Waterproof electronic equipment unit
The waterproof electronic equipment unit optimizes space usage and heat dissipation by positioning the connector housing in the base recess and using a heat transfer mechanism to manage temperature distribution, ensuring effective watertight sealing and efficient heat dissipation.
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- MITSUBISHI ELECTRIC CORP
- Filing Date
- 2016-08-19
- Publication Date
- 2026-05-21
AI Technical Summary
Existing waterproof electronic equipment units face challenges in effectively utilizing space and efficiently dissipating heat while maintaining a watertight seal, particularly when heat-generating components are involved, as they often result in uneven temperature distribution and potential water ingress.
The design incorporates a frame with a recessed mounting surface area, positioning the connector housing within the base recess, a water-repellent filter inlet away from direct water exposure, and a heat transfer mechanism that directs heat from high-temperature components to a lower-temperature cover, using adhesives with varying thermal conductivities to manage heat distribution.
This configuration optimizes space usage, prevents water ingress, maintains a hermetic seal, and enhances heat dissipation by directing heat from high-temperature components to a lower-temperature area, thus improving overall performance and reducing the unit's size and cost.
Smart Images
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Abstract
Description
BACKGROUND OF THE INVENTION 1. Field of the invention
[0001] The present invention relates to a waterproof electronic equipment unit suitable, for example, for installation directly in an automotive gearbox, and relates in particular to a waterproof electronic equipment unit that is improved to be able to use a given installation environment effectively. 2. Description of the related prior art
[0002] Generally, there are two types of waterproof electronic equipment units, in which a circuit substrate is hermetically enclosed within a frame configured from a base and a cover, circuit components which include a heat-generating component, and an external wiring connector housing, part of which is exposed from the frame, on which the circuit substrate is mounted, and a waterproof sealing material is applied to the junction surfaces of the base, the cover and the connector housing, wherein the two types are one type in which the connector housing, which forms a tall component, is located between the circuit substrate and the cover, and one type in which the connector housing is located between the circuit substrate and the base.
[0003] In this case, the base is part of the frame on one side, which has a mounting leg for arranging and fixing the electronic equipment unit on a mounting surface, and the frame is configured by the fact that the cover is attached to the base, for example by screws.
[0004] Air is also released from the frame to the atmosphere by providing a water-repellent filter on an inner surface of the cover or base, in order to prevent deformation of the frame structure or damage to the hermetic sealing structure caused by a difference in atmospheric pressure inside and outside the frame due to an increase in the temperature of the heat-generating component inside the frame.
[0005] The water-repellent filter is configured from a flat porous material containing several tiny holes that prevent water droplets from flowing into and passing through the interior of the frame, while allowing air to pass through freely. However, the installation structure is designed so that the porous material is not contaminated by direct contact with water.
[0006] For example, according to Fig. 3 of patent document 1 (“Electronic control device substrate housing frame”) a circuit substrate 40 on which a connector housing 41 is mounted, hermetically enclosed within a substrate housing frame 10, which is configured from a base 30 and a cover 20, and mounting legs 32 are provided on the base 30 and arranged and fixed on a mounting surface not shown, and the cover 20 is integrated with the base 30 by curved pieces provided at four curved corners.
[0007] In patent document 1, a connector housing 41 is arranged between the circuit substrate 40 and the cover 20, the size is reduced by a high flat part 22 and a low flat part 21 provided on the cover 20, and heat generated by a heat-generating component 43a is transferred to a heat transfer base part of the base 30 by means of a heat transfer mechanism 12.
[0008] Also according to Fig. 1 and Fig. 2 of patent document 2 “Frame and method for assembling the frame” a circuit substrate 40A, on which connector housings 24Aa and 24Ab are mounted, hermetically housed within a substrate housing frame 10A, which is configured from a housing 20A, here corresponding to a base, and a cover 30A, mounting holes 21a to 21d are provided in mounting feet of the base (housing) 20A, and the mounting legs are arranged on and fixed to a mounting surface not shown, and the cover 30A and base (housing) 20A are integrated using four corner screws 31a to 31d and screw holes 22a to 22d of the base (housing) 20A.
[0009] In patent document 2, the connector housings 24Aa and 24Ab are arranged between the circuit substrate 40A and the base (housing) 20A, and connecting pins 25a and 25b of the straight type are press-fitted into body areas of the connector housings 24Aa and 24Ab and connected to the circuit substrate 40A by soldering.
[0010] Heat generated by a heat generation component 42 is also transferred via a heat transfer conductor to a heat transfer base part of the base (housing) 20A. Patent Document 1: JP-A-2013-004611 ( Fig. 1 and Fig. 3, Summary) Patent Document 2: JP-A-2014-060307 ( Fig. 1, Fig. 2, and Fig. 4 and summary) 1. Description of problems with existing technology
[0011] The “electronic control device substrate housing frame” according to patent document 1 includes an advantage of being able to absorb radiant heat emitted from one side of the first substrate surface 43 of the circuit substrate 40 using a low flat part 21 of the cover 20, but the configuration is such that space on the outside of the low flat part 21 is not used effectively and no reduction in the external dimensions of the overall frame can be expected.
