Modular panel element for creating a wall heating system and system for modularly creating a wall from wall heating elements
The modular panel element with fluid-conducting chambers and low-temperature infrared heating paint addresses uneven heat distribution in walls, ceilings, and floors by controlling heat flow and reducing energy loss, ensuring uniform heating and insulation.
Patent Information
- Application Number
- DE102017007995
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2017-08-24
- Publication Date
- 2025-07-10
- Estimated Expiration
- 2037-08-24
AI Technical Summary
Existing heating systems for walls, ceilings, and floors suffer from uncontrolled heat conduction, leading to high heat dissipation and inefficient heat distribution, especially in areas with significant temperature gradients, resulting in energy loss and uneven heating.
A modular panel element with a carrier element containing chambers for fluid conduction and a heating paint using low-temperature infrared technology, combined with a reflective and insulating structure to control and direct heat flow, ensuring uniform heating and minimizing energy loss.
The system achieves efficient heat distribution across large surfaces with minimal energy consumption, reducing heat loss and providing uniform heating by directing heat to colder areas, while maintaining structural integrity and insulation properties.
Smart Images

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Abstract
Description
The present invention relates to a modular panel element for creating a wall, a ceiling and / or a floor of a room and to a system for modular creating a wall, a ceiling and / or a floor of a room.In the prior art, for example, in the field of infrared heating, different technologies are used which act primarily on the basis of different temperatures between the heating surface and the surface to be heated and, associated therewith, different areas of the heating elements and also greatly differing switching hysteresis.The heat conduction through the medium is not directed or defined in all systems known on the market, but follows the temperature gradient within the material in all three dimensions.The control of heat conduction is possible, for example, by:changing the material conductance gradient within an otherwise homogeneous material by changing the material within the insulating layer;controlling the heat supply by mechanical transport of liquids having a high heat storage capacity with the aid of measurement and control technology;changing the points of introduction of heat by controlling the heating layers for conductive, radiation-based or convective heating.All options involve very high technical complexity and do not represent satisfactory solutions. Above all, against the background that heat conduction in solids is not influenced by gravity. This has the consequence that the heat propagation takes place more or less uncontrolled in rooms to be heated.The loss of control control results in a high dissipation of heat from the space to be heated, at locations where mass-bound energy transfer takes place and at locations where the temperature gradient has high deviations in temperature differences between the outer region and the heating region.DE 28 25 746 A1 describes heating elements for the ceilings of rooms. WO 02 / 079 697 A1 discloses a heating system.It is therefore an object of the present invention to provide a modular panel element for constructing a wall, a ceiling and / or a floor of a room and a system for modular construction of a wall, a ceiling and / or a floor of a room, which allows heating with low outlay and at the same time keeping the losses as low as possible, and also to control the heat flow and at the same time to achieve a high radiation fraction which allows optimum distribution of heat in the room to be heated.This object is achieved according to the invention by the features of the independent claims. Further advantageous developments are the subject matter of the dependent claims.The most favorable technology is always in the thermodynamic sense that which simultaneously heats a large surface at the coldest points of the outer wall up to room temperature, in the process uses particularly short switching times in the seconds range and at the same time achieves a particularly good heat distribution on the inner side of the outer wall.Radiations emitted at room temperature have the advantage that the lowest possible energy of the infrared photons is emitted, since this energy depends essentially on the temperature of the emitting surface. The radiation thus becomes identical to the radiation that is remitted from other surfaces in space, which is referred to in the industry as secondary radiation.The idea on which the present invention is based is preferably that the heating surface is bounded in each surface heating and that therefore the thermal transfer of heat within a wall, a floor and / or a ceiling is to be extended to regions next to the actual heating surface.In this case, it is advantageous, briefly summarized, to use a modular plate element, by means of which a carrier medium or fluid, such as air, allows heat transport by conduction and mass-bound energy transport, in order to thus allow and support the heat transport into other regions of the wall / of the floor / of the ceiling which are intended to be tempered at a higher temperature without further technical control complexity.Furthermore, by forming at least one chamber, the modular panel system makes it possible to intentionally direct the heat transport and thus also to prevent heat build-up behind, for example, cabinets or other furniture.According to the invention, in the present invention, a modular panel element for at least partially creating a wall, a ceiling and / or a floor of a room