Electronic device and method for manufacturing a fabric casing for an electronic device

Abstract

An electronic device, comprising: a main body; and a tissue housing comprising a connecting part at an inner periphery of the tissue housing (1); wherein the fabric housing (1) is connected to the main body via the connecting part, wherein the fabric casing (1) has a predetermined hardness, and wherein the tissue casing (1) is obtained with the specified hardness by a process comprising the following: Provision of a ramie cotton slurry; Degreasing treatment and spinning of the ramie cotton slurry to obtain ramie cotton threads; characterized by: Twisting (203) a predetermined number of ramie cotton threads to obtain ramie cotton yarns of a predetermined diameter; and Weaving (204) the ramie cotton yarns into a fabric of a predetermined thickness.

Description

STATE OF THE ART

[0001] The present invention relates to the field of an electronic device, in particular to an electronic device and a method for manufacturing the same.

[0002] Documents US 2002 / 0 106 952 A1 and EP 2 717 549 A2 each describe methods for manufacturing a housing for a mobile computing unit. BACKGROUND

[0003] As science and technology have continuously developed, various electronic devices have been used more and more to make daily life and work easier, thus becoming indispensable tools.

[0004] For the safe use of electronic devices, a housing is required as a protective capsule. Common housings for electronic devices can be made of metal or plastic. Plastic housings are most widely used because they offer advantages such as low cost, light weight, corrosion resistance, and do not interfere with reception.

[0005] Conventional electronic devices use plastic housings, typically molded directly into a predetermined shape from molten plastic material using a thermoplastic process. However, these plastic housings, manufactured directly using a thermoplastic process, tend to have a monotonous appearance. BRIEF SUMMARY

[0006] In summary, an aspect provides an electronic device comprising: a main body; and a fabric housing comprising a connecting part at an inner periphery of the fabric housing, the fabric housing being connected to the main body via the connecting part.

[0007] Another aspect provides a process, the process comprising: providing a tissue material; forming a slurry layer on a surface of the tissue material to increase the hardness of the tissue material; and hardening the tissue material with the slurry layer.

[0008] Another aspect provides a device comprising: a fabric housing with a connecting part at an inner periphery of the fabric housing; wherein the fabric housing is connected to the body of an electronic device; and wherein the fabric housing consists of a fabric with a predetermined hardness.

[0009] The foregoing is a summary and may therefore contain simplifications, generalizations and omissions of details; therefore, the average person of knowledge can understand that this summary is for illustrative purposes only and is in no way limiting.

[0010] For a better understanding of the embodiments, along with other features and advantages thereof, reference is made to the following descriptions in conjunction with the corresponding drawings. The scope of the invention is clarified in the attached claims. BRIEF DESCRIPTION OF THE DIFFERENT VIEWS OF THE DRAWINGS Fig. Figure 1 is a schematic diagram of the structure of the housing of an electronic device provided in one embodiment of the present invention; Fig. Figure 2 is a schematic flowchart of a manufacturing process in the embodiment of the present invention; Fig. Figure 3 is a schematic flowchart of a further manufacturing process in the embodiment of the present invention; Fig. Figure 4 is a schematic structural view of an electronic device according to one embodiment; Fig. Figure 5 is a front view of a casing for an electronic device according to one embodiment; Fig. Figure 6 is a rear view of a casing for an electronic device according to one embodiment; Fig. Figure 7 is a flowchart of a process for manufacturing a casing for an electronic device according to one embodiment; and Fig. Figure 8 is a flowchart of a process for providing a tissue of predetermined thickness in a process for manufacturing a casing for an electronic device according to one embodiment. DETAILED DESCRIPTION

[0011] It is therefore readily understandable that the components of the embodiments, as generally described and illustrated in the accompanying figures, can be arranged and designed in a multitude of different configurations in addition to the described example embodiments. Therefore, the following, more detailed description of the example embodiments shown in the figures does not limit the scope of the embodiments as claimed, but is merely representative of the example embodiments.

[0012] Reference within this specification to "an embodiment" [an = numerical form] or "an embodiment" [an = indefinite article] (or similar) means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Therefore, the phrase "in an embodiment" [an = numerical form] or "in an embodiment" [an = indefinite article], used in various places in this specification, does not necessarily refer to the same embodiment.

[0013] Furthermore, the described features, structures, or properties can be combined in a suitable manner in one or more embodiments. Numerous specific details are provided in the following description to facilitate a thorough understanding of the embodiments. However, a person skilled in the art will understand that the various embodiments can be implemented without one or more of the specific details or with different methods, components, materials, etc. In other cases, well-known structures, materials, or processes are not shown or described in detail to avoid confusion.

[0014] To solve the aforementioned problem, one embodiment provides an electronic device and a method for manufacturing it that improves the appearance of the housing by integrating a textured layer.

[0015] One embodiment provides an electronic device comprising: a housing with a predetermined hardness and shape, wherein the housing comprises a textured layer and a transparent layer, the textured layer being made of a first material and forming a three-dimensional structure, and the transparent layer being made of a second material and enabling transparency; a connecting element being installed inside the housing; a main body to which the housing is attached via the connecting part.

