Electronic circuit unit

Abstract

Electronic circuit unit (1) serving as an inverter for an electric machine or as a converter, comprising at least one electronic unit (4), wherein the electronic unit (4) comprises at least one substrate (5) and at least one electrical and / or electronic component (32) arranged on the substrate (5), wherein the substrate (5) is arranged on a top surface (3) of a heat sink (2) and wherein at least one connection point (100) is formed on the substrate surface (7) of the substrate (5) facing away from the top surface (3) of the heat sink (2), wherein the electronic circuit unit (1) further comprises at least one electrical or electronic component (8) with at least one connection contact (101), wherein the at least one connection contact (101) is electrically connected to the at least one connection point (100).wherein the at least one connection contact (101) and the at least one connection point (100) in the area of ​​electrical contacting are surrounded by an electrically insulating mass (9), wherein the electrical or electronic component (8) is arranged outside the electrically insulating mass (9), wherein at least two connection contacts (101), comprising at least one first connection contact (11) and at least one second connection contact (21), are formed on the electrical or electronic component (8), and at least two connection points (100), comprising at least one first connection point (10) and at least one second connection point (20), are formed on the substrate surface (7) of the support substrate (5), wherein the first connection contact (11) is formed at least partially as a planar first busbar (12) and the second connection contact (21) is formed at least partially as a planar second busbar (22),wherein the first terminal contact (11) and the second terminal contact (21) are arranged relative to each other such that a first large area (14) of the first busbar (12) is opposite a second large area (24) of the second busbar (22), so that at least one gap (30) is formed between the first busbar (12) and the second busbar (22), and wherein an insulating element (31) is arranged in the gap (30) between the first busbar (12) and the second busbar (22), which electrically insulates the first busbar (12) from the second busbar (22), wherein the insulating element (31) is planar and is led into the electrically insulating mass (9) together with the first terminal contact (11) and the second terminal contact (21).

Description

State of the art The invention relates to an electronic circuit unit, in particular a circuit unit that serves as an inverter for an electric machine or as a converter, with the features of the preamble of independent claim 1. Hybrid and electric vehicles utilize inverter and converter structures with commutation circuits consisting of DC link capacitors and half-bridges, which are implemented, for example, in power modules. Inverters are used, for instance, to operate an electric machine, providing phase currents for the machine. The inverters and converters comprise, for example, power modules and at least one DC link capacitor that provides electrical energy for a short period. The power modules can, for example, include a substrate with conductive traces on which, for example, power semiconductors are arranged, forming an electronic assembly together with the substrate. It is known that the terminal contacts of the DC link capacitor are electrically connected to the power modules.For this purpose, contact elements extending from the power module, which electrically connect the electronic assembly, are connected to the terminals of the DC link capacitor. The electronic assembly may be encased in an electrically insulating compound, from which the contact elements extending from the electronic assembly are connected to the terminals outside of the insulating compound. US patent 2007 / 0109715 A1 discloses such a DC link capacitor, which is electrically connected to power modules. The electronic assemblies of the power modules are arranged in frames, and contact elements that electrically connect the electronic assembly are extended from the frame for further contact and then screwed to the terminals of the DC link capacitor, thus establishing an electrically conductive connection. Furthermore, DE 102013219833 A1 discloses an electronic circuit unit in which an electronic unit is encapsulated on a substrate using an electrically insulating compound, and another electronic component is arranged outside the electrically insulating compound. Disclosure of the invention According to the invention, an electronic circuit unit, in particular a circuit unit that serves as an inverter for an electric machine or as a converter, is proposed. The electronic circuit unit comprises at least one electronic unit, in particular a power electronic unit, wherein the electronic unit comprises at least one substrate and at least one electrical and / or electronic component arranged on the substrate, wherein the substrate is arranged on the top surface of a heat sink and wherein at least one connection point is formed on the substrate surface facing away from the top