comprises:a first carrier element having at least one chamber for mechanical stabilization and for transporting heat with the aid of a fluid, anda heating paint for heating the room using a low-temperature infrared technique, wherein the heating paint comprises an electrically conductive substance mixture.Such a modular panel element, in combination with a heating paint, in particular a needle-based heating paint, has a service life which is many times longer than that of the conventional and known heating systems.The fields of application for the modular panel element according to the invention are listed below by way of example:heating for zone heating or full heating of living and working environments which are no longer accessible after the support device;heating in surfaces which each independently represent the construction substance, i.e. the wall;heating surfaces which are particularly at risk and are damaged by reworking in the event of power loss;heating rooms with complex temperature distribution in the secondary radiation;heating and tempering of areas of walls, floor and ceiling, which are at risk of heat build-up;heating rooms that promote crack formation;heating and tempering for the treatment of mold and moisture;heating of low-energy houses on a full surface without a heating surface that is too high;insulation of surfaces which may be heated or unheated;air conditioning and cooling surfaces;dry construction replacement;sound insulation of large areas;multiple uses of a wall material in new construction, rehabilitation, fire protection, sound protection and heating;Use of the plate element with common plaster and paints.In addition to the heating, a surface can also be cooled with the aid of the modular plate element according to the invention. With the aid of the at least one chamber, heat transport in different directions along the plane of the plate element can be ensured, so that heat can be exchanged from a location with high heat to a location with lower heat and vice versa.A modular plate element is produced, for example, by milling the at least one chamber out of a solid plate or by pressing in a press mold which has the corresponding chamber geometry.The modular panel element can also be used to replace insulating and insulating plaster. It also serves as a wall replacement and in this case performs the two tasks of heating and cooling equally.The first carrier element advantageously comprises an inner element, in particular a fluid-conveying inner element, and a load-bearing outer element.It is furthermore advantageous if a reinforcing element for stiffening is arranged on the first carrier element, in particular on its outer element, preferably on the side of the outer element facing away from the inner element.Preferably, the reinforcing element is designed as a honeycomb structure for stiffening purposes. In the field of application as a passage for a fluid, a hexagonal honeycomb pattern or a honeycomb structure is preferably used in order to maximize the mechanical compressive strength in all three spatial directions and at the same time to keep the wall thickness between adjacent chambers as low as possible.It is furthermore favorable if the first carrier element has a structure for fluid exchange and / or the at least one chamber is not closed or open or open-pored, so that, for example, cooled fluid, such as air, can flow through. In this way, the chambers can be used for air conditioning and cooling a room. The air conditioning function can be used independently of the heater.In addition, waste heat from transformers which, for example, supply the heating paint with electrical energy can be conducted into the at least one chamber.Another function of the modular panel element is the sound insulation produced by the at least one chamber. Sound is thus conducted, for example, from the outside to the at least one chamber or the carrier element, is continued as a phoneme and is then refracted within the at least one chamber. The sound wave is preferably aligned along the at least one chamber and is weakened in its intensity in the process. The energy of the wave can be converted into thermal energy. Although this amount of energy is too small to have heating effects, it is only heat after absorption.Advantageously, a second carrier element is arranged on the reinforcing element. The modular plate element can be mechanically reinforced by means of the second carrier element.It is advantageous here if the load-bearing outer element of the first carrier element and / or the second carrier element is designed as a plate.Furthermore, the at least one chamber follows any desired curve in the space within the plate element, in particular within the inner element. Any desired shape of the at least one chamber can thus be realized.It is furthermore advantageous if at least two chambers are oriented parallel to one another in order to convey a fluid in one direction.Furthermore, at least two chambers are oriented perpendicular to one another in order to convey a fluid in two different directions.It can also be provided that the at least two chambers are oriented at different angles to one another, preferably are oriented between 45 degrees and 90 degrees to one another.With the aid of the at least one chamber, it is also possible, for example, to realize electrical cabling and / or simple laying of IT networks, lighting power, signal and video cable laying.Preferably, the at least one chamber of the carrier element has a dome shape in cross section and / or is semicircular.Preferably, in cross section, the two opposite ends of the open side of the at least one chamber are at a distance of at least one millimeter and at most two centimeters.It is also preferred that the at least one chamber of the carrier element extends from one side edge of the plate element