. For example, the CPU calculates... 25a in step S10 based on the measured current value from the current sensor 24 The input voltage is entered, and the measured connection voltage, which is entered by the battery control device BC, determines the resistance R of the electrically conductive path of the ceramic support. 21 between the positive and negative electrodes 22 and 23 ; the resistance R is equivalent to the combined resistance of the resistance values ​​of resistors R1 to R5.

[0053] In step S10 the CPU 25a to figure M1 using the calculated value of the resistance R of the ceramic support 21as a key reference to determine a value Tnow of the temperature T of the ceramic support based on a result of the reference. 21 to extract the calculated value of the corresponding resistor R. In other words, the CPU converts 25a the calculated value of the resistance R of the ceramic support 21 to the value Tnow of the temperature T using figure M1.

[0054] When determining that the value Tnow is the temperature T of the ceramic support 21 If the evaporation temperature is greater than or equal to the preset temperature T1 (YES in step S10), the CPU 25a Considering that, even if moisture is present in the ceramic substrate 21 The moisture contained within evaporated to disappear. Then the CPU... 25aIn step S13, a bump flag, for example a bit set to OFF (0), is either set or retained. For example, the bump flag is set to an initial value of OFF (0).

[0055] Otherwise, when determining that the value Tnow depends on the temperature T of the ceramic support, 21 lower than the preset evaporation temperature T1 (NO in step S10), the CPU 25a Considering the possibility that moisture may be present in the ceramic substrate 21 This includes the process of moving on to step S11. In step S11, the CPU determines 25a , as long as the performance is supplied to the ceramic substrate 21 is supplied, whereby the power machine 10 is switched off (not in operation), whether moisture (water vapor) is present due to the ignition of the engine. 10 generated during the last operating period, in and / or on the ceramic support 21remains. When the power machine 10 The CPU is working, progressing 25a The process proceeds to step S12, while the operation in step S11 is omitted. Specifically, when the air-fuel mixture burns during the last ignition before the engine shuts down, hydrocarbons (HC) contained in the fuel are oxidized by oxygen (O2) contained in the intake air, producing water vapor (H2O). This results in the water vapor adhering to the ceramic support. 21 can adhere. Thus, it is possible that if power is supplied to the ceramic substrate... 21 When the next engine start-up, there is a risk of impact due to the delayed boiling of the remaining water vapor (moisture). The operation in step S11 serves to determine whether such water vapor is present in and / or on the ceramic support. 21 remains.

[0056] Specifically, the CPU determines25a in step S11, whether a value Tstop of the temperature T of the ceramic support 21 (the catalyst layers 21b ) at the last engine shutdown is lower than the evaporation temperature T1. When determining that the value Tstop is the temperature T of the ceramic support 21 The CPU determines if the evaporation temperature T1 is lower than the evaporation temperature T1 (YES in step S11). 25a that moisture in and / or on the ceramic substrate 21 remains at this time.

[0057] In step S11, the CPU can 25a determine whether a power supply to the ceramic support 21 The first time this occurs is after the driver switches on the ignition switch of the motor vehicle. In determining that the supply of power to the ceramic carrier 21The first time, after the ignition switch of the motor vehicle is turned on by the driver (YES in step S11), the CPU determines 25a that moisture in the ceramic substrate 21 remains at this time.

[0058] Specifically, the CPU progresses 25a in a determination that moisture is present in and / or on the ceramic substrate 21 remains (YES in step S11), the CPU 25a Proceed to step S15. In step S15, the CPU determines 25a , that there is a high probability of collision during moisture boiling delay, with the collision flag being set to ON (1) or left as is. Otherwise, if it is determined that the value Tstop is the temperature T of the ceramic support 21 greater than or equal to the evaporation temperature T1, or that a power supply to the ceramic support 21 This is not the first time (NO in step S11), the CPU 25aProceed to step S12.

[0059] It should be noted that if the power machine 10 a process starts, water vapor, which is produced by the ignition of the engine 10 is generated, into the exhaust pipe 21a flows, creating a large amount of moisture in an atmosphere around the ceramic support. 21 This results in a change in temperature. This causes the dew point to rise, making condensation likely. Additionally, condensation is more likely because the operation in S12 relies on the negative determination that the value Tnow is equal to the temperature T of the ceramic support. 21 lower than the evaporation temperature T1.

[0060] Thus, the CPU determines 25a in step S12, whether the power machine 10 is in operation. Upon determination that the power machine 10 The CPU determines when it is in operation. 25athat condensation occurs on the ceramic support 21 forms (YES in step S12), whereby the shock flag is set to ON (1) or retained in step S15. Otherwise, the CPU determines 25a in a determination that the power machine 10 It is not in operation, so that condensation does not occur on the ceramic support. 21 forms (NO in step S12), whereby the shock flag is set to OFF (0) or retained in step S13.

[0061] If the shock flag has been set OFF in step S13, the CPU executes 25a a “normal power control”, which is described below in step S14.

