Circuit arrangement for controlling a power semiconductor device with two circuit carriers and a plastic molded body and arrangement therewith

Abstract

Circuit arrangement (1) for controlling a power semiconductor device (7) with a first circuit carrier (2) and with a second circuit carrier (3) arranged parallel to and at a distance from the first, and with a plastic molded body (4) arranged in an intermediate space (5) between the first and second circuit carriers (2, 3), wherein the first circuit carrier (2) has a first conductor track (22) with a first contact point (24), which is arranged on a main side (200) of the first circuit carrier (2) facing the plastic molded body (4), wherein the second circuit carrier (3) has a second conductor track (32) with a second contact point (34), which is arranged on a main side (300) of the second circuit carrier (3) facing the plastic molded body (4), wherein the plastic molded body (4) has a first receptacle (42) for a first component (6) with a first and a second contact device (64) designed as a press-fit contact.68) and wherein the first contact device (64) is electrically conductively connected to the first contact point (24) and the second contact device (68) is electrically conductively connected to the second contact point (34), wherein the plastic molded body (4) rests on the first circuit carrier (2) with first contact surfaces (402) and wherein the plastic molded body (4) rests on the second circuit carrier (3) with second contact surfaces (404), whereby a structural unit is formed from the two circuit carriers (2, 3) and the plastic molded body (4).

Description

[0001] The invention describes a circuit arrangement for controlling a power semiconductor device having a first circuit carrier and a second circuit carrier. The invention also describes an arrangement having such a circuit arrangement.

[0002] It is generally known prior art to electrically connect two circuit carriers, in particular two circuit boards arranged parallel to each other, by means of connectors.

[0003] US 2010 / 0 008 056 A1 discloses a stereoscopically connected structure consisting of a first circuit board and a second circuit board equipped with electronic components, and a relay board with a recess, which is equipped with an electronic component and is provided with a lead connecting the electronic component to a connection point connected to a conductor track on one of the surfaces of the first or second circuit board. Thus, the electronic component can be arranged on the relay board and also connect the first and second circuit boards, thereby achieving an overall arrangement with a high packing density.

[0004] DE 10 2013 104 237 A1 discloses a circuit arrangement with a first and a second circuit carrier, wherein said circuit arrangement has a transformer arranged between the first and second circuit carriers, which transformer is designed for the electrically potential-separated transmission of a signal, wherein the transformer has electrically conductive first and second spring elements arranged on a first side facing the first circuit carrier and electrically conductive third and fourth spring elements arranged on a second side facing the second circuit carrier, wherein the transformer is connected to the first and second circuit carrier in an electrically conductive and mechanically oscillatable manner by means of the first, second, third and fourth spring elements.This creates a vibration-resistant circuit arrangement with a first and a second circuit carrier and a transformer, which has a small space requirement and in which the transformer is reliably electrically connected to the first and the second circuit carrier.

[0005] US 4,661,792 A discloses a transformer with a coil former suitable for mounting a secondary circuit board on a primary circuit board. Means are provided for electrically connecting the primary and secondary circuit boards to each other and to the transformer.

[0006] US 5 004 974 A discloses a current measuring device for measuring a current flowing in a primary conductor. The primary conductor is coupled to a magnetic circuit, and a device for measuring the magnetic flux in this circuit is provided. The primary conductor consists of U-shaped sections arranged in a rider-like manner over the magnetic circuit and connected by their pin-shaped ends to a printed circuit. The printed circuit contains conductor elements arranged to interconnect certain of the pins and, together with the U-shaped sections, form a primary winding with the desired number of turns.

[0007] In view of the state of the art, the invention is based on the object of presenting a circuit arrangement and an arrangement therewith, wherein various components can be arranged particularly advantageously in terms of space and circuitry.

[0008] This object is achieved according to the invention by a circuit arrangement having the features of claim 1, as well as by an arrangement having the features of claim 7. Preferred embodiments are described in the respective dependent claims.

[0009] The circuit arrangement according to the invention for controlling a power semiconductor device with a first circuit carrier and with a second circuit carrier arranged parallel to and at a distance from the first and with a plastic molded body arranged in a space between the first and second circuit carriers, wherein the first circuit carrier has a first conductor track with a first contact point, which can be designed in particular as a contact surface or as a contact recess, which is arranged on a main side of the first circuit carrier facing the plastic molded body, wherein the second circuit carrier has a second conductor track with a second contact point, which is arranged on a main side of the second circuit carrier facing the plastic molded body,The plastic molded body has a first receptacle for a first component with a first and a second contact device, and the first contact device is electrically connected to the first contact point and the second contact device is electrically connected to the second contact point. The plastic molded body rests on the first circuit carrier with first contact surfaces, and the plastic molded body rests on the second circuit carrier with second contact surfaces, thereby forming a structural unit from the two circuit boards and the plastic molded body. This connection, or more precisely the contact device, is formed by means of press-fit contacts.