to another side edge of the plate element.Advantageously, the at least one chamber of the carrier element extends over the entire width and / or height and / or length of the plate element.Furthermore, it can be provided that a support element is arranged on the first carrier element, in particular on its outer element. With the aid of the support element, the plate element can be further reinforced, in order to serve as a wall replacement, for example.Preferably, the support element is arranged on the side of the inner element facing away from the outer element. In other words, it is advantageous if the support element is arranged on the one side of the inner element and the outer element is arranged on the other side of the inner element.The support element is advantageously designed as a plate.It is further preferred that the support member comprises the heating paint for heating the room and for indirectly heating fluid within the inner member.It is also advantageous if the support element comprises a carrier, to which a conductive material is applied or bonded in tracks, preferably copper strips.Preferably, the support element comprises the heating paint, in which preferably the heating paint is arranged on the conductive material, in particular is applied flat on the support element.It is also preferred that the support element comprises a primer, which is arranged in particular on the heating paint.Preferably, the support element comprises a fabric, which is arranged in particular on the primer.It is furthermore advantageous if the support element comprises a cleaning material, in particular a wall cleaning, which is arranged in particular on the fabric.Furthermore, it is advantageous if a fire-retardant layer is arranged on the heating layer. A further property of the panel element is preferably its coating with a fire-retardant substance which substantially inhibits the spread of fire.Furthermore, the plate element comprises a reflection element for reflecting infrared radiation, wherein preferably the reflection element is arranged between the inner element and the outer element in order to reflect radiation.Furthermore, it can be provided that the plate element comprises at least one electrical line, wherein the at least one electrical line is preferably formed from conductive material.Preferably, the at least one electrical line is arranged within the at least one chamber.It is furthermore advantageous if the at least one electrical line is designed as a copper strip, which is preferably laid flat inside the plate element.It is furthermore favorable if the plate element comprises at least one fluid connection element for connecting two chambers of two plate elements and for transporting heat with the aid of a fluid. With the aid of the fluidic connection element, all functions of the plate element can be further guided around an edge, for example, without a functional restriction being expected.The plate element preferably comprises at least one electrical plug element which serves for the electrical connection of two plate elements.It is also advantageous if the plate element comprises a contacting device, wherein the contacting device preferably connects at least two electrically conductive strips of a plurality of plate elements to one another in an electrically conductive manner by a plug-in system.The contacting device advantageously comprises a tongue and groove system or pluggable connectors. The contacting device is preferably designed conically in a plate element in order to be able to produce a connection with a high contact pressure, as a result of which the transmission of a current is made possible.With the aid of the electrical plug element, all functions of the plate element can be further guided around an edge, for example, without a functional restriction being expected.A further aspect of the present invention comprises a system for at least partially modular construction of a wall, a ceiling and / or a floor of a room.This system comprises a modular plate element with a first carrier element according to the aspect set out above, wherein the first carrier element comprises an inner element, in particular a fluid-conveying inner element, and a load-bearing outer element.It is expressly pointed out that the features of the modular plate element as mentioned under the first aspect can be used individually or combined with one another in the system.In other words, the features mentioned under the above aspect of the invention relating to the modular plate element can also be combined here under the further aspect of the invention with further features.Furthermore, the system comprises a further modular plate element. This has:a further first carrier element having at least one chamber for mechanical stabilization and for transporting heat with the aid of a fluid,wherein the further first carrier element also comprises an inner element, in particular a fluid-conveying inner element, and a supporting outer element.The fluid-conveying inner elements of the two carrier elements are arranged lying one on top of the other, in particular lying directly one on top of the other. Thus, modular panel elements can be combined with each other. They can perform different functions, for example in combination on or in or as a wall, also in combined assembly.In this case, the at least one chamber follows any desired curve in the space within the plate element and at least two chambers are oriented perpendicular to one another in order to convey a fluid in two directions.It can also be provided that the chambers of the first carrier elements of the two modular plate elements are oriented at different angles to one another, preferably between 45 degrees and 90 degrees, when bonded or joined.It is furthermore preferred that passage points are formed at the