Electronic device with a structural layer

Abstract

Device that features the following: a structural layer (130, 550, 650, 815, 915, 1215, 1315) that exhibits graphs; a first glass fiber reinforced epoxy board (110-1, 110-2, 910-1, 1210-1) mounted on one side of the structural layer (130, 550, 650, 815, 915, 1215, 1315); a second glass fiber reinforced epoxy board (110-N, 910-2, 1210-N) mounted on an opposite side of the structural layer (130, 550, 650, 815, 915, 1215, 1315); Components, wherein the components comprise a processor (1404, 1522), a memory (1402, 1540) operationally coupled to the processor (1404, 1522), and a display (840, 953, 1408, 1440, 1592) operationally coupled to the processor (1404, 1522); and a case material supported by the structural layer (130, 550, 650, 815, 915, 1215, 1315).

Description

TECHNICAL AREA

[0001] The subject matter disclosed herein generally relates to electronic devices. BACKGROUND

[0002] An electrical device can include electrical components mounted on a printed circuit board.

[0003] US 2015 / 0022986 A1 relates to a circuit arrangement comprising a first circuit substrate and a second circuit substrate. The first circuit substrate defines a first main surface, and the second circuit substrate defines a second main surface. A variety of electrical components may be arranged on either the first or the second main surface. One or more substrate bridging elements are arranged between the first circuit substrate and the second circuit substrate. Each substrate bridging element may form a single structure having a first end connected to the first main surface and a second end connected to the second main surface to bridge the first and second circuit substrates.

[0004] US 2009 / 0290089 A1 relates to a liquid crystal display device comprising a liquid crystal display panel, a backlight system, a control board for controlling the liquid crystal display panel and the backlight system, and a housing for containing the aforementioned elements. A metal plate is provided between the backlight system and the control board, having a flat surface on its front and back that is wider than the backlight system and the control board. A sloping and / or a rising section is provided along the edges of the metal plate on at least one pair of opposite edges. Furthermore, a bezel is located between the housing and the sloping and / or rising sections, arranged to support the metal plate and / or the liquid crystal display. SUMMARY

[0005] The present invention is based on the objective of providing a device with improved stability.

[0006] The problem is solved by the subject matter of the main claim.

[0007] The subject matter of the dependent claims represents preferred embodiments. SUMMARY

[0008] A device comprises a structural layer containing graphene; a first glass-fiber-reinforced epoxy board mounted on one side of the structural board; a second glass-fiber-reinforced epoxy board mounted on the opposite side of the structural board; components, the components comprising a processor, a memory operationally coupled to the processor, and a display operationally coupled to the processor; and a housing material supported by the structural layer. Various other devices, systems, methods, etc., are also disclosed. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The features and advantages of the described implementations are easier to understand with reference to the following description, which can be seen in conjunction with examples in the accompanying drawings. These show: Fig. 1. A diagram with examples of layered structures; Fig. 2 a graph of stress versus strain; Fig. 3 a graph of force versus displacement for FR4 samples; Fig. 4 a series of graphs for mechanical properties of display glass; Fig. 5. A split view of an example of an electronic device; Fig. 6. A split view of an example of an electronic device; Fig. 7 a series of views of examples of electronic devices comprising at least one structural layer; Fig.8 a series of views of an example of an electronic device comprising a structural layer; Fig. 9 a series of views of an example of a circuit structure comprising a structural layer; Fig. 10 a series of views of the circuit structure in relation to covers, forming an example of an electronic device; Fig. 11 a perspective view and a cross-sectional view of the electronic device from Fig. 10; Fig. 12 a series of views of an example of a circuit structure comprising a structural layer and at least one support for mounting a component; Fig. 13 a series of views of examples of structural layers; Fig. 14 a diagram with examples of devices; and Fig. 15 a diagram of an example of a system comprising one or more processors. DETAILED DESCRIPTION

[0010] The following description encompasses the best currently considered method for implementing the described features in practice. This description is not intended to be restrictive, but rather serves only to describe general principles of various implementations. The scope of the invention is to be determined with reference to the granted claims.

[0011] FR4 is a grade designation assigned to glass fiber reinforced epoxy laminates used as a substrate in printed circuit boards (PCBs). FR4 is a composite material consisting of woven glass fiber fabric with an epoxy resin binder that is flame-retardant (self-extinguishing), hence the abbreviation "FR," which stands for "flame retardant." FR4 is a heat-cured material of a plastic laminate quality with electrically insulating properties. FR4 was created by NEMA in 1968 from its constituent materials (epoxy resin, woven glass fiber reinforcement, brominated flame retardant, etc.). Other grade designations for glass-epoxy laminates include: G10, G11, FR5, and FR6.Table 1 below lists various parameters and values ​​for FR4, where the abbreviations LW (longitudinal, warp direction) and CW (transverse, weft direction) refer to the perpendicular fiber orientations in the XY plane of a plate (in the plane). In Cartesian terms, longitudinal can run along the X-axis and transverse can run along the Y-axis, with the Z-axis representing a direction through the plane (e.g., thickness). Table 1. FR4 sample data parameter Value Specific density 1.850 g / cm 3 (3.118 lb / cu yd) Water absorption -0.125 in < 0.10 % Temperature index 140 °C (284 °F) Thermal conductivity across the plane 0.29 W / (m·K), 0.343 W / (m·K) Thermal conductivity, in the plane 0.81 W / (m·K), 1.059 W / (m·K) Rockwell hardness 110 Scale M Adhesive strength > 1000 kg (2200 lb) Flexural strength (A; 0.125 in)- LW > 415 MPa (60200 psi) Flexural strength (A; 0.125 in)- CW > 345 MPa (50000 psi) Carbon copy (A) > 50 kV Punch (D48 / 50) > 50 kV Dielectric strength 20 MV / m Relative dielectric constant (A) 4,8 Relative dielectric constant (D24 / 23) 4,8 Loss factor (A) 0,017 Loss factor (D24 / 23) 0,018 dielectric constant 4.70 max., 4.35 at 500 MHz, 4.34 at 1 GHz Glass transition temperature > 100 °C E-module - LW 3,5×10 6 psi (24 GPa) E-module - CW 3,0×10 6 psi (21 GPa) Coefficient of thermal expansion - X-axis 1,4 ×10 -5 K -1 Coefficient of thermal expansion - Y-axis 1,2×10 -5 K -1 Coefficient of thermal expansion - Z-axis 7,0×10 -5 K -1 Cross number - LW 0,136 Cross number - CW 0,118 LW Speed ​​of sound 3602 m / s SW Speed ​​of sound 3369 m / s LW Acoustic Impedance 6.64 MRayl