[0010] Preferably, the first receptacle containing the first component is filled with an electrically insulating potting compound. It is usually sufficient for the component to be completely covered, meaning the receptacle is not necessarily filled to the brim. The potting compound can also be designed to dissipate heat generated in the component as efficiently as possible.

[0011] It can often be preferred if the first component has at least one further first and one further second contact device, the first circuit carrier has at least one further first contact point, the second circuit carrier has at least one further second contact point and the further first contact device is electrically conductively connected to the further first contact point and the further second contact device is electrically conductively connected to the further second contact point in a circuit-appropriate manner.

[0012] Such first components can preferably be designed as a galvanically isolating transmission component, in particular as a transformer or as an optocoupler.

[0013] In particular, it is expedient and preferred if additional components with additional contact devices are arranged in additional receptacles of the plastic molded body, and these are electrically connected to associated additional contact points on at least one of the circuit carriers. Such additional components can, for example, be printed circuit boards or current sensors, or a structural unit comprising both.

[0014] It is particularly advantageous if the plastic molded body rests on the first circuit carrier with first contact surfaces. It is equally advantageous if the plastic molded body rests on the second circuit carrier with second contact surfaces. If both configurations are implemented simultaneously, an assembly consisting of the first and second circuit carriers and the plastic molded body is formed, which enables particularly simple further use of this assembly.

[0015] In a particularly preferred embodiment of the circuit arrangement, the plastic molded body is designed and provided to form electrical insulation, in particular according to the specifications of EN 60664 (current version), between the first and second circuit carriers. Here, the first circuit carrier can form the primary side and the second circuit carrier the secondary side of a driver for a power semiconductor device, which is particularly compact because the insulation is not formed on one circuit carrier but distributed across two circuit carriers.

[0016] The arrangement according to the invention is designed with the above-mentioned circuit arrangement and with a power semiconductor device, wherein the second circuit carrier is electrically connected to the power semiconductor device by means of control connections. It may be advantageous to also design load connections in a fundamentally similar manner, as long as the current-carrying capacity of the associated circuit carrier is sufficiently dimensioned.

[0017] It is particularly advantageous if the power semiconductor device is designed as a power semiconductor module or a power semiconductor submodule. In this case, the power semiconductor device can have its own housing or sub-housing. An advantageous alternative to this is a common housing for the circuit arrangement and the power semiconductor device.

[0018] Of course, unless this is explicitly or per se excluded or contradicts the idea of ​​the invention, the features or groups of features mentioned in the singular, for example the respective contact points and contact devices, can be present multiple times in the circuit arrangement or the arrangement according to the invention.

[0019] It is understood that the various embodiments of the invention, regardless of whether they are mentioned in connection with the circuit arrangement or the arrangement itself, can be implemented individually or in any combination to achieve improvements. In particular, the features mentioned and explained above and below can be used not only in the specified combinations, but also in other combinations or on their own, without departing from the scope of the present invention.

[0020] Further explanations of the invention, advantageous details and features, emerge from the following description of the Fig. 1 to 5 schematically illustrated embodiments of the invention, or of respective parts thereof. Fig. 1 shows schematically a first embodiment of a circuit arrangement according to the invention in a side sectional view. Fig. 2 shows schematically a second embodiment of a circuit arrangement according to the invention in a side sectional view. Fig. 3 schematically shows an arrangement according to the invention with a circuit arrangement and two power semiconductor modules in exploded view and side sectional view. Fig. 4 and Fig. 5 show, in three-dimensional view and in plan view, an embodiment of a plastic molded body of a circuit arrangement according to the invention.

[0021] Fig. Figure 1 schematically shows a first embodiment of a circuit arrangement 1 in an exploded view and a side sectional view to explain the invention. It shows a first circuit carrier 2, designed here as a standard printed circuit board with conductor tracks 22, 220 on its first and second main sides. This printed circuit board 2 is particularly designed and intended to support the primary-side circuit components within the framework of a power electronic driver circuit.