intersection of two chambers of the plate elements, which allow fluid to flow from the one chamber into the other chamber.The assembly system advantageously has a connection system which is preferably constructed from clips, rails and brackets and which forms the plate elements such that they can be connected with respect to fluid and electricity.The easy dismantling of rails and brackets also allows a simple replacement or repair of a modular panel element if a mechanical external impact has damaged the panel element.Furthermore, it is additionally or alternatively preferred that the system comprises rails for fastening to a wall and / or a ceiling and / or a floor of a room in order to fasten a modular plate element to the rails.Additionally or alternatively, it is also advantageous if the system comprises an adhesive layer for fastening to a wall, a ceiling and / or a floor of a room in order to fasten a modular panel element to the adhesive layer.Furthermore, it is possible for at least two plate elements to be arrangeable next to one another in a planar manner, preferably to connect to one another in a seamless manner. Thus, modular panel elements can be combined with each other. They can perform different functions, for example in combination on or in or as a wall, also in combined assembly.Preferably, at least two plate elements can be arranged on top of one another, preferably these connect to one another seamlessly.Finally, the materials of the aforementioned components of the modular plate element may also be mentioned.It is thus favorable if the first carrier element, in particular its outer element, comprises the following materials individually or in combination:- Hemp compositeglass fiber- Flaxcarbon- plastic fabric- HanfIt is furthermore advantageous if the second carrier element comprises the following materials individually or in combination:- Hemp compositeglass fiber- Flaxcarbon- plastic fabric- HanfFurthermore, it is advantageous if the first carrier element, in particular its inner element, comprises the following materials individually or in combination:Hemp with cementitious compositePlaster for cleaning walls, ceilings and / or floorsAluminum composite material- glass foam- FlaxIt is also advantageous if the reinforcing element comprises the following materials individually or in combination:Aerogelplastic(s)- glass foamPreferably, the carrier comprises the following materials, individually or in combination:- Hemp compositeglass fiber- Flaxcarbon- plastic fabric- HanfAdvantageously, the reflection element comprises the following materials individually or in combination:aluminium foil is perforated or slitglass granulesThe concept of the invention presented above is expressed in other words in the following.This concept relates preferably-shown in simplified form-to a modular plate element for at least partially creating a wall, a ceiling and / or a floor of a room to be provided with a carrier element (preferably a first carrier element) with at least one chamber for mechanical stabilization and for transporting heat with the aid of a fluid. In order to generate heat, a heating paint is preferably provided for heating the room by low-temperature infrared technology, the heating paint comprising an electrically conductive substance mixture.Viewed from another side again, there have been heating mats and heating paints in the past to solve the above problem. There was an eclant difference in the lifetime between the two heating variants, since the incorporation of carbon black as conductor material into mats dramatically reduces the lifetime. The performance data which are computationally based on a needle-based hot paint suggest a computational durability of several thousand years.For this reason, a heating paint of this needle-based type is advantageously used for the heating technique in a modular plate element according to the invention.Heat is generally transported only when different temperatures are present at two points in the space. It flows from the warmer location to the colder location according to the temperature gradient.Old heating systems, such as convection heaters or infrared heating panels, require extremely high delta-T for the heat transfer, i.e. deviations between two temperature ranges which are intended to exchange energy, with the aim of heating the colder surfaces.These differences are necessary in the systems because they all have in common that large areas should be heated in spaces with small areas of heating.This procedure has the technical consequence that the distribution of heat can never become homogeneous. At locations with high temperature differences, too high amounts of heat therefore flow away.This energy is lost for heating a house and escapes to the environment and atmosphere.In addition, all more modern heating systems which already act over a large area and are installed on walls have the common feature that they cannot cover the entire wall. The systems operate with clear and invariable power densities to obtain a heat flow which depends on the type of heating and its sheet resistance. If these systems were to cover the entire wall, firstly the heating medium costs would be too high and secondly the assembly effort would be too high and thirdly the supply electrical system would be more complex.Added to this is an effect which is important especially in modern new construction. The better the thermal insulation values of houses become, the less the distribution of radiant heat will be ideally distributed.This is primarily due to the fact that radiation, although a very light but also an overtemperature is required, also requires, so that an imbalance between primary and secondary radiation arises.Without the imbalance that the heater must generate, there is no energy transfer.This imbalance is compensated