Semiconductor device

Abstract

Semiconductor device comprising: a packing component (1) obtained by sealing a semiconductor element; and a housing (3) which forms a unit by inserting the packing component (1) into the housing (3), wherein: the packing component (1) comprises a connection (21) extending upwards from a side surface thereof; the housing (3) includes a busbar (4) which is connected to the terminal (21) and extends upwards from one side; and the connection (21) extends in such a way that it widens upwards, wherein the connection (21) has a projection on a contact part with the busbar (4).

Description

[0001] The present invention relates to a semiconductor device, and more particularly to a semiconductor device using semiconductor elements in which a large current flows.

[0002] US 2009 / 0 160 048 A1 discloses a semiconductor device comprising a semiconductor chip and terminals electrically connected to the electrodes of the semiconductor chip. A hollowed-out cooler houses the semiconductor device, which is encapsulated in resin with high thermal conductivity and electrically insulating properties.

[0003] US 2007 / 0 183 130 A1 describes a power converter with a base. The base has a first and a second section coupled to each other at a specific angle. Power modules are mounted on the first section, and a control plate is mounted on the second section such that a first main surface of the control plate directly or indirectly contacts the second section. Components forming a control circuit are mounted on a second main surface of the control plate.

[0004] JP 2006-302543 A describes a terminal connecting method. A predetermined connecting portion having a shape such that an opposite corner portion is recessed toward the center is formed at an end portion of a part-side connecting terminal of the busbar. The end faces of the part-side connecting terminal of the busbar and the electronic component connecting terminal are brought into contact with each other, and the end portions of both connecting terminals are melted and connected by irradiating a laser beam onto a near-center portion thereof. As a result, the entire predetermined connecting portion is melted by nearly uniform heat transfer to the entire predetermined connecting portion formed on the part-side connecting terminal, and the generation of metal scrap formed at the unmelted portion is prevented in advance.

[0005] DE 39 09 010 C2 describes an expansion anchor with outwardly facing barbed tongues or fins which counteract unwanted pulling out of the expansion anchor from its receiving bore.

[0006] JP 2009-99339 A describes a wiring connection structure of an electronic device. It has a connection section in which the respective head portions of an I / O terminal and a wiring are arranged in the same direction and overlap each other. The connection section is connected by welding and has a section for preventing void formation in the connection section at the time of welding.

[0007] Typically, wiring connection of a semiconductor device using semiconductor elements is performed by threaded connection or soldering. However, in the case of wiring connection by threaded connection, it is difficult to reduce the size and weight of a semiconductor device, whereas in the case of wiring connection by soldering, high durability is difficult to achieve in a mounting portion. Furthermore, production efficiency of the manufacturing steps in both threaded connection and soldering is undesirable, and the steps depend on an operator. This makes it difficult to improve productivity and achieve stable steps.

[0008] In contrast to the above-mentioned wiring connection method, there is, for example, a method for establishing a wiring connection by welding, as described in JP 2002-134688 A. However, in the case of connection by welding, it is necessary to apply a potential to each fixed portion using a special welding jig such as a clamp. Therefore, package components (PKG components) in which the required semiconductor elements are sealed with a resin are installed in a case to manufacture a semiconductor device. As a result, a terminal exposed from the package component is brought into contact with a bus bar in the case, thereby easily performing wiring connection.

[0009] However, even in the above-mentioned case, the packing component and the guide rail are not in contact with each other or are not conductively connected at a fastening portion, resulting in the problem that poor welding may occur. For example, no arc discharge is generated because no potential is applied, and as a result, welding cannot be performed. Furthermore, a branched shape is created in which the base materials melt individually but are not bonded to each other.

[0010] It is an object of the invention to provide a semiconductor device that can achieve wiring connection with excellent productivity, high quality, high reliability and long life.

[0011] This object is achieved according to the invention by a semiconductor device according to claim 1 or claim 2. Further embodiments are specified in the subclaims.

