Organic light-emitting diode and method for electrically connecting an organic light-emitting diode

Abstract

Organic light-emitting diode (100), comprising: - a substrate (101) with an active region (102) and a connection region (103), wherein the active region (102) and the connection region (103) of the substrate (101) are connected and formed in one piece, - an organic layer sequence (104) for light generation, which is attached to the substrate (101) in the active area (102), - at least one contact path (105) on the substrate (101) extending from the active area (102) to the connection area (103) and in contact with the organic layer sequence (104) in the active area (102), - a metallic contact element (106) for external electrical contacting of the organic layer sequence (104), which is arranged in the connection area (103), which penetrates the substrate (101) and which is in contact with the contact track (105) by a plastic deformation of a part (108) of the contact element (106).

Description

[0001] An organic light-emitting diode and a method for connecting such an organic light-emitting diode are described.

[0002] Document DE 10 2013 112 270 A1 discloses an optoelectronic component, a component arrangement and a method for manufacturing an optoelectronic component.

[0003] The publication DE 10 2012 200 023 A1 relates to an organic light-emitting diode, a connector and a luminaire.

[0004] It is desirable to specify an organic light-emitting diode that is easy and reliable to connect.

[0005] The organic light-emitting diode includes: - a substrate with an active area and a connection area, wherein the active area and the connection area of ​​the substrate are connected and formed in one piece, - an organic layer sequence for light generation, which is attached to the substrate in the active area, - at least one contact path on the substrate extending from the active area to the connection area and in contact with the organic layer sequence in the active area, - a metallic contact element for external electrical contacting of the organic layer sequence, which is arranged in the connection area, which penetrates the substrate and which is in contact with the contact track by a plastic deformation of a part of the contact element.

[0006] According to at least one embodiment, the organic light-emitting diode (OLED) comprises a substrate. The substrate can be the component that mechanically holds the OLED together. The substrate can be mechanically flexible, so that the OLED as a whole is mechanically flexible. Alternatively, the substrate can be mechanically rigid, so that the OLED does not deform, or does not deform significantly, during intended use. The substrate may, for example, be made of or comprise plastic. Other materials are also possible that allow for electrical connection, as described in this application.

[0007] According to at least one embodiment, the substrate has an active region. An organic layer sequence for light generation is deposited on the active region. According to further embodiments, the organic layer sequence comprises one or more active zones in which light is generated via charge carrier combinations. In addition to the active zone, light generation can also occur via photoluminescence, either directly within the organic layer sequence or in an additional photoluminescent layer.

[0008] The active region of the substrate is characterized by the presence of the organic layer sequence on this part of the substrate. In particular, the substrate is flexible in the active region. According to at least one embodiment, the substrate has a connection region. The connection region serves, in particular, to connect the organic light-emitting diode and, especially, the organic layer sequence to an external power source. The power source includes, for example, a current and / or voltage supply as well as any other control electronics that may be necessary. For example, connector components of a terminal block can be arranged in the connection region.

[0009] According to at least one embodiment, the active area and the connection area of ​​the substrate are contiguous and formed in one piece. The active area and the connection area are made of the same material or materials as a single, continuous component. In particular, the substrate extends continuously from the active area to the connection area without any intermediate areas with differently shaped properties. The substrate thus has the active area and the connection area, which are manufactured contiguously from the same workpiece and form integral components of the substrate. The active area and the connection area are directly adjacent to each other. In particular, neither area is manufactured independently of the other area of ​​the substrate and subsequently joined to the other area.There is no additional bonding material between the active area and the connection area. In particular, the active area and the connection area of ​​the substrate have the same thickness.

[0010] According to at least one embodiment, the organic light-emitting diode (OLED) has a contact track on the substrate. The contact track extends from the active region to the terminal region. In the active region, the contact track is in contact with the organic layer sequence. The contact track is specifically designed and configured to be electrically contactable by means of an external contact element. For example, the contact track is designed and configured to provide an electrical supply to the organic layer sequence. The contact track is, for example, a layer of a metal or another electrically conductive material on the substrate. Depending on the configuration of the organic layer sequence, the OLED has a plurality of contact tracks. The contact track is connected to the organic layer sequence in the active region, in particular by an electrically conductive connection.

[0011] According to at least one embodiment, a metallic contact element is provided for external electrical contacting of the organic layer sequence. The contact element is arranged in the connection area. The contact element penetrates the substrate and is in contact with the contact track. The contact element is electrically conductively connected to the contact track, particularly in the connection area. The metallic contact element is designed such that a portion of it can penetrate the substrate or other layers of the LED without requiring prior removal of the substrate or other layers. The contact element is not inserted into a recess in the substrate or the other layers. The contact element is designed to separate the substrate and / or the other layers in a manner similar to a needle or a cutting blade.