surface of the heat sink. The electronic circuit unit further comprises at least one electrical or electronic component with at least one connection contact, wherein the at least one connection contact is electrically connected to the at least one connection point.According to the invention, the at least one connection contact and the at least one connection point in the area of ​​electrical contacting are surrounded by an electrically insulating mass, wherein the electrical or electronic component is arranged outside the electrically insulating mass. Advantages of the invention Compared to the prior art, the electronic circuit unit with the features of the independent claim has the advantage that the at least one terminal contact of the electrical or electronic component of the electronic circuit unit is directly contacted with the at least one terminal point of the substrate of the electronic unit, and the terminal contact and the terminal point are encased in an electrically insulating material in the area of ​​electrical contact. Thus, additional contact elements for electrical contact, which, as in the prior art, are arranged, for example, between the terminal point and the terminal contacts, are eliminated, and the electronic circuit unit can therefore be advantageously designed to be compact, simple, and inexpensive.The electrically insulating material allows the connection contacts and contact points to be electrically isolated from other electrical and / or electronic components or from the environment. Furthermore, at least two connection contacts, comprising at least one first connection contact and at least one second connection contact, are formed on the electrical or electronic component, and at least two connection points, comprising at least one first connection point and at least one second connection point, are formed on the substrate surface of the support substrate, such that the first connection contact is at least partially formed as a planar first busbar and the second connection contact is at least partially formed as a planar second busbar, wherein the first connection contact and the second connection contact are arranged to each other in such a way that a first large area of ​​the first busbar is opposite a second large area of ​​the second busbar, so that at least one gap is formed between the first busbar and the second busbar.Busbars designed and arranged in this way advantageously reduce the inductance in the area where the connection contacts are led into the electrically insulating ground, and thus also advantageously reduce the overall inductance of the electronic circuit unit. This also advantageously reduces losses and heat generation. Furthermore, an insulating element is arranged in the gap between the first and second busbars, electrically isolating the first busbar from the second. This insulating element is planar and, together with the first and second terminal contacts, extends into the electrically insulating compound. With such an insulating element, the terminal contacts of the electrical or electronic component can advantageously be isolated from each other all the way to the electrically insulating compound. Thus, the terminal contacts can, for example, be advantageously arranged parallel to each other and isolated from each other all the way to the electrically insulating compound surrounding the electronic unit. This parallel arrangement, in turn, reduces the overall inductance of the circuit unit. Further advantageous embodiments and developments of the inventions are made possible by the features specified in the dependent claims. In a particularly advantageous embodiment, the electronic unit on the top of the heat sink is completely surrounded by the electrically insulating material, and the at least one terminal contact of the electrical or electronic component is embedded in the electrically insulating material. Thus, a first region of the terminal contact, facing the electrical or electronic component, is located outside the electrically insulating material, while a second region of the terminal contact, in which the terminal contact is electrically conductive with the connection point, is located inside the electrically insulating material. In this way, the terminal contact of the electrical or electronic component is advantageously electrically insulated in the second region of the terminal contact, where it is located inside the electrically insulating material.In this area, smaller tracking distances and clearances are required, allowing the electronic circuit unit to be designed with a particularly compact design. Furthermore, the electrically insulating mass effectively protects the electronic assembly from external influences, such as mechanical stresses or the surrounding media. It proves particularly advantageous if the insulating element arranged in the gap adheres to the first large surface of the first busbar and / or to the second large surface of the second busbar by means of a material bond. In this way, the insulating element can be advantageously and securely arranged in a fixed position within the circuit unit, and the electronic