[0012] FR4 thickness can be specified in thousandths, inches, micrometers, or millimeters. For example, FR4 thicknesses can range from approximately 10 thousandths (0.010 inches, 254 micrometers) to approximately 3 inches (76 mm).

[0013] Fig. Figure 1 shows examples of the layer structures 101 and 103, wherein each of the layer structures 101 and 103 comprises at least one printed circuit board (PCB) 110-1 to 110-N and at least one structural plate 130.

[0014] As an example, a structural panel can be or comprise a material that has one or more characteristics (e.g., material properties) that exceed one or more of the characteristics of FR4. Consider, for example, a material characterized by a modulus of elasticity (e.g., Young's modulus) greater than approximately 50 GPa. For instance, a material can be selected from those listed in Table 2 where the Young's modulus in GPa is greater than approximately 100 GPa, or, for example, greater than approximately 140 GPa, or, for example, greater than approximately 179 GPa, or, for example, greater than approximately 193 GPa. Table 2. Unalloyed carbon and low-alloy steel types metal E (GPa) Steel alloy A36 207 Steel alloy 1020 207 Steel alloy 1040 207 Steel alloy 4140 207 Steel alloy 4340 207 Stainless steel types alloy 304 193 Alloy 316 193 Alloy 405 200 Alloy 440A 200 Alloy 17-7PH 204 Other Nickel 200 204 Inconel 625 207 Monel 400 180 Haynes alloy 25 236 Invar 141 Super Invar 144 Kovar 207 Chemically pure lead 13,5 Antimony lead (6%) 44,3 Tin (technically pure) 30 Lead-tin solder (60Sn - 40Pb) 104,5 Zinc (technically pure) 99,3

[0015] Regarding the flexural strength of FR4, the International Electrotechnical Commission (IEC) specifies 340 MPa LW and 170 MPa CW. Values ​​for commercially available materials can range from approximately 450 MPa to approximately 550 MPa LW and roughly proportionally lower CW.

[0016] For example, a structural layer material can be a carbon-based material such as carbon fiber. Carbon fiber can be used to form a structural layer with a flexural strength greater than approximately 1 GPa. A structural layer containing carbon fiber can be directional or structured to be relatively homogeneous (e.g., more than two orientations). Carbon fibers can have lengths that are smaller than the width or length of a structural layer (e.g., a composite material with short lengths of randomly or otherwise oriented carbon fibers).

[0017] As an example, a material of a structural layer may include a titanium (Ti) alloy, which may be formed to exhibit a flexural strength of more than about 1 GPa.

[0018] As an example, a material of a structural layer can have a tensile strength of more than approximately 50 × 10 9 encompass Pa in its highest direction.

[0019] As an example, for a homogeneous material, the flexural strength value can be approximately the same as the tensile strength value. As another example, a material can be used as a structural layer where the material is essentially homogeneous in the plane directions of the structural layer (e.g., compared to FR4, which, as in Fig.Figure 3 shows that it is inhomogeneous in the plane direction. As an example, a structural layer that is essentially homogeneous (for example, a metal, an alloy, random fibers, etc.) may be more suitable for quality control testing when such a structural layer is used in an electronic device. In such an example, the electronic device can be used by a user with greater confidence regarding the stresses that the electronic device can handle with minimal risk of damage; whereas for a material such as FR4, the maximum stress may depend on the orientation of the fibers, and the type of damage may depend on the arrangement of the circuits, components, etc., relative to the orientation of the fibers.

[0020] For example, if a warning is included in a manual, marketing materials, etc., the use of a structural layer whose quality can be tested with greater certainty for possible, foreseeable stress conditions than a material such as FR4 may be advantageous for an end user, a manufacturer, an insurer, an insured, etc.

[0021] As an example, a structural layer thicker than FR4 can be used as a substrate for a circuit board based on FR4. In such an example, the structural layer can help ensure that the displacement (e.g., bending) of the FR4 under load is minimized, since the load can be absorbed (e.g., transferred) to the structural layer. Furthermore, as mentioned, such a solution can help minimize unknowns, such as the orientation of the load relative to the fiber orientation in the FR4, especially if the structural layer is more homogeneous than FR4 (e.g., with respect to its structure and associated mechanical properties, etc.).