[0012] According to at least one embodiment, an organic light-emitting diode (OLED) comprises a substrate with an active region and a terminal region. The active region and the terminal region of the substrate are contiguous and formed in one piece. An organic sequence of layers for light generation is deposited on the substrate in the active region. The LED has at least one contact track on the substrate. The contact track extends from the active region to the terminal region. The contact track is in contact with the organic sequence of layers in the active region. The LED has a metallic contact element for external electrical contacting of the organic sequence of layers. The contact element is located in the terminal region. The contact element penetrates the substrate and is in contact with the contact track.

[0013] The contact element provides, in particular, a connection option for plastic-based, especially flexible, organic light-emitting diodes.

[0014] The following considerations, among others, underlie the light-emitting diode described here. It is possible to directly contact the contact surfaces of the organic layer sequence, for example with spring pins. This is commonly used for testing purposes and / or in characterizing the LED. However, this is not a robust method for using the LED in its intended operation.

[0015] For contacting during intended operation, flexible printed circuit boards (FlexPCBs) can be attached to the substrate using an anisotropic conductive adhesive. A connector can then be provided at the end of the flexible PCB furthest from the component. However, this approach is complex and expensive. In particular, this method requires the removal of layers of the organic light-emitting diode (OLED), such as an encapsulation and / or a top layer, to expose the contact path. Lasers are used for this purpose. Furthermore, removing these layers in the contact area can affect the robustness of the component and / or lead to a longer manufacturing time.

[0016] The organic light-emitting diode (OLED) described here utilizes, among other things, the idea that a contact method is used to connect the OLED, particularly its polymer-based components, in which the contact element cuts through the substrate or subsequent layers without requiring their prior removal. For example, a crimping process or an insulation displacement connection (IDC) technique is employed. In particular, a non-conductive substrate is used to prevent lateral current flow within the substrate during operation. Alternatively, an electrically conductive substrate coated with electrical insulation can also be used.

[0017] The contact path on the substrate is structured so that, outside the active area, it provides sufficient surface area in the connection area for contact with the contact element. The connection area has the same continuous substrate and, if applicable, the continuous additional layers as the active area. The connection area is fitted with the contact element, for example, by crimping or other mechanical processes.

[0018] This eliminates the need for additional materials such as flexible PCBs and anisotropic adhesive. The metallic contact element and the necessary assembly process utilize cost-effective methods and materials. This provides a simple, fast, and economical connection option for the organic light-emitting diode (OLED). No layers of the OLED need to be removed to create the electrical connection. Furthermore, the connection area is at least partially covered by the metallic contact element. This results in a robust design for the LED. In particular, the LED with the metallic contact element is designed for use in motor vehicles and meets the specific requirements applicable in the automotive sector.The metallic contact element can have different designs, so that common connector types can be attached directly to the substrate of the light-emitting diode.

[0019] According to at least one embodiment, the light-emitting diode (LED) has an encapsulation arrangement over the active element. The encapsulation arrangement extends from the active area into the terminal area and covers the terminal area. The contact element penetrates the encapsulation arrangement. The encapsulation arrangement comprises, in particular, one or more layers of a plastic or other materials. For example, the encapsulation arrangement includes a thin-film encapsulation for the hermetic sealing of the organic layer sequence. Furthermore, a cover layer made of a plastic is provided, which offers, in particular, protection against mechanical influences. The encapsulation arrangement protects, in particular, the organic layer sequence from damaging external influences such as moisture or harmful gases from the environment.The contact element penetrates the encapsulation arrangement so that it is in contact with the contact track through the encapsulation arrangement. The encapsulation arrangement does not need to be removed for this to occur. The contact element is designed to cut through the encapsulation arrangement during manufacturing.

[0020] According to at least one embodiment, the contact element comes into contact with the contact track through plastic deformation of a portion of the contact element. For example, the metallic contact element is a crimp terminal element. During manufacturing, after being pressed through the connection area and / or the substrate, it is bent. This plastic deformation, for example, causes the contact element to come into contact with the contact track.

[0021] According to at least one embodiment, the contact element penetrates the substrate in a top view next to the contact track. It is therefore possible that the contact element initially penetrates the substrate and / or the encapsulation arrangement without being in contact with the contact track. Only through plastic deformation or other reshaping processes is the contact element deformed in such a way that it comes into contact with the contact track.

[0022] According to at least one further embodiment, the contact element penetrates the contact track. In particular, the contact element is in direct contact with the contact track when inserted into the connection area and does not need to be additionally deformed.

[0023] According to at least one further embodiment, the contact element penetrates the contact track. In particular, the contact element is in direct contact with the contact track upon insertion into the connection area, and the contact element is additionally deformed in such a way that it also comes into contact with the contact track.