[0062] Specifically, an increase in the feed rate to the ceramic support can 21 reduce the time required to raise the temperature of the ceramic support 21 (ceramic layers) 21b) to increase to the activation temperature, i.e., the time required for catalyst warm-up. An excessive increase in the feed rate to the ceramic support 21 However, the amount of heat that is in the locally heated section can 21p is generated, compared to the amount of heat generated by the locally heated section. 21p is transferred to another section. This can cause the locally heated section to... 21p excessively high temperatures, rising to a degree that may pose a risk of thermal damage to the ceramic substrate. 21 consists.

[0063] Thus, the CPU 25a In order to prevent such a danger, the normal power control is switched off in order to determine a normal power P0 such that the normal power P0 is a higher value at which there is no risk of thermal damage to the ceramic support. 21can exist, and the normal power P0 to the ceramic support 21 to supply. This aims to prevent such a danger while reducing the time required for catalyst warm-up as much as possible.

[0064] In contrast, the CPU 25a , if the shock flag has been set to ON in step S15, a “low power control” is activated, which is described below in step S16.

[0065] Specifically enabled, even if moisture is present in and / or on the ceramic substrate. 21 remains a low level of power input to the ceramic support 21 that the moisture gradually evaporates, with the moisture flowing into the channels 21a can escape (see the arrows) 21y in Fig. 4) This reduces the risk of thermal expansion of the moisture without a means of escape, i.e., impact during boiling delay of the moisture (see reference numeral). 21x in Fig. 4), thus causing thermal damage to the ceramic support 21 is prevented.

[0066] Thus, the CPU 25a The low-power control is switched off to determine a low power P1 such that the low power P1 is a higher value at which there is no risk of shock during boiling delay of the moisture in and / or on the ceramic support. 21 can exist, whereby it is lower than the normal power P0, and the low power P1 to the ceramic support 21 to introduce. This aims to eliminate such a risk of impact during the boiling delay of moisture in and / or on the ceramic substrate. 21to prevent this, while reducing the time required for catalyst warm-up as much as possible.

[0067] Fig. Figure 6 shows a time sequence diagram that schematically illustrates the temperature transitions T of the ceramic support. 21 (the catalyst layers 21b ) and the size of a feed rate to the ceramic support 21 illustrated depending on the state of the shock flag, while the CPU 25a the performance control program PR1 is running.

[0068] When the catalyst warm-up request is represented with the shock flag set to OFF, the normal power P0 is supplied to the ceramic support. 21 supplied under normal power control (see dashed line in (b) according to Fig. 6) Since the shock flag is set to OFF, indicating that there is no possibility of shock during moisture boiling delay, this causes the temperature T of the ceramic support to... 21 increases, as shown by the dashed lines in (a) according to Fig. Figure 6 is shown. If the temperature T of the ceramic support 21 Once the activation temperature T0 is reached at a time ta, the catalyst heating is complete, so that the supply of power to the ceramic support 21 is stopped (see time ta in (b) according to Fig. 6).

[0069] In contrast, when the catalyst warm-up request occurs, with the shock fly set to ON, as shown in (c) according to Fig. Figure 6 illustrates the low power P1 of the ceramic support. 21 supplied under the low-power control (see solid lines in (b) according to Fig. 6) since the collision Flog on EIN represents that there is a high probability of collision during the boiling delay of moisture. This results in the fact that, as shown by a solid line in (a) according to Fig. Figure 6 illustrates the temperature of the ceramic support. 21 The temperature gradually increases under low-power control compared to normal power control. This allows any moisture-containing condensation to gradually evaporate, with the moisture being carried to the ducts. 21a exits (see the arrows) 21y in Fig. 4), which makes it possible to prevent bumping during the boiling delay of the moisture.

[0070] Then, when the temperature T of the ceramic support 21 When the evaporation temperature T1 is reached at time tb, the shock flow is switched to OFF, so that a feed rate to the ceramic support 21from the low power P1 to the normal power P0 is increased (see time ta in (b) according to Fig. 6) The reason for this is that, even if moisture is present in the ceramic substrate 21 This included the temperature T of the ceramic support. 21 , which is greater than or equal to the evaporation temperature T1, causes the moisture to evaporate and disappear, making it possible to increase the feed rate from the low rate P1 to the normal rate P0 without fear of shock during the boiling delay of the liquid.

[0071] Then, if the temperature T of the ceramic support 21 The activation temperature T0 is reached at a time tc, the catalyst heating is complete, so that the supply of power to the ceramic support 21 is stopped (see time tc in (b) according to Fig. 6).

[0072] As described above, the power supply control device according to the first embodiment is provided with a moisture detection device for determining whether moisture is present in the ceramic support. 21 This includes, according to the operations in steps S10 to S12. If it is determined that the moisture in the ceramic carrier 21 Included is the power supply control device, which serves as a power control device for supplying the low power P1 to the ceramic support. 21 ; the low power P1 is lower than the normal power P0, which is supplied to the ceramic support 21 is supplied when it is determined that the moisture in the ceramic support 21 is not included.