[0022] Also shown is a second circuit carrier 3, also designed as a standard printed circuit board with conductor tracks on its first 300 and second main sides. This printed circuit board 3 is particularly designed and intended to support the secondary-side circuit components within the framework of a power electronic driver circuit.

[0023] The two circuit boards 2, 3 are arranged parallel to each other and spaced apart, with a gap 5 being formed at least between sections of both circuit boards 2, 3. In other words, at least sections of the circuit boards are arranged flush with each other in the normal direction of their main sides 200, 300.

[0024] Arranged in the intermediate space 5, and possibly overlapping it, is a plastic molded body 4 having a plurality of recesses, the respective openings of which face one of the circuit boards 2, 3. These recesses form receptacles 42, which are designed to accommodate components 6, in particular electrical or electronic components.

[0025] A transmitter 60, technically a transformer, is arranged in one of the receptacles 42. This transmitter 60 is designed to transmit electrical signals in a potential-isolated manner from the first circuit board 2 to the second circuit board, and possibly also back. The term "signal" refers here in particular to control or measurement signals. However, such a signal can also be an energy signal, by means of which power is transferred from the first to the second circuit board in order to supply it with energy. All of these types of signals are common in the field of power electronic driver circuits.

[0026] The receptacle 42 of the transformer 60, which is designed here without its own housing, is almost completely filled with an electrically insulating potting compound 44. This potting compound 44 serves both to provide internal electrical insulation for the transformer 60 and to secure the transformer 60 in the receptacle 42.

[0027] The transformer 60 here has two first contact devices 64, 640, which are designed here, without restriction of generality, as spring contact devices. These first contact devices 64, 640 establish an electrically conductive connection to associated first contact points 24, 240 of the first circuit board 2. For this purpose, two conductor tracks 22, 220 of the first circuit board 2, here the main side 200 facing the plastic molded body 4, have first contact points 24, 240, designed here as contact surfaces.

[0028] The transformer 60 further comprises two second contact devices 68, 680, which, without limitation of generality, are designed as part of a plug-in connection, in this case as a plug. These second contact devices 68, 680 establish an electrically conductive connection to associated second contact points 34, 340 of the second circuit board 3. For this purpose, two conductor tracks 32, 320 of the first side, in this case the main side 300 of the second circuit board 3 facing the plastic molded body 4, have second contact points 34, 340, in this case designed as sockets.

[0029] A further component 62, in this case a capacitor, is arranged in a further receptacle 42. This capacitor 62 has further contact devices 660, which here form a plug connection with sockets 360 on further conductor tracks of the second circuit board 3.

[0030] Fig. Figure 2 schematically shows a second embodiment of a circuit arrangement 1 according to the invention in an exploded view and a side sectional view, this embodiment being fundamentally similar to the first. Differences are described below.

[0031] The plastic molded body 4 of this second embodiment has, in addition to that of the first embodiment, first and second support surfaces 402, 404, which are designed to rest on associated main sides 200, 300 of the respective printed circuit board 2, 3, whereby a structural unit is created from the two printed circuit boards 2, 3 and the plastic molded body 4, which structural unit can be installed as a whole, for example, in a power electronic arrangement.

[0032] Furthermore, the first contact devices 64, 640 are designed here as standard press-fit contacts. The first circuit board 2 of this second embodiment has standard recesses for accommodating these press-fit contacts as first contact points 24, 240.

[0033] Furthermore, an electronic component 280 is shown on the first main side 200 of the first printed circuit board 2 only as an example. This component is accommodated in one of the receptacles when the printed circuit board 2 and the plastic molded body 4 are assembled.

[0034] The second circuit board 3 also has an electronic component 380 on its second main side purely by way of example and is otherwise identical to that according to the first embodiment.

[0035] Fig. Figure 3 schematically shows an arrangement 100 according to the invention with a circuit arrangement 1 and two power semiconductor modules 7 in an exploded view and a lateral sectional view. The plastic molded body 4 here has two receptacles 42 with identical transformers 60, which are basically the same as the one from Fig. 2 are designed and arranged.

[0036] The first printed circuit board 2 has corresponding first contact devices 24, 240 for the press-fit contacts of the two transformers.

[0037] Also shown are two second circuit carriers 3, each designed as a standard printed circuit board with conductor tracks 32, 320 on its first and second main sides. These second printed circuit boards 3 are particularly designed and intended to support the secondary-side circuit components within the framework of a power electronic driver circuit for the arrangement 100 according to the invention.