unit can thus be manufactured advantageously simply and cost-effectively. Advantageously, the first busbar of the first connection contact and the second busbar of the second connection contact can be arranged at least partially perpendicular to the substrate. This allows the electronic circuit unit to be designed in a space-saving manner, and the connection elements can be advantageously routed into the electrically insulating material surrounding the electronic unit. In a particularly advantageous embodiment, at least one first connecting web is formed on the first busbar and at least one second connecting web is formed on the second busbar, wherein the electrically conductive connection between the first connecting contact and the first connection point is made via the first connecting web and the electrically conductive connection between the second connecting contact and the second connection point is made via the second connecting web, wherein the width of the first connecting web is less than the width of the first busbar and the width of the second connecting web is less than the width of the second busbar.In this way, a size difference between the electrical or electronic component, such as an intermediate circuit capacitor with connection contacts designed, for example, as wide busbars, and the connection points of the substrate, for example, on conductor tracks of the substrate, can be advantageously compensated. It can prove particularly advantageous if the first connecting web of the first connecting contact and / or the second connecting web of the second connecting contact have an L-shaped profile, wherein a first area of ​​the first connecting web is formed in a plane of extension of the first busbar and a second area of ​​the first connecting web is arranged parallel to the support substrate and / or a first area of ​​the second connecting web is formed in a plane of extension of the second busbar and a second area of ​​the second connecting web is arranged parallel to the support substrate.With connection bridges designed in this way, advantageous stable mechanical connections between the electronic unit and the connection contacts of the electrical or electronic component can be established through the second areas of the connection rails, which are arranged parallel to the support substrate, in the case of busbars arranged at least partially perpendicular to the support substrate. This allows for a wide contact area between the connection points and the connection elements, which enables, for example, a particularly stable and simple connection of the connection contacts to the connection points by means of welding, soldering, a press contact, a press-fit contact, a pure pressure contact or other suitable contacting techniques. If the first and / or second connection contact is symmetrical with respect to a plane of symmetry perpendicular to the substrate, the overall inductance of the electronic circuit unit is advantageously reduced, thus also preventing losses and heat generation. Furthermore, with such connection contacts, the electronic unit itself can also be advantageously symmetrical, further minimizing the overall inductance of the electronic circuit unit and associated losses. In a particularly advantageous embodiment, the first connection contact is welded to the first connection point and / or the second connection contact is welded to the second connection point. Thus, in addition to a stable electrically conductive connection between the connection contacts and the connection points, an advantageously strong and stable mechanical connection can also be established. If the electrically insulating compound is designed as a potting compound and the electronic unit is potted in it, the advantage arises that the insulating compound can be applied particularly easily. This allows the insulating compound to advantageously fill gaps in the electronic assembly and cover the electrical and / or electronic components of the assembly, the substrate surface, and any conductor tracks arranged on the substrate from all exposed sides, thus providing advantageously good insulation. For example, this can also create an advantageous, metallurgical bond between the terminal contacts and the insulating compound, preventing air bubbles or voids in the insulating compound and thus also advantageously preventing leakage currents.At the same time, the electronic unit can be advantageously well protected from external influences. Brief description of the drawings An embodiment of the invention is shown in the drawing and is explained in more detail in the following description. Fig. 1 shows a schematic cross-section through an embodiment of the electronic circuit unit according to the invention, Fig. 2 shows a schematic cross-section through a three-dimensional section of the embodiment of the electronic circuit unit according to the invention, and Fig. 3 shows a top view of the embodiment of the electronic circuit unit according to the invention. Embodiments of the invention The electronic circuit unit according to the invention can find diverse applications, for example as an inverter or converter