[0016] In one embodiment of the electronic device, the textured layer in the electronic device is the support body of the housing, and the transparent layer is the protective layer of the support body.

[0017] In one embodiment of the electronic device, the texture layer comprises an outer surface facing the transparent layer and an inner surface facing away from the transparent layer, wherein the outer surface has a three-dimensional structure, the outer surface and the transparent layer constitute the appearance of the housing, and the inner surface is configured for the attachment of the connecting part.

[0018] In one embodiment of the electronic device, the texture layer is woven from a yarn of the first material, wherein the yarn forms the three-dimensional structure during the weaving process, wherein the yarn is subjected to degreasing and the texture layer achieves the predetermined hardness and shape by means of hot forming presses.

[0019] In one embodiment of the electronic device, the manufacturing process of the housing comprises: integrating a textured layer woven from degreased yarn and having a three-dimensional structure; processing the textured layer by means of hot forming to obtain a textured layer with a predetermined hardness and shape; forming the transparent layer on the textured layer; and cutting.

[0020] In one embodiment, the electronic device further comprises a galvanizing layer arranged between the textured layer and the transparent layer, wherein the galvanizing layer is a mirror-reflecting layer with a predetermined color.

[0021] Furthermore, a method for manufacturing a housing for an electronic device as described above is provided. The method comprises: preparing a yarn from the first material;

[0022] Weaving the yarn into a textured layer, wherein the yarn forms a three-dimensional structure during the weaving process; processing the textured layer by means of a first hot forming process to obtain a textured layer with a predetermined hardness and shape; forming a transparent layer on the outer surface of the textured layer, wherein the textured layer is a support body of the housing and the transparent layer is a protective layer of the support body; and cutting the textured layer with a transparent layer on its outer surface to form the housing of the electronic device.

[0023] In one embodiment, the manufacturing process further includes impregnating the texture layer in epoxy resins to increase the hardness and resilience of the texture layer prior to hot forming.

[0024] In one embodiment, the manufacturing process further includes processing the cut housing of the electronic device by means of a second hot forming process.

[0025] In one embodiment, the manufacturing process further comprises forming a galvanizing layer on the outer surface of the textured layer prior to forming the transparent layer, wherein the galvanizing layer is a mirror-reflecting layer of a predetermined color.

[0026] It is evident from the preceding description that the electronic device provided in one embodiment comprises the following: a housing with a predetermined hardness and shape, wherein the housing includes a textured layer and a transparent layer, the textured layer being made of a first material and forming a three-dimensional structure, and the transparent layer being made of a second material and enabling transparency; a connecting element located inside the housing; and a main body to which the housing is attached via the connecting element. Therefore, the housing of the electronic device described in the technical solution comprises a textured layer and a transparent layer, and the housing can exhibit different appearances through the integration of the three-dimensional structure of the textured layer.

[0027] The technical solution of the embodiments is expressly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is evident that the described embodiments are not all, but only a subset of the embodiments. All other embodiments obtained by a person skilled in the art without any creative activity based on the embodiments of the present invention fall within the scope of the patent claims.

[0028] As described in the background, conventional electronic devices use plastic housings, typically formed directly into a predetermined shape from molten plastic material using a thermoplastic (or curing) process. However, these plastic housings, manufactured directly using a thermoplastic process, tend to have a monotonous appearance.

[0029] To solve the problem, an embodiment of the present invention provides an electronic device comprising: a housing with a predetermined hardness and a predetermined shape, wherein the housing comprises a textured layer and a transparent layer, the textured layer being made of a first material and forming a three-dimensional structure, and the transparent layer being made of a second material and enabling transparency; a connecting part being mounted inside the housing; and a main body to which the housing is attached via the connecting part.

[0030] In one embodiment of the present invention, the electronic device can be a mobile phone, a tablet, etc. The connecting element is arranged on the inner surface of the housing. The connecting element can be manufactured as an integral part of the housing or manufactured separately from the housing and then attached to the inner surface of the housing. The main body is the body of the electronic device, and the housing serves as a protective capsule for the body. The housing can also have various three-dimensional structures, allowing the electronic device to present different appearances, thus increasing the diversity of design options. The connecting element is configured for attaching the housing to the main body.

[0031] In one embodiment of the present invention, the housing of the electronic device comprises a textured layer and a transparent layer, wherein the housing can exhibit different appearances through the integration of the three-dimensional structure of the textured layer. In particular, in the electronic device of the embodiment of the present invention, the first material itself defines the three-dimensional structure, and various three-dimensional structures laid down with the first material result in a number of different appearances of the housing. The housing structure of the electronic device in the embodiment of the present invention is in Fig. 1 shown.

[0032] Fig. Figure 1 is a schematic diagram of the structure of the electronic device as provided in one embodiment of the present invention. A housing 10 comprises a textured layer 11 and a transparent layer 12. The textured layer 11 is the support body of the housing 10, and the transparent layer 12 is the protective layer of the support body.

[0033] As in Fig. As shown in Figure 1, the textured layer 11 in the housing 10 comprises an outer surface 111 facing the transparent layer 12 and an inner surface 112 facing away from the transparent layer 12, wherein the outer surface 111 has a three-dimensional structure. The outer surface 111 and the transparent layer 12 constitute the appearance of the housing, and the inner surface 112 is configured for attaching the connecting part.