[0012] Even though heat generated by the heat generation component 43a is transferred to the side of the base 30, there is a problem with the fact that the heat radiation characteristics of the heat generation component 43a are disadvantageous if the side of the base 30 is at a higher temperature than the side of the cover 20.
[0013] There is no discussion of an installation location for a water-repellent filter to protect sealing materials 11a to 11c that are applied between the cover 20 of the base 30 and the connector housing 41.
[0014] The “frame and method for assembling the frame” according to patent document 2 provides a small, inexpensive frame such that it improves the watertight seal between the cover 30A and the base (housing) 20A. This frame is configured to hermetically house a circuit substrate. However, when heat generated by the heat-generating component 42 is transferred to the side of the base (housing) 20A, the heat dissipation characteristics of the heat-generating component 42 are disadvantageous if the base (housing) 20A side is at a higher temperature than the side of the cover 30A. An advantage can be expected when transferring heat to the cover 30A. Instead, heat-radiating fins 23A are provided adjacent to the connector housings 24Aa and 24Ab, which are tall components, resulting in a large overall configuration. SUMMARY OF THE INVENTION 2. Description of the problems of the invention
[0015] A first object of the invention is to provide an arrangement with a waterproof electronic equipment unit in which a mounting surface having a recessed area, where an area of a flat mounting area forms a void, is such that the mounting surface recessed area can be used effectively.
[0016] A second objective of the invention is to provide an arrangement with a waterproof electronic equipment unit in a simple and ready-to-assemble manner, so that an inlet of a water-repellent filter for carrying out respiration with external air is not in direct contact with water.
[0017] An arrangement comprising a waterproof electronic equipment unit and a mounting surface according to the invention includes the features according to claim 1. Preferred embodiments are defined in dependent claims 2-7.
[0018] As described above, the arrangement with a waterproof electronic equipment unit according to the invention includes a frame that is arranged on and fixed to a mounting surface which has a mounting surface recess area, the frame is configured from a base and a housing that covers a circuit substrate, the base includes a base recess area that is arranged in the mounting surface recess area, a tall component including a connector housing mounted on a circuit substrate is arranged in the base recess area, a water-repellent filter is provided in a non-recess area of the base and an inlet of the water-repellent filter is positioned above the mounting surface recess area.
[0019] Consequently, by arranging a tall component that includes a connector housing utilizing a mounting surface recess area, there is an advantage in that the effective space occupied by an electronic equipment unit can be limited.
[0020] Also, since the mounting surface recess area is not positioned above it, it is not possible for the mounting surface recess area to become a chimney and accumulated water to flow into the inlet. Furthermore, since the inlet of the water-repellent filter is positioned on the rear surface of the electronic equipment unit, there is the advantage that the inlet is unlikely to be directly exposed to water. There is no need to provide a mechanism to prevent direct exposure to water at the periphery of the inlet, and the configuration is therefore small and inexpensive.
[0021] The foregoing and other tasks, features, aspects and advantages of the invention will become more apparent from the following detailed description of the invention when viewed together with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an external monitoring of the waterproof electronic equipment unit according to a first aspect of the invention; Fig. 2 is an external end view as seen from a connector housing mounting surface side of Fig. 1; Fig. 3 is an internal oversight of the base of Fig. 1; Fig. 4 is a sectional view along a line Z4-Z4 of Fig. 3. Fig. 5 is a sectional view along a line Z5-Z5 of Fig. 3; Fig. 6 is an internal view of a cover of Fig. 1; Fig. 7 is a sectional view along a line Z7-Z7 of Fig. 6; Fig. 8 is a sectional view along a line Z8-Z8 of Fig. 1; Fig. 9 is a sectional view along a line Z9-Z9 of Fig. 1; Fig. Figure 10 is an enlarged sectional view of a connector housing from Fig. 8; Fig. 11 is a sectional view along a line Z11-Z11 of Fig. 9; and Fig. Figure 12 is an assembly process diagram of the waterproof electronic equipment unit according to the first embodiment of the invention. DETAILED DESCRIPTION OF THE PREFERRED DESIGN First Design 1. Detailed Description of Configuration
[0022] The following will Fig. 1, which is an external monitoring of the waterproof electronic equipment unit according to an embodiment of the invention, Fig. 2, which shows an external end view when viewed from a connector housing mounting surface side of Fig. 1 is, Fig. 3, which provides internal oversight of a base of Fig. 1 is, Fig. 4, which shows a cross-sectional view along a line Z4-Z4 of Fig. 3 is; Fig. 5, which shows a sectional view along a line Z5-Z5 of Fig. 3 is, Fig. 6, which provides internal oversight of the coverage of Fig. 1 is and Fig. 7, which shows a sectional view along a line Z7-Z7 of Fig. 6 is described one after the other.