[0073] This makes it possible to... even if liquid is in and / or on the ceramic substrate. 21 The remaining low power P1, which is due to the ceramic support 21is supplied so that the moisture gradually evaporates along with the moisture or condensation that enters the channels. 21a exits (see the arrows) 21y in Fig. 4) This reduces the risk of thermal expansion of the moisture or condensation without a means of escape, i.e., the shock caused by the boiling bump of the moisture (see reference numeral). 21x in Fig. 4), thus causing thermal damage to the ceramic support 21 is prevented.

[0074] Additionally, the power supply control device is configured according to the first embodiment to ensure that no moisture is present in the ceramic support. 21 This includes (setting the shock flag to OFF) without carrying out the provisions based on the operations in steps S11 and S12, if the present value Tnow is the temperature T of the ceramic support. 21The evaporation temperature T1 is greater than or equal to, for example, 100°C. Thus, the configuration determines whether moisture is present in and / or on the ceramic substrate. 21 It includes high accuracy.

[0075] Furthermore, the power supply control device according to the first embodiment is provided with a residual determination device corresponding to the operation in S11. The residual determination device focuses on cases in which water vapor, produced by the ignition of the engine, 10 generated during the last operating period, on the ceramic support 21 It is attached to remain on the surface.

[0076] Specifically, the residual moisture determination device is designed to determine that the residual moisture is on the ceramic support. 21 is available to set the impact flag to ON when it is determined that the value Tstop is the temperature T of the ceramic support.21 the temperature at the last power engine shutdown is lower than the preset evaporation temperature T1, or that there is a supply of power to the ceramic support. 21 This occurs for the first time after the driver switches on the ignition of the motor vehicle. Thus, the configuration determines whether moisture (water vapor) is present in and / or on the ceramic substrate. 21 It includes high accuracy.

[0077] Furthermore, the power supply control device according to the first embodiment is equipped with a condensation detection device corresponding to the operation in S12. The condensation detection device focuses on cases in which engine start-up takes place in a high humidity atmosphere surrounding the ceramic support. 21 This results in a rise in the dew point, leading to condensation on the ceramic substrate. 21can form.

[0078] Specifically, the condensation detection device is designed to determine whether condensation has occurred on the ceramic support. 21 forms, in order to set the collision flag to ON when it is determined that both the preset value Tnow and the temperature T of the ceramic support are 21 lower than the preset evaporation temperature T1, as well as the power engine 10 is in operation. Thus, the configuration determines whether moisture (condensation) occurs in and / or on the ceramic substrate. 21 It includes high accuracy.

[0079] In particular, the ceramic support causes 21 , which has the NTC property that the amount of heat in the lower resistance section (locally heated section) 21p of the ceramic support 21The resistance R1, which increases more than any other unit section, is due to the locally heated section. 21p As the resistance decreases, the locally heated section increases. 21p the temperature continues to rise, resulting in an increase in the temperature of the locally heated section. 21p accelerated. The abrupt increase in temperature of the locally heated section. 21p Impact can easily occur during boiling delay due to moisture in and / or on the ceramic substrate. 21 cause. However, since in the first embodiment the power supply control device according to the first embodiment reduces the risk of shock occurring during the boiling delay of moisture, it is possible to improve the reliability of the EHC device. 20 , whose ceramic support 21 to improve the NTC property. Second embodiment

[0080] A power supply control device according to the second embodiment of the present invention is described below with reference to the Fig. 7 and Fig. 8 described.

[0081] The design and / or functions of the power supply unit according to the second embodiment differ from those of the power supply unit according to the first embodiment in the following points. Therefore, the differences are described primarily below.

[0082] The power supply device according to the second embodiment is configured to perform a sequence of operations that are in Fig. 7 are illustrated, according to a power control program PR2, which is in the storage medium 25b is stored instead of or in addition to the performance control program PR1 (see Fig. 3) to execute. Of course, the PR2 power control program can be stored in the storage medium 25b the control device 25 as in the first example.

[0083] Specifically, the establishments are identified in steps S10, S11 and S12 in the sequence of establishments that are in Fig. Figure 5 illustrates the operations in steps S20 and S23 in the sequence of operations that are in Fig. 7 are illustrated, replaced.

[0084] The CPU 25a The performance control program PR2 repeatedly runs in a preset cycle during a catalyst warm-up, which occurs during CPU operation. 25a is requested when the temperature of the catalyst layers 21b , i.e., the temperature of the ceramic support 21 , is lower than the activation temperature of the catalyst layers 21b .

[0085] When the PR2 power control program is started, the CPU determines 25a in step S20, whether the elapsed time since the start of a power supply to the ceramic carrier 21 shorter than a preset time A. In other words, the CPU determines 25a in step S20, whether the duration of a power supply to the ceramic carrier 21 shorter than the preset time A.