[0012] A semiconductor device according to the invention comprises a package component obtained by sealing a semiconductor element, and a housing that forms a unit (assembly) by inserting the package component therein. The package component includes a terminal extending upward from one side surface thereof. The housing includes a lead bar that is in contact with the terminal and extends upward from one side. The lead extends in such a way that it widens upward.

[0013] According to the semiconductor device of the invention, contact between the terminal and the guide rail as a wiring part of the package can be ensured, and poor welding can be ensured. Therefore, it is possible to obtain a wiring connection with excellent productivity, high quality, high reliability, and long service life, thus achieving high reliability of the semiconductor device.

[0014] These and other objects, features, aspects and advantages of the invention will become more apparent from the following detailed description of the invention taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic perspective view showing a semiconductor device according to a first embodiment; Fig. 2 is a plan view showing the semiconductor device according to the first embodiment; Fig. 3 is a cross-sectional view showing the semiconductor device according to the first embodiment; Fig. 4 shows the relationship between a bending angle of a terminal of a packing component and a reaction force exerted on the terminal of the packing component by a guide rail in a case where the packing component is inserted; Fig. 5 is a cross-sectional view showing a semiconductor device according to a second embodiment; Fig. Fig. 6 is a cross-sectional view showing a semiconductor device according to a third embodiment of the invention; and Fig. 7 is a cross-sectional view showing a semiconductor device according to a fourth embodiment of the invention. DESCRIPTION OF THE EMBODIMENTS

[0015] A semiconductor device according to a first embodiment and a method of manufacturing the semiconductor device will be described below with reference to the drawings. A-1. Configuration

[0016] Fig. 1 is a schematic perspective view of a semiconductor device 101 according to the first embodiment. Fig. 2 is a plan view of Fig. 1.

[0017] With reference to Fig. 1, the semiconductor device 101 includes an input / output terminal 5 in a housing 3 and includes package components 1 provided with terminals 2 connected to the input / output terminal 5 in the housing 3.

[0018] A plurality of packing components 1 are present in the housing 3 and the respective packing components 1 are connected to one another by guide rails 4.

[0019] Fig. 2 is a view showing the semiconductor device 101 of Fig. 1 as seen from above, wherein it can be seen that the plurality of packing components 1 accommodated in the housing 3 are connected to one another by the guide rails 4 and that the input / output terminal 5 provided on the housing 3 is connected to the terminals 2 of the packing components 1.

[0020] Fig. 3 is a cross-sectional view of the semiconductor device 101 shown in the Fig. 1 and Fig. 2 is shown. Fig. Figure 3 is a detailed cross-sectional view showing the Fig. 1 and Fig. 2 omitted components are added.

[0021] The semiconductor device 101 includes the package components 1 as package components in which semiconductor elements and the like are sealed with a resin, the case 3 in which the plurality of package components 1 are inserted to form a unit, the guide rails 4 for the case 3 which are interposed when the respective package components 1 are connected to each other, and the terminals 2 for the package components 1.

[0022] The semiconductor device 101 further includes the configuration described below. Note that the dimensions of the respective parts described below are only examples and are not limited to the dimensions to be described.

[0023] The housing 3 of the semiconductor device 101 has a side of about 60 to 400 mm and a height of about 50 to 70 mm in a planar direction and is fixed to an upper surface of a cooler 6 having an area of ​​60 to 400 mm 2 The housing 3 has no bottom, and the bottom surface is formed by the cooler 6, which is attached to the housing 3.

[0024] The housing 3 is obtained by integrally molding a conductive metal composed primarily of copper and having a thickness of 0.6 to 2.5 mm with a thermoplastic resin such as poly(phenyl sulfide) (PPS) and poly(butylene terephthalate) (PBT). A portion of the conductive metal is exposed from the resin as guide rails 4 and input / output terminal 5. The guide rails 4 are each connected to the input / output terminal 5 by wiring. The input / output terminal 5 is connected to a power supply of a battery or the like, a motor drive, or a generator.

[0025] The cooler 6, positioned below the housing 3, is primarily constructed of aluminum, which cools the semiconductor elements mounted in the package components 1 by air cooling or water cooling. The housing 3 is attached and fixed to the cooler 6 with an adhesive.