[0023] First, in the Fig. 1 and Fig. 2, which are external unit views, a waterproof electronic equipment unit 100 (hereinafter sometimes referred to as the unit) configured from a frame 101, comprising a base 110 made of cast aluminum or sheet metal or formed of thermosetting polymer, and having mounting feet 111a to 111d at four locations, and a cover 120 made of cast aluminum or sheet metal, integrated using fastening screws 139 at four corners, and a circuit substrate 130 (see Fig. 8), which is included in the frame, and an area of a polymer cast connector housing 131, which is mounted on one side of the circuit substrate 130, is exposed from an end face of the frame.
[0024] A cross-section of a body area 132 (see Fig. 10) of the connector housing 131 is of a trapezoidal shape and a mating connector (not shown) is inserted into the exposed area of the connector housing 131 and connected with external orientation via a cable harness.
[0025] Mounting feet 111a to 111d provided at the four locations on the base 110 are arranged on a flat mounting area 201 of a mounting surface 200 and fixed using fixing screws not shown, but a mounting surface recess area 202, which is a void, is configured in an area of the flat mounting area 201.
[0026] A heat transfer socket rear surface area 121, positioned on an outer surface of the cover 120, is subsequently described using Fig. 6 and Fig. 7 described.
[0027] In Fig. 3, Fig. 4 to Fig. Figure 5, which shows a detailed configuration of the base 110, are screw holes 119 into which the screws are inserted using... Fig. The fastening screws 139 described above are screwed through the cover 120 at the four corners of the base 110, which has the mounting feet 111a - 111d in the four places, and a three-sided recessed strip 112 is provided on three sides of the inner periphery of the screw holes 119.
[0028] A base recess area 114 provided in a region of a base surface 110 configures an end surface opening 115 of the base 110, and a recess surface sealing area 113, into which the body area 132 (see Fig. 10) of the connector housing 131 of Fig. 1 is fitted into the end face opening 115.
[0029] The recess surface sealing area 113 is configured from a three-sided flat area, which has trapezoidal, inclined side areas and a short tip area, a first sealing material 141 is applied to the flat area and the heat transfer coefficient of the material is, for example, 0.18W / mK or less.
[0030] A filter mounting surface 118, on which a water-repellent filter 117 (see Fig. 8) is attached and fixed, is provided on the inside of a non-recessed surface of the base 110, and an inlet surface of the water-repellent filter 117 communicates with outside air via an inlet 116 provided in the base 110.
[0031] In the Fig. 6 and Fig. Figure 7, which shows a detailed configuration of the cover 120, are through holes 129 through which the [material] used [for] Fig. The fastening screws 139 described above are passed through and fixed to the base 110, provided at the four corners of the cover 120, and a ring-shaped projecting strip 122 is provided on four sides of the inner periphery of the through holes 129.
[0032] Tubular projecting areas 128 project on the outer circumferences of the through holes 129, and the thickness of a second sealing material 142 (see Fig. 12), which is to be described below, is defined by the height of the tubular projecting areas 128. An intermediate-stage heat transfer base 124 and a high-stage heat transfer base 125 are also provided on the inner bottom surface of the cover 120, first heat transfer adhesives 126 and 127 are applied to the heat transfer bases 124 and 125, and the first heat transfer adhesives 126 and 127 come into contact with a second heat-generating component 136 and a first heat-generating component 135a, which are subsequently described using Fig. 9 are to be described. An adhesive with high thermal conductivity, where the heat transfer coefficient exceeds, for example, 0.83 W / mK, is used as the heat transfer adhesive.
[0033] Several gap-regulating projections 123a and 123b, provided on the high-stage heat transfer socket 125, are in contact with an island-shaped pattern that does not correspond to a substrate surface or other circuit pattern on a rear surface area of the Fig. 9 shown circuit substrate 130 communicates, and serve to stably secure the applied thickness of the high-level heat transfer adhesive 127.
[0034] Next, Fig. 8, which shows a sectional view along a line Z8-Z8 of Fig. 1 is, Fig. 9, which shows a sectional view along a line Z9-Z9 of Fig. 1 is, Fig. 10, which shows an enlarged sectional view of the connector housing of Fig. 8 is, and Fig. 11, which shows a sectional view along a line Z11-Z11 of Fig. 9 is described one after the other.
[0035] In Fig. Figure 8, which is a main sectional view of the unit, shows the electronic equipment unit 100 from the frame 101, which is configured from the base 110 with the mounting feet 111a to 111d at the four locations (only the mounting foot 111c is shown) and the cover 120, and the circuit substrate 130 housed in the frame, and a cast polymer connector housing 131 mounted on one side of the circuit substrate 130 is exposed from an end face of the frame.
[0036] Several right-angled connection terminals 133 are press-fitted into the body area 132 of the connector housing 131 cast from thermoplastic polymer, and one end of each connection terminal 133 is soldered to one side of the circuit substrate 130.