for in radiant heaters by emitting more and more energetic infrared photons from the warm wall in which the heater is installed than from the cold walls that emit lower energy secondary radiation. Thus, in the case of radiant heaters, energy transport functions.In a wall surface heater of this type, as long as the heat is discharged from the heating surface, the entire heating surface of the heater heats up by a range of one to two degrees and emits energy as infrared radiation while the overtemperature exists. The infrared heating now requires this temperature difference in order to transport heat, but at the same time the hysteresis should be maintained at only one tenth degree.In order not to give an incorrect impression, it must be emphasized that surface-based carbon heaters as paints are the currently best technical solutions on the market, since, in addition to cost, rapid installation and extreme service life, they have only a very low consumption, which all other heating systems make system-dependent. The qualitative physical comparison shows this immediately and very clearly.The less energy such heating now requires, the less electricity is introduced to obtain the radiation surface temperature. The switching times become so short that the best possible distribution is no longer guaranteed.If it were possible to increase the area, not to increase the pure heating energy supply and at the same time to achieve good insulation and reflection which is directed in the wall, the conditions for thermodynamically most favorable heating would be fulfilled.In the case of a surface heating system according to the invention or in the case of a modular plate element, therefore, the technical challenge for further improving the systems, for such applications, now arises. If the described technical problem of distribution were solved, this results in a heater which also supplies improved values and saves energy in all other fields of application.The technical solution presented here aims to distribute the heating energy within a wall, ceiling and / or floor in such a way that it overcomes the geometrical outer limits of the heating to the side and up and down in order to also distribute heat at locations without heating, which is to be emitted as radiation at the wall surface.This solution is also interesting in areas of flooring where zones of high thermal density and thus high temperature may occur, which cannot be adequately dissipated, for example, under carpets. A system which can dissipate excessive amounts of heat at heat build-up points to the side thus also changes the conduction through the wall, which decreases as the delta-T decreases. The heat which has not been lost is now fed back to the heating of the room.In walls at the same time as vertical and horizontal energy transport, however, the insulation property in the direction of penetration of the wall must not only be impaired, but should also be improved in the most favorable case.Thus, by changing the type of heating in a large area of a wall, the aim is to control the heat flow so that it follows the desired flow pattern along the wall or the floor, but does not preferentially penetrate either wall or floor.The heater or the modular plate element must be able to conduct heat particularly well in one spatial orientation in the same medium and to restrict the heat flow particularly well in another orientation of the same spatial element.Against this background, it is preferable to provide a modular plate member or a composite material plate consisting of a multilayer structure which can be repeated when the plate member is produced in a higher layer thickness in order to carry a higher vertical load or surface load, for example.The plate is preferably coated with heating paint in one design centrally and over a large area along its longer side or is coated with a plurality of heating tracks connected in parallel in another design at right angles to the running direction.The plate element also advantageously has a reflection element which can be formed perforated or can have a geometric shot-through pattern in order to guarantee diffusion openness. The shot-through pattern preferably does not overlap with a honeycomb structure installed in the plate element or the at least one chamber in order not to cause mass-bound energy transport as in a heat exchanger.Preferably, the plate element has a reflective film or a reflective element downstream of the at least one chamber and subsequently a stability layer preferably made of hemp thereon. In addition, the material is advantageously diffusion-open.The next layer preferably consists of a double layer of compartments which protrude beyond the heating paint and which are conveniently openly connectable over their entire length. Thus, along the longitudinal direction of the plate element, chambers are formed which cover the entire length of the plate element. In other designs, the chambers can also run over the plate element at oblique angles. In a further design, the chambers can be connected to further chambers on adjoining plate element.These chambers or the at least one chamber is preferably situated in one of the two layers at any angle, for example vertically in the plate element and horizontally in the combined layer or offset at some other angle. A plate element is preferably gripped or pressed in a mold, so that when superimposed in the material, passages are formed between the chambers or chamber systems of the two alignments.Air is preferably present in each end-closed chamber which is situated, for example, horizontally or vertically in the wall. The fluid allows for slow thermal migration within the panel member, but above all beyond the technical limit of application of the heating paint. In this case, heat can be exchanged at the geometric transitions of