Electronic component with a component housing

Abstract

Electronic component (1) with a component housing (2) and an integrated circuit (5) with sensor function, which is accommodated in an electronics housing (4) made of plastic, wherein the component housing (2) has a recess (3) in the region of the integrated circuit (5) with sensor function, so that the integrated circuit (5) can perform its function as a sensor through the recess (3), wherein the component housing (2) rests against the edge of the recess (3) on the electronics housing (4) and is sealingly connected to the electronics housing (4) by an adhesive connection, and wherein the component housing (2) has a first vertical section (9) at the edge (7) of the recess (3) which extends along the side of the electronics housing (4) and a second horizontal section (10) which projects beyond the electronics housing (4), characterized by that a projection (11) is formed in the component housing (2) at the edge (7) of the recess (3), the distance (13) between the projection (11) and the electronics housing (4) being smaller than the distance between the remaining component housing (2) and the electronics housing (4), and that the projection (11) is arranged between the first vertical section (9) and the second horizontal section (10).

Description

[0001] The invention relates to an electronic component with a component housing and an integrated circuit with a sensor function, which is accommodated in an electronic housing made of plastic, wherein the component housing has a recess in the region of the circuit with a sensor function, so that the integrated circuit can perform its function as a sensor through the recess and with the features of the preamble of patent claim 1.

[0002] Such a sensor of this type is known from DE 197 03 206 A1. Another comparable sensor is known from DE 10 2010 039 599 A1.

[0003] The documents US 2012 / 0174680 A1 and CN 101979977 A also disclose electronic components that are similar to the generic electronic component.

[0004] Further general prior art is known from DE 10 2005 006 753 A1, DE 20 2008 011 684 U1 and DE 10 2012 014 307 A1.

[0005] Further sensors are known, for example, from US Pat. Nos. 8,596,139 B2 and 9,087,504 B2. These patents describe electronic components, namely ultrasonic transducers with a larger component housing. This component housing contains an integrated circuit with a sensor function. The outer component housing has a recess centrally located above the integrated circuit with a sensor function, through which the ultrasonic waves can pass, allowing a measurement to be performed above the component housing.

[0006] The invention is based on the object of creating an electronic component of the type mentioned at the outset with which a particularly simple and reliable protection of the integrated circuit against external influences, in particular against aggressive media, can be achieved.

[0007] This object is achieved by an electronic component having the features of patent claim 1. Advantageous embodiments of the invention are described in the subclaims.

[0008] In an electronic component with a component housing and an integrated circuit with a sensor function, which is accommodated in an electronics housing made of plastic, wherein the component housing has a recess in the region of the circuit with a sensor function, so that the integrated circuit can perform its function as a sensor through the recess, it is provided that the component housing rests against the electronics housing at the edge of the recess and is sealingly connected to the electronics housing with an adhesive connection, and that the component housing has a first vertical section at the edge of the recess, which extends along the side of the electronics housing and has a second, horizontal section that projects horizontally over the electronics housing.With such an electronic component, a plastic electronics housing can be bonded to the component housing or sensor housing to ensure tightness against the medium to be sensed. The medium to be sensed can be liquid or gaseous. A particularly advantageous feature is that the surface of the electronics housing to be sensed is not affected or only minimally affected. This is achieved by a circumferential bond to the electronics housing, with the bonding being applied to the sides and also in a small section from above.

[0009] In a preferred embodiment of the invention, the vertical section at the edge of the recess is longer than the horizontal section. The horizontal section only extends beyond a small portion of the electronics housing, i.e., only beyond a small edge area. The vertical section is preferably more than twice as long as the horizontal section, and particularly preferably more than three times as long as the horizontal section.

[0010] According to the invention, a projection is formed in the component housing at the edge of the recess, wherein the distance between the projection and the electronics housing is smaller than the distance between the rest of the component housing and the electronics housing. This projection is particularly preferably arranged between the horizontal section and the vertical section at the edge of the component housing. This projection ensures that the excess adhesive can be absorbed. Tolerance compensation takes place. The capillary-induced absorption of the adhesive prevents the adhesive from flowing onto the surface to be sensed. This design with the projection and the resulting distance causes capillary forces to arise. Excess adhesive is therefore not directed onto the sensor housing, but is guided by the capillary-induced absorption of the adhesive, in particular, into the vertical area next to the electronics housing.Due to the defined positioning of the adhesive and the effective capillary force, the electronics housing is tightly bonded, regardless of the adhesive's viscosity. A space-optimized design is achieved.

[0011] According to the invention, the projection is approximately rectangular in cross-section and aligned with the corner of the electronics housing (seen in cross-section). Viewed three-dimensionally, it is more like two circumferential edges that are opposite each other. Viewed in cross-section, the angle bisectors of the projection and the electronics housing would form approximately a line. In this area, the distance between the projection and the electronics housing is minimal. Preferably, the distance between the projection and the electronics housing is 40% to 60% of the distance that exists in other areas between the edge of the component housing and the electronics housing. This creates a capillary effect and excess adhesive is not on the sensing surface, but is drawn by capillary action into other areas, in particular into the vertical area between the electronics housing and the component housing.