[0037] Also, a soldered high component 134 mounted on the rear surface of the circuit substrate 130 and the body area 132 of the connector housing 131 are arranged in the base recess area 114.
[0038] The water-repellent filter 117 is attached to the filter mounting surface 118 (see Fig. 3) attached and fixed, which is provided on the inner side of the non-recessed surface of the base 110, and the inlet surface of the water-repellent filter 117 communicates with the external air via the inlet 116 provided in the base 110.
[0039] An opening surface of the inlet 116 and the flat mounting area 201 of the mounting surface 200 are opposite each other via an inlet surface gap D1, and the inlet surface gap D1 is of a dimension such that the inlet 116 is not blocked by water flowing onto the rear surface of the base 110 when a water exposure test is performed according to predetermined specifications.
[0040] The flat mounting area 201 has an inclination angle θ with respect to the surface of the earth and water flowing onto the rear surface of the base flows in the direction of the base depression area 114.
[0041] The mounting surface 200 of the base 110 has the flat mounting area 201 and the mounting surface recess area 202, and the base recess area 114 of the base 110 is arranged in the mounting surface recess area 202 opposite the mounting surface recess area 202 across a recess area gap D2.
[0042] The dimensions of the inlet surface gap D1 and the recess area gap D2 are regulated in relation to the depth of the mounting surface recess area 202, the depth of the base recess area 114 and the height of the mounting feet 111a to 111d.
[0043] In Fig. Figure 9, which shows a heat transfer mechanism of heat generation components, shows that the first heat generation component 135a and a third heat generation component 135b are mounted on the rear surface of the circuit substrate 130 opposite the base 110, and the second heat generation component 136 is mounted on a front surface of the circuit substrate 130 opposite the cover 120.
[0044] A back surface pattern of the first heat generation component 135a, to which an electrode connection is attached, and a front surface pattern positioned on the opposite surface communicate via a via and a transfer of heat is carried out between the front and back patterns.
[0045] The front surface pattern comes into heat-transferring contact via the first heat transfer adhesive 127 (see Fig. 7), with the high-level heat transfer base 125 provided on the inner surface of the cover 120.
[0046] A rear surface (a surface opposite a soldering surface and opposite the circuit substrate 130) of the second heat-generating component 136 comes into heat transfer contact via the first heat transfer adhesive 126 (see Fig. 7) with the intermediate heat transfer base 124, which is provided on the inner surface of the cover 120 (or with the inner bottom surface of the cover 120).
[0047] A rear surface (a surface opposite a solder surface opposite the circuit substrate 130) of the third heat-generating component 135 comes into heat transfer contact with a socket surface, which is provided on the inner surface of the base 110 (or with an inner bottom surface of the base 110), via a second heat transfer adhesive 135bb.
[0048] In Fig. Figure 10, which shows a detailed configuration of the connector housing, shows the several right-angled connection terminals press-fitted into the body area 132 of the connector housing 131 such that one end of the same is soldered to one side of the circuit substrate 130.
[0049] A cross-section of the body area 132 is trapezoidal in shape, wherein the three surfaces of the trapezoidal, inclined side areas and a short tip area configure a flat sealing area 138 and connect over the first sealing material 141 with the recessed surface sealing area 113 of the in Fig. 5 shown base 110 come into contact.
[0050] A recessed strip sealing area 137 is also provided in a long bottom side area of the bottom area 132, and the recessed strip sealing area 137 and the three-sided recessed strip 112 communicate with each other. Fig. 3 base 110 shown together, forming a ring-shaped recessed strip 140.
[0051] If the circuit substrate 130, on which the connector housing 131 is mounted, is placed on a three-sided envelope area of the base 110 in Fig. 6 is placed, which shows a configuration of an annular sealing surface, the annular recessed strip 140 is formed by three-sided recessed strips 112 of the in Fig. 3 and Fig. 4 shown base 110 and the recessed strip sealing area 137 of the in Fig. The circuit substrate 130 shown in the diagram is configured and the second sealing material 142 is applied circularly to the ring-shaped recessed strip.
[0052] Furthermore, a condition exists in which the ring-shaped projecting strip 122 of the in the Fig. 6 and Fig. The cover 120 shown in section 7 is fitted into the ring-shaped recessed strip 140, in Fig. 8 shown.
[0053] As before, using Fig. 7 and Fig. As described in 9, the first heat transfer adhesive 127 is applied to the substrate surface corresponding to the first heat generation component 135 provided on the rear surface of the circuit substrate 130, or to the heat transfer base 125 of the opposite cover 120, and the first heat transfer adhesive 126 is applied to the rear surface of the second heat generation component 136 provided on the front surface of the circuit substrate 130, or to the heat transfer base 124 of the opposite cover 120.