[0086] If it is determined that the elapsed time is shorter than the preset time A (YES in step S20), the CPU determines 25a that the current time is within an early stage of power input processing for catalyst warm-up. Then the CPU determines 25a In step S21, the CPU determines that there is a high probability of bumping during moisture boiling delay, setting or keeping the bump flag ON (1). Afterward, the CPU executes 25aIn step S22, the low-power control is deactivated; the low-power control is identical to that in step S16.

[0087] Otherwise, the CPU determines 25a If it is determined that the elapsed time is longer than or equal to the preset time A (NO in step S20), the current time point is not within the early stage of power input processing for catalyst warm-up, and it proceeds to step S23.

[0088] In step S23, the CPU determines 25a , whether there is moisture in the ceramic substrate 21 due to the low-power control in the early stage of power input processing, it has been evaporated to disappear.

[0089] Specifically, the CPU determines 25aIn step S23, as in the operation in step S10, the CPU determines whether the temperature value Tnow at that time is lower than the preset evaporation temperature T1, such as 100°C. In other words, the CPU determines 25a , whether the equation “Tnow < T1” is formed in step S23.

[0090] When determining that the value Tnow is the temperature T of the ceramic support 21 If the evaporation temperature is lower than the preset T1 (YES in step S23), the CPU pulls 25a Considering that there is a possibility of moisture in the ceramic substrate 21 It includes, and it determines that moisture is present in and / or on the ceramic substrate. 21 remains, proceeding to step S21.

[0091] In step S21, the CPU can 25a determine whether the speed or rate ΔTnow of a change in the temperature T of the ceramic support 21The rate of change of temperature T of the ceramic substrate is lower than a preset threshold value ΔT2, i.e., it determines whether the equation “ΔTnow < T2” is formed. It should be noted that the rate ΔTnow is a variation of the temperature T change of the ceramic substrate. 21 an absolute value of the velocity or rate ΔTnow of an increase / decrease in the temperature T of the ceramic support 21 is the rate ΔTnow of a change in the temperature T of the ceramic support. 21 represents the rate of change of temperature T of the ceramic support. 21 per unit of time.

[0092] When determining that the rate ΔTnow is a change in the temperature T of the ceramic support 21 If the value is lower than the preset threshold ΔT2 (YES in step S23), the CPU pulls 25a Consider the following reason: there is a possibility that moisture may be present in the ceramic substrate. 21This includes determining that moisture is present in and / or on the ceramic substrate. 21 remains, proceeding to step S21.

[0093] Specifically, it works if the ceramic support 21 is supplied with energy, with moisture in the ceramic carrier 21 This includes a portion of the thermal energy contained in the ceramic carrier. 21 The heat generated by the energy supply is lost as heat of vaporization of the moisture. Thus, the rate of temperature rise T of the ceramic substrate is reduced. 21 , i.e., the rate of change of the temperature T of the ceramic support 21 with regard to the size of the power supply to the ceramic support 21 reduced. For this reason, the CPU determines 25a in a determination that the rate ΔTnow of a change in the temperature T of the ceramic support 21lower than the preset threshold ΔT2 (ΔTnow < ΔT2), indicating that moisture is present in and / or on the ceramic substrate. 21 remains, proceeding to step S21.

[0094] It should be noted that in step S23 the CPU 25a can determine that moisture is present in and / or on the ceramic substrate 21 remains, in a determination that: either the first condition is formed according to “Tnow < T1” or the second condition is formed according to “ΔTnow < ΔT2”, or both the first condition is formed according to “ΔTnow < T1” and the second condition is formed according to “ΔTnow < ΔT2”.

[0095] Otherwise, the CPU determines 25a in a determination that the value Tnow is the temperature T of the ceramic support 21 greater than or equal to the preset evaporation temperature T1 and / or the rate ΔTnow of a change in the temperature T of the ceramic support 21higher than or equal to the preset threshold ΔT2 (NO in step S23), indicating that there is no moisture in and / or on the ceramic substrate. 21 remains, advancing to step S24. In step S24, the CPU sets 25a the shock flag is set to OFF (0) or retained, performing the normal power control in step S25; the normal power control is identical to that in step S14.

[0096] In summary, the CPU 25a , if the present time point is within the early stage of power input processing, the low-power control is deactivated while preventing normal power control, without the provisions in steps S10, S11 and S12, which are in Fig. The steps illustrated in section 5 are to be executed. Additionally, the CPU sets 25a Even after the early stage of power input processing, low-power control continues until the CPU 25aStep S23 determines that there is no moisture in and / or on the ceramic substrate. 21 remains, performing normal power control after determining that there is no moisture in and / or on the ceramic substrate 21 remains.

[0097] Fig. Figure 8 is a time-lapse diagram that schematically shows the temperature transitions T of the ceramic support. 21 (the catalyst layers 21b ), the rate ΔTnow of a change in the temperature T of the ceramic support 21 and the size of a feed rate to the ceramic support 21 illustrated depending on the state of the shock flag, while the CPU 25a the PR2 performance control program is running.