in automotive engineering. For example, the electronic circuit unit, also referred to as an inverter, can be used for operating an electric machine, for example in hybrid or electric vehicles. Figures 1, 2 to 3 show different views and representations of an embodiment of the electronic circuit unit according to the invention. The figures also show axes of a Cartesian coordinate system to indicate directions in the representations of the embodiment. Fig. 1 shows a schematic cross-section through an embodiment of the electronic circuit unit according to the invention. The circuit unit comprises an electronic unit 4, in particular a power electronic unit, wherein the electronic unit 4 comprises a substrate 5 and electrical and / or electronic components 32 arranged on the substrate 5. The substrate 6 can comprise several layers of electrically conductive materials such as metals and / or diaelectric materials. The substrate 5 is, for example, a circuit carrier, in this embodiment a DBC substrate (Direct Bonded Copper). However, the substrate 5 can also be, for example, an AMB substrate (Active Metal Brazed), an IMS (Insulated Metal Substrate), a printed circuit board (PCB), or another substrate suitable for power modules.Various electrical and / or electronic components 32, such as power semiconductors like field-effect transistors such as MIS-FETs (Metal Insulated Semiconductor Field Effect Transistors), IGBTs (Insulated-Gate Bipolar Transistors), power MOSFETs (Metal Oxide Semiconductor Field-Effect Transistors), and / or diodes, such as rectifier diodes, can be arranged on a substrate surface 7 of the support substrate 5. These can be, for example, bare-die power semiconductors. Furthermore, passive components such as resistors or capacitors can also be arranged as electrical and / or electronic components 32 on the support substrate 5. The support substrate 5 can also include conductive traces 17, 27.The electrical and / or electronic components 32 can be electrically connected to each other or to further electrical and / or electronic elements arranged outside the electronic unit 4 and not shown in the figures, for example via the conductor tracks 17, 27 of the substrate 5, via bond wires or other suitable electrically conductive contact elements, for example by soldering or sintering. The conductor tracks 17, 27 can be designed as conductive surfaces, as in this embodiment. At least one connection point 100 is formed on the upper surface 7 of the substrate 5. In the embodiment shown in Figs. 1, 2 to 3, several connection points are formed on the upper surface 7 of the substrate.For example, first connection points 10 of the substrate 5 are formed on a first conductor track 17, and second connection points 20 of the substrate 5 are formed on a second conductor track 27. The electronic unit 4 can be electrically connected to elements located outside the electronic unit 4 via these connection points 100. As shown in Fig. 3, in this embodiment, four first connection points 10 are formed on the first conductor track 17 of the substrate 5, and four second connection points 20 are formed on the second conductor track 27 of the substrate 5. In this embodiment, the substrate 5 of the electronic unit 4 is arranged on a top surface 3 of a heat sink 2 and is, for example, soldered to the top surface 3 of the heat sink 2. The substrate 5 can rest directly on the heat sink 2 or, as in this embodiment, with an interposition of a thermally conductive layer 6. The heat sink 2 serves to dissipate heat generated in the electronic unit 4 and is characterized by high thermal conductivity. The heat sink 2 is made of a material with good thermal conductivity, such as aluminum or copper. In this embodiment, the heat sink 2 is made of copper and is designed as a plate. Structures not shown in the figures, such as fins, pins, or channels, can also be formed on the heat sink 2 to improve heat dissipation.The carrier substrate 5 of the electronic unit 4 can, for example, also lie directly on the top surface 3 of the heat sink 2 and be insulated from the heat sink 2 by an electrically insulating layer encompassed by the carrier substrate 5. Furthermore, the electronic circuit unit 1, as shown in Fig. 1, comprises at least one electrical and / or electronic component 8 that is not included by the electronic unit 4. In the embodiment described in the present application, the electrical and / or electronic component 8 is a capacitor. It can, for example, be a power capacitor, which serves, for instance, as an intermediate circuit capacitor of the electronic circuit unit 1. Such a capacitor can also comprise several electrically connected capacitor elements, each forming its own individual capacitance, and, for example, also the electrically conductive connecting elements necessary for the electrically conductive connection of these capacitor elements.Various capacitor technologies, such as film capacitors, stack or round-wound capacitors, or other suitable capacitor technologies, can be used as capacitors or capacitor elements. In this embodiment, the capacitor, as an electrical and / or electronic component 8, comprises two