[0026] As described above, a plurality of packing components 1 (in Fig. 1 14 package components) are housed in the housing 3. The package components 1 include semiconductor elements, such as an insulated gate bipolar transistor (IGBT) and a freewheeling diode (FwDi).

[0027] The above semiconductor element is attached to a circuit board with heat dissipation capability, for example, with a metal attachment material made of tin or the like, a silver paste with a thermal conductivity of 20 to 90 W / mk, or a nano-paste-type conductive adhesive material with a strength of up to 175°C or higher. Furthermore, the semiconductor elements and the circuit board in the package component 1 are realized by wire bonding with a wire made of aluminum or the like or a metal bonding material made of tin or the like.

[0028] Then, the package components 1 are integrally molded with a resin, such as PPS resin, PBT resin, or epoxy resin, and the terminals 2, which are mainly composed of copper and are the wiring parts of the package components 1, are exposed. While the semiconductor elements are an IGBT and a freewheeling diode in the first embodiment, metal-oxide-semiconductor field-effect transistors (MOSFETs), for example, may be used depending on the application.

[0029] The number of semiconductor elements mounted in package 1 varies according to their application. Therefore, the size of package component 1 corresponds to the specifications (in number and size) of a semiconductor element, and one side of the package component is 20 to 80 mm long.

[0030] The package component 1 is attached to the cooler 6 through a thermal lubricant 7. The thermal lubricant 7 has a heat dissipation efficiency of approximately 1.1 to 5 W / mK, and the heat generated in the semiconductor element mounted on the package component 1 is dissipated to the cooler 6 through the heat dissipation circuit board and the thermal lubricant 7. As a result, the properties of the semiconductor element can be sufficiently utilized.

[0031] A control substrate 8, which includes a capacitor, an IC, a protection circuit, and the like, is mounted on upper surfaces of the package components 1 and is connected to signal terminals of the package components 1 by wiring (not shown). Although in the Fig. 1 to 3, the interior of the housing 3 may be filled with a resin, such as an epoxy resin. Alternatively, a cover may be provided by threaded fastening further above the control substrate 8.

[0032] A semiconductor product has a conduction current of 45 to 400 A and a rated voltage of 600 to 1,500 V. The semiconductor product has the function of a converter, which mainly increases an input voltage, and acts to recover regenerative energy of a motor and to control the motor.

[0033] The terminal 2 of the package component 1 is connected to each electrode of the semiconductor element and has a width of approximately 3 to 20 mm and a thickness of approximately 0.5 to 2.0 mm. The terminal 2 is exposed from a side surface of the package component 1, undergoes shaping to be bent, and extends to widen upwardly so that the portion thereof having a length of approximately 3 to 10 mm faces upward and is in contact with the guide rail 4 near the tip of the terminal 2.

[0034] The terminal 2 has a shape that extends horizontally from the side surface of the package component 1 and is bent and guided substantially vertically upward. In this case, the terminal 2 is formed to be guided upward at a smaller angle than the case where the terminal 2 is bent vertically upward, so that the ends of the terminals 2 extend so as to be spaced apart from each other (expand upward) and lean against the side of the guide rail 4. That is, the bending angle of the terminal 2 is less than 90°.

[0035] By forming in this manner, a reaction force is exerted on the terminals 2 of the packing components 1 by the guide rails 4 that are in contact with them, respectively. The guide rail 4 is in contact with the terminal 2 from the side. In the first embodiment, the bending angle of the terminal 2 is equal to or greater than 75° and less than 90°. The guide rail 4 is formed with a thickness slightly greater than the thickness of the terminal 2 and with a rigidity different from that of the terminal 2.