[0024] According to at least one embodiment, the light-emitting diode (LED) has a retaining element that is coupled to one end of the contact element to fix the contact element in place. In particular, the retaining element is a plastic element that prevents the contact element from slipping out of the LED. The retaining element is especially provided when the contact element is not plastically deformed.

[0025] According to at least one embodiment, the contact element penetrates the substrate from a first side to a second side. Contact with the contact track occurs, in particular, on the side of the contact track facing the second side. Thus, it is possible, especially by bending the contact element on the second side, to ensure reliable contact and an electrical connection between the contact element and the contact track.

[0026] According to at least one embodiment, the light-emitting diode has two active areas, with the connection area arranged between the two active areas. Each active area has, in particular, an organic layer sequence for light generation. The contact element makes it easy to variably position the connection area on the light-emitting diode, so that a centrally located connection area is also possible.

[0027] According to further embodiments, more than two active areas, for example three or more active areas with respective organic layer sequences, are provided. The connection area is electrically connected, in particular, to the contact tracks with the respective active areas and the respective organic layer sequences. Several connection areas can also be provided, each electrically connected to one or more organic layer sequences. If several active areas are present, at least one embodiment provides for a continuous organic layer sequence over all active areas. The organic layer sequence is therefore not interrupted laterally between the active areas.

[0028] According to at least one embodiment, the connection area has a transverse dimension. The transverse dimension of the connection area is smaller than that of the active area. This allows for the realization of an organic layer sequence with a sufficiently large surface area to create the desired light-emitting surface. The connection area, in which the connections for the organic layer sequence are implemented, can be smaller than the active area. This enables material savings and the implementation of various connector shapes.

[0029] According to at least one embodiment, the LED has a connector housing that at least partially surrounds the contact element. The contact element, together with the connector housing, forms a connector, allowing the LED to be designed for a wide variety of applications. Thus, a connector is formed directly on the LED's substrate. The LED can be plugged into a corresponding counterpart, such as a power source, using this connector.

[0030] Furthermore, a method for electrically connecting an organic light-emitting diode (OLED) is disclosed, in particular an OLED according to at least one embodiment as specified in the application. Features and advantages of the OLED are also disclosed for the method, and vice versa.

[0031] The procedure comprises the following steps, in particular in the order given: - Providing the organic light-emitting diode with a substrate having an active area and a terminal area, wherein the active area and the terminal area of ​​the substrate are interconnected and formed in one piece, an organic layer sequence for light generation which is attached to the substrate in the active area, and at least one contact track on the substrate which extends from the active area to the terminal area and which is in contact with the organic layer sequence in the active area, - Inserting a metallic contact element in the connection area through the substrate, and - Contacting the contact element with the contact track in the connection area by plastically deforming a part of the contact element.

[0032] This method allows for a simple and reliable mechanical and electrical connection of the contact element as an interface to the substrate and the contact tracks. The contact element is pressed through the initially intact substrate, thus cutting through it.

[0033] According to at least one embodiment, the organic light-emitting diode (OLED) has an encapsulation arrangement over the active element and the terminal area. The encapsulation arrangement extends from the active area into the terminal area. The contact element is inserted through the encapsulation in the terminal area. Specifically, the contact element is inserted into the initially intact encapsulation arrangement. The contact element itself cuts through the encapsulation arrangement. Prior exposure of the contact path for contacting with the contact element is not necessary. Neither the substrate from the underside nor the encapsulation arrangement from the top side needs to be removed to access the contact path.

[0034] According to at least one embodiment, pressure is applied to the contact element to cut it through the substrate. The contact element is forced open and cuts through the substrate and / or the encapsulation arrangement itself.

[0035] According to at least one embodiment, part of the contact element is plastically deformed to contact the contact track. For example, the part of the contact element is bent over to come into contact with the contact track. For example, the contact element is first pressed through the encapsulation arrangement and / or the substrate and then subsequently bent over.

[0036] According to at least one embodiment, a retaining element is applied to one end of the contact element. This secures the contact element. The retaining element is particularly useful for securing the contact element when plastic deformation of the contact element is avoided.

[0037] According to at least one embodiment, a connector housing is arranged that at least partially surrounds the contact element. The contact element and the connector housing together form a connector interface for the mechanical and / or electrical connection of the light-emitting diode.

[0038] For contacting or electrically connecting the organic light-emitting diode (OLED), a crimping process and / or insulation displacement connection (IDC) technology is used, for example. The electrical connection is made possible without removing any material from the layers surrounding the contact track. The contact element is pressed into the LED along with the substrate and encapsulation assembly to make contact with the track. The sharp edges of the contact element partially cut through the substrate and / or encapsulation assembly. The substrate and / or encapsulation assembly are in direct contact with the contact element after it has been inserted. In particular, the substrate and / or encapsulation assembly seals tightly with the contact element, creating a sufficiently gas-tight and / or liquid-tight connection.