[0022] For example, a device can include a structural layer, such as a structural plate. Such a layer can be integrated into a device as the core for the device's working components (e.g., electronic devices, PC circuit boards, batteries, displays, etc.). For example, a structural layer (e.g., a matrix, a grid, a laminate, etc.) can comprise one or more rigid materials. For example, a structural layer can be layered in one or more layers of one or more circuit boards, for example, on one or more surfaces. For example, wires to one or more peripheral connectors, sensors, etc., can pass through holes, channels, grooves, etc., in a structural layer and / or exit one or more edges.

[0023] For example, a device may include one or more covers made of structural materials, attached (e.g., directly) to a structural layer. In such an example, one or more covers may serve to keep out dust, protect component surfaces, reduce shocks, and / or improve appearance and / or ergonomics. For instance, an external cover may be metallized to act as a Faraday cage around various electronic components (e.g., components, circuits, etc.).

[0024] Fig.Figure 2 shows a stress-strain curve (Figure 200) illustrating the flow behavior of a characteristic curve for non-ferrous alloys. Stress σ is defined as force per unit area and plotted as a function of strain ε, which is defined as an incremental change in a value of one dimension relative to an initial value for that dimension. The points labeled in Figure 200 include: 1 the true yield strength, 2 the proportional limit, 3 the elastic limit, and 4 the proof strength. The directional coefficient in Figure 200 is labeled E, which represents the Young's modulus (or modulus of elasticity) of the tested material.

[0025] Regarding the limit of proportionality (point 2), up to this stress level, the stress tends to be proportional to the strain (see, for example, Hooke's Law). Thus, data can be fitted using a linear model if the direction coefficient of the stress-strain data is an estimate of the material's modulus of elasticity. Regarding the elastic limit (point 3), this is referred to as the yield strength, where permanent deformation occurs beyond the yield strength. The elastic limit is therefore the lowest stress at which permanent deformation can be measured. Precise strain measurements have shown that plastic strain can begin at low stresses. Some metals, such as soft unalloyed steel, reach an upper yield strength before rapidly dropping below a lower yield strength.The material behavior tends to be linear up to the upper yield strength, however, the lower yield strength is used as a cautious value in civil engineering.

[0026] The material can be characterized by the use of one or more of various testing methods. For example, one can use a machine marketed under the INSTRON™ brand (Norwood, Massachusetts), such a machine being designed to evaluate the mechanical properties of materials and components.

[0027] One test is known as the three-point bending test or three-point strain test, which determines the values ​​for the modulus of elasticity during bending E. f , the bending stress σ f , the bending strain ε f , and can provide the bending stress-strain behavior of the material.

[0028] Fig.Figure 3 shows a graph 300 of force versus displacement for FR4 specimens using the 3-point strain test for flexural strength, flexural strain, and modulus of elasticity. Specifically, graph 300 shows the load as a function of displacement and orientation for three FR4 material specimens with a low Tg (glass transition temperature), each specimen having a thickness of approximately 1.6 mm and a width of approximately 12 mm to approximately 16 mm. The flexural strength and flexural strain can be calculated based on the failure load, the specimen geometry, and the boundary conditions provided by the 3-point strain test. The modulus of elasticity can be calculated based on the linear portion of the graph. For a material with a low Tg and a high Tg, the warp orientation exhibits the highest values.The failure load can be quite dependent on minor defects that cause high stress concentrations, and thus it can be problematic to assess the flexural strength and elongation, which may argue against the use of FR4 as a structural material. In Figure 300, the 45-degree orientation is more compliant than the warp and weft directions, as shown by the shape of the force-displacement curve. As a result, the specimens with a 45-degree orientation yielded and did not fail under the forces and displacements shown in Figure 300.

[0029] As mentioned, FR4 can be problematic to assess with regard to its material properties, for example, due to its dependence on factors such as small defects that can occur in localized regions of high stress concentration. Furthermore, as shown in Figure 300, some properties can be quite dependent on the applied force relative to the warp, weft, and non-warp or non-weft orientations of the FR4. Although FR4 exhibits certain properties that make it suitable for use in printed circuit boards, it also displays characteristics that can lead to quality control and / or performance issues (e.g., due to defects, orientation, etc.).

[0030] For the approximately 1.6 mm thick FR4 samples, flexural strength values ​​were estimated, and it turned out that these were less than about 700 MPa, and the modulus of elasticity was less than about 25000 MPa (e.g. 25 GPa) (see e.g. Haugen et al., “Characterization of the material properties of two FR4 circuit board laminates”, Norwegian Defence Research Establishment (FFI), January 2014 (FFI Report 2013 / 01956), which is hereby adopted for reference).

[0031] As shown in graphic 300 Fig.As shown in Figure 3, the 1.6 mm thick FR4 samples could withstand a maximum force of approximately 250 N (e.g., a force of about 25 kg or approximately 56 lbs) in the warp direction using the 3-point test. Consider, for example, a pocket-sized computer, tablet, etc., where a person weighing approximately 70 kg might accidentally sit on it. If the device were supported by a 1.6 mm thick layer of FR4, as shown in Figure 300, it would likely be damaged. Furthermore, the extent and / or nature of the damage may depend on factors such as minor defects in the FR4, the orientation of the warp and weft, etc.

[0032] As shown in graphic 300 Fig.As shown in Figure 3, a displacement of approximately 1 mm occurs at approximately 50 N (e.g., a force of approximately 5 kg or approximately 11 pounds), and such a degree of displacement may be sufficient to disrupt and / or damage one or more features of a PCB based on FR4 as a structural support layer.

[0033] For example, a device might incorporate glass, such as GORILLA™ glass (Corning, Corning, New York). Another type of glass could be XENSATION™ glass (Schott, Louisville, Kentucky), which can exhibit a strength of approximately 800 MPa or more in a 4-point bending test and is available in thicknesses from approximately 0.5 mm to approximately 3 mm.