[0034] In one embodiment of the present invention, the texture layer 11 is woven from a yarn of the first material, wherein the yarn forms the three-dimensional structure during the weaving process; that is, the texture layer 11 is a fabric and the three-dimensional structure can be created with various three-dimensional structural patterns. The weaving process of the fabric is designed, whereby the yarn undergoes degreasing and the textured layer is hot-molded to achieve the specified hardness and shape. Degreasing the yarn increases the fabric's resilience and strength, thus improving the case's durability and strength. By hot-molding the textured layer, its shape and structure can be formed and designed to a specific size and shape, allowing it to, for example, conform to the profile of a mobile phone or tablet case, and the case can also be manufactured with a predetermined hardness.

[0035] The textured layer 11 is woven from the yarn of the first material. The three-dimensional structure with a specific pattern can be formed by the fabric material itself. The structural pattern of the outer surface 111 is visible through the transparent layer 12, and the inner surface 112 can be planarized by appropriate processing methods.

[0036] One embodiment of the present invention provides a method for manufacturing the housing, which is in Fig. As shown in 1, it is ready and the procedure is in Fig. 2 shown.

[0037] Fig. Figure 2 is a flowchart of a manufacturing process in the embodiment of the present invention. The manufacturing process serves to produce the [subject] in Fig. The process, as illustrated in Figure 1, comprises, in step S21, the integration of a textured layer woven from degreased yarn and exhibiting a three-dimensional structure. The use of degreased yarn reduces yarn shrinkage, thereby increasing the hardness of the textured layer. In step S22, the process includes processing the textured layer by hot forming to obtain a textured layer with a predetermined hardness and shape. By processing the textured layer of the fabric by hot forming, the textured layer can be shaped into a predetermined form and structure suitable for the housing of various electronic devices, while simultaneously exhibiting a predetermined hardness and shape. In step S23, the process includes the application of a transparent layer to the textured layer. The transparent layer can be applied by a spraying process.The transparent layer can be a UV adhesive (UV-curing adhesive). The transparent layer can enhance the stereo transparency effect of the three-dimensional structure of the texture layer.

[0038] The electronic device can optionally include a galvanic layer arranged between the textured layer and the transparent layer, wherein the galvanic layer is a mirror-reflective layer of a predetermined color. The galvanic layer is first applied to the surface of the textured layer, and the transparent layer is then applied. This means that, in one embodiment of the present invention, the housing of the electronic device can further include the galvanic layer, which is capable of enhancing the stereo effect of the three-dimensional structure of the textured layer. The galvanic layer is a mirror-reflective layer of a predetermined color, which determines the color of the three-dimensional structure, and its reflective effect can also increase the gloss of the three-dimensional structure.The texture layer can be subjected to NCVM (Non-Conductive Vacuum Metallization) treatment to create the electroplating layer.

[0039] Step S24 of the process includes cutting. Cutting can be performed by laser edging and polishing to smooth the edges of the housing.

[0040] Furthermore, the manufacturing process can also include processing the cut housing of the electronic device by means of a second hot forming process in order to further solidify the shape of the housing and thus further shape the housing and increase the hardness of the housing.

[0041] As can be seen from the preceding description, in one embodiment of the present invention, the housing of the electronic device comprises a textured layer having a three-dimensional structure, and the appearance of the housing offers various pattern effects. Furthermore, the textured layer can be woven from yarn of a first material, resulting in good durability. The textured layer is further processed by thermoforming, which achieves good hardness and a defined shape. Changing the color of the first material or the color of the electroplated layer allows for different colors for the three-dimensional structure, further increasing the variety of the appearance.

[0042] One embodiment of the present invention also provides a method for manufacturing the housing of the electronic device described in the above embodiment, wherein the method is described in Fig. 3 is shown. Fig. Figure 3 is a flowchart of a further manufacturing process provided in one embodiment of the present invention.

[0043] The manufacturing process comprises, in step 31, the production of a yarn from a first material. In one embodiment of the present invention, the first material can be aramid fiber. Aramid fiber includes PET, nylon, linen, carbon fiber, polyester aramid, and glass fiber. Aramid fiber exhibits good tensile strength and is cost-effective. In one embodiment of the present invention, the first material is preferably PET (polyethylene terephthalate plastic).

[0044] The yarn preparation process includes degreasing the pulp of the initial material and air-drying the degreased pulp to produce the yarn. The degreasing process increases the yarn's mechanical strength and reduces shrinkage, which contributes to increasing the mechanical strength of the texture layer.

[0045] Step D32 of the process involves weaving the yarn into a textured layer. During the weaving process, the yarn forms a three-dimensional structure. Different weaving techniques will result in different three-dimensional structures in the textured layer. Changing the weaving technique will alter the appearance of the casing.

[0046] In one embodiment of the present invention, to increase manufacturing efficiency, a large-area textured layer fabric can be produced, wherein the textured layer fabric is then cut into smaller textured layers for the production of housings on an assembly line. Alternatively, the textured layer fabric can be cut into many smaller textured layers using a laser cutting process. To avoid yellow edges of the PET caused by laser cutting, which result in an unsightly appearance, the laser output power can be set to 60 W - 100 W with a single-beam laser head at a cutting speed of 20 - 10,000 mm / min.