[0098] In the early stage of power input processing for catalyst heating, from the start of a power input to the ceramic support 21at a time td, where the preset time A has elapsed since the start of a power supply to the ceramic carrier 21 Once the time limit has expired, the shock flag is forcibly set to ON (see (c) and (d) according to Fig. 8) If there is no moisture in and / or on the ceramic substrate 21 The remaining value is the rate of increase of the temperature T of the ceramic support. 21 faster than when moisture is present in and / or on the ceramic substrate 21 remains (see (a) according to Fig. 8) That is, the rate ΔTnow of a change in the temperature T of the ceramic support. 21 , if there is no moisture in and / or on the ceramic substrate 21 The remaining moisture content is higher than that which occurs when moisture is present in and / or on the ceramic substrate. 21 remains (see (b) according to Fig. 8).

[0099] If the velocity ΔTnow corresponds to a change in the temperature T of the ceramic support 21higher than or equal to the preset threshold ΔT2 due to the absence of moisture in and / or on the ceramic substrate 21 is, in an example, the one that is defined by the dashed line (b) according to Fig. As illustrated in Figure 8, a feed rate is applied to the ceramic support. 21 from the low power P1 to the normal power P0 at time td increased.

[0100] In contrast, the rate ΔTnow is the rate of change of the temperature T of the ceramic support. 21 lower than the preset threshold ΔT2 due to moisture in and / or on the ceramic substrate 21 is present at a time td in an example defined by the solid line in (b) according to Fig. Figure 8 illustrates that low-power control continues even after the early power input processing stage is complete. Afterward, when the temperature T of the ceramic support... 21 When the evaporation temperature T1 is reached at a time te, the shock flag changes from ON to OFF, thus increasing the feed rate to the ceramic support. 21 from the low power P1 to the normal power P0.

[0101] As described above, the power supply unit according to the second embodiment is configured to perform low-power control in the early stage of the power supply process. This prevents bumping during boiling caused by the supply of normal power P0 to the ceramic support. 21 at the start of the energy supply of the ceramic carrier 21 .

[0102] The power supply device according to the second embodiment is also configured to be considered when the value Tnow is the temperature T of the ceramic support. 21 Since the temperature at this time is lower than the evaporation temperature T1, there is a high probability that moisture will be present in and / or on the ceramic substrate. 21 It remains, then continues the low-power control after the early stage of power input processing is complete. This simply determines whether moisture is present in and / or on the ceramic substrate. 21 This is included and reliably prevents the occurrence of bumping during boiling delay. If the rate ΔTnow of the change in temperature T of the ceramic support 21If the value is lower than the preset threshold ΔT2, the power supply device according to the second embodiment takes into account that there is a high probability that moisture is present in and / or on the ceramic substrate. 21 It remains in this state, then resumes low-power control after the early power input processing phase has ended. This reliably prevents the occurrence of a shock. Third example

[0103] A power supply control device according to the third embodiment of the present invention is described below with reference to Fig. 9 described.

[0104] The design and / or functions of the power supply device according to the third embodiment differ from those of the power supply device according to the second embodiment in the following respect. Therefore, the following description focuses primarily on this difference.

[0105] The power supply unit according to the second embodiment is programmed to operate in step S23 according to Fig. 7 to determine that moisture is present in the ceramic support 21 In other words, this implies that there is a possibility of collisions during boiling delay if the rate ΔTnow changes with a change in the temperature T of the ceramic support. 21 is lower than the preset threshold ΔT2 after the completion of the early stage of power input processing.

[0106] In contrast, the power supply device according to the third embodiment focuses on the fact that the rate ΔInow of a change in a current I supplied by the power source 24 to the ceramic carrier 21 is supplied at the rate ΔTnow of a change in the temperature T of the ceramic support. 21 is interrelated. Thus, the power supply unit is programmed according to the third embodiment to determine in step S23 that moisture is present in the ceramic carrier. 21 This includes, if the velocity ΔInow is a change in the current I flowing through the ceramic support. 21 The applied current is lower than a preset threshold ΔI3 after the completion of the early power supply processing stage. It should be noted that the rate ΔInow of a change in the current I supplied to the ceramic carrier 21supplied, an absolute value of the velocity ΔInow of an increase / decrease of the current I supplied to the ceramic support 21 is supplied. The velocity ΔInow of a change in the current I supplied to the ceramic support. 21 The change in the current I supplied to the ceramic support is represented by the change in the current I. 21 The amount supplied is per unit of time.

[0107] Fig. Figure 9 shows a time-lapse diagram that schematically illustrates the temperature transitions T of the ceramic support. 21 (catalyst layers 21b ), the rate of change ΔInow of a change in the current I flowing to the ceramic support 21 is supplied, and the size of a supply capacity to the ceramic support 21 illustrated depending on the state of the shock flag, while the CPU 25a the PR2 performance control program is running.