[0054] The second heat transfer adhesive 135bb, which corresponds to the back surface of the third heat generation component 135b provided on the back surface of the circuit substrate 130, is also applied to the heat transfer base of the base 110. 2. Detailed description of the assembly process
[0055] Next, a detailed description of Fig. 12 is given, which is an assembly process diagram of the waterproof electronic equipment unit 100.
[0056] In Fig. Step 12 is a step 700, a step of starting an operation to assemble the waterproof electronic equipment unit 100. The subsequent step 701 is a step of mounting the base 110 on an assembly device, with the inner surface of the base 110 facing the ceiling.
[0057] A subsequent step 702b is a first process step of applying the paste-like first sealing material 141 (see Fig. 5) in planar form on the depression surface sealing area 113 of base 110 and application of the second heat transfer adhesive 135bb (see Fig. 9) on the inner bottom surface of the base 110, but before step 702b the water-repellent filter 117 is placed on the filter mounting surface 118 (see Fig. 3) the base 110 was applied and fixed in a previous processing step 702a.
[0058] A step 703b following step 702b is a second process step of assembling a “circuit substrate between assembly body” which is completed in a preparatory step 703a before step 703b on envelope areas provided at three locations on the base 110, and connecting the first sealing material 141 applied in step 702b and the body area 132 of the connector housing 131.
[0059] The preparation step 703a is a step in which the first and third heat generation components 135a, 136 and 135b, and many other circuit components are mounted on the circuit substrate 130 and soldered, and in which one end of the connection terminal 133 is soldered to a solder lug provided on the circuit substrate 130 in order to complete the “circuit substrate intermediate assembly body”.
[0060] Step 703b, followed by step 704, is a third process step of applying the paste-like second sealing material 142 circularly onto the annular recessed strip configured by the three-sided recessed strip 112, which is more adjacent to the outer side than the envelope area of the base 110, and the recessed strip sealing area 137 of the circuit substrate 130 (see Fig. 11). A subsequent step 705b is a fourth processing step of mounting the cover 120, onto which the first heat transfer adhesives 126 and 127 are applied (see Fig. 7) in a preparatory step 705a preceding step 705b, applied to the base 110 in an inverted state, joining the second sealing material 142 and the first heat transfer adhesives 126 and 127, which were applied to matching surfaces in step 704 and step 705a, and integrally fixing the cover 120 and base 110 using the fixing screws 139 (see Fig. 1).
[0061] Instead of applying the first heat transfer adhesives 126 and 127 to the cover 120 in preparation step 705a, the first heat transfer adhesives 126 and 127 can be applied to the opposite surface of the circuit substrate 130, on which the first heat-generating component 135a is mounted, and a back surface area of the second heat-generating component 136 in step 704 or step 703b (see Fig. 11).
[0062] Step 706, following step 705b, is a step of performing initial settings, a performance inspection and a visual inspection of the electronic equipment unit 100, while the first heat transfer adhesives 126 and 127, the second heat transfer adhesive 135bb and first and second sealing materials 141 and 142, applied in step 702b and step 705a, or in step 704 or step 703b, are dried at room temperature or by heating, after which a shift is made to the overall assembly completion step 707.
[0063] In the above description, it is assumed that a maximum ambient surface temperature of the cover 120 is a low ambient temperature equal to or lower than a maximum ambient temperature of the mounting surface 200, and that heat generated by the heat-generating components which is transferred to the cover 120 side is more advantageous than heat transferred to the side of the base 110.
[0064] Also, in order to limit heat from the high-temperature side base 110, which is transferred to the side of the low-temperature cover 120, it is desirable that the second sealing material 142 be a material with low thermal conductivity and that an adhesive of a material with a different thermal conductivity be used for the first heat transfer adhesives 126, of which high thermal conductivity is required.
[0065] The third heat generation component 135b (see Fig.9), is such that if the base 110 side is of a higher temperature than the side of the cover 120, the temperature of the third heat-generating component 135b, which is opposite and adjacent to the base 110 and whose temperature is already high, will be further increased due to an increase in the temperature of the third heat-generating component 135b itself, which is added, therefore the transfer of heat to the base 110 via the second heat transfer adhesive 135bb can limit the temperature increase more than if no heat is transferred.
[0066] Even if a fourth heat-generating component (not shown) is mounted on the front surface side of the circuit substrate 130, which is opposite the cover 120, a front surface pattern of the fourth heat-generating component, to which an electrode connection is attached, and a rear surface pattern, which is positioned on an opposite surface, communicate via a through-hole connection and heat transfer is carried out between the front and rear patterns, the rear surface pattern can be brought into heat-transferring contact with a heat transfer socket provided on the inner surface of the base 110 via a thermally conductive adhesive.