[0047] The textured layer fabric or layer can be impregnated with epoxy resin before thermoforming. Epoxy impregnation can simultaneously harden the yarn, increase its strength, and prevent cracking, thus improving the performance of the finished housing product.

[0048] The process, in step S33, involves processing the textured layer by means of a first hot forming operation to obtain a textured layer with a predetermined hardness and shape. This hot forming operation allows the textured layer to be shaped into a predetermined form and structure suitable for the housing of various electronic devices, while simultaneously exhibiting a predetermined hardness and shape. The first hot forming operation can also planarize the inner surface of the textured layer to facilitate the attachment of the connecting element and its connection and attachment to the main body of the electronic device.

[0049] In step S34, the process involves forming a transparent layer on the outer surface of the texture layer. The texture layer is the support body of the housing, and the transparent layer 12 is the protective layer of the support body.

[0050] The transparent layer can be a UV adhesive. This can be applied using a spray process. After spraying, the UV adhesive is cured at 60°C–70°C to ensure adhesion of the transparent layer and prevent secondary crystallization and oxidation of the material. To guarantee the smoothness and homogeneity of the transparent layer, the spray gun is set to a flat spray pattern with 360° rotation.

[0051] Step S35: Cutting the texture layer with a transparent layer on its outer surface to form the housing of the electronic device.

[0052] Optionally, the manufacturing process can also include impregnating the texture layer in epoxy resins to increase the hardness and resilience of the texture layer before hot forming.

[0053] By impregnating the texture layer of the fabric in epoxy resins, an epoxy resin layer can be formed on the surface of the texture layer, allowing the texture layer to reach the specified thickness after the epoxy resin layer has cured and the first thermoforming process. Optionally, this can be done in Fig. The manufacturing process shown in Figure 3 further includes the processing of the cut housings of the electronic device by means of a second hot forming process to further shape the housing and increase its hardness.

[0054] In one embodiment of the present invention, the housing is woven from a fabric with a predetermined hardness, and the textured layer of the fabric for manufacturing the housing is the supporting body of the housing, and the fabric has good resilience, which reduces the probability of the housing breaking when the electronic device is dropped, thus extending the service life of the electronic device and its housing.

[0055] It is important to note that, due to specific hardness requirements for the housing of the electronic device, in one embodiment of the present invention the hardness of the housing can be adjusted by modifying the thickness of the fabric. This allows for a housing with a predetermined hardness to be obtained in a manner other than by impregnating the textured layer of the fabric in epoxy resin to form a slurry layer on its surface to improve the housing's hardness. That is, the thickness of the slurry layer can be increased accordingly if the fabric thickness is small, and the thickness of the slurry layer can be reduced if the fabric thickness is large, in order to obtain a housing with a predetermined hardness. One embodiment of the present invention is illustrated using the example of transparent epoxy resin as the slurry layer, although the slurry layer can also consist of other transparent curing materials.Depending on the circumstances, there is no limit to the thickness of the fabric and the slurry layer, provided that the casing has the specified hardness.

[0056] In one embodiment of the present invention, the textured layer can either be a single layer of fabric or can be formed by several layers of fabric bonded together. Optionally, the thickness of the single layer of fabric is approximately 0.2 mm. The specific thickness can be determined according to the requirements of the electronic device.

[0057] Furthermore, it is important to note that due to the complexity and high cost of the process for joining multiple layers of fabric, the texture layer of this embodiment of the present invention is preferably a single-layer fabric.

[0058] In one embodiment of the present invention, the fabric with a predetermined hardness can be obtained by increasing the thickness of the slurry layer, wherein the fabric should have the required hardness for the housing of the electronic device, i.e., it does not deform when subjected to certain external forces, wherein the connecting part of the housing is located on the inside of the housing and is used only for attaching and connecting the housing to the main body.

[0059] In one embodiment of the present invention, if the fabric with a predetermined hardness is obtained by forming a slurry layer on the surface of the fabric, but meeting the fabric hardness requirements for the housing of the electronic device is difficult, the connecting element is used, in addition to connecting the housing to the main body, to increase the mechanical strength of the housing so that no deformation occurs when a certain external force is applied to the housing. In one embodiment, the supporting element is made of plastic, rubber, or other materials of a specific hardness.

[0060] In one embodiment, the housing 10 can also be shaped in a different way if the hardness of the housing does not meet the hardness requirements for the housing of the electronic device.

[0061] As described above, the process further includes forming a galvanizing layer on the outer surface of the texture layer prior to forming the transparent layer, wherein the galvanizing layer is a mirror-reflecting layer of a predetermined color.

[0062] A planarized transparent layer is applied to the surface of the casing. This transparent layer can serve as a protective layer for the textured layer and can also enhance the casing's gloss. In particular, the weave structure, i.e., the three-dimensional structure of the textured layer, becomes visible through the transparent layer. The transparent layer can increase the casing's gloss, further improving its aesthetic appearance. The color of the transparent layer can be determined by matching the yarn color or the color of the electroplating layer, thus enabling a variety of casing colors.