[0039] Further advantages, features, and enhancements are illustrated in the following examples. Identical, similar, or equivalent elements can be designated with the same reference symbols. The figures and the relative sizes of the elements depicted within them are not to scale. Rather, individual elements may be exaggerated for clarity and / or to improve comprehensibility.

[0040] They show: Fig. 1 a schematic representation of an organic light-emitting diode according to an exemplary embodiment, Fig. 2A and Fig. 2B Schematic representations of an organic light-emitting diode according to an exemplary embodiment, Fig. 3A to 3D schematic representations of various manufacturing steps according to an exemplary embodiment, Fig. 4A to 4C schematic representations of various manufacturing steps according to an example, Fig. 5A and Fig. 5B Schematic representations of sectional views of a light-emitting diode according to an exemplary embodiment, Fig. 6A and Fig. 6B Schematic representations of sectional views of a light-emitting diode according to an exemplary embodiment, Fig. 7A and Fig. 7B Schematic representations of sectional views of a light-emitting diode according to an example, Fig. 8 a schematic representation of a light-emitting diode according to an exemplary embodiment, Fig. 9 a schematic representation of a light-emitting diode according to an exemplary embodiment, and Fig. 10 A schematic representation of a sectional view of a light-emitting diode according to an exemplary embodiment.

[0041] Fig. Figure 1 shows a schematic representation of an embodiment of an organic light-emitting diode 100. The light-emitting diode 100 has a substrate 101. The substrate is, for example, a metal foil or, in particular, an electrically non-conductive plastic film. The thickness in the Z-direction of the substrate 101 is, for example, in a range between 5 µm and 250 µm, particularly around 100 µm.

[0042] On a first side 111 of the substrate 101, an organic layer sequence 104 for light generation is applied. The organic layer sequence 104 is electrically connected to contact tracks 105. The organic light-emitting diode 100 can thus be electrically connected via the electrical contact tracks 105. The electrical contact tracks 105 are, for example, each formed by one or more metal layers.

[0043] The organic layer sequence 104 is arranged on a first sub-region of the substrate 101, which forms an active region 102. Immediately adjacent to the active region 102, the substrate has a further sub-region that forms a connection region 103. The active region 102 and the connection region 103 are contiguous and formed as a single piece, thus constituting integral components of the substrate 101. The active region 102 and the connection region 103 are formed from the same material and, for example, are cut from a single, shared workpiece.

[0044] The contact tracks 105 extend from the organic layer sequence 104 to the connection area 103. In the illustrated embodiment, two contact tracks 105 are provided. More or fewer contact tracks 105 can also be provided.

[0045] In the connection area 103, a contact element 106 is provided for each contact track 105. The contact element 106 penetrates the substrate 101 and an encapsulation arrangement 107 (for example, Fig. 2A) and is in direct electrical and mechanical contact with the respective contact track 105. The contact track 105 and the contact element 106 touch each other. The contact element 106, in particular, represents an interface between the organic light-emitting diode 100 and an external energy source. The encapsulation arrangement 107 is omitted according to embodiments not explicitly shown. According to further embodiments, it is also possible that only parts of the light-emitting diode 100 have the encapsulation arrangement 107; in particular, the encapsulation arrangement 107 is arranged only on the active area 102.

[0046] One area of ​​the contact element 106 is arranged, in particular, within the connection area 103, and another area of ​​the contact element 106 is arranged outside the connection area 103. In particular, the area located outside the connection area 103 is, for example, surrounded by a connector housing 117. According to further embodiments, the connector housing 117 also encloses a portion of the substrate 101 and the encapsulation arrangement 107, particularly within the connection area 103. The contact element 106, together with the connector housing 117, forms a connector 124, with which the organic light-emitting diode 100 can be plugged into a corresponding counterpart. The connector 124 thus serves for the mechanical and / or electrical contacting of the organic light-emitting diode 100.

[0047] The contact element 106, as explained in more detail below, is provided with sharp and / or pointed edges so that it can cut through the encapsulation arrangement 107 and / or the substrate 101. For its manufacture, the contact element 106 is pressed through the encapsulation arrangement 107 and / or the substrate 101 without having to remove the substrate 101 and / or the encapsulation arrangement 107 beforehand. For example, the contact element 106 is pressed in starting at a side facing away from the substrate 101 and thus penetrates the connection area 103 along the Z-direction. This can be done either directly or after bending a part 108 (for example, Fig. 3C) the contact element 106 then contacts the contact track 105, so that electrical energy can be conducted through the contact element 106 to the contact track 105 and subsequently to the organic layer sequence 104.