terminal contacts 101. In the context of this application, a terminal contact 101 of the electrical and / or electronic component 8 is understood to be an electrically conductive, monolithic component extending from or projecting from the electrical and / or electronic component 8, which is provided for electrical contacting the electrical and / or electronic component 8 with electrical and / or electronic elements arranged outside the electrical and / or electronic component 8. Thus, in this embodiment, two terminal contacts 101 project from the capacitor, as an electrical and / or electronic component 8, which are provided for electrical contacting the two electrodes of the capacitor 8 with electrical and / or electronic elements arranged outside the capacitor 8, such as, in particular, the electronic unit 4.The terminal contacts 101 can be made at least partially of one or more metals, such as copper or aluminum, and may be partially insulated or uninsulated. They may, for example, be made of sheet metal. The present application distinguishes between a first terminal contact 11 and a second terminal contact 21, wherein the first terminal contact 11 is a terminal contact 101 which, as in the exemplary embodiment of a capacitor as an electrical and / or electronic component 8, extends from a first of the two electrodes of a capacitor, and the second terminal contact 21 is a terminal contact 101 which extends from a second of the two electrodes of the capacitor. The figures show, by way of example, two terminal contacts 101, a first terminal contact 11, and a second terminal contact 21.However, several first and / or second connection contacts 21 can also be formed, which can, for example, be electrically connected to further connection points 100 formed on other electronic units 4 not shown in the figures. Furthermore, the electrical and / or electronic component 8 can also be electrically connected via other electrical contacts not shown in the figures to other elements not shown in the figures, such as other electrical and / or electronic components 8. The first terminal 11 of the electrical and / or electronic component 8 is electrically connected to the first terminals 10, and the second terminal 21 of the electrical and / or electronic component 8 is electrically connected to the second terminals 20. A terminal 101 can, for example, be welded to a terminal 100 and thus be connected to it both electrically and mechanically. Terminal 101 can also be electrically connected to terminals 100, for example, by soldering, press-fit contacts, insertion contacts, simple pressure contacts, or other suitable contacting techniques.In the embodiment, the first terminal 11 of the capacitor is electrically connected as an electrical and / or electronic component 8 to the four first terminals 10 of the first conductor track 17 of the substrate 5, and the second terminal 21 of the capacitor is electrically connected to the four second terminals 20 of the second conductor track 27. As shown in Fig. 1, in this embodiment of the electronic circuit unit 1, the first connection contact 11 is partially designed as a planar first busbar 12, and the second connection contact 21 is partially designed as a planar second busbar 22. The first connection contact 11 and the second connection contact 21 are arranged relative to each other such that a first large area 14 of the first busbar 12 faces a second large area 24 of the second busbar 22, so that at least one gap 30 is formed between the first busbar 12 and the second busbar 22. In the context of this application, a busbar 12, 22 is understood to be an electrically conductive planar conductor, for example, an electrically conductive strip or bar, which forms at least part of a connection contact 101. A busbar 12, 22 can thus, for example, be a busbar.The conductor rails 12, 22 can, for example, be bent or curved, or may also run in a curved or stepped manner. In the context of this application, the term "large surfaces 14, 24 of the conductor rails 12, 22" refers to flat or curved surfaces formed on the conductor rails 12, 22, which are at least partially bounded by an edge 12, 22 of the conductor rail 12, 22. The busbars 12, 22 can largely overlap and, for example, be at least partially parallel to each other to enable the lowest possible inductance of the current. The busbars 12, 22 can preferably be parallel to each other, at least in certain areas, and, for example, be of the same width. As shown in Fig. 3, in this embodiment, a width B12 of the first busbar 12 corresponds to a width B22 of the second busbar 22. In the embodiment shown in Fig. 1, the first busbar 12 of the first connection contact 11 and the second busbar 22 of the second connection contact 21 are arranged partially perpendicular to the support substrate 5. The first terminal contact 11 can be at least partially separated from the second terminal contact 21 by a gap 30 and not be in direct contact with the second terminal contact 21. In this embodiment, an insulating element 31 is arranged in the gap 30 between the first busbar 12 and the second busbar 22, which electrically isolates the first busbar 12 