[0063] The manufacturing process in one embodiment of the present invention is simple and cost-effective. The color of the housing produced by this process can be customized to meet the user's individual requirements. The housing has the same appearance and strength as the ceramic housing, but the manufacturing costs are only 10% of the cost of the ceramic housing.

[0064] One embodiment provides an electronic device and a method for manufacturing a housing for the electronic device, such that the durability of the housing for the electronic device is improved and the service life of the electronic device and its housing is extended.

[0065] One embodiment provides an electronic device comprising: a housing, wherein the housing is made of fabric, the fabric having a predetermined hardness and the fabric having the predetermined hardness taking the form of a housing; a connector, wherein the connector is arranged in the housing; and a body, wherein the housing is attached to the body by means of the connector.

[0066] In one embodiment, the fabric is ramie cotton fabric, wool fabric or fiber fabric.

[0067] In one embodiment, a method for producing the fabric having the predetermined hardness comprises: producing a fabric with predetermined hardness; and forming a slurry layer on a first surface of the fabric to obtain a fabric with the predetermined hardness.

[0068] In one embodiment, the slurry layer is an epoxy resin layer.

[0069] In one embodiment, the thickness of the slurry layer is between 0.1 mm and 0.2 mm.

[0070] In one embodiment, the step of producing the fabric with a predetermined hardness, if the fabric is ramie cotton fabric, comprises the following: providing a ramie cotton slurry; degreasing treatment and spinning the ramie cotton slurry to obtain ramie cotton threads; twisting a predetermined number of ramie cotton threads to obtain ramie cotton yarns of a predetermined diameter; and weaving the ramie cotton yarns into a fabric of a predetermined thickness.

[0071] In one embodiment, the fabric having the predetermined hardness and forming the housing comprises: thermoforming a fabric having a predetermined hardness, such that the fabric having a predetermined hardness represents a prototype for the housing shape; and cutting and polishing the prototype for the housing shape of the fabric having a predetermined hardness, such that the fabric having a predetermined hardness assumes the housing shape.

[0072] In one embodiment, the following step after cutting and polishing the housing-shape prototype of the fabric with predetermined hardness further comprises: forming a transparent lacquer layer on a second surface of the fabric with predetermined hardness, wherein the second surface is opposite the first surface.

[0073] In one embodiment, the transparent lacquer layer is a UV lacquer layer.

[0074] Furthermore, a method for manufacturing a housing for an electronic device is provided. The method comprises: producing a fabric of a predetermined thickness; and forming a slurry layer on a first surface of the fabric to obtain a fabric of the predetermined hardness; thermoforming a fabric of the predetermined hardness so that the fabric of the predetermined hardness represents a prototype for the housing shape; and cutting and polishing the prototype housing shape of the fabric of the predetermined hardness so that the fabric of the predetermined hardness assumes the housing shape.

[0075] In one embodiment, the fabric is ramie cotton fabric, wool fabric or fiber fabric.

[0076] In one embodiment, the step of producing the fabric with a predetermined hardness, if the fabric is ramie cotton fabric, comprises the following: providing a ramie cotton slurry; degreasing treatment and spinning the ramie cotton slurry to obtain ramie cotton threads; twisting a predetermined number of ramie cotton threads to obtain ramie cotton yarns of a predetermined diameter; and weaving the ramie cotton yarns into a fabric of a predetermined thickness.

[0077] In one embodiment, the following step after cutting and polishing the housing-shape prototype of the fabric with predetermined hardness further comprises: forming a transparent lacquer layer on a second surface of the fabric with predetermined hardness, wherein the second surface is opposite the first surface.

[0078] In one embodiment, the transparent lacquer layer is a UV lacquer layer.

[0079] In one embodiment, the slurry layer is an epoxy resin layer.

[0080] In one embodiment, the thickness of the slurry layer is between 0.1 mm and 0.2 mm.

[0081] In one embodiment, an electronic device comprises a body and a housing attached to the body by means of a connecting piece. The housing is made of fabric with a predetermined hardness, which is shaped to fit the housing and exhibits good formability, thus reducing the likelihood of breakage if the electronic device is dropped, thereby extending the service life of both the electronic device and its housing.

[0082] State-of-the-art plastic housings have poor formability, so the plastic housing breaks easily when the electronic device is dropped, resulting in a short lifespan for both the electronic device and its housing.

[0083] Therefore, one embodiment provides an electronic device comprising: a housing, wherein the housing is made of fabric, the fabric having a predetermined hardness and the fabric having the predetermined hardness taking the form of a housing; a connector, wherein the connector is arranged in the housing; and a body, wherein the housing is attached to the body by means of the connector.

[0084] Accordingly, one embodiment provides a method for manufacturing a housing for an electronic device, comprising: manufacturing a fabric of a predetermined thickness; forming a slurry layer on a first surface of the fabric to obtain a fabric of the predetermined hardness; thermoforming a fabric of a predetermined hardness such that the fabric of a predetermined hardness represents a prototype for the housing shape; and cutting and polishing the prototype for the housing shape of the fabric of predetermined hardness so that the fabric of predetermined hardness assumes the housing shape.