[0048] The contact elements 106 are thus electrically and mechanically directly and immediately connected to the contact tracks 105 and the substrate 101 of the organic light-emitting diode 100. The contact elements 106 are connected to the same substrate 101 that also carries the organic layer sequence 104. The substrate 101 therefore provides mechanical support for both the organic layer sequence 104 and the contact elements 106.

[0049] The contact element 106 is formed in one piece from a metal. The area that contacts the contact track 105 and the area opposite it, which is part of the connector 124, are made of the same material. For example, the contact element 106 has copper or another electrically conductive and malleable metal as its main component.

[0050] The connection area 103 of the substrate 100 has a transverse orientation 115 along the X-direction. The active area 102 has a transverse extent 116 along the X-direction. In the illustrated embodiment, the transverse extent 115 of the connection area 103 is smaller than the transverse extent 116 of the active area 102. According to further embodiments, the transverse extent 115 of the connection area 103 is equal to the transverse extent 116 of the active area. According to further embodiments, the transverse extent 115 of the connection area 103 is larger than the transverse extent 116 of the active area 102.

[0051] If the transverse dimension 116 of the active area 102 is larger than the transverse dimension 115 of the connection area, as in Fig. As shown in Figure 1, it is possible to form a large-area organic layer sequence 104 with a comparatively small connector 124. For example, the individual contact elements 106 have a spacing 121 in the range of millimeters, for example, approximately 2.5 mm. Depending on the number of contact elements 106, the transverse dimension 115 is therefore in the range of a few millimeters to a few tens of millimeters, for example, 10 mm to 20 mm. The area of ​​the organic layer sequence 104 can be chosen to be correspondingly larger in order to realize a sufficiently large emission area for the light emitted by the organic layer sequence 104 during operation, for example, 40 mm to 200 mm. The size of the connection area 103 and the size of the active area 102 can be determined independently of each other according to respective requirements.

[0052] The contact elements 106, for example, have a length 120 of a few millimeters up to 10 mm or 20 mm. For example, a section of 5 to 10 mm overlaps the contact track 105. Another section of 5 mm to 10 mm is exposed, so that this section, together with the connector housing 117, can form the connector 124.

[0053] Fig. 2A and Fig. Figure 2B shows a sectional view of the organic light-emitting diode 100 according to an exemplary embodiment during manufacturing.

[0054] Fig. Figure 2A shows the connection area 103 of the light-emitting diode 100 before the contact element 106 is attached. In the Z-direction, the contact track 105 is arranged on a first side 111 of the substrate 101. The encapsulation arrangement 107 is arranged on the contact track 105. The encapsulation arrangement 107 covers, in particular, both in the connection area 103 and in the active area 102, the contact track 105 and the organic layer sequence 104. The encapsulation arrangement 107 has, for example, a thin-film encapsulation 122. In the Z-direction, a cover layer 123 is arranged, for example, on the thin-film encapsulation 122. The encapsulation arrangement 107 serves in particular to protect the organic layer sequence 104 and the contact layer 105. The thin-film encapsulation 122 is intended, for example, to form a barrier against atmospheric substances, in particular against moisture and oxygen and / or against other damaging substances.The top layer 123, which is made of a plastic, for example, serves in particular as protection against mechanical influences.

[0055] Fig. Figure 2B shows the connection area 103 after the contact element 106 has been inserted. In the illustrated embodiment, the contact element is pressed through the connection area 103, starting at the outer side of the encapsulation arrangement 107 facing away from the substrate and moving in the opposite direction to the Z-axis. The contact element 106 penetrates at least partially the encapsulation arrangement 107, the substrate 101, and the contact track 105. The contact element 106 comes into contact with the contact track 105, for example, by plastic deformation such as bending. The contact track 105 does not need to be exposed separately for this purpose.

[0056] The connector housing 117 is then clipped onto the exposed elements of the contact element 106. The contact element 106 thus has both the electrical and mechanical coupling with the organic light-emitting diode 100 and elements of the connector 124.

[0057] In the illustrated embodiment, the contact element 106 is a crimp terminal element 113. The crimp terminal element 113 is mechanically and electrically connected to the organic light-emitting diode 100 by means of a crimping process. The crimp terminal element 113 has one or more pointed or sharp ends 110. The ends 110 are pierced through the encapsulation arrangement 107 and the substrate 101. On the second side 112 of the substrate 101, facing away from the contact track 105, the ends 110 are then bent or rolled over using a suitable tool. In the illustrated embodiment, the bent ends 110 then penetrate the substrate 101 again and make contact with the contact track 105. For example, the ends 110 penetrate into the contact track 105 or conform to it in such a way that an electrically conductive connection is formed between the contact track 105 and the end 110.