[0034] Fig.Figure 4 shows graphs 410 and 430 for GORILLA™ glass, where graph 410 shows the critical load in grams, which for the sample of GORILLA™ glass 3 is about 14000 (14 kg), and where graph 430 shows the breaking load, which increases with thickness, noting that a 1 mm thick sample has a breaking load of about 120 kgf; whereas the soda-lime glass, which has a thickness of about 1 mm, has a breaking load of about 20 kgf.

[0035] According to the data from Fig. 3 and Fig. 4. An FR4 layer and / or a type of glass may be damaged, whereby such damage may be damage to the circuits of an FR4 printed circuit board and / or damage to the glass (e.g. cracking, breaking, etc.).

[0036] As an example, a computer device might include an internal structural layer that serves as the primary support structure for the device. In such an example, the structural layer might include one PCB coupled to one side and, for instance, another PCB coupled to the opposite side. These examples could include one or more PCBs, such as one or more FR4-based PCBs or one or more non-FR4-based PCBs. Regarding the latter, the structural layer might optionally allow the use of a thinner, lighter, and so on PCB. Consider, for example, a film-based PCB where layers of film can contain circuits, etc.

[0037] As an example, a device comprising an array of layers, including a structural layer, may include a capsule attached to the structural layer, where the capsule may be, for example, a thin layer of material. For instance, the capsule may be formed as a heat-cured or thermoplastic layer that is cured or hardened in place. For example, a subassembly may be placed in a mold into which a heat-cured and / or thermoplastic material is inserted and then cured.

[0038] Fig.Figure 5 shows an example of a device 500 comprising an LCD assembly 501, a camera assembly 502, a fan assembly 503, a circuit board 504 (e.g., a circuit board, a system board, a mainboard, etc.), a wireless WAN card 505, a wireless LAN card 506, an I / O board 507, a cover assembly 508, a DC cable assembly 509, a communication card 510, a solid-state drive 511, a battery pack 513, a stylus 514, and a structural layer 550, wherein the circuit board 504 and / or one or more other components may be physically coupled to the structural layer 550 (e.g., to form a layer structure, such as layer structure 101 or layer structure 103). Fig. 1, to form). In the example from Fig.5. The 504 board can include a processor and memory, which can be configured to store instructions that the processor can access and which can be executed by the processor to perform one or more operations.

[0039] Fig. Figure 6 shows an example of a device 600. For example, device 600 can be operationally coupled to device 600. In the example from Fig. 6 The device 600 comprises a cover and hinge assembly 601, a connecting structure 602, a fan assembly 603, a keypad assembly 604, a battery block 605, a base cover 606, an I / O board 607, a hinge assembly 608, connecting pieces 609, a connecting piece cover 610 and a structural layer 650, wherein the components can be physically coupled to the structural layer 650 (e.g. to form a layer structure, such as layer structure 101 or layer structure 103). Fig.1, to form) .

[0040] Fig. Figure 7 shows the exemplary assemblies 710 and 750, which include the layer structures 715 and 755, which, for example, are layer structures such as layer structure 101 or layer structure 103. Fig. 1. can be. In the examples from Fig. In example 7, the layer structure 715 can support one or more components, and the layer structure 755 can support one or more components. In these examples, a structural layer of the layer structure 715 can be the main structural support for a device, which may, for example, be the support for a capsule 717, and a structural layer of the layer structure 755 can be the main structural support for a device, which may, for example, be a support for a capsule 757.

[0041] Fig.Figure 8 shows an example of a device 800, which can comprise a structural layer 815 that is part of a circuit structure 825, wherein the circuit structure 825 can optionally be embedded in a polymer material 835 or optionally in a polymer composite material, and wherein the device 800 can optionally comprise a display 840 that can be covered with glass. As in the example from Fig.As shown in Figure 8, various types of graphical user interfaces can be displayed on the Display 840 of the Device 800. For example, the Device 800 can include mobile communication circuits, internet communication circuits, camera and / or video circuits, etc. For example, the Device 800 can include processor-executable instructions stored in a processor-readable memory medium that is not a carrier wave, is not a signal, and is non-transient. In such an example, the instructions can be application instructions that instruct the Device 800 to display information on the Display 840. If the Display 840 is a touchscreen display, a user can touch the Display 840, so that the Device 800 receives the touch(s) as input via sensors on the touchscreen display, and one or more commands can be generated as sensor-based output.

[0042] Fig. Figure 9 shows an example of a circuit structure 925, which is formed from a plurality of circuit boards 910-1 and 910-2 and a structural layer 915. As shown, the structural layer 915 can include connectors 916 and / or openings 917. As an example, the circuit board 910-1 and / or the circuit board 910-2 can include the openings 911-1 and 911-2, and these can contain the components 912-1 and 912-2 (e.g., chips or other electrical components, etc.). In the example from Fig.In Figure 9, the circuit board 910-1 is connected to one side of the structural layer 915, and the circuit board 910-2 is connected to the opposite side of the structural layer 915. As shown, the connecting elements 916 can be accessible to connect, for example, one or more components to the structural layer 915. In such an arrangement, the connections can be direct or indirect. For example, the connecting elements 916 can be extensions of the material of the structural layer 915 and / or terminals connected to the structural layer 915. In both cases, the connecting elements 916 are structurally part of the structural layer 915 or are coupled to it.