[0036] Fig. Figure 4 shows the relationship between the bending angle of terminal 2 and a reaction force. Fig. 4, the horizontal axis represents the bending angle of the terminal 2, and the vertical axis represents the reaction force applied to the terminal 2. In the first embodiment, the bending angle is set so that a reaction force of 80 N or less is applied, that is, the bending angle is 75° or more. This is because it is conceivable that the magnitude of the reaction force can remain almost unchanged even if the terminal 2 is bent at a bending angle of 75° or less, and therefore there is no difference in the effects of improving contact by the reaction force. Due to the reaction force from the guide bar 4, the terminal 2 and the guide bar 4 are brought into contact with each other and are made conductive, thereby making it possible to easily realize wiring connection in the semiconductor device 101.For this reason, the resistance value of terminal 2 and guide rail 4 is 0.1 Ω or less.

[0037] The port 2 has the shape of widening upwards, and accordingly, the packing component 1 can be mounted while the port 2 is in contact with the guide rail 4, which facilitates operation. In addition, as shown in Fig. 3, in the case where the terminals 2 are positioned symmetrically with respect to the center of the packing component 1, that is, in the case where a pair of terminals 2 are arranged at positions opposite to each other on the opposite side surfaces of the packing component 1, reaction forces are applied to the terminals 2 in substantially symmetrical directions with respect to the center of the packing component 1. Accordingly, the position and arrangement of the packing component 1 can be easily fixed on the radiator 6 with the reaction force providing guidance. This brings about the effect that the positioning structure for the packing component 1 and a welding jig, which are conventionally required, are no longer required.

[0038] The wiring connection in the semiconductor device 1 becomes more stable by welding the portion (welding part 11) where the tips of the terminal 2 and the guide bar 4 are in contact with each other, with the result that a wiring connection can be obtained in which a bonding strength of a certain level or higher is ensured. It is possible to use arc welding and grounding, such as TIG welding, laser welding using a laser source capable of local heating, or welding using an electron beam as the welding technique.

[0039] Normally, with the aforementioned welding techniques, a potential must be applied to all the mounting portions, or the bonding will be poor if there is a gap between the mounting portions. However, in the first embodiment, the terminal 2 and the guide rail 4 are in contact with each other while experiencing a reaction force and are conductive, and thus, it is not necessary to apply an electric potential to each mounting portion with a special welding jig such as a clamp. That is, if a relevant portion of the input / output terminal 5 of the semiconductor device 101 is wired with a cable or the like to be applied with an electric potential, welding can be easily performed.In addition, it is possible to avoid the situation in which welding cannot be performed due to the fact that the electric potential is not supplied (processing time is improved).

[0040] The terminal 2 and the guide rail 4 are in contact with each other at the ends which are fastening portions, and thus a gap (gap interval) between the terminal 2 and the guide rail 4 can be limited to be at most half of the smaller of the thicknesses of the terminal 2 and the guide rail 4 (in the first embodiment, the thickness of the terminal 2). Accordingly, it is possible to prevent the generation of a branch shape (a shape in which the fastening portions have not one fastening shape but two fastening shapes, and a poor weld in which the terminal 2 and the guide rail 4 are not properly fastened to each other or only a part of them is fastened) resulting from a gap.

[0041] In the case that the terminal 2 of the packing component 1 is not in contact with the guide rail 4, the terminal 2 is directly in contact with the housing (see Fig. 3). The side surface of the casing 3, with which the terminal 2, which is not in contact with the guide rail 4, is initially brought into contact when the packing component 1 is mounted on the radiator 6, is formed to have a tapered shape 3a. As a result, the tapered shape 3a serves as a guide when the packing component 1 is mounted, and the mountability thereof is improved, thereby making it possible to prevent the resin casing from cracking or chipping, which tend to occur when the packing component 1 is mounted. A-2. Manufacturing process

[0042] Manufacturing steps for the semiconductor device 101 will be described sequentially below. The case 3, which is molded integrally with the guide rails 4, is manufactured, and then the case 3 and the cooler 6, which is manufactured by die casting or brass brazing, are fixed to each other with an adhesive (the cooler 6 in the first embodiment).

[0043] Next, the thermal lubricant 7 is applied or printed on the cooler 6 between the side surfaces of the housing 3, and the packing components 1 are lowered vertically at positions on the upper surface of the cooler 6 where the thermal lubricant 7 has been applied. For this purpose, the packing components 1 are pressed into the housing 3, while their displacements and loads are controlled by the device having an adhesive force and a compressive force.