[0067] Note that if a cast article using a highly heat-resistant, thermally curing polymer is used as the base 110, instead of a metal material made of cast aluminum or sheet metal, there is a characteristic that may considerably restrict the transfer of heat from the side of the base 110 to the side of the cover 120, in which case no advantage is obtained by applying a heat transfer adhesive to a heat transfer base corresponding to the third heat-generating component 135b or the fourth heat-generating component. 3. Main points and characteristics of the embodiment
[0068] As is clear from the above description, the waterproof electronic equipment unit according to the first embodiment of the invention is an electronic equipment unit 100 which, with respect to the mounting surface 200, which includes the flat mounting area 201 and mounting surface recess area 202, comprises the base 110, which is fixed to the flat mounting area 201 by screwing it, the frame 101 configured from the base and the metal cover 120, the circuit substrate 130, which is hermetically housed in the frame, the polymer connector housing 131, which is mounted on one side of the circuit substrate, an area of which is exposed from the end face opening 115 of the frame 101, and the plurality of connection terminals 133, which are fixed to the body area 132 of the connector housing.One end of the connection terminal is connected to a circuit pattern of the circuit substrate 130 and the other end is in conductive contact with a connection terminal of a mating connector, wherein the mounting surface 200, on which the mounting feet 111a to 111d provided on the base 110 are fixed by screwing, has the mounting surface recess area 202 in a region of the flat mounting area 201, and the base 110 includes the base recess area 114, which is fitted and arranged in the mounting surface recess area 202 via the recess area gap D2.
[0069] Furthermore, the connector housing 131, or the connector housing 131 and the tall component 134, which is mounted on the circuit substrate 130, is mounted in the base recess area 114; the inlet 116 of the water-repellent filter 117, fixed to the inner surface of the base 110, is provided in the non-recessed area of the base 110; the outer plane of the inlet is arranged opposite the flat mounting area 201 across the inlet surface gap D1; the water-repellent filter 117 is made of a flat porous material containing a plurality of minute holes that allow air to pass freely through it and prevent water droplets from flowing into and passing through the interior of the frame 101; the height dimension of the mounting feet 111a to 111d is greater than the depth of the base 110. Basic depth area 114 is, as set,that it is a greater value than the height of a water flow flowing onto the outer surface of the base 110 when a water exposure test is performed according to a predetermined specification than the inlet surface gap D1, the height dimension of the mounting feet 111a to 111d is determined such that the outer surface of the base recess area 114 does not come into contact with the mounting surface recess area 202 when the depth of the mounting surface recess area 202 is less than the depth of the base recess area 114 and the inlet 116 of the water-repellent filter 117 is positioned vertically higher than a spatial region contained in the mounting surface recess area 202.
[0070] When the mounting feet 111a to 111d of the base 110 are attached and fixed to the mounting surface 200, which forms a floor surface, the angle of inclination θ is provided for the flat mounting area 201, and the angle of inclination θ is an angle inclined in one direction such that water flowing in a gap between the rear surface of the base 110 and the flat mounting area 201 flows in the direction of the mounting surface recess area 202.
[0071] As previously described, in conjunction with claim 2 of the invention, an angle of inclination for the flat mounting area is provided such that water flowing into a gap between the rear surface of the waterproof electronic equipment unit and the flat mounting area flows towards the connector housing.
[0072] Consequently, there are characteristics such that the inlet of the water-repellent filter is prevented from being blocked by an accumulation of water on the flat mounting area and damage to the hermetic sealing element can be prevented without inhibiting respiration of external air due to temperature changes within the frame.
[0073] The three-sided recessed strip 112 is provided on three sides of an outer peripheral area of the inner surface of the base 110; the recessed surface sealing area 113, onto which the first sealing material 141 is applied, is provided in the end surface opening 115, in which inclined sides and a short tip of a trapezoidal shape are configured by the base recessed area 114; one end of several connecting terminals 133, fixed to the body area 132 of the connector housing 131, is bent at a right angle and connected to the circuit pattern of the circuit substrate 130; the three-sided flat sealing area 138, configuring the two inclined sides and a short tip of a trapezoidal shape, is fitted into the end surface opening 115; and the recessed strip sealing area 137, provided in a long bottom side of the trapezoidal shape, are configured on the outer peripheral surface of the body area 132.the annular projecting strip 122 is provided on four sides of an outer peripheral area of the inner surface of the cover 120, the annular recessed strip 140, onto which the second sealing material 142 is applied circularly, is configured by the three-sided recessed strip 112 and the recessed strip sealing area 137, and the annular projection strip 122 is fitted into the annular recessed strip.
[0074] As previously described in connection with claim 3 of the invention, the end surface opening of the base and the end surface shape of the connector housing form three surfaces consisting of trapezoidal inclined sides and a short tip, onto which the first sealing material is applied, the long bottom side of the connector housing and three sides of the base configure an annular, recessed strip onto which the second sealing material is applied, and the annular projecting strip of the cover is fitted into the annular recessed strip.