[0108] In the early stage of power input processing for catalyst heating, from the start of a power input to the ceramic support 21 at a time td, where the preset time A has elapsed since the start of power supply to the ceramic carrier 21 Once the time limit has expired, the shock flag is forcibly set to ON (see (c) and (d) according to Fig. 9) If there is no moisture in and / or on the ceramic substrate 21 The remaining value is the rate of increase of the temperature T of the ceramic support. 21 faster than when moisture is present in and / or on the ceramic substrate 21 remains (see (c) according to Fig. 9) That is, the rate ΔTnow of a change in the temperature T of the ceramic support. 21 , if there is no moisture in and / or on the ceramic substrate 21 The remaining moisture content is higher than that which occurs when moisture is present in and / or on the ceramic substrate. 21remains (see (c) according to Fig. 9).

[0109] Since the ceramic support 21 exhibiting the NTC characteristic, the resistance R of the ceramic support decreases. 21 with an increase in the temperature T of the ceramic support 21 ab, which is an increase in the current I flowing to the ceramic support 21 is supplied, resulting in. Specifically, as shown in (b) and (c) according to Fig. Figure 9 illustrates the rate ΔTnow of the temperature change of the ceramic support. 21 an interaction with the velocity ΔInow of a change in the current supplied to the ceramic support 21 is supplied. Thus, the velocity ΔInow is a change in the current supplied to the ceramic support. 21 is supplied when there is no moisture in / or on the ceramic substrate. 21 remains, like the rate ΔT of a temperature change of the ceramic support 21higher than when moisture is present in and / or on the ceramic substrate 21 remains (see (b) according to Fig. 9).

[0110] In an example shown by the dotted line (b) according to Fig. Figure 9 illustrates the velocity ΔInow of a change in the current flowing to the ceramic support. 21 supplied, higher than or equal to the preset threshold ΔI3 due to the fact that no moisture is in and / or on the ceramic substrate 21 is present. Thus, a supply of material to the ceramic support is established. 21 from the low power P1 to the normal power P0 at time td increased.

[0111] In contrast, the velocity ΔInow is a change in the current flowing to the ceramic support. 21 supplied at a time td in an example defined by the solid line (b) according to Fig. Figure 9 illustrates that the value is lower than the preset threshold ΔI3 due to the presence of moisture in and / or on the ceramic substrate. 21 is present. Thus, the low-power control continues even after the early stage of power input processing has finished. Afterwards, when the temperature T of the ceramic support... 21 When the evaporation temperature T1 is reached at a time te, the shock flag changes from ON to OFF, thus increasing the feed rate to the ceramic support. 21 from the low power P1 to the normal power P0.

[0112] As described above, the power supply device according to the third embodiment determines whether moisture is present in and / or on the ceramic substrate. 21 This includes, based on the velocity ΔInow of a change in the current flowing to the ceramic support. 21After the early stage of power supply processing, the same technical effects are achieved as with the power supply device according to the second embodiment, which is based on the rate ΔTnow of a temperature change of the ceramic support. 21 determines whether moisture is present in and / or on the ceramic substrate 21 is included. Fourth embodiment

[0113] A power supply control device according to the fourth embodiment of the present invention is described below with reference to Fig. 10 described.

[0114] The design and / or functions of the power supply device according to the fourth embodiment differ from those of the power supply device according to the second embodiment in the following respect. Therefore, the following mainly describes this difference.

[0115] The power supply device according to the fourth embodiment focuses on the fact that the rate ΔRnow of a resistance change of the ceramic support 21 an interaction with the velocity ΔTnow a change in the temperature T of the ceramic support 21 exhibits. Thus, the power supply device is programmed according to the fourth embodiment to determine in step S23 that moisture is present in the ceramic support. 21 This includes situations where the velocity ΔRnow is a change in the resistance of the ceramic support. 21 higher than or equal to a preset threshold ΔR3 after the completion of the early power input processing stage. It should be noted that the rate ΔRnow is a change in the resistance R of the ceramic support. 21 an absolute value of the velocity ΔRnow of an increase / decrease in the resistance R of the ceramic support 21is the rate ΔRnow of a change in the resistance R of the ceramic support. 21 represents the change in the resistance R of the ceramic support. 21 per unit of time.

[0116] Fig. Figure 10 is a time-lapse diagram that schematically illustrates the temperature transitions T of the ceramic support. 21 (the catalyst layers 21b ), the rate ΔRnow of a change in resistance of the ceramic support 21 and the size of a feed rate to the ceramic support 21 illustrated depending on the state of the shock flag, while the CPU 25a the PR2 performance control program is running.

[0117] In the early stage of power input processing for catalyst heating, from the start of a power input to the ceramic support 21at a time td, where the preset time A has elapsed since the start of power supply to the ceramic carrier 21 Once expired, the shock fly is forced to ON (see (c) and (d) according to Fig. 10) If there is no moisture in and / or on the ceramic substrate 21 The remaining value is the rate of increase of the temperature T of the ceramic support. 21 faster than when moisture is present in and / or on the ceramic substrate 21 remains (see (c) according to Fig. 9) That is, the rate ΔTnow of a change in the temperature T of the ceramic support. 21 , if there is no moisture in and / or on the ceramic substrate 21 The remaining moisture content is higher than that which occurs when moisture is present in and / or on the ceramic substrate. 21 remains (see (c) according to Fig. 10).