the milled-out portions or press-forming portions.In a further design, layers of a plate element are preferably not connected and each allow directed heat migration independently of one another.However, the material used ensures that the heat cannot be transported in the direction normal to the wall, i.e. through the wall, or can be transported only slightly by conduction.Oriented teflon platelets can be installed within the plate element, which preferably on a microscopic scale independently assume an orientation parallel to the surface of the earth while they are introduced into the plate elements. Thus, they conduct the heat in the width, but not in the depth of the wall. The effect arises because the number of phase boundaries is high in the direction of the overlying wafers and small in the transverse direction.The heating paint is preferably applied directly or with a thermal transfer layer. The heating paint is preferably flown through as an electric resistance and therefore heats uniformly over the entire surface.The electrodes for simplified electricity transport are preferably optionally pressed into the chambers to create a plug-in system, or chambers are created which house cables independently of the thermal system.Electrodes in the pressed version preferably allow the transition of current between a plurality of plate elements by means of simple plug connections. In this case, it is also possible in particular to prevent the problem that excessively high currents flow through poor connections.The panel elements advantageously comprise as the last layer a combination of insulation and reflection in the form of two material layers which can be applied individually or in combination.The insulating layer serves the purpose of simultaneously minimizing the passage of heat and sound.The insulation and reflection layer serves the purpose of directly reflecting infrared radiation generated in the wall back. Reflected photons of this layer are absorbed and conducted on the heating side as a phonon through the material into the at least one chamber.For constructing a plate member, adhesive materials having low heat transfer coefficients are preferably used to restrain the normal direction conduction of the wall. Tile adhesives with high heat transfer coefficients ensure good dissipation of the heat into the interior space in order to optimally supply the radiation surfaces with heat.The plate elements housing the at least one chamber or the chambers are preferably made of different materials. Wood-carbon mixed materials are used for pressing, glass fiber, linen, hemp, natural fibers, cement fiber mixtures, PE, PP, acrylic with adapted expansion coefficients depending on the temperature profile are used in order to keep thermal stresses within the material and the plate element low.In the assembly of several plate elements on or on, for example, a wall, the following three connection options are preferably used. Clips for permanent connection, rails and nuts and / or bracket systems for multiple assembly and disassembly and adhesive technology for permanent insertion into a wall / ceiling / floor.The physical stability of a plate element is preferably extremely increased by a honeycomb structure or another geometric chamber structure with high compressive and bending stiffness and / or by the at least one chamber. In this way, it can not only be installed in, for example, the wall or coat the wall, but it can replace the wall in the composite system. Thus, it becomes possible to build an entire house from heating walls, ceilings and floors.In another design, it is preferably provided that the plate element is not heated, but rather, in addition to the heatable elements, creates the option of being used only as insulating and construction material.The modular panel element and e.g. its on-wall or e.g. in-wall ensures that no thermal expansions arise within the panel that could cause cracking, as is not possible when applying heating systems directly to a wall. The systems for bridging cracks are, in the prior art, reinforcements with fabric or the installation of the heaters on plaster of Paris or wood panels, with the disadvantage that no perfect thermal distribution is present on these substrates.Another option of application is an industry-usable panel that reverses properties and improves heat conduction through a wall while degrading heat distribution along the panel to conduct heat remotely through massive materials while still heating the environment as little as possible. In this design, the chambers or the at least one chamber are introduced normally to the heating and connect the individual layers of the plate in the normal direction thereof.A modular panel element is preferably made of the following materials and mixtures of the materials mentioned.The invention is explained in more detail below on the basis of exemplary embodiments in conjunction with associated drawings. The following are shown schematically: FIG. 1 is a 3-dimensional view of a structure of a modular plate element according to the invention; FIG. 2 shows a further 3-dimensional view of the structure of the modular plate element from FIG. 1 ; FIG. 3 shows a further 3-dimensional view of the structure of the modular plate element from FIG. 1 ; FIG. 4 shows a construction of a modular plate element according to the invention on a wall; FIG. 5 shows a further construction of a modular plate element according to the invention on a wall; and FIG. 6 shows an alternative construction of a modular panel element according to the invention on a wall.In the following description, like reference numerals are used for like items.Fig. 1 shows a 3-dimensional view of a construction of a modular plate element 1 according to the invention, wherein Figs. 2 and 3 show the same modular plate element 1, but