[0043] Fig.Figure 10 shows a cover or capsule 952 and a cover or capsule 954, wherein the capsule 952 and the capsule 954 can be connected to the structural layer 915 of the circuit structure 925, for example, via the connectors 916. As an example, the cover or capsule 952 can include a display 953 (e.g., display glass, etc.). As an example, the cover or capsule 952 can include the couplings 956, and the cover or capsule 954 can include the couplings 958. In such an example, the couplings 956 and 958 can be used to couple the capsule 952 and the capsule 954 to the structural layer 915, for example, via the connectors 916. As in Fig. As shown in Figure 9, the various parts can be assembled to form a Device 900.

[0044] Fig.Figure 11 shows an example of the device 900 along with a cross-sectional view. As shown, the circuit structure 925 comprises the structural layer 915, which is used to support circuits, and the covers or capsules 952 and 954.

[0045] In an assembly process, the device 900 is assembled using a subassembly, shown as circuit structure 925, which includes the structural layer. As an example, such a circuit structure can be provided as a completed subassembly from a production line. In such an example, a device can be completed by attaching one or more components to the circuit structure (e.g., subassembly) and / or by encapsulating at least part of the circuit structure in a polymer material (e.g., optionally a polymer composite material).

[0046] Fig.Figure 12 shows an example of a component 1205 that can be attached to a circuit structure 1225 comprising a structural layer 1215 arranged between a plurality of circuit boards 1210-1 to 1210-N. As in the example from Fig. As shown in Figure 12, component 1205 can comprise one or more supports 1207-1 and 1207-2, and circuit structure 1225 can comprise one or more corresponding supports 1217-1 and 1217-2. For example, component 1205 can be structurally coupled to structure layer 1215 via supports 1207-1 and 1217-1 and / or supports 1207-2 and 1217-2.

[0047] Fig.Figure 13 shows an example of a structural layer 1315 comprising cells. Consider, for example, a honeycomb cell structure. Such a cell structure can impart desirable physical properties. For example, the cells can increase the flexural strength of the structural layer 1315. As an example, the cells can allow the passage of wires, connectors, etc. As an example, the cells can create air spaces.

[0048] For example, cell walls can include openings that allow airflow. In the example from Fig.Figure 13 shows the structural layer 1315 with optional exemplary openings 1317 as dotted lines. As an example, these openings can be direction-dependent. For instance, if a device is to be oriented in a direction relative to gravity, it may experience buoyancy in the convection airflow in a direction opposite to that of gravity. Consider, for example, a tablet device that includes a stand which can orient the tablet device at an angle of approximately 45 degrees to approximately 90 degrees. In such an example, where a structural layer includes openings, passages, etc., the air can heat up due to the operation of the device, with the heated air becoming less dense and flowing upwards through the openings, passages, etc. In such an example, the structural layer can be a heat transfer layer, which can be passive. As an example, a device can be a ventilation unit (e.g.,a blower) wherein the ventilation device promotes the flow through a structural layer (e.g. optionally directionally dependent, etc.).

[0049] As an example, the structural layer 1315 can be at least partially covered with an adhesive 1320, which can be an adhesive for an outer skin material 1330. Consider, for example, a structural layer made of metal or metal alloy with cells, where an adhesive is applied to bond an outer skin material to the structural layer. For example, an adhesive can be used to bond a circuit board to the structural layer (e.g., indirectly by means of the adhesive).

[0050] As an example, a structural layer can be a conductor made of an electrically conductive material, and / or it can comprise one or more outer skin materials, which are also electrically conductive. In these examples, the structural layer and / or its outer skin can serve as a ground plane. In printed circuit boards, a ground plane can be a large area of ​​copper foil on the board that is connected to the power supply ground terminal and serves as a return path for current from various components on the board.

[0051] As an example, a structural layer can comprise a foam layer and one or more outer skin layers. Jan et al., “Flexural strength of honey comb sandwich structures,” Int. Journal of Applied Sciences and Engineering Research, Vol. 4, Issue 1, 2015, present data for a honeycomb core material made of aluminum (e.g., as a foam layer) and glass fiber face sheets (e.g., as outer skin layers) with a total thickness of approximately 14 mm (13 mm core and 0.5 mm per face sheet). Test specimens with a length of 200 mm and a width of 28 mm were subjected to a 3-point test. The results showed a maximum load of 0.92 kN (920 N) with a deflection of approximately 0.7 mm, with core curvature occurring upon failure.

[0052] Table 3 shows some example elastic modulus data for aluminium, which can be compared with the data in Table 2. Table 3. Example data for aluminum metal GPa Aluminum alloy 1100 69 Aluminum alloy 2024 72,4 Aluminium alloy 6061 69 Aluminium alloy 7075 71 Aluminum alloy 356.0 72,4

[0053] As an example, a structural layer can comprise a material stronger than aluminum (see, for example, one or more materials in Table 2, etc.), such that the material can be formed as a foam layer, with one or more outer skin layers attached to the foam layer. In such an example, the maximum load can exceed 920 N, and the deflection can be less than approximately 1 mm. As an example, a structural layer can have a thickness of less than approximately 15 mm, or, for example, less than approximately 10 mm, or, for example, less than approximately 5 mm. As an example, a structural layer can withstand a force of 250 N or more in a 3-point test, with the displacement at approximately 250 N being less than approximately 4 mm, or, for example, less than approximately 2 mm, or, for example, less than approximately 1 mm.

[0054] Fig.Figure 14 shows some examples of devices 1400 that include components. For example, one or more of the devices 1400 can be powered by one or more lithium-ion cells (e.g., in the form of one or more lithium-ion batteries). For example, a mobile phone, a tablet, a camera, a GPS device, a notebook computer, or another device can be powered by one or more lithium-ion cells. A device can be a motor vehicle, a toy, a remote-controlled device (e.g., bomb detectors, drones, etc.), etc. A device can include one or more processors 1402, memory 1404, one or more network interfaces 1406, one or more displays 1408, and, as a power source, for example, one or more lithium-ion cells 1410.