from the second busbar 22. The insulating element 31 can, for example, be a flat surface and be, for example, paper or a film made of electrically insulating material, such as electrically insulating plastic.The insulating element 31 can also project beyond the gap 30 between the first busbar 12 and the second busbar 22, i.e., it can project beyond the edges of the busbars 12 and 22, and can electrically insulate the connection contacts 11 and 21 from each other even in areas of the connection contacts 11 and 21 that are not configured as busbars 12 and 22, or in areas where the large surfaces 14 and 24 of the busbars 12 and 22 do not face each other. The insulating element 31, which is at least partially located in the gap 30, can, for example, also adhere to the first large surface 14 of the first busbar 11 and / or to the second large surface 24 of the second busbar 21 by means of a material bond. Thus, the insulating element 31 can, for example, form a laminate with the first connection contact 11 and / or with the second connection contact 21. As shown in Fig. 2, at least one first connecting web 16 can be formed on the first busbar 12 and at least one second connecting web 26 on the second busbar 22 in the electronic circuit unit 1. In this embodiment, four connecting webs 16, 26 are formed on each of the busbars 12, 22. In this embodiment, the connecting webs 16, 26 are formed at the edges 13, 23 of the busbars 12, 22 as lateral extensions of the busbars 12, 22. In this embodiment, as shown in Fig. 3, four first connecting webs 16 are formed on the first busbar 12 and four second connecting webs 26 are formed on the second busbar 22.The electrically conductive connection between the first terminal contact 11 and the first terminals 10 is established via the first terminal ribs 16, and the electrically conductive connection between the second terminal contact 21 and the second terminals 20 is established via the second terminal ribs 26. In this embodiment, the terminal ribs 16 and 26 are welded to the respective terminals 10 and 20, thus forming an electrically conductive and mechanical connection to them. However, the terminal ribs 16 and 26 can also be electrically conductively connected to the respective terminals 10 and 20, for example, by soldering, a press-fit contact, a push-in contact, a simple pressure contact, or other suitable contacting techniques. In this embodiment, the width B16 of each first terminal rib 16 is less than the width B12 of the first busbar 12.Similarly, the width B26 of every second connecting web 26 is less than the width B22 of the second busbar 22. In the illustrated embodiment, the widths B12, B16, B22, and B26 are measured in the y-direction. The widths B12 and B16 belonging to the first connecting contact 11 are measured in the same direction in this embodiment. The widths B22 and B26 belonging to the second connecting contact 21 are also measured in the same direction in this embodiment. In general, in the context of this application, the width of a busbar 12, 22 or a connecting web 16, 26 is a width measured perpendicular to an edge 13, 23 of the busbar 12, 22 or to an edge 15, 25 of the connecting web 16, 26, respectively, and transverse to a current flow direction through the busbar 12, 22 or to a current flow direction through the connecting web 16, 26, respectively. As shown in Fig. 1 and Fig. 2, in the exemplary embodiment of the electronic circuit unit 1, the first connecting webs 16 of the first connecting contact 11 and the second connecting webs 26 of the second connecting contact 21 have L-shaped profiles. As in this exemplary embodiment, first regions 18 of the first connecting webs 16 can be formed in a plane of extension of the first busbar 12, and second regions 19 of the first connecting webs 16 can be arranged parallel to the support substrate 5. Similarly, first regions 28 of the second connecting webs 26 can be formed in a plane of extension of the second busbar 22, and second regions 29 of the second connecting webs 26 can be arranged parallel to the support substrate 5. The connecting webs 16, 26 can, for example, be formed as lateral extensions of the busbars 12, 22 in the extension planes of the busbars 12, 22 and then be bent out of these extension planes, so that their first areas 18, 28 remain in the extension planes and their second areas 19, 29 are aligned parallel to the support substrate 5. The connecting webs 16, 26 can, for example, be formed at edges 15, 25 of the busbars 12, 22 and connect to the busbars 12, 22 in a lateral extension. As shown in Fig. 3, in the exemplary embodiment, the first connection contact 11 and the second connection contact 21 are symmetrically designed with respect to a plane of symmetry S extending perpendicular to the support substrate 5. However, only the first connection contact 11 or the second connection contact 21 can also be symmetrically designed with respect to the plane of symmetry S. The plane of symmetry S can, for example, extend perpendicular to the support substrate 5, as illustrated by the exemplary embodiment and shown in Fig. 3. It can also be arranged perpendicular to at least one of the