from slightly different perspectives.In the following, FIGS. 1 to 3 will be described together.More specifically, FIGS. 1 to 3 show a modular panel element 1 for at least partially creating a wall, a ceiling and / or a floor of a room.The panel element 1 has a first carrier element 2 with several chambers 3 for mechanical stabilization and for transporting heat with the aid of a fluid, as well as a heating paint 4 for heating the room using low-temperature infrared technology. The heating paint 4 comprises an electrically conductive substance mixture for generating infrared radiation.Specifically, FIGS. 1 to 3 show that the first carrier element 2 comprises a fluid-conveying inner element 5 and a load-bearing outer element 6, wherein a reinforcing element 7 for stiffening is arranged on the outer element 6 of the first carrier element 2.Furthermore, the plate element 1 comprises a reflection element 9 for reflecting infrared radiation generated by the heating paint 4, wherein the reflection element 9 is arranged between the inner element 5 and the outer element 6.The reinforcing element 7 is located on the side of the outer element 6 facing away from the inner element 5, wherein the reinforcing element 7 is formed as a honeycomb structure.Also, FIGS. 1 to 3 show that a second carrier element 8 is arranged on the reinforcing element 7, wherein the second carrier element 8 is arranged on the one side of the reinforcing element 7 and the outer element 6 is arranged on the other opposite side.In the example described here, both the supporting outer element 6 of the first carrier element 2 and the second carrier element 8 are designed as a plate.As can be seen in particular in FIGS. 1 and 3, various chambers 3 are aligned parallel to one another in the horizontal direction H within the inner element 5.Furthermore, various chambers 3 are likewise oriented in the vertical direction V.Thus, fluid within the chambers 3 can flow both vertically and horizontally.Each chamber 3 of the support element 2 is semicircular in cross section, wherein in cross section the two free opposite ends of the open side of each chamber 3 are at a distance of, for example, 1.5 centimeters.The support element 2 can have 3 extending from one side edge of the plate element 1 to another side edge of the plate element 1.In other words, the chambers 3 of the carrier element 2 extend over the entire width and height of the plate element 1.Furthermore, FIGS. 1 to 3 show that a support element 10 is arranged on the inner element 5 of the first support element 2, which support element is arranged on the side of the inner element 5 facing away from the outer element 6.In other words, the outer element 6 is arranged on one side of the inner element 5 and the support element 10 is arranged on the other side.The support element 10, like the support elements 6, 8, is designed as a plate.Here, the support member 10 includes a substrate 11, the heating paint 4, a primer 12, a fabric 13, and a cleaning material 14.A conductive material L is bonded to the substrate 11 in sheets formed as copper strips, and the heating paint 4 is disposed on the conductive material L and over the entire supporting member 10.On top of the heating paint 4 is again arranged the primer 12 on which the fabric 13 is applied.A cleaning material 14 is also arranged on the fabric 13.In addition, a fire-retardant layer can also be arranged on the heating paint 4.Not shown in the figures, however, the modular plate element 1 comprises electrical lines of conductive material L arranged inside the chambers 3.In this case, the electrical lines are designed as copper strips which are laid flat inside the plate element 1.In order to connect a plurality of plate elements to one another, the plate element 1 has one or more fluid connection elements for connecting two chambers 3 of two plate elements 1 and for transporting heat with the aid of a fluid.The plate element 1 in FIGS. 1 to 3 has also comprised various electrical plug elements, which serve for the electrical connection of two plate elements 1.FIG. 4 shows a structure of a modular plate element 1 according to the invention on a wall W, FIG. 5 showing a further structure and FIG. 6 showing an alternative structure of a modular plate element 1 according to the invention on a wall W.In this case, in FIG. 4, an adhesive layer K is used for fastening to a wall, a ceiling and / or a floor of a room in order to fasten a modular panel element 1 to the adhesive layer K.In FIG. 5, on the other hand, rails for fastening to a wall, a ceiling and / or a floor of a room are used to fasten a modular panel element 1 to the rails S.Finally, it should also be pointed out that the modular plate element 1 is designed in such a way that various plate elements can be arranged two-dimensionally next to one another and one on top of the other.Finally, it should also be mentioned with reference to FIGS. 1 to 6 that the second carrier element 8 comprises carbon, the reinforcing element 7 comprises plastics, the outer element 6 comprises carbon, the reflection element 9 comprises glass granulate, the inner element 5 comprises an aluminum composite material and the carrier 11 comprises carbon as materials.List of reference characters1 Modular Panel Member 2 First Support Member 3 Chamber 4 Heating paint 5 Inner Member 6 Outer Member 7 Reinforcing Member 8 Second Support Member 9 Reflective Member 10 Support Member 11 Support 12 Primer 13 Fabric 14 Cleaning Material H Horizontal Direction V Vertical Direction K Adhesive Layer L Conductive Material S Rail W Wall
Claims