[0055] As an example, a device 1411 can comprise a circuit structure 1425, which includes a structural layer and the interconnects 1416-1 and 1416-2, a display 1440 (e.g., with display glass), and one or more energy cells 1480. In such an example, the thickness of the device 1411 can be largely determined by the thickness of the energy cells 1460. As an example, a structural layer can comprise an opening, wherein one or more energy cells are at least partially arranged in the opening. In such an example, the thickness can be reduced compared to an example in which the energy cell(s) are arranged on one side or the other side of the structural layer.

[0056] According to the invention, a device comprises a structural layer containing graphene; a first glass fiber reinforced epoxy board mounted on one side of the structural board; a second glass fiber reinforced epoxy board mounted on an opposite side of the structural board; components, wherein the components comprise a processor, a memory operationally coupled to the processor, and a display operationally coupled to the processor; and a housing material supported by the structural layer.

[0057] As an example, a structural layer can comprise at least one transition metal. For instance, a structural layer can comprise one or more metals, which may be in the form of a metallic material, such as a relatively pure metal material or as an alloy (e.g., an alloying material).

[0058] As an example, a structural layer can comprise cells, such as the cells of a foam. In such an example, the foam can be a metal, an alloy, or a composite material. As an example, the cells can comprise wall openings. For instance, a wall defining a cell can have one or more openings. As an example, a hexagonal cell can have six walls, where one or more of the walls can have one or more openings.

[0059] As an example, a device may comprise a structural layer; a first glass-fiber-reinforced epoxy board mounted on one side of the structural board; a second glass-fiber-reinforced epoxy board mounted on an opposite side of the structural board; components, wherein the components include a processor, memory operationally coupled to the processor, and a display operationally coupled to the processor; and an enclosure material supported by the structural layer. In such an example, the structural layer may have a modulus of elasticity greater than approximately 50 GPa. As an example, an enclosure material may be or comprise a polymer material. As an example, such a polymer material may be bonded to a structural layer. As an example, the enclosure material may be or form a capsule associated with a structural layer.

[0060] As an example, a device may comprise a structural layer; a first glass-fiber-reinforced epoxy board mounted on one side of the structural layer; a second glass-fiber-reinforced epoxy board mounted on an opposite side of the structural layer; components, wherein the components include a processor, memory operationally coupled to the processor, and a display operationally coupled to the processor; and an enclosure material supported by the structural layer. In such an example, the device may have a maximum thickness of less than approximately 10 mm. For instance, such a device may be substantially rectangular, defined by the length and width of a rectangle, with a thickness between opposite sides of less than approximately 10 mm.

[0061] As an example, a structural layer in a device can be or comprise a ground plane. As an example, a structural layer can comprise at least one support pin, where, for instance, a device can comprise a component connected to a support pin, the support pin being connected to the structural layer. As an example, one or more support pins can be used to transfer one or more loads applied to a capsule, an outer surface, etc., to a structural layer. For example, if a capsule is attached to a structural layer via support pins, a force applied to the capsule can be transferred to the structural layer in such a way that it does not directly transmit the load to a printed circuit board (PCB) that may be coupled to the structural layer.In such an example, the structural layer can be used as a structural core that can bear and withstand loads exerted on the surface of an electronic device, with a reduced risk of damage to the circuits of a printed circuit board (PCB), since it can include FR4 as a substrate.

[0062] For example, a device can include a display glass, wherein the display glass forms at least part of a first side of the device, and wherein the enclosure material forms at least part of a second, opposite side of the device. For example, a structural layer can be coupled to a capsule of an electronic device that includes a display glass, wherein a force can be transferred from the capsule to the structural layer, which can help reduce the risk of damage to the display glass. For example, a structural layer can be used as a support for a display glass, for example in a stacked orientation, wherein the display glass and a display are stacked on the structural layer (e.g., with little to no space between the display glass, the display, and a surface of the structural layer).In such an example, a force applied to the display glass can be transferred to the structural layer, which can help prevent displacement, bending, etc., of the display glass and / or the display. In such an example, the display may include printed circuits or other types of display circuitry (e.g., electrodes, etc.) that may be mounted on an FR4 or other substrate. In such an example, the display may be mounted on one side of the structural layer, and another circuit board may be mounted on the other side of the structural layer.

[0063] For example, a device might include a lithium-ion battery mounted on a structural layer. For example, a structural layer can help protect a lithium-ion battery from a force exerted on an electronic device. For instance, a lithium-ion battery might be positioned between a structural layer and a capsule, with support pins or other supports transferring a force exerted on the capsule to the structural layer, thus protecting the lithium-ion battery from the force. For example, a lithium-ion battery could be a pouch-type battery (e.g., with a flexible layered pouch) or it could be of a different type.

[0064] As an example, a device may comprise a structural layer; a first circuit board mounted on one side of the structural layer; a second circuit board mounted on the opposite side of the structural layer; components, wherein the components include a processor, memory operationally coupled to the processor, and a display operationally coupled to the processor; and an enclosure material supported by the structural layer. In such an example, the device may be one or more of a tablet and a smartphone. As an example, the device may be at least one part of a clamshell computer. For instance, such a device may be part of a clamshell laptop computer.