[0085] In the electronic device and the method for manufacturing a housing for it, which is provided in embodiments, the housing consists of fabric, the fabric has a predetermined hardness, the fabric with predetermined hardness assumes a housing shape, and the fabric has good formability, so that the probability of breakage for the housing when the electronic device is dropped is reduced, thereby extending the service life of the electronic device and its housing.

[0086] One embodiment of the present invention provides an electronic device as described in Fig. 4 shown ready, wherein the electronic device comprises: A housing 1, as shown in Fig. 5 and Fig. Figure 6 shows the housing 1 being made of fabric, the fabric having a predetermined hardness and the fabric with predetermined hardness assuming a housing shape; a connecting piece (not shown), wherein the connecting piece is attached in the housing 1; and a body 2, wherein the housing 1 is attached to the body 2 by means of the connecting piece.

[0087] Based on the aforementioned embodiment, in one embodiment the fabric is a ramie cotton fabric. In another embodiment, the fabric is a wool fabric. In a further embodiment, the fabric is a fibrous fabric, and in other embodiments the fabric can consist of other materials.

[0088] In one embodiment, a method for producing the fabric having the desired hardness comprises: producing a fabric of a desired thickness; and forming a slurry layer on a first surface of the fabric to obtain a fabric of the desired hardness, such that the fabric assumes a solid shape. In one embodiment, the slurry layer is an epoxy resin layer. In another embodiment, the slurry layer may also be a layer of a different material, provided that it can improve the hardness of the fabric depending on specific situations.

[0089] It should be noted that the housing for the electronic device has a specific hardness requirement, and, in order to obtain the housing with the specified hardness, in one embodiment, in addition to forming a slurry layer on the surface of the fabric to improve the housing's hardness, the housing's hardness can also be adjusted by modifying the fabric's thickness. That is, the thickness of the slurry layer can be increased accordingly if the fabric is relatively thin, and decreased accordingly if the fabric is relatively thick, to obtain the housing with the specified hardness. Provided the housing meets the specified hardness, the specific thickness of the fabric and the specific thickness of the slurry layer are not limited in the present invention and depend on specific situations.

[0090] In one embodiment, the specified thickness is between approximately 0.2 mm and 0.6 mm, and the thickness of the slurry layer is between approximately 0.1 mm and 0.2 mm. In another embodiment, the thickness of the slurry layer is approximately 0.2 mm.

[0091] The method of producing the fabric with a predetermined hardness in the embodiment of the present invention is described using ramie cotton fabric as an example. Based on one of the embodiments mentioned above, the step of producing the fabric with a predetermined hardness in one embodiment, using ramie cotton fabric as the fabric, comprises the following: providing a ramie cotton slurry; degreasing and spinning the ramie cotton slurry to obtain ramie cotton threads; twisting a predetermined number of ramie cotton threads to obtain ramie cotton yarns of a predetermined diameter; and weaving the ramie cotton yarns into a fabric of a predetermined thickness.

[0092] It should be noted that in actual application, weaving ramie cotton into fabric of a specified hardness involves the following: weaving using the ramie cotton threads to obtain a single-ply fabric, the thickness of which is approximately 0.2 mm. If the specified thickness is equal to the thickness of the single-ply fabric, the ramie cotton threads are used directly for weaving, resulting in a thickness equal to the specified thickness; if the specified thickness is greater than the thickness of the single-ply fabric, the ramie cotton threads are first woven into the single-ply fabric, and several layers of this fabric, each with the thickness of the single-ply fabric, are then layered and laminated together to obtain the fabric of the specified thickness.

[0093] It should further be noted that the process of layering and laminating multiple layers of fabric with the thickness of a single-layer fabric is complicated and costly; therefore, based on the embodiments described above, the fabric with the specified thickness is preferably a single-layer fabric in one embodiment. In another embodiment, the fabric with a specified hardness can be obtained by increasing the thickness of the slurry layer, and the hardness of the fabric can thus meet the housing requirements of the electronic device. That is, the housing will not deform when a certain degree of external force is applied to it. In this housing, the connector is located at the periphery of the interior of the housing 1 and is used only to firmly connect the housing 1 to the body.In one embodiment, the hardness of the fabric, after the slurry layer has been formed on its surface to obtain a fabric of the specified hardness, may not meet the housing hardness requirements of the electronic device. In this housing, the connector comprises: a connecting part located at the periphery of the interior of the housing 1, and a support part located on the lower surface of the interior of the housing 1, the support part conforming to the shape of the housing 1 so that it supports and maintains the shape of the housing 1; therefore, the housing will not deform when a certain degree of external force is applied to it. In one embodiment, the support part may be made of plastic, rubber, or other materials of a specific hardness.

[0094] If the hardness of the housing 1 does not meet the housing hardness requirements of the electronic device, in one embodiment the shape of the housing 1 can be fixed in another way.

[0095] In one embodiment, the fabric having the predetermined hardness and forming the housing comprises: thermoforming a fabric having a predetermined hardness, such that the fabric having a predetermined hardness represents a prototype for the housing shape; and cutting and polishing the prototype for the housing shape of the fabric having a predetermined hardness, such that the fabric having a predetermined hardness assumes the housing shape.