[0012] In a preferred embodiment of the invention, the integrated circuit with the electronics housing is a SOIC component made of thermoset plastic. This refers to a "small outline integrated circuit" that is encased or encapsulated in a thermoset plastic.

[0013] In the preferred embodiment of the invention, the electronic component is a fill level measuring device. In such a case, the integrated circuit with sensor function is preferably an ultrasonic sensor. In a preferred embodiment, such ultrasonic sensors are installed, for example, in an oil-lubricated engine to measure the fill level of engine oil. The component housing seals the electronics housing from the surrounding medium, in particular the medium to be measured. This medium can be liquid or gaseous. In addition to a fill level sensor, the sensor can also be a pressure sensor or a gas sensor.

[0014] The invention is further explained below with reference to an exemplary embodiment illustrated in the drawing. The schematic representations show in detail: Fig. 1: a top view of an electronic component with the component housing; and Fig. 2: a cross-section through the integrated circuit with electronics housing and part of the component housing.

[0015] In Fig. 1 shows the electronic component 1 with a component housing 2. The component housing 2 does not necessarily have to be the outermost housing of an entire device, but should be understood as a component housing 2 or possibly also a sensor housing that covers the actual sensor or an integrated circuit 5 with a sensor and / or protects it from the surrounding medium. The component housing 2 has a central recess 3 below which the electronics housing 4 is arranged.

[0016] In Fig.Figure 2 shows a cross-section through the electronics housing 4 with the integrated circuit 5 with sensor function accommodated therein. The sensing surface 6 is located on top of the electronics housing 4 and is arranged in the region of the recess 3 of the component housing 2. The component housing 2 has an edge 7 around the recess 3, which lies tightly against the electronics housing 4. A narrow gap remains between the edge 7 and the electronics housing 4, which is filled with adhesive 8. The edge 7 can be divided into a vertical section 9 and a horizontal section 10. The vertical section 9, which is aligned parallel to a vertical side of the electronics housing 4, is longer than the horizontal section 10 of the edge 7, which is aligned parallel to the horizontally aligned top side on which the sensing surface 6 is arranged.In the transition area between the vertical section 9 and the horizontal section 10, a projection 11 is formed in the edge 7 of the component housing 2. Between the projection 11 and the outer upper edge 12 of the electronics housing 4, a minimum distance 13 is formed, which is smaller than the distance between the electronics housing 4 and the edge 7 in the area of ​​the vertical section 9 of the component housing 2 and is also smaller than the distance between the top side of the electronics housing 4, i.e. in particular in the area of ​​the sensing surface 6 of the electronics housing 4 and the horizontal section 10 of the component housing 2. This minimum distance is so small that capillary forces act and liquid adhesive is drawn in particular into the area near the vertical section 9 and does not run on the sensing surface 6 of the electronics housing 4.

[0017] All features mentioned in the above description and in the claims can be combined in any desired manner with the features of the independent claim. The disclosure of the invention is therefore not limited to the described or claimed feature combinations; rather, all feature combinations that are meaningful within the scope of the invention are to be considered disclosed. List of reference symbols: 1 electronic component 2 component housings 3 recess 4 electronics housing 5 integrated circuit 6 sensing area 7 Edge of the component housing 2 8 Adhesive / Gap 9 vertical section of 7 10 horizontal section of 7 11 lead in 7 12 edge of 4 13 minimum distance

Claims

[1] Electronic component (1) with a component housing (2) and an integrated circuit (5) with sensor function, which is accommodated in an electronics housing (4) made of plastic, wherein the component housing (2) has a recess (3) in the region of the integrated circuit (5) with sensor function, so that the integrated circuit (5) can perform its function as a sensor through the recess (3), wherein the component housing (2) rests against the edge of the recess (3) on the electronics housing (4) and is sealingly connected to the electronics housing (4) by an adhesive connection, and wherein the component housing (2) has a first vertical section (9) at the edge (7) of the recess (3) which extends along the side of the electronics housing (4) and a second horizontal section (10) which projects beyond the electronics housing (4), characterized by , that a projection (11) is formed in the component housing (2) at the edge (7) of the recess (3), wherein the distance (13) between the projection (11) and the electronics housing (4) is smaller than the distance between the remaining component housing (2) and the electronics housing (4), and that the projection (11) is arranged between the first vertical section (9) and the second horizontal section (10). [2] Electronic component according to claim 1, characterized by that the first, vertical section (9) is longer than the second, horizontal section (10). [3] Electronic housing according to one of claims 1 or 2, characterized by that the projection (11) is approximately rectangular in cross-section and is aligned with an edge (12) of the electronics housing (4). [4] Electronic component according to one of the preceding claims, characterized bythat the distance between the projection (11) and the electronics housing (4) is 40% to 60% of the distance that exists in other areas between the edge (7) of the component housing (2) and the electronics housing (4). [5] Electronic component according to one of the preceding claims, characterized by that the integrated circuit (5) with the electronics housing (4) is a SOIC component with a thermoset housing. [6] Electronic component according to one of the preceding claims, characterized by that the electronic component (1) is a level measuring device. [7] Electronic component according to one of the preceding claims, characterized by that the integrated circuit (5) with sensor function is an ultrasonic sensor. [8] Electronic component according to one of the preceding claims, characterized by that the component housing (2) seals the electronics housing (4) against the surrounding medium.

Images