[0118] Since the ceramic support 21exhibiting the NTC characteristic, the resistance R of the ceramic support decreases. 21 with an increase in the temperature T of the ceramic support 21 ab. Specifically, as shown in (b) and (c) according to Fig. Figure 10 illustrates the rate ΔTnow of a temperature change of the ceramic support. 21 an interaction with the rate ΔRnow of a change in resistance of the ceramic support 21 Therefore, the rate ΔRnow of a change in resistance of the ceramic support is 21 , if there is no moisture in and / or on the ceramic substrate 21 remains lower than when moisture is present in and / or on the ceramic substrate 21 remains (see (b) according to Fig. 10).

[0119] In an example shown by the dashed line in (b) according to Fig. Figure 10 illustrates the rate ΔRnow of a change in resistance of the ceramic support.21 lower than the preset threshold ΔR3 due to the absence of moisture in and / or on the ceramic substrate 21 is present. Thus, a supply of material to the ceramic support is established. 21 from the low power P1 to the normal power P0 at time td increased.

[0120] In contrast, the rate ΔRnow is the rate of change of resistance of the ceramic support. 21 at a time td in an example defined by the dashed line in (b) according to Fig. Figure 10 illustrates that the value is higher than or equal to the preset threshold ΔR3 due to the presence of moisture in and / or on the ceramic substrate. 21 is present. Thus, the low-power control continues even after the early stage of power input processing has finished. Afterwards, when the temperature T of the ceramic support... 21When the evaporation temperature T1 is reached at a time te, the shock flag changes from ON to OFF, thus increasing the feed rate to the ceramic support. 21 from the low power P1 to the normal power P0.

[0121] As described above, the power supply device according to the fourth embodiment, which is based on the rate ΔRnow of a resistance change of the ceramic support, achieves 21 After the completion of the early stage of power input processing, it is determined whether moisture is present in and / or on the ceramic substrate. 21 This includes the same technical effects as the power supply device according to the second embodiment, which is based on the rate ΔTnow of a temperature change of the ceramic support. 21 determines whether moisture is present in and / or on the ceramic substrate 21 is included.

[0122] The present disclosure is not limited to the embodiments described above and can be modified as described below. It should be noted that some of the elements of the first to fourth embodiments specified above can be freely combined with one another.

[0123] The CPU 25a It is determined in each of steps S10 and S23 that moisture is present in and / or on the ceramic substrate. 21 evaporates to disappear when the value Tnow is the temperature T of the ceramic support 21 at this time is higher than or equal to the evaporation temperature T1, but the present disclosure is not limited to this.

[0124] Specifically, the CPU can 25a determine that moisture is present in and / or on the ceramic substrate 21evaporates to disappear when a preset time has elapsed since the start of an energy supply to the ceramic support. 21 at least one of steps S10 and S23 has occurred. In this modification, the preset time can be adjusted so that the higher the temperature of the ceramic support, the longer the time. 21 at the start of a power supply to the ceramic carrier 21 The longer the time, the shorter the preset time.

[0125] The CPU 25a In each of the steps S10, S11 and S12, reference is made to figure M1 (the RT characteristic curve) using the value of the resistance R of the ceramic support. 21 as a key to calculating a value of the temperature T of the ceramic support 21 , however, the present disclosure is not limited to this.

[0126] Specifically, the present disclosure may be provided with a temperature sensor mounted on the ceramic support. 21 is attached, whereby it uses a measured value from the temperature sensor as a value of the temperature T of the ceramic support. 21 S10, S11, and S12 are used in each of the steps. While the power machine 10 is inactive and the ceramic carrier 21 If it is not supplied with energy, the temperature of the ceramic support can change. 21 are considered identical to the outside air temperature, the temperature of the engine coolant, or the temperature of the intake air when the EHC device is in operation. 20 is sufficiently cooled. Thus, the present disclosure can define any of the outside air temperature, the temperature of the engine coolant, or the temperature of the inlet air as a value of the temperature T of the ceramic support. 21 Use S10, S11 and S12 in each of the steps.

[0127] The present disclosure can freely combine the destination operations in steps S10, S11 and S12 and the destination operation in step S23 to achieve in each of the Fig. 5 and Fig. 7. To determine whether moisture is present in and / or on the ceramic substrate. 21 is included.

[0128] In each of the first to fourth embodiments, the present disclosure is applied to the EHC device. 20 applied, which the ceramic carrier 21 used as an example in Fig. 2 is illustrated, but it can be applied to an EHC device that uses a conductive porous support carrying a catalyst.