connection contacts 11, 21 and, for example, in the case of busbars 12, 22 arranged at least partially perpendicular to the support substrate 5, also be perpendicular to the portion of the busbars 12, 22 that is perpendicular to the support substrate 5. This is the case in the exemplary embodiment shown in the present application.Thus, in this embodiment, the carrier substrate 5 can also be designed at least partially symmetrically, and the overall inductance of the electronic circuit unit 1 can therefore be advantageously reduced. In this embodiment, the electronic unit 4 is completely surrounded by an electrically insulating material 9 on the upper surface 3 of the heat sink 2. The first terminal contact 11 and the first terminals 10, as well as the second terminal contact 21 and the second terminals 20, are surrounded by the electrically insulating material 9 in the area of ​​their electrical contacts. The electronic unit 4 can, for example, be arranged, also together with other electronic units, in a frame (not shown in the figures) placed on the upper surface 3 of the heat sink 2, which is filled with the electrically insulating material 9, so that the entire electronic unit 4 is surrounded by the electrically insulating material 9.As shown in the exemplary embodiment, the electrical and / or electronic component 8, in this exemplary embodiment the capacitor, is arranged outside the electrically insulating material 9, and the terminal contacts 11, 21 of the capacitor 8 are led into the electrically insulating material 9. Thus, in the exemplary embodiment, the first terminal contact 11 and the first connection point 10, as well as the second terminal contact 21 and the second connection point 20, are also surrounded by an electrically insulating material 9 in the area of ​​electrical contact.If the electronic unit is completely surrounded by the electrically insulating mass 9, the electrical and / or electronic components 32 of the electronic unit 4 are electrically isolated from each other and from other electrically conductive parts of the electronic circuit unit 1, and the electrically insulating mass 9 can also be bonded to the substrate 5, the conductor tracks 17, 27 and / or the electrical and / or electronic components 32. In this embodiment, the connection contacts 101 of the electrical or electronic component 8 are inserted into the electrically insulating material 9. Thus, first regions 35 of the connection contacts 101, which face the electrical or electronic component 8, are arranged outside the electrically insulating material 9, and second regions 36 of the connection contacts 101, in which the connection contacts 101 are electrically conductively contacted with the connection points 100, are arranged inside the electrically insulating material 9. In this embodiment, the electrically insulating material 9 is designed as a potting compound, and the electronic unit 4 is potted in the electrically insulating material 9. The potting compound can be, for example, silicone gel, epoxy resin, and / or a transfer molding compound. The insulating element 31, as in the exemplary embodiment, can be inserted into the electrically insulating material 9 together with the first terminal contact 11 and the second terminal contact 21. This ensures continuous insulation of the terminal contacts 11 and 21 from each other, extending into the electrically insulating material 9. The electrically insulating compound 9 can, for example, electrically insulate the components of the electronic unit 4, such as semiconductor switches or diodes, and / or the conductor tracks 17, 27 of the substrate 5 from each other and from the environment, and can also, for example, provide an airtight seal. Furthermore, the electrically insulating compound 9 can advantageously be thermally conductive in order to effectively dissipate the heat generated by the electrical and / or electronic components 32. The electrically insulating compound 9 is preferably designed as a casting compound, for example, as a plastic compound, which is cast or sprayed onto the electrical and / or electronic components 32, such as semiconductor switches or diodes, and the conductor tracks 17, 27, which are already arranged and electrically connected to each other, using a casting process, particularly an in-mold process.The electrically insulating compound 9 can also be a passivation gel, for example, a silicone gel. The electrically insulating compound 9 can thus, on the one hand, electrically insulate the electronic unit 4 and simultaneously stabilize it, and, for example, protect the electrical and / or electronic components 32 embedded within it, such as power semiconductors and diodes, or the conductive traces 17, 27 of the substrate 5 from external influences. The electrically insulating compound 9 can, for example, also be a flowable liquid that solidifies through a curing process. It can therefore, for example, be a polymeric protective system and be applied by overmolding or potting. It can also, for example, be a thermoset such as an epoxy resin. Of course, other embodiments and hybrid forms of the illustrated embodiments are also possible.