[0044] The packing component 1 is provided with the terminals 2, and when the packing component 1 is mounted on the cooler 6, the terminals 2 are brought into contact with the guide rails 4 provided on the casing 3 or the side surface of the casing. A pair of terminals 2 are provided so that they lean against the side of the guide rail 4 or the side surface of the casing, that is, so that they expand upwards, and thus the reaction force is exerted on the terminal 2 by the guide rail 4 or the side surface of the casing.

[0045] Next, welding is performed on the tips of the terminal 2 and the guide rail 4 which are in contact with each other by exerting the reaction force (welding part 11 of Fig. 3). Finally, the control substrate 8 is placed above the housing 3 and soldered, and a cover is screwed on (not shown). Note that the terminal 2 and the guide rail 4 may be press-bonded instead of bonded by welding.

[0046] In this way, in the method for manufacturing the semiconductor device 101 according to the first embodiment, the semiconductor elements are not directly implemented, and thus the semiconductor device can be manufactured easily. Moreover, the semiconductor device 101 includes a plurality of package components 1, and therefore, if a malfunction occurs in the semiconductor element for some reason during the manufacturing steps or use as a product, it is sufficient that only a malfunctioning portion, that is, only the malfunctioning package component 1, is replaced or repaired. This is considerably advantageous in terms of cost, considering that the entire product is usually discarded. A-3. Effects

[0047] According to the first embodiment, the semiconductor device includes: the package component 1 as a package component obtained by sealing a semiconductor element; and the case 3 which is integrally formed by inserting the package component 1 into the case (3), wherein the package component 1 includes the terminal 2 extending upward from one side surface thereof; the case 3 includes the guide bar 4 which is in contact with the terminal 2 extending upward from one side surface; and the terminal 2 extends so as to expand upward. Accordingly, the contact between the terminals 2 and the guide bars 4 as the wiring part of the case 3 can be ensured, and the generation of poor quality welding can be prevented.Therefore, it is possible to achieve a wiring connection that is excellent in productivity and has high quality, high reliability, and a long service life, resulting in high reliability of the semiconductor device. In addition, the wiring connection is simplified.

[0048] Furthermore, according to the first embodiment, in the semiconductor device, the terminal 2 and the guide bar 4 are welded together. Accordingly, it is possible to obtain a semiconductor device having a more stable wiring connection and excellent reliability.

[0049] Furthermore, according to the first embodiment, the terminal 2 in the semiconductor device includes a plurality of terminals 2, and the plurality of terminals 2 are arranged at positions opposite to each other on opposite side surfaces of the packaged product 1. Accordingly, the reaction forces are applied to the package component 1 from the guide rails 4 in substantially symmetrical directions, and the package component 1 is easily positioned with the reaction forces providing guidance for mounting.

[0050] Furthermore, according to the first embodiment, the side surface of the housing 3 in the semiconductor device has a tapered shape 3a. Accordingly, when inserting the package component 1, it is possible to prevent malfunctions such as damage to the side surface of the housing 3 caused by the terminal 2 not being in contact with the guide rail 4 and damage to the terminal 2. In addition, the package component 1 can be inserted easily. B. Second EmbodimentB-1. Configuration

[0051] Fig. 5 is a cross-sectional view of a semiconductor device 102 according to a second embodiment. The semiconductor device 102 includes package components 1 in which the semiconductor elements are sealed with a resin, the case 3 integrally formed with the guide rails 4, and the cooler 6. Other components, which are denoted by similar reference numerals to those of the first embodiment, are similar to those of the first embodiment, and therefore, their detailed description will be omitted.