[0058] A method for electrically connecting the organic light-emitting diode 100 is also described in the Fig. 3A to 3D schematically represented. As shown. Fig. As can be seen in Figure 3A, the crimp terminal element 113 is initially provided separately from the terminal area 103 of the organic light-emitting diode 100. In terminal area 103, the contact track 105 is completely covered on the upper side by the encapsulation arrangement 107 and on the lower side by the substrate 101. Neither the encapsulation arrangement 107 nor the substrate 101 is partially removed to expose the contact track 105 for contact with the contact element 106.

[0059] In Fig. Figure 3B shows how pressure is applied to the crimp terminal element 113 in the opposite direction to the Z-direction using a punch 118 or another tool. The ends 110 thus first pierce or cut through the encapsulation arrangement 107 and subsequently the substrate 101. The crimp terminal element 113 then cuts through the encapsulation arrangement 107 and the substrate 101 independently, without the need for additional tools such as lasers or similar devices. Only the pressure in the direction of the substrate 101 needs to be applied.

[0060] Fig. Figure 3C shows another punch 119 or a similar tool that exerts pressure in the Z-direction on part 108 of the crimp terminal element 113 in order to plastically deform it. This creates a terminal as shown in Fig. 3D representation, in which the ends 110 of the crimp terminal element 113 penetrate into the contact track 105 and thus create an electrical connection.

[0061] Fig. Figures 4A to 4C show different process steps of the manufacturing process according to an example in overhead view.

[0062] The organic light-emitting diode 100 is designed with the connection area 103 and the active area 102 such that the contact tracks 105 are also arranged outside the organic layer sequence 104 on the substrate 101.

[0063] The contact elements 106 are then connected to the corresponding contact track 105 from above or below ( Fig. 4B).

[0064] The connector housing 117 is then attached, for example by being plugged in and / or clipped on, so that the connector 124 is formed ( Fig. 4C).

[0065] Fig. 5A and Fig. Figure 5B shows the attachment of the contact element 106 according to an exemplary embodiment.

[0066] For example, the ends 110 of the contact element 106 are pierced laterally next to the contact track through the encapsulation arrangement 107 and the substrate 101, so that the ends 110 emerge again on the second side 112 of the substrate 101.

[0067] Subsequently, the parts 108 with the ends 110 are bent back towards the contact track 105, as shown in Fig. Figure 5B shows that the ends 110 do not necessarily have to penetrate the contact track 105. For example, the ends 110 can bend again at the contact track 105, so that they only make contact with one surface of the contact track 105. Even in this way, a sufficiently good electrical connection between the contact element 106 and the contact track 105 is achieved.

[0068] Fig. 6A and Fig. Figure 6B shows the penetration of the contact element 106 according to a further embodiment. According to this embodiment, the ends 110 of the contact element 106 penetrate the contact track 105 and subsequently the substrate 101 immediately after they have cut through the encapsulation arrangement 107. On the second side 112 of the substrate, the ends 110 are bent over again so that they come into contact with the contact track 105 once more. Alternatively, the ends 110 are bent over in such a way that they do not come into contact with the contact track 105 again, but mechanically fix the contact element 106.

[0069] Fig. 7A and Fig. Figure 7B shows the penetration of the contact element 106 according to another example. The end 110 of the contact element 106 is inserted through the encapsulation arrangement 107 and the substrate 101 in such a way that it also penetrates the contact track 105. A retaining element 109 is then applied to the end 110 of the contact element 106 on the second side 112 of the substrate 101. The retaining element 109 is, for example, made of a plastic. The retaining element 109 fixes the contact element 106 to the second side 112 of the substrate 101. Thus, bending or other plastic deformation of the end 110 or part 108 of the contact element 106 is unnecessary. The retaining element 109 prevents the contact element 106 from falling out in the Z-direction. The electrical contact between the contact element 106 and the contact track 105 is ensured by piercing the contact track 105 when inserting the contact element 106.

[0070] Fig. Figure 8 shows the organic light-emitting diode 100 according to a further embodiment. According to the embodiment of Fig. Figure 8 provides two connection areas 103, each configured corresponding to the connection area 103 as previously described. For example, only a single contact track 105 is arranged for each connection area 103. The active area 102 with the organic layer sequence 104 is arranged along the Y-direction between the two connection areas 103. A connector 124 is provided at each connection area 103. If, for example, the mating parts for the connectors 124 are arranged closer to each other than the two connectors 124 are in the unplugged state, the substrate 101 with the organic layer sequence 104 is automatically warped when the connectors 124 are plugged in. Furthermore, it is equipped with the Fig. The 8 connection areas 103 shown allow several appropriately constructed organic light-emitting diodes 100 to be connected directly to each other in series. This enables a modular design of a luminaire.