Claims

Electronic circuit unit (1) serving as an inverter for an electric machine or as a converter, comprising at least one electronic unit (4), wherein the electronic unit (4) comprises at least one substrate (5) and at least one electrical and / or electronic component (32) arranged on the substrate (5), wherein the substrate (5) is arranged on a top surface (3) of a heat sink (2) and wherein at least one connection point (100) is formed on the substrate surface (7) of the substrate (5) facing away from the top surface (3) of the heat sink (2), wherein the electronic circuit unit (1) further comprises at least one electrical or electronic component (8) with at least one connection contact (101), wherein the at least one connection contact (101) is electrically connected to the at least one connection point (100).wherein the at least one connection contact (101) and the at least one connection point (100) in the area of ​​electrical contacting are surrounded by an electrically insulating mass (9), wherein the electrical or electronic component (8) is arranged outside the electrically insulating mass (9), wherein at least two connection contacts (101), comprising at least one first connection contact (11) and at least one second connection contact (21), are formed on the electrical or electronic component (8), and at least two connection points (100), comprising at least one first connection point (10) and at least one second connection point (20), are formed on the substrate surface (7) of the support substrate (5), wherein the first connection contact (11) is formed at least partially as a planar first busbar (12) and the second connection contact (21) is formed at least partially as a planar second busbar (22),wherein the first terminal contact (11) and the second terminal contact (21) are arranged relative to each other such that a first large area (14) of the first busbar (12) is opposite a second large area (24) of the second busbar (22), so that at least one gap (30) is formed between the first busbar (12) and the second busbar (22), and wherein an insulating element (31) is arranged in the gap (30) between the first busbar (12) and the second busbar (22), which electrically insulates the first busbar (12) from the second busbar (22), wherein the insulating element (31) is planar and is led into the electrically insulating mass (9) together with the first terminal contact (11) and the second terminal contact (21). Electronic circuit unit according to claim 1, characterized in that the electronic unit (4) on the top (3) of the heat sink (2) is completely surrounded by the electrically insulating material (9) and the at least one terminal contact (101) of the electrical or electronic component (8) is led into the electrically insulating material (9), such that a first area (35) of the terminal contact (101), which faces the electrical or electronic component (8), is arranged outside the electrically insulating material (9) and a second area (36) of the terminal contact (101), in which the terminal contact (101) is electrically conductively contacted with the connection point (100), is arranged inside the electrically insulating material (9). Electronic circuit unit according to claim 1, characterized in that the insulating element (31) arranged in the gap (30) adheres materially to the first large surface (14) of the first busbar (11) and / or to the second large surface (24) of the second busbar (21). Electronic circuit unit according to one of the preceding claims, characterized in that the first busbar (12) of the first connecting contact (11) and the second busbar (22) of the second connecting contact (21) are arranged at least partially perpendicular to the carrier substrate (5). Electronic circuit unit according to one of the preceding claims, characterized in that at least one first connecting web (16) is formed on the first busbar (12) and at least one second connecting web (26) is formed on the second busbar (22), wherein the electrically conductive connection between the first connecting contact (11) and the first connection point (10) is established via the first connecting web (16) and the electrically conductive connection between the second connecting contact (21) and the second connection point (20) is established via the second connecting web (26), wherein a width (B16) of the first connecting web (16) is less than a width (B12) of the first busbar (12) and a width (B26) of the second connecting web (26) is less than a width (B22) of the second busbar (22). Electronic circuit unit according to claim 5, characterized in that the first connecting web (16) of the first connecting contact (11) and / or the second connecting web (26) of the second connecting contact (21) have an L-shaped profile, wherein a first area (18) of the first connecting web (16) is formed in a plane of extension of the first busbar (12) and a second area (19) of the first connecting web (16) is arranged parallel to the support substrate (5) and / or a first area (28) of the second connecting web (26) is formed in a plane of extension of the second busbar (22) and a second area (29) of the second connecting web (26) is arranged parallel to the support substrate (5). Electronic circuit unit according to one of the preceding claims, characterized in that the first connection contact (11) and / or the second connection contact (21) are symmetrical with respect to a plane of symmetry (S) extending perpendicular to the carrier substrate (5). Electronic circuit unit according to one of the preceding claims, characterized in that the first connection contact (11) is welded to the first connection point (10) and / or the second connection contact (21) is welded to the second connection point (20). Electronic circuit unit according to one of the preceding claims, characterized in that the electrically insulating mass (9) is designed as a potting compound and the electronic unit (4) is potted in the electrically insulating mass (9).

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