[0096] It should be noted that in one embodiment, the area of ​​the fabric with a predetermined hardness corresponds to the area of ​​the housing of an electronic device. In other embodiments, the area of ​​the fabric with a predetermined hardness can correspond to the area of ​​the housings of several electronic devices, in order to enable the mass production of housings for electronic devices.In one embodiment, the fabric of predetermined hardness that forms the housing shape comprises: dividing the fabric of predetermined hardness into several fabric units of predetermined hardness, wherein the area of ​​each fabric unit of predetermined hardness corresponds to the area of ​​the housing of an electronic device; thermoforming a fabric unit of predetermined hardness such that the fabric unit of predetermined hardness represents a prototype for the housing shape; and cutting and polishing the prototype for the housing shape of the fabric of predetermined hardness so that the fabric of predetermined hardness forms the housing shape.

[0097] In one embodiment, the next step after cutting and polishing the housing-shape prototype of the fabric with a predetermined hardness further comprises the following: forming a transparent lacquer layer on a second surface of the fabric with a predetermined hardness, wherein the second surface is opposite the first surface. In one embodiment, the transparent lacquer layer is not only able to further improve the hardness of the housing, but it can also improve the three-dimensional appearance of the housing. Furthermore, the transparent lacquer layer can further improve the smoothness of the second surface. In one embodiment, the transparent lacquer layer is a UV lacquer layer.

[0098] In one embodiment of the electronic device, the housing consists of a fabric, the fabric has a predetermined hardness, the fabric with predetermined hardness takes on a housing shape, and the fabric has good formability, so that not only is the probability of breakage of the housing reduced when the electronic device is dropped, but also the abrasion resistance of the housing is improved, thereby extending the service life of the electronic device and its housing.

[0099] Accordingly, one embodiment further provides a method for manufacturing a housing for an electronic device, as in Fig. 7 presented, ready, comprehensive:

[0100] Step 1: Producing a fabric of a predetermined thickness. In one embodiment of the present invention, a method for producing the fabric of a predetermined hardness comprises: producing a fabric of a predetermined thickness; and forming a slurry layer on a first surface of the fabric to obtain a fabric of the predetermined hardness, such that the fabric assumes a solid shape. In one embodiment, the slurry layer is an epoxy resin layer. In another embodiment, the slurry layer may be a layer of another material, provided that it can improve the hardness of the fabric depending on specific situations.

[0101] Step 2: Forming a slurry layer on an initial surface of the fabric to obtain a fabric with the specified hardness.

[0102] It should be noted that the housing for the electronic device has a specific hardness requirement, and, in order to obtain the housing with the specified hardness, in one embodiment, in addition to forming a slurry layer on the surface of the fabric to improve the housing's hardness, the housing's hardness can also be adjusted by modifying the fabric's thickness. That is, the thickness of the slurry layer can be increased accordingly if the fabric is relatively thin, and decreased accordingly if the fabric is relatively thick, to obtain the housing with the specified hardness. Provided the housing meets the specified hardness, the specific thickness of the fabric and the specific thickness of the slurry layer are not limited in the present invention and depend on specific situations.

[0103] In one embodiment, the specified thickness is between approximately 0.2 mm and 0.6 mm, and the thickness of the slurry layer is preferably between approximately 0.1 mm and 0.2 mm. In another embodiment, the thickness of the slurry layer is approximately 0.2 mm.

[0104] The process for producing the fabric with a predetermined hardness in one embodiment is described using ramie cotton fabric as an example. In one embodiment, the step of producing the fabric with a predetermined hardness, if the fabric is ramie cotton fabric, comprises, as shown in Fig. 8 shown, the following: Step 201: Preparing a ramie cotton slurry; Step 202: Degreasing treatment and spinning of the ramie cotton slurry to obtain ramie cotton threads; Step 203: Twisting a predetermined number of ramie cotton threads to obtain ramie cotton yarns of a predetermined diameter; and Step 204: Weaving the ramie cotton yarns into a fabric with a predetermined thickness.

[0105] It should be noted that in actual application, weaving ramie cotton into fabric of a specified hardness involves the following: weaving using the ramie cotton threads to obtain a single-ply fabric, the thickness of which is approximately 0.2 mm. If the specified thickness is equal to the thickness of the single-ply fabric, the ramie cotton threads are used directly for weaving, resulting in a thickness equal to the specified thickness; if the specified thickness is greater than the thickness of the single-ply fabric, the ramie cotton threads are first woven into the single-ply fabric, and several layers of this fabric, each with the thickness of the single-ply fabric, are then layered and laminated together to obtain the fabric of the specified thickness.

[0106] Step 3: Thermoforming (or hardening) a fabric with a predetermined hardness, so that the fabric with a predetermined hardness represents a prototype for the housing shape.

[0107] It should be noted that in one embodiment, the area of ​​the fabric with a predetermined hardness corresponds to the area of ​​the housing of an electronic device. In another embodiment, the area of ​​the fabric with a predetermined hardness can correspond to the area of ​​the housings of several electronic devices to enable the mass production of housings for electronic devices. In one embodiment, the following steps prior to thermoforming the fabric with a predetermined hardness further comprise: dividing the fabric with a predetermined hardness into several fabric units of a predetermined hardness, the area of ​​each fabric unit of a predetermined hardness corresponding to the area of ​​the housing of an electronic device; and thermoforming the fabric with a predetermined hardness so that the fabric with a predetermined hardness represents a prototype for the housing shape. However, this is not limited in the present invention and is situation-dependent.