[0038] Each power semiconductor module 7 is electrically connected, here by means of contact springs 70, to the second circuit boards 3, more precisely to conductor tracks 36 of the second main side. These connections are designed at least as auxiliary connection connections, in particular for transmitting control signals. It is also common practice to transmit sensor signals, for example from temperature sensors, from the power semiconductor module 7 to the circuit board 3. In some applications and with suitable power semiconductor modules 7, load connection connections can also be formed between the respective second circuit board 3 and the associated power semiconductor module 7.

[0039] Furthermore, an electronic component 282 is shown on the second main side of the first circuit board 2 only as an example.

[0040] Fig. 4 and Fig.5 show, in a three-dimensional view and a top view, an embodiment of a plastic molded body 4 of a circuit arrangement according to the invention. These plastic molded bodies 4 serve, within the context of a power electronics arrangement, to connect the primary-side circuit part of a driver circuit to three secondary-side circuit parts of a three-phase bridge circuit.

[0041] For this purpose, the plastic molded body 4 has three transformers 60, here designed for transmitting energy, each arranged in associated receptacles 42. A potting compound has been omitted here for reasons of clarity. Further components shown are transformers for transmitting control signals, as well as three current measuring devices 66, each comprising a current sensor and a third circuit board for evaluating the signals from the respective current sensor.

[0042] Also shown are second contact devices 68, 680, as well as second support surfaces 404 for a second circuit board 3, which here carries all the secondary-side circuit components for all three phases. Also shown are fastening devices 406, which, together with screws (not shown), serve to form a structural unit from the plastic molded body 4 and the circuit boards (not shown).

Claims

[1] Circuit arrangement (1) for controlling a power semiconductor device (7) with a first circuit carrier (2) and with a second circuit carrier (3) arranged parallel to and at a distance from the first, and with a plastic molded body (4) arranged in an intermediate space (5) between the first and second circuit carriers (2, 3), wherein the first circuit carrier (2) has a first conductor track (22) with a first contact point (24) which is arranged on a main side (200) of the first circuit carrier (2) facing the plastic molded body (4), wherein the second circuit carrier (3) has a second conductor track (32) with a second contact point (34) which is arranged on a main side (300) of the second circuit carrier (3) facing the plastic molded body (4), wherein the plastic molded body (4) has a first receptacle (42) for a first component (6) with a first and a second contact device designed as a press-fit contact (64,68) and wherein the first contact device (64) is electrically conductively connected to the first contact point (24) and the second contact device (68) is electrically conductively connected to the second contact point (34), wherein the plastic molded body (4) rests on the first circuit carrier (2) with first contact surfaces (402) and wherein the plastic molded body (4) rests on the second circuit carrier (3) with second contact surfaces (404), whereby a structural unit is formed from the two circuit carriers (2, 3) and the plastic molded body (4). [2] Circuit arrangement (1) according to claim 1, wherein the first receptacle (42) is filled with the first component (6) located therein by means of an electrically insulating potting compound (44). [3] Circuit arrangement (1) according to one of the preceding claims, wherein the first component (6) has at least one further first and one further second contact device (640, 680), the first circuit carrier (2) has at least one further first contact point (240), the second circuit carrier (3) has at least one further second contact point (340) and the further first contact device (640) is electrically conductively connected to the further first contact point (240) and the further second contact device (680) is electrically conductively connected to the further second contact point (340) in a circuit-appropriate manner. [4] Circuit arrangement (1) according to claim 3, wherein the first component (6) is designed as a galvanically isolating transmission component, in particular as a transformer (60) or as an optocoupler. [5] Circuit arrangement (1) according to one of the preceding claims, wherein further components (62, 66) with further contact devices (660) are arranged in further receptacles of the plastic molded body (4) and these are electrically conductively connected to associated further contact points (360) on at least one of the circuit carriers (3). [6] Circuit arrangement (1) according to one of the preceding claims, wherein the plastic molded body (4) is designed and provided to form an electrical insulation between the first and second circuit carrier (2, 3). [7] Arrangement (100) with a circuit arrangement (1) according to one of the preceding claims and with a power semiconductor device (7), wherein the second circuit carrier (3) is electrically conductively connected to the power semiconductor device (7) by means of control connections (70). [8] Arrangement according to claim 7, wherein the power semiconductor device (7) is a power semiconductor module or a power semiconductor submodule.

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