[0052] A terminal 20 of the packaging component 1 has a shape such that it extends horizontally from the side surface of the packaging component 1 and is bent and guided substantially vertically upward. In this case, the terminal 20 is formed to be bent upward at a smaller angle than the vertically upward direction, so that the ends of the terminals 20 extend in directions such that they are away from each other (expand upward) and lean against the side of the guide rail 4 with which they are in contact, respectively. Moreover, the terminal 20 has a bent shape so that it extends counter to the vertical direction from the bent portion to the tip, that is, so that the contact part between a pair of terminals 20 and the guide rails 4 is parallel to the guide rails 4.

[0053] The above-described configuration increases the contact area between the ends of the terminal 2 and the guide rail 4, making it possible to increase the bond size and ensure sufficient fastening strength. Furthermore, the wiring connection by welding allows the terminal 20 and the guide rail 4 to contact each other even near the bottom of the fastening part, in addition to the fastening part created by welding, and thus the wiring connection can have high quality and a long service life. This results in high quality and a long service life of the semiconductor device, and thus the above-described wiring connection is particularly suitable for a semiconductor device for vehicle installation.

[0054] Furthermore, when mounted on the cooler 6, the packing components 1 can be smoothly inserted and assembled from the beginning of assembly. It should be noted that the connector 20 and the guide rail 4 can have the same shape. B-2. Effects

[0055] According to the second embodiment, the terminal 20 in the semiconductor device includes a bending part to cause a contact part with the guide rail 4 to be parallel to the guide rail 4. Accordingly, the contact area between the terminal 20 and the guide rail 40 increases, thereby realizing a wiring connection having higher quality and a longer life. C. Third EmbodimentC-1. Configuration

[0056] Fig. 6 is a cross-sectional view of a semiconductor device 103 according to a third embodiment of the invention. The semiconductor device 103 includes the package components 1 in which semiconductor elements are sealed with a resin, the case 3 integrally formed with the guide rails 4, and the cooler 6. Other components, denoted by similar reference numerals to those of the first embodiment, are similar to those of the first embodiment, and therefore a detailed description thereof is omitted.

[0057] A terminal 21 of the package component 1 has a shape such that it extends horizontally from the side surface of the package component 1 and is bent and guided substantially vertically upward. In this case, the terminal 21 is formed to be guided upward at a smaller angle than the angle at which the terminal 21 is bent (vertically upward), so that the ends of the terminals 21 extend in directions such that they are away from each other (expansion upward) and lean against the side of the guide rail 4 with which each of them is in contact. Moreover, the terminal 21 has a convex shape (protrusion) in a portion (contact part) where the terminal 21 and the guide rail 4 are in contact with each other.

[0058] The terminal 21 and the guide rail 4 are easily brought into contact with each other and conductively connected by forming a tip of the terminal 21 on the side of the guide rail 4 with which the tip of the terminal 21 is in contact with a convex shape (protrusion).

[0059] Furthermore, pressure plates 9 can be arranged on the upper surfaces of the packing components 1 by springs 10 after mounting the packing components 1 on the radiator 6, thereby pressing the packing components 1 downward. As a result, the contact portion between the terminal 21 and the guide rail 4 is stabilized, and thus, it is possible to maintain the heat dissipation capability of the packing component 1 even when the upward force is applied to the packing component 1. Note that the springs 10 and the pressure plates 9 can also be provided in the first and second embodiments.

[0060] It should be noted that in the case where the terminal 21 including a projection is provided, the terminal 21 may have such a bending angle that an apex portion of the convex shape is in contact with the guide rail 4 and the reaction force is applied thereto. C-2. Effects

[0061] According to the third embodiment of the invention, the terminal 21 in the semiconductor device includes a protrusion at the contact portion with the guide rail 4. Accordingly, the terminal 21 and the guide rail 4 are easily connected, enabling highly reliable wiring. In addition, processing is facilitated. D. Fourth EmbodimentD-1. Configuration

[0062] Fig. 7 is a cross-sectional view of a semiconductor device 104 according to a fourth embodiment of the invention. The semiconductor device 104 includes the package components 1 in which semiconductor elements are sealed with a resin, the case 3 integrally formed with the guide rails 40, and the cooler 6. Other components denoted by similar reference numerals to those of the first embodiment are similar to those of the first embodiment, and therefore, a detailed description thereof is omitted here.