[0108] Step 4: Cutting and polishing the prototype for the housing shape of the fabric with a specified hardness, so that the fabric with the specified hardness takes on the housing shape. In one embodiment, the cutting process is a laser cutting process.

[0109] In one embodiment, the next step after cutting and polishing the housing-shaped prototype of the fabric with a predetermined hardness further comprises the following: forming a transparent lacquer layer on a second surface of the fabric with a predetermined hardness, wherein the second surface is opposite the first surface. In this embodiment, the transparent lacquer layer is not only able to further improve the hardness of the housing, but it can also improve the three-dimensional appearance of the housing. Furthermore, the transparent lacquer layer can further improve the smoothness of the second surface. In one embodiment, the transparent lacquer layer is a UV lacquer layer; however, this is not limited in the present invention and is situation-dependent.

[0110] It should be noted that after the enclosures have been manufactured and before they are transported to electronic device manufacturers for assembly, the enclosures are further identified and screened. Qualified enclosures are packaged for transport to the electronic device manufacturers, while non-qualified enclosures are neither packaged nor transported. The identification and packaging steps are well known to those skilled in the art and are therefore not described in detail in the present invention.

[0111] In one embodiment, the housing consists of fabric, the fabric has a predetermined hardness, the fabric with predetermined hardness takes on a housing shape, and the fabric has good formability, so that not only is the probability of breakage of the housing reduced when the electronic device is dropped, but also the abrasion resistance of the housing is improved, thereby extending the service life of the electronic device and its housing.

[0112] Different parts of the specifications are described in a progressive manner, with each part describing a component that differs from other parts, and identical or similar components can be obtained through mutual reference.

[0113] After reading the description of the embodiments disclosed above, a person skilled in the art should be able to carry out or use this invention. Various modifications are apparent to a person skilled in the art; the general principle defined here can also be implemented in other embodiments without deviating from the scope or spirit of the disclosure. Accordingly, the present invention is not limited to the embodiments presented here, but encompasses the broadest scope compatible with the principles disclosed herein and with the novelty.

Claims

[1] An electronic device comprising: a main body; and a tissue housing comprising a connecting part at an inner periphery of the tissue housing (1); wherein the fabric housing (1) is connected to the main body via the connecting part, wherein the fabric casing (1) has a predetermined hardness, and wherein the tissue casing (1) is obtained with the specified hardness by a process comprising the following: Provision of a ramie cotton slurry; Degreasing treatment and spinning of the ramie cotton slurry to obtain ramie cotton threads; characterized by : Twisting (203) a predetermined number of ramie cotton threads to obtain ramie cotton yarns of a predetermined diameter; and Weaving (204) the ramie cotton yarns into a fabric of a predetermined thickness. [2] The electronic device according to claim 1, wherein the fabric is selected from a group of fabrics comprising ramie cotton fabric, wool fabric and fiber fabric. [3] The electronic device according to claim 1, wherein the fabric with the specified hardness comprises the following: A fabric with a predetermined thickness; and a slurry layer on a first surface of the tissue. [4] The electronic device according to claim 3, wherein the slurry layer contains an epoxy resin. [5] The electronic device according to claim 4, wherein the thickness of the slurry layer is between 0.1 mm and 0.2 mm. [6] The electronic device according to claim 1, wherein the fabric housing (1) is obtained by a method comprising: Thermoforming a fabric with a predetermined hardness, wherein the fabric with a predetermined hardness represents a prototype for the housing shape; and Cutting and polishing the prototype for the case shape to obtain the fabric case. [7] The electronic device according to claim 6, wherein the method further comprises: Forming a transparent lacquer layer on a second surface of the fabric with a predetermined hardness, wherein the second surface is opposite the first surface. [8] The electronic device according to claim 7, wherein the transparent lacquer layer is a UV lacquer layer. [9] A procedure comprising: Provision of tissue material; Forming a slurry layer on the surface of the fabric material to increase the hardness of the fabric material; and Hardening of the tissue material with the slurry layer, wherein the hardened tissue material has a predetermined hardness, the step of providing a tissue includes the following: Provision (201) of a ramie cotton slurry: Degreasing treatment and spinning (202) of the ramie cotton slurry to obtain ramie cotton threads; characterized by : Twisting (203) a predetermined number of ramie cotton threads to obtain ramie cotton yarns of a predetermined diameter; and Weaving (204) the ramie cotton yarns into a fabric of a predetermined thickness. [10] The method according to claim 9, wherein the fabric is selected from a group of fabrics comprising ramie cotton fabric, wool fabric and fiber fabric. [11] The method of claim 9, further comprising: Forming a transparent lacquer layer on a second surface of the fabric, with the second surface facing the first surface. [12] The method according to claim 11, wherein the transparent lacquer layer is a UV lacquer layer. [13] The method according to claim 9, wherein the slurry layer contains an epoxy resin. [14] The method according to claim 9, wherein the thickness of the slurry layer is between 0.1 mm and 0.2 mm.

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