[0071] Fig. Figure 9 shows the organic light-emitting diode 100 according to an embodiment. In contrast to the previous embodiments and examples, the organic light-emitting diode 100 according to the embodiment of the Fig. 9 two active regions 102. The active regions 102 each exhibit an organic layer sequence 104. The organic layer sequences 104 can each be identical or different in structure.

[0072] The two active regions 102 and the connection region 103 arranged between them along the Y-direction share a single, continuous substrate 101. Several organic layer sequences 104 and at least one connector 124 are thus realized on this single substrate 101. The layer sequences 104 can be contacted via the common connector 124.

[0073] Fig. Figure 10 shows a contact element 106 according to a further embodiment. In particular, in the case of a connector 124 as in the embodiment shown in Figure 10. Fig. As provided in section 9, it is advantageous if connector 124 does not extend primarily horizontally in the XY plane, but rather vertically primarily along the Z direction. Accordingly, in Fig. Figure 10 shows that the contact element 106 in the upper part, which does not extend through the encapsulation arrangement 107 and the substrate 109, is mainly extended along the Z-direction. The mating part is inserted along the Z-direction. Together with the connector housing 117 (not explicitly shown), this results in a connector 124 that can be contacted, in particular, from above in the negative Z-direction.

[0074] According to exemplary embodiments, the contact track 104 has the same thickness along its entire length in the Z-direction. According to further exemplary embodiments, the thickness in the Z-direction is greater or reinforced in the connection area 103, where the contact element 106 is mounted. For example, a metal layer is printed from a solution in this area. This is particularly cost-effective to produce. The cover layer 123 extends, in particular, across the entire surface of the LED 100. For example, the cover layer 123 is based on a polymer. According to exemplary embodiments, common materials are used for the substrate 101, the contact track 105, and the encapsulation arrangement 107. Furthermore, the already established layer thicknesses can be used. The attachment of the contact element 109 is adapted to the corresponding materials and thicknesses.

[0075] The contact element 106 can be inserted either starting at the encapsulation arrangement 107 or starting at the substrate 101. The contact element can therefore be inserted in the Z-direction or in the negative Z-direction. This also applies in particular to the embodiments and examples described together with the figures.

[0076] Particularly when the substrate 101 is a plastic substrate, it is possible that an encapsulation layer is also located between the layer sequence 105 and the substrate 101. In these embodiments and examples, the contact element 106 also penetrates this additional encapsulation layer. According to these embodiments, the substrate-side additional encapsulation layer is provided in the connection area 103, which in particular covers the entire substrate 101. According to these embodiments, the encapsulation arrangement covering the layer sequence 104 can be omitted in the connection area.

[0077] The connection between the contact element 106 and the contact track 105 is located outside the layer sequence 104. Therefore, the connection between the encapsulation arrangement 107 and the substrate 101 via the contact element 106 does not need to be as hermetically sealed as in the organic layer sequence 104. It is only necessary to ensure that disturbances cannot propagate laterally from the contact element 106 to the organic layer sequence 104. Because the contact element 106 is integrated into the continuous encapsulation arrangement 107 and the continuous substrate 101, the substrate 101 and the encapsulation arrangement 107 connect directly to the contact element 106 via a positive fit. This creates a sufficiently tight, and in particular gas-tight, connection.

[0078] In particular, there are no free surfaces during manufacturing, so contamination of the contact path 105 can be largely avoided. This prevents delamination effects and similar problems. Furthermore, heat input via the contact path 105 to the organic layer sequence 104 is avoided, which can conventionally occur during the removal of the encapsulation arrangement 107, for example, using a laser to expose the contact path 105.

[0079] Due to the compression of the contact element 106 with the substrate 101 and the encapsulation arrangement 107, the connection is also sufficiently mechanically stable. The contact element 106 is applied to the substrate 101, on which active elements such as the organic layer sequence 104 are also deposited. For example, the substrate 101 is a polyimide film. A material bond is formed between the contact element 106 and the substrate 101, as well as the encapsulation arrangement 107. Due to the compression of the contact element 106, pressure is exerted on the encapsulation arrangement 107 from above and on the substrate 101 from below. This further counteracts delamination.