[0075] Consequently, while the recessed strip sealing area is provided on the long bottom side of the connector housing, the body dimension of which becomes shorter as the connector housing approaches the circuit substrate, thus shortening a sealing path (water ingress path), the body dimension of the remaining three trapezoidal sides, which include the bent connection terminals, is lengthened, due to which there are such characteristics that a sufficient sealing path can be ensured even with a flat sealing area, without using an irregular sealing surface, thus limiting the height dimension of the connector housing and allowing the base recess area to be arranged even if the depth of the mounted surface recess is small.
[0076] The cover 120 is cast from a conductive metal material or machined from sheet metal. One or both of the first heat-generating component 135a on the rear surface and the second heat-generating component 136 on the front surface are mounted on the circuit substrate 130. The first heat-generating component 135a is mounted on the rear surface of the substrate, opposite the base 110. Heat generated by this heat-generating component is transferred to the high-level heat transfer socket 125 provided on the cover 120 via a flat surface pattern on the front surface of the substrate, which is connected by a through-hole connection provided in the circuit substrate 130. The second heat-generating component 136 is mounted on the front surface of the substrate opposite the cover.If heat generated by this heat-generating component is transferred to the inner surface of the cover 120 or to the intermediate-stage heat transfer base 124, the first heat transfer adhesives 126 and 127 of the silicone polymer series, which contain a conductive material, are applied to the intermediate-stage or advanced-stage heat transfer bases 124 or 125, and the maximum value of the ambient surface temperature of the cover 120 is equal to or lower than the maximum ambient temperature of the mounting surface 200.
[0077] As described above, in connection with claim 4 of the invention, the heat generated by the heat-generating component mounted on the front surface side or rear surface side of the circuit substrate is transferred to the inner surface of the cover made of a metal material, and a conductive adhesive is applied to the surface to which heat is transferred.
[0078] Consequently, there is a characteristic such that if the mounting surface of the base is of high temperature, heat generated by the heat-generating component is transferred to the cover side and heat distribution can be carried out from the surface of the cover.
[0079] The base 110 is cast from a conductive metal material or machined from sheet metal; the circuit substrate 130 further includes the third heat-generating component 135b, which is added to the rear surface side; and heat generated by the third heat-generating component 135b is transferred to the base 110 via the second heat transfer adhesive 135bb of the silicone polymer series, which includes a conductive material applied to the inner surface of the base 110.
[0080] As described above, in connection with claim 5 of the invention, heat generated by the third heat-generating component mounted on the rear surface side of the circuit substrate is transferred to the inner surface of the base made of a metal material, and a conductive adhesive is applied to the surface to which heat is transferred.
[0081] Consequently, if the base side is at a lower temperature than the cover side, the temperature rise of the third heat-generating component can be more advantageously limited than the heat transferred to the cover side. Even if the base side is at a higher temperature than the cover side, the temperature of the third heat-generating component, which is opposite and adjacent to the base and whose ambient temperature is high, will be even higher due to the temperature rise of the self-added third heat-generating component. This characteristic means that transferring heat to the base via a conductive adhesive can limit the temperature rise more effectively than if no heat is transferred.
[0082] The base 110 is cast from a conductive metal material or machined from sheet metal, the first sealing material or the first sealing material or the second sealing material is a silicone polymer series adhesive with low thermal conductivity that does not contain a conductive material, and the adhesives are of a polymer material with a thermal conductivity lower than that of the first heat transfer adhesives 126 and 127 or the second heat transfer adhesive 135bb.
[0083] As described above, in connection with claim 6 of the invention, an adhesive sealing material with a thermal conductivity lower than that of a heat transfer adhesive applied between a heat generating component and a heat transfer base is used for the second sealing material, which is provided on the connecting surfaces of the base and cover.
[0084] Consequently, if the mounting surface of the base is of high temperature, there is a characteristic such that the amount of heat transferred from the mounting surface to the cover via the base is limited and the increase in ambient temperature can be limited within the framework.
[0085] Base 110 is processed by casting using a thermosetting polymer with high-temperature strength. As described above, in conjunction with claim 7 of the invention, the base is cast using a thermosetting polymer.
[0086] Consequently, if the mounting surface of the base is of high temperature, there is a characteristic that limits the amount of heat transferred from the mounting surface to the cover, and a further increase in ambient temperature can be limited.