Modular panel element (1) for at least partially constructing a wall, a ceiling and / or a floor of a room, comprising: - a first carrier element (2) with at least one chamber (3) for mechanical stabilization and for transporting heat with the aid of a fluid, - a heating paint (4) for heating the room with low-temperature infrared technology, wherein the heating paint (4) comprises an electrically conductive substance mixture, and - a reflection element (9) for reflecting infrared radiation, - wherein the at least one chamber (3) follows any curve in the room inside the panel element (1), and - wherein at least two chambers (3) are oriented perpendicular to one another in order to convey a fluid in two directions.Modular panel element according to claim 1, - wherein the first carrier element (2) comprises a fluid-conveying inner element (5) with the at least one chamber (3) and a load-bearing outer element (6), - wherein a reinforcing element (7) for stiffening is preferably arranged on the first carrier element (2), in particular on its outer element (6), preferably on the side of the outer element (6) facing away from the inner element (5), - wherein the reinforcing element (7) for stiffening is preferably designed as a honeycomb structure, - wherein a second carrier element (8) is preferably arranged on the reinforcing element (7), - wherein the load-bearing outer element (6) of the first carrier element (2) and / or the second carrier element (8) is preferably designed as a panel.Modular panel element according to one of the preceding claims, - wherein a support element (10) is arranged on the first support element (2), in particular on its outer element (6), - wherein preferably the support element (10) is arranged on the side of the inner element (5) facing away from the outer element (6), - wherein preferably the support element (10) is formed as a panel, - wherein preferably the support element (10) comprises the heating paint (4) for heating the room and for indirectly heating fluid within the inner element (5), - wherein preferably the support element (10) comprises a support (11) on which a conductive material is applied in tracks, preferably copper strips, - wherein preferably the support element (10) comprises the heating paint (4), wherein preferably the heating paint (4) is arranged on the conductive material, - wherein preferably the support element (10) comprises a primer (12), which is arranged in particular on the heating paint (4), - wherein preferably the supporting element (10) comprises a fabric (13) which is arranged in particular on the primer (12), - wherein preferably the supporting element (10) comprises a cleaning material (14) which is arranged in particular on the fabric (13), - wherein preferably a fire-retardant layer is arranged on the heating paint (4).Modular panel element according to any of the preceding claims, - wherein the reflecting element (9) is arranged between the inner element (5) and the outer element (6) to reflect radiation.Modular panel element according to one of the preceding claims, - wherein the panel element (1) comprises at least one electrical line, - wherein preferably the at least one electrical line is formed from conductive material, - wherein preferably the at least one electrical line is arranged within the at least one chamber (3), - wherein preferably the at least one electrical line is formed as a copper strip which is laid flat within the panel element (1), - wherein preferably the panel element (1) comprises at least one fluid connection element for connecting two chambers (3) of two panel elements (1) and for transporting heat with the aid of a fluid, - wherein preferably the panel element (1) comprises at least one electrical plug element which serves for electrically connecting two panel elements (1).System for at least partially modular construction of a wall, a ceiling and / or a floor of a room, comprising: - a modular plate element (1) with a first carrier element (2) according to one of the preceding claims, - wherein the first carrier element (2) comprises a fluid-conveying inner element (5) and a load-bearing outer element (6), - a further modular plate element with a further first carrier element (2) according to one of the preceding claims, - wherein the further first carrier element (2) likewise comprises a fluid-conveying inner element (5) and a load-bearing outer element (6), and - wherein the fluid-conveying inner elements of the two carrier elements (2) are arranged lying one on top of the other in such a way that the modular plate elements (1) can be arranged adjacent to one another.System according to claim 6, - wherein the chambers (3) of the first carrier elements (2) of the two modular plate elements (1) are oriented at different angles to one another, preferably between 45 degrees and 90 degrees to one another, when bonded or joined, - wherein preferably at the intersection of two chambers (3) of the plate elements (1) passage points are formed which allow fluid to flow from the one camera into the other chamber.The system according to claim 6 or 7, - wherein the system comprises rails (S) for attachment to a wall, a ceiling and / or a floor of a room for attaching to the rails (S) a modular panel element (1), and / or - wherein the system comprises an adhesive layer (K) for attachment to a wall, a ceiling and / or a floor of a room for attaching to the adhesive layer (K) a modular panel element (1).The system according to any one of claims 6 to 8, - wherein at least two plate elements can be arranged next to one another in a planar manner, preferably connect to one another in a seamless manner, - wherein preferably at least two plate elements can be arranged on one another, preferably connect to one another in a seamless manner.
Citation Information
Patent Citations
Heating element-containing construction unit for ceilings
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Modular panels for building ceilings
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Space heating system
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