[0080] In particular, any combination of individual features of the different designs of the contact element 106, as especially in the Fig. 5A, Fig. 5B, Fig. 6A, Fig. 6B, Fig. 7A and Fig.Figure 7B shows that different bending directions of the end 110 are possible, both when the contact element 106 is pierced next to the conductor track 105 and when the contact element 106 is pierced directly through the conductor track 105. In the various embodiments and examples, the contact element 106 can be configured with one end 110, two ends 110, or more ends 110. The different types of contact elements are possible with a single connection area 103, with two or more connection areas 103, and with a centrally located connection area 103. Thus, the individual configurations of the connection area 103 and the contact element 106 from the various embodiments and examples can be combined in a wide variety of ways.The various combinations of configurations of the contact element 106 can each be inserted starting on the substrate side or starting on the side of the encapsulation arrangement. It is also possible that some of the contact elements 106 are inserted from one side and others from the opposite side. Reference symbol list 100 Organic Light Emitting Diodes 101 Substrat 102 active area 103 Connection area 104 organic layer sequence 105 Contact track 106 Contact element 107 Encapsulation arrangement 108 Part of the contact element 109 Holding element 110 End of the contact element 111 first side of the substrate 112 second side of the substrate 113 Crimp terminal element 115, 116 Lateral extent 117 Connector housings 118, 119 stamps 120 length 121 distance 122 Thin-film encapsulation 123 Top layer 124 plugs

Claims

[1] Organic light-emitting diode (100), comprising: - a substrate (101) with an active region (102) and a connection region (103), wherein the active region (102) and the connection region (103) of the substrate (101) are connected and formed in one piece, - an organic layer sequence (104) for light generation, which is attached to the substrate (101) in the active area (102), - at least one contact path (105) on the substrate (101) extending from the active area (102) to the connection area (103) and in contact with the organic layer sequence (104) in the active area (102), - a metallic contact element (106) for external electrical contacting of the organic layer sequence (104), which is arranged in the connection area (103), which penetrates the substrate (101) and which is in contact with the contact track (105) by a plastic deformation of a part (108) of the contact element (106). [2] Light-emitting diode according to claim 1, comprising an encapsulation arrangement (107) over the organic layer sequence (104) and the connection area (103), extending from the active area (102) into the connection area (103), wherein the contact element (106) penetrates the encapsulation arrangement (107). [3] Light-emitting diode according to one of claims 1 to 2, wherein the contact element (106) penetrates the substrate (101) in top view next to the contact track (105). [4] Light-emitting diode according to one of claims 1 to 3, wherein the contact element (106) penetrates the contact track (105). [5] Light-emitting diode according to one of claims 1 to 4, comprising a retaining element (109) which is coupled to an end (110) of the contact element (106) to fix the contact element (106). [6] Light-emitting diode according to one of claims 1 to 5, wherein the contact element (106) penetrates the substrate (101) starting at a first side (111) to a second side (112) and the contact with the contact track (105) is on a side of the contact track (105) facing the second side (112). [7] Light-emitting diode according to any one of claims 1 to 6, wherein the contact element (106) is a crimp terminal element (113). [8] Light-emitting diode according to one of claims 1 to 7, comprising two active areas (102), wherein the connection area (103) is arranged between the two active areas (102). [9] Light-emitting diode according to any one of claims 1 to 8, wherein the connection area (103) and the active area (102) each have a transverse dimension and the transverse dimension (115) of the connection area (103) is less than the transverse dimension (116) of the active area (102). [10] Light-emitting diode according to any one of claims 1 to 9, comprising a connector housing (117) that at least partially surrounds the contact element (106). [11] Light-emitting diode according to any one of claims 1 to 10, wherein the substrate (101) is a plastic substrate. [12] Method for electrically connecting an organic light-emitting diode (100), comprising: - Providing the organic light-emitting diode with a substrate (101) having an active region (102) and a terminal region (103), wherein the active region (102) and the terminal region (103) of the substrate (101) are interconnected and formed in one piece, an organic layer sequence (104) for light generation which is attached to the substrate (101) in the active region (102), and at least one contact track (105) on the substrate (101) which extends from the active region (102) to the terminal region (103) and which is in contact with the organic layer sequence (104) in the active region (102), - Insertion of a metallic contact element (106) in the connection area (103) through the substrate (101), and - Contacting the contact element (106) with the contact track (105) in the connection area (103) by plastically deforming a part (108) of the contact element (106). [13] Method according to claim 12, wherein the organic light-emitting diode has an encapsulation arrangement (107) over the organic layer sequence (104) and the connection area (103), extending from the active area (102) into the connection area (103), comprising: - Inserting the contact element (106) into the connection area (103) through the encapsulation arrangement (107). [14] Method according to claim 12 or 13, comprising: - Applying pressure to the contact element (106) to insert the material, causing the contact element (106) to cut through the substrate (101). [15] Method according to any one of claims 12 to 14, comprising: - Applying a retaining element (109) to one end (110) of the contact element (106), and thereby - Fixing the contact element (106). [16] Method according to any one of claims 12 to 15, comprising: - Arranging a connector housing (117) that at least partially surrounds the contact element (106).

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