[0129] In each of the first to fourth embodiments, the present disclosure is applied to an EHC device whose support has the NTC characteristic as specified above, but it can also be applied to an EHC device whose support does not have the NTC characteristic, i.e., whose support has a property in which resistance increases as the temperature increases.

[0130] While illustrative embodiments of the present invention have been described herein, the present disclosure is not limited to the embodiments described herein, but encompasses any and all embodiments that include modifications, omissions, combinations (for example, of configurations across different embodiments), adaptations, and / or changes, as would be apparent to a person skilled in the art based on the present disclosure. The limitations in the claims are to be interpreted broadly based on the language used in the claims and are not limited to examples described in the present specification or during the pursuit of the application, and such examples are to be considered non-exclusive.

[0131] In a device for controlling the power supply to a conductive porous support of a catalyst device for emission control, a moisture detection device determines whether moisture is contained in and / or on the conductive porous support. A power control device regulates the power supply to the conductive porous support such that, when moisture is determined to be contained in and / or on the conductive porous support, the power supply value is lower than the power supply value when moisture is determined not to be contained in and / or on the conductive porous support. QUOTES INCLUDED IN THE DESCRIPTION

[0132] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0133] JP 2010-103575

[0001] JP 3602614

[0003]

Claims

[1] Device for controlling a power supply to a conductive porous support of a catalyst device for cleaning an emission, wherein the conductive porous support carries a catalyst of the catalyst device, wherein the conductive porous support is supplied with energy for heating the catalyst, the device comprising: a moisture detection device for determining whether moisture is contained in and / or on the conductive porous substrate, and A power control device for controlling the power supply to the conductive porous carrier for a power supply of the conductive porous carrier, such that a value of the power supply to the conductive porous carrier, when it is determined that the moisture is contained in and / or on the conductive porous carrier, is lower than a value of the power supply to the conductive porous carrier, when it is determined that the moisture is not contained in and / or on the conductive porous carrier. [2] Device according to claim 1, wherein the moisture detection device is configured to determine that the moisture is contained in and / or on the conductive porous support, provided that a time of determination is within a time period for which a preset time has elapsed since the start of a supply of power to the conductive porous support. [3] Device according to claim 1, wherein the emission originates from an internal combustion engine and the moisture detection device comprises a residual detection device configured to determine during the internal combustion engine shutdown whether water vapor generated by ignition of the internal combustion engine during a final operating period of the internal combustion engine remains in and / or on the conductive porous support, wherein the moisture detection device is configured to determine that the moisture is contained in and / or on the conductive porous support, as long as it is determined that the water vapor generated by ignition of the internal combustion engine during the final operating period of the internal combustion engine remains in and / or on the conductive porous support. [4] Device according to claim 3, wherein the residual determination device is configured to determine that the moisture is contained in and / or on the conductive porous support, as long as the temperature of the conductive porous support at the last shutdown of the internal combustion engine is lower than a preset threshold. [5] Device according to claim 1, wherein the moisture detection device comprises a condensation detection device configured to determine whether condensation is forming on the conductive porous support, wherein the moisture detection device is configured to determine that the moisture is contained in and / or on the conductive porous support, as long as it is determined that condensation is forming on the conductive porous support. [6] Device according to claim 5, wherein the emission originates from an internal combustion engine and the condensation detection device is configured to determine that condensation forms on the conductive porous support as long as the temperature of the conductive porous support is lower than a preset threshold while the internal combustion engine is in operation. [7] Device according to claim 1, wherein the moisture detection device is configured to determine that the moisture is contained in and / or on the conductive porous support, as long as one of an absolute value of a rate of change of a temperature of the conductive porous support and one of an absolute value of a change of a physical parameter that has a relationship with the temperature of the conductive porous support is lower than a preset value, irrespective of whether power is supplied to the conductive porous support. [8] Device according to claim 1, wherein the moisture detection device is configured to determine that the moisture is contained in and / or on the conductive porous support as long as a temperature of the conductive porous support is higher than or equal to a preset evaporation temperature. [9] Device according to claim 1, wherein the conductive porous support has a property in which a resistance decreases with an increase in temperature. [10] Device according to claim 1, wherein the conductive porous support is a conductive ceramic support. [11] Computer program product for a device for controlling a power supply to a conductive porous support of a catalyst device for cleaning an emission, wherein the conductive porous support carries a catalyst of the catalyst device, wherein the conductive porous support is supplied with energy for heating the catalyst, and wherein the computer program product comprises: a medium usable by a computer, and a set of computer program instructions contained on the medium usable by the computer, wherein the instructions comprise: a first instruction for determining whether moisture is contained in and / or on the conductive porous substrate, and a second instruction for controlling the power supply to the conductive porous carrier for a power supply of the conductive porous carrier, such that a value of the power supply to the conductive porous carrier, when it is determined that the moisture is contained in and / or on the conductive porous carrier, is lower than a value of the power supply to the conductive porous carrier, when it is determined that the moisture is not contained in and / or on the conductive porous carrier.