[0065] As an example, a method may involve building a structural matrix into the core of working parts of an electronic device, such as one or more printed circuit boards, one or more batteries, or one or more display screens. As an example, a structural lattice may consist of a relatively rigid material that can be laminated with one or more other layers, which may be an inner layer or a surface layer of a layered structure. As an example, a layered structure assembly may include wires connected to one or more peripheral terminals and / or one or more sensors, wherein these wires may pass through one or more holes in a lattice of a layered structure assembly and / or exit at one or more edges of a layered structure assembly.

[0066] As an example, a device cover can consist of one or more materials attached to a structural layer, which is a rigid circuit board structure. In such an example, the cover may aim to keep out dust, provide a certain degree of impact resistance, enhance the appearance of the device, and / or provide ergonomic benefits (e.g., grip, tactile feel, etc.).

[0067] For example, a device may include an external cover, which may be metallized. In such a case, the cover may act as a Faraday cage around various electronic components. For example, a cover may be partially metallized and partially transparent to a specific range of electromagnetic energy, such as that associated with wireless communication circuitry. For example, a cover may include one or more solid metal sections and / or one or more mesh-like metal sections.

[0068] The term “circuit” or “circuits” may be used in the abstract, description, and / or claims. As is well known in the engineering, the term “circuits” encompasses all levels of available integration, e.g., from discrete logic circuits to the highest level of circuit integration, such as VLSI, and includes programmable logic devices programmed to perform the functions of an embodiment, as well as general-purpose or specific processors programmed with instructions to perform these functions. These circuits may optionally be based on one or more computer-readable media comprising computer-executable instructions. As described herein, a computer-readable medium may be a storage device (e.g., a memory card, a storage disk, etc.) and may be referred to as a computer-readable storage medium.For example, a computer-readable medium can be a computer-readable medium that is not a carrier wave.

[0069] Although various examples of circuits or switching systems have been discussed, it forms Fig. Figure 15 shows a block diagram of an explanatory computer system 1500. The system 1500 can be a desktop computer system, such as one of the ThinkCentre PC series. ® or ThinkPad ® , sold by Lenovo (US) Inc. of Morrisville, NC, or a workstation computer, such as a ThinkStation ® , sold by Lenovo (US) Inc. of Morrisville, NC; however, as is evident from the present description, a satellite, base station, server, or other machine may include other features or only some of the features of the System 1500. As described herein, a device such as one of the Devices 1400 from Fig. 14, include at least some of the features of System 1500.

[0070] As in Fig. As shown in Figure 15, the System 1500 includes a so-called chipset 1510. A chipset refers to a group of integrated circuits or chips designed to work together. Chipsets are usually marketed as individual products (see, for example, the chipsets sold under the Intel brand). ® , AMD ® etc. are marketed).

[0071] In the example from Fig. The 1510 chipset has a specific architecture, which can vary somewhat depending on the brand or manufacturer. The architecture of the 1510 chipset includes a core and memory control group 1520 and an I / O control node 1550, which exchange information (e.g., data, signals, commands, etc.) via, for example, a Direct Management Interface or Direct Media Interface (DMI) 1542 or a Link Controller 1544. In the example from Fig.15 The DMI 1542 is a chip-to-chip interface (occasionally referred to as a link between a "Northbridge" and a "Southbridge").

[0072] The core and memory control group 1520 comprises one or more processors 1522 (e.g., single-core or multi-core, etc.) and a memory control node 1526, which exchange information via a front-side bus (FSB) 1524. As described herein, various components of the core and memory control group 1520 can be integrated onto a single processor chip, for example, to create a chip that replaces the conventional "northbridge" architecture.

[0073] Memory control node 1526 interfaces with memory 1540. For example, memory control node 1526 can provide support for DDR SDRAM memory (e.g., DDR, DDR2, DDR3, etc.). Generally, memory 1540 is a type of main memory (RAM). It is often referred to as "system memory."

[0074] The memory control node 1526 may also include a low-voltage differential signaling (LVDS) interface 1532. The LVDS 1532 may be a so-called LVDS display interface (LDI) to support a display device 1592 (e.g., a CRT, a flat panel display, a projector, etc.). A block 1538 includes some examples of technologies that can be supported via the LVDS interface 1532 (e.g., serial digital video, HDMI / DVI, DisplayPort). The memory control node 1526 also includes one or more PCI Express (PCI-E) interfaces 1534, for example, to support discrete graphics 1536. Discrete graphics using a PCI-E interface has become an alternative solution to an accelerated graphics port (AGP). For example, the memory control node 1526 can include a 16-lane (x16) PCI-E slot for an external PCI-E-based graphics card.A system may include AGP or PCI-E for graphics support. As described herein, a display may be a sensor display (e.g., configured to receive input using a stylus, finger, etc.). As described herein, a sensor display may rely on resistive scanning, optical scanning, or some other type of scanning.

[0075] The I / O control node 1550 includes various interfaces. The example from Fig.15 includes a SATA interface 1551, one or more PCI-E interfaces 1552 (optionally one or more legacy PCI interfaces), one or more USB interfaces 1553, a LAN interface 1554 (more generally, a network interface), a general-purpose I / O (GPIO) interface 1555, a low-pin processor (LPC) interface 1570, a power management interface 1561, a clock interface 1562, an audio interface 1563 (e.g., for speakers 1594), a total cost of ownership (TCO) interface 1564, a system management bus interface (e.g., a serial multi-master computer bus interface) 1565, and a serial peripheral flash memory / controller interface (SPI flash) 1566, which in the example from Fig.The BIOS (1568) and boot code (1590) are included. Regarding network connectivity, the I / O control node (1550) can include integrated Gigabit Ethernet controller lines multiplexed with a PCI-E interface connector. Other network features can function independently of a PCI-E interface.