Claims
An arrangement comprising a waterproof electronic equipment unit (100) and a mounting surface (200), comprising: with respect to the mounting surface (200), which includes a flat mounting area (201) and a mounting surface recess area (202), a base (110) fixed to the flat mounting area (201) by screwing, a frame (101) configured from the base (110) and a metal cover (120), a circuit substrate (130) hermetically enclosed in the frame (101), a polymer connector housing (131) mounted on one side of the circuit substrate (130), a portion of which is exposed from an end face opening (115) of the frame (101), and several connection terminals (133) fixed to a body area (132) of the connector housing (131).wherein one end of each of the connection terminals (133) is connected to a circuit pattern of the circuit substrate (130) and another end is in conductive contact with a connection terminal of a connector on a mating side, wherein the mounting surface (200), to which mounting feet (111a-111d) provided on the base (110) are fixed by screwing, has the mounting surface recess area (202) in a region of the flat mounting area (201), the base (110) includes a base recess area (114) which is fitted and arranged in the mounting surface recess area (202) over a recess area gap (D2), the connector housing (131) or the connector housing (131) and a tall component (134) mounted on the circuit substrate (130) is arranged in the base recess area (114), an inlet (116) of a fixed to an inner surface of the base (110),a water-repellent filter (117) is provided in a non-recessed area of the base (110), an outer plane of the inlet (116) is arranged opposite the flat mounting area (201) across an inlet surface gap (D1), the water-repellent filter (117) is made of a flat, porous material, including several minute holes that allow air to pass freely through and prevent water droplets from flowing into and passing through an interior of the frame (101), a height dimension of the mounting feet (111a-111d) is then, when a depth of the mounting surface recess area (202) is greater than a depth of the base recess area (114), adjusted so that it has a value greater than the height of a flow of water flowing onto an outer surface of the base (110), and then, when a water exposure test is performed according to a predetermined specification, ,the height dimension of the mounting feet (111a-111d) is determined such that an outer surface of the base recess area (114) does not come into contact with the mounting surface recess area (202) when the depth of the mounting surface recess area (202) is less than the depth of the base recess area (114), wherein the inlet surface gap (D1) is of a dimension such that the inlet (116) is not blocked by water, and the inlet (116) of the water-repellent filter (117) is positioned vertically higher than any spatial region contained within the mounting surface recess area (202). Arrangement according to claim 1, wherein the mounting feet (111a - 111d) of the base (110) are attached and fixed to the mounting surface (200), which forms a floor surface, an angle of inclination θ is provided for the flat mounting area (201), and the angle of inclination θ is an angle inclined in a direction such that water flows into a gap between a rear surface of the base (110) and the flat mounting area (201) in the direction of the mounting surface recess area (202). An arrangement according to claim 1 or 2, wherein a three-sided recessed strip (112) is provided on three sides of an outer peripheral region of the inner surface of the base (110), a recessed surface sealing area (113) on which a first sealing material (141) is applied is provided in the end surface opening (115) in which two trapezoidal inclined sides and a short tip are configured through the base recessed area (114), one end of the multiple connection terminals (133) that are fixed to the body region (132) of the connector housing (131) is bent at a right angle and connected to the circuit pattern of the circuit substrate (130), a three-sided flat sealing area (138) that configures the two inclined sides and the short tip of a trapezoidal shape fitted into the end surface opening (115), and a recessed strip sealing area (137) that is provided in a long bottom side of the trapezoidal shape,configured on an outer peripheral surface of the body area (132), an annular, projecting strip (122) is provided on four sides of an outer peripheral area of an inner surface of the metal cover (120), an annular recessed strip (140) on which a second sealing material (142) is applied circularly, is configured by the three-sided recessed strip (112) and recessed strip sealing area (137), and the annular projecting strip (122) is fitted into the annular recessed strip (140). Arrangement according to claim 3, wherein the metal cover (120) is cast from a conductive metal material or machined from sheet metal, one or both of the first heat-generating components (135a) of the rear surface and of the second heat-generating components (136) of the front surface are mounted on the circuit substrate (130), and the first heat-generating components (135a) are mounted on the rear surface of the substrate opposite the base (110), heat generated by these first heat-generating components (135a) is transferred to a high-level heat transfer socket (125) provided on the metal cover (120) via a flat surface pattern on the front surface of the substrate which is connected by a through-hole connection provided in the circuit substrate (130), and the second heat-generating components (136) are mounted on the front surface of the substrate opposite the cover.Heat generated by the second heat-generating components (136) is transferred to the inner surface of the metal cover (120) or to an intermediate-stage heat transfer base (124), first heat transfer adhesives (126, 127) of the silicone polymer series, which contain a conductive material, are applied to the intermediate-stage or advanced-stage heat transfer base (124, 125), and the maximum value of the ambient surface temperature of the metal cover (120) is equal to or lower than the maximum ambient temperature of the mounting surface (200). Arrangement according to claim 4, wherein the base (110) is cast from a conductive metal material or processed from sheet metal, the circuit substrate (130) further comprises a third heat-generating component (135b) added to the rear surface side, and heat generated by the third heat-generating component (135b) is transferred to the base (110) via a second heat transfer adhesive (135bb) of the silicone polymer series, which comprises a conductive material applied to the inner surface of the base (110). Arrangement according to claim 5, wherein the first sealing material (141) or wherein the first sealing material (141) and the second sealing material (142) is a silicone polymer series adhesive with low thermal conductivity, which does not include any conductive material and the adhesives are made of a polymer material with a thermal conductivity lower than that of the first heat transfer adhesives (126, 127) or the second heat transfer adhesive (135bb). Arrangement according to claim 4, wherein the base (110) is produced by casting using a thermally curing polymer with high temperature strength.