[0063] A terminal 22 extends substantially vertically upward from the side surface of the package component 1. In this case, the terminal 22 is formed so as to be inclined upward with respect to the vertical toward the guide rail 40 side, that is, so that the ends of the terminals 22 extend so as to be away from each other (moving away from each other upward) and lean against the side of the guide rail 40 with which each of them is in contact. Moreover, its tip has an R-shape toward the directions in which a pair of terminals 22 face each other (directed inward). Similarly, the guide rail 40 is also formed so as to extend substantially vertically upward while being inclined toward the terminal 22 side. The terminal 22 and the guide rail 40 are in contact with each other at the R-shaped tip portions thereof and are brought into conduction.

[0064] In the portion where the terminal 22 and the guide rail 40 are in contact with each other, a rounded surface is created by forming each of them with a wire-cut molding that can be inserted. However, the directions of the rounded surfaces must be opposite to each other.

[0065] The above-mentioned configuration allows the terminal 22 and the guide rail 40 to be easily brought into contact with each other, and a new step for bringing the terminal 22 and the guide rail 40 into contact with each other is not required in the manufacturing steps, thus achieving cost-effectiveness. Note that the terminal 22 and the guide rail 40 may have the same thickness.

[0066] In addition, the existing R-shaped section increases the welding and fastening size and thus it is possible to obtain a fastening part with sufficient fastening strength.

[0067] The tips of the connector 22 and the guide rail 40 do not need to be welded.

[0068] The tapered shape 3a as described in the first to third embodiments is not formed in the side surface of the housing 3 of Fig. 7, which can be provided in a similar way. D-2. Effects

[0069] According to the fourth embodiment of the invention, the tip of the terminal 22 has an R-shaped portion extending inward, allowing the terminal 22 and the guide rail 40 to be easily brought into contact with each other. In addition, the terminal 22 is formed and cut with a molded body, thus also utilizing a rounded surface. Accordingly, the step of bringing the terminal 22 and the guide rail 40 into contact with each other becomes unnecessary.

[0070] Furthermore, according to the fourth embodiment of the invention, in the semiconductor device, the guide rail 40 has a similar shape to the terminal 22, which allows the terminal 22 and the guide rail 40 to be easily brought into contact with each other. In addition, it is possible to ensure conduction even after applying a larger reaction force. Furthermore, the package components 1 are stably fixed.

Claims

[1] A semiconductor device comprising: a package component (1) obtained by sealing a semiconductor element; and a housing (3) which forms a unit by inserting the packing component (1) into the housing (3), wherein: the packing component (1) comprises a terminal (21) extending upwardly from a side surface thereof; the housing (3) comprises a busbar (4) which is connected to the terminal (21) and extends upwards from one side; and the connection (21) extends so that it widens upwards, wherein the terminal (21) has a projection on a contact part with the busbar (4). [2] A semiconductor device comprising: a package component (1) obtained by sealing a semiconductor element; and a housing (3) which forms a unit by inserting the packing component (1) into the housing (3), wherein: the packing component (1) comprises a terminal (22) extending upwardly from a side surface thereof; the housing (3) comprises a busbar (40) which is connected to the terminal (22) and extends upwards from one side; and the connection (22) extends so that it widens upwards, wherein a tip of the terminal (22) comprises an R-shaped part extending inwardly. [3] A semiconductor device according to claim 2, wherein the bus bar (40) has a similar shape to the terminal (22). [4] A semiconductor device according to any one of claims 1 to 3, wherein the terminal (21, 22) and the bus bar (4, 40) are welded together. [5] The semiconductor device according to any one of claims 1 to 4, wherein the terminal (21, 22) comprises a plurality of terminals (21, 22); and the plurality of terminals (21, 22) are arranged at positions corresponding to each other on opposite side surfaces of the package component (1). [6] A semiconductor device according to any one of claims 1 to 5, wherein a part of a side surface of the case (3) with which the terminal (21, 22) is in contact has a tapered shape (3a).

Images