[0076] The interfaces of the I / O control node 150 can provide communication with various devices, networks, etc. For example, the SATA interface 1551 provides reading, writing, or reading and writing of information on one or more drives 1580, such as HDDs, SSDs, or a combination thereof. The I / O control node 1550 can also include an Advanced Host Controller Interface (AHCI) to support one or more drives 1580. The PCI-E interface 1552 enables wireless connections 1582 with devices, networks, etc. The USB interface 1553 provides input devices 1584, such as keyboards, one or more optical sensors, mice, and various other devices (e.g., microphones, cameras, telephones, storage devices, media playback devices, etc.). One or more other sensor types can optionally be based on the USB interface 1553 or another interface (e.g., PC, etc.).Regarding the microphones, the system can be configured as 1500. Fig. 15. Include hardware (e.g., a sound card) that is appropriately configured to receive sound (e.g., user voice, ambient noise, etc.).

[0077] In the example from Fig. Reference 15 to the LPC interface 1570 provides the use of one or more ASICs 1571, a Trusted Platform Module (TPM) 1572, a Super I / O 1573, a Firmware Node 1574, BIOS support 1575, and various types of memory 1576, such as ROM 1577, Flash 1578, and non-volatile RAM (NVRAM) 1579. With regard to the TPM 1572, this module can be in the form of a chip that can be used to authenticate software and hardware devices. For example, a TPM can be capable of performing platform authentication and can be used to verify that a system requesting access is the expected system.

[0078] Upon power-up, the System 1500 may be configured to execute the boot code 1590 for the BIOS 1568, which is stored in the SPI flash memory 1566, and subsequently processes data under the control of one or more operating systems and application software (such as those stored in system memory 1540). An operating system may be stored in any of several locations and may be accessible, for example, according to the instructions of the BIOS 1568. As described herein, a satellite, base station, server, or other machine may, in turn, have a smaller or larger number of features than the System 1500. Fig. The 1500 system is shown. Fig.Figure 15 shows how it optionally includes mobile phone circuits 1595, which may include GSM, CDMA, and similar types of circuits configured for coordinated operation with one or more of the other features of the System 1500. Also in Fig. Figure 15 shows battery circuits 1597 that can provide one or more features related to batteries, energy, etc. (e.g., optionally to control one or more other components of the system 1500). As an example, an SMBus can be connected via an LPC interface (see, for example, the LPC interface 1570), via an I 2 C interface (see, for example, the SM / I) 2 C-interface 1565) etc. operable. CONCLUSION

[0079] Although examples of methods, devices, systems, etc., have been described in terms specific to structural features and / or methodological actions, it is understood that the subject matter defined in the accompanying claims is not necessarily limited to the specific features or actions described. Rather, the specific features and actions are disclosed as examples of ways to implement the claimed methods, devices, systems, etc.

Claims

[1] Device that has the following features: a structural layer (130, 550, 650, 815, 915, 1215, 1315) that exhibits graphs; a first glass fiber reinforced epoxy board (110-1, 110-2, 910-1, 1210-1) mounted on one side of the structural layer (130, 550, 650, 815, 915, 1215, 1315); a second glass fiber reinforced epoxy board (110-N, 910-2, 1210-N) mounted on an opposite side of the structural layer (130, 550, 650, 815, 915, 1215, 1315); Components, wherein the components comprise a processor (1404, 1522), a memory (1402, 1540) operationally coupled to the processor (1404, 1522), and a display (840, 953, 1408, 1440, 1592) operationally coupled to the processor (1404, 1522); and a case material supported by the structural layer (130, 550, 650, 815, 915, 1215, 1315). [2] Device according to claim 1, wherein the structural layer (130, 550, 650, 815, 915, 1215, 1315) comprises at least one transition metal. [3] Device according to claim 1, wherein the structural layer comprises (130, 550, 650, 815, 915, 1215, 1315) cells. [4] Device according to claim 3, wherein the cells have wall openings. [5] Device according to claim 3, wherein the cells are hexagonal cells. [6] Device according to claim 1, wherein the structural layer (130, 550, 650, 815, 915, 1215, 1315) has a modulus of elasticity greater than approximately 50 GPa. [7] Device according to claim 1, wherein the housing material comprises a polymer material. [8] Device according to claim 7, wherein the polymer material is connected to the structural layer (130, 550, 650, 815, 915, 1215, 1315). [9] Device according to claim 1, wherein the housing material has a capsule which is connected to the structural layer (130, 550, 650, 815, 915, 1215, 1315). [10] Device according to claim 1, wherein the device has a thickness of less than approximately 10 mm. [11] Device according to claim 1, wherein the structural layer (130, 550, 650, 815, 915, 1215, 1315) has a mass area. [12] Device according to claim 1, wherein the structural layer (130, 550, 650, 815, 915, 1215, 1315) has at least one support pin. [13] Device according to claim 1, wherein the device has a component connected to a support pin, the support pin being connected to the structural layer (130, 550, 650, 815, 915, 1215, 1315). [14] Device according to claim 1, wherein the device has a display glass, wherein the display glass forms at least a partial first side of the device, and wherein the housing material forms at least a partial second, opposite side of the device. [15] Device according to claim 1, wherein the device has a lithium-ion battery mounted on the structural layer. [16] Device according to claim 1, wherein the device is a tablet. [17] Device according to claim 1, wherein the device is a smartphone. [18] Device according to claim 1, wherein the device is at least a part of a clamshell computer.

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