Method for manufacturing a printed circuit board using a mold for conductor elements

Abstract

Method for manufacturing a printed circuit board (1) with at least one conductor element (2) extending in the printed circuit board (1) between connection points (1d), comprising the steps: a. Step A: Provide a form (3) with at least one recess (3c) for a conductor element (2). b. Step B: Arranging a conductor element (2) in the receptacle (3c) of the mold (3). c. Step C: Connecting the conductor element (2) arranged in the recess (3c) of the mold (3) to an electrically conductive surface element (5) at the positions of the provided connection points (1d). d. Step D: Embedding the conductor element (2) connected to the electrically conductive surface element (5) in insulating material (7) to form the printed circuit board (1). e. Step E: Extracting the connection points (1d) from the electrically conductive surface element (5) by locally removing surrounding sections of the electrically conductive surface element (5), preferably by etching.

Description

[0001] The present invention relates to a method for manufacturing a printed circuit board with at least one conductor element extending in the printed circuit board between connection points.

[0002] Such a method is known from EP 1 842 402 A2.

[0003] In the known method, a conductor wire is welded to a copper foil and then pressed with insulating material.

[0004] Further methods for manufacturing a printed circuit board are known from DE 22 13 823 A, DE 10 2014 110 220 A1 and US 4 847 991 A.

[0005] Given today's requirements for manufacturing precision, the positions and orientations of conductor elements and connection points must be measured precisely. Particularly in the mass production of printed circuit boards, repeated measurement processes slow down the manufacturing process, thus reducing the productivity of the procedure.

[0006] Based on these considerations, the present invention aims to increase the productivity of the known method.

[0007] The problem is solved by the method according to claim 1.

[0008] The method disclosed herein for manufacturing a printed circuit board with at least one conductor element extending in the printed circuit board between connection points comprises the following steps: - Step A: Provide a mold with at least one recess for a conductor element. - Step B: Arranging a ladder element in the mold's recess. - Step C: Connecting the conductor element arranged in the mold's recess to an electrically conductive surface element at the positions of the intended connection points. - Step D: Embedding the conductor element connected to the electrically conductive surface element in insulating material. - Step E: Extracting the connection points from the electrically conductive surface element.

[0009] By using this mold, the relative orientation of numerous conductor elements can be precisely determined, as the arrangement and orientation of the receptacles relative to each other are precisely defined within the mold. Unlike conventional methods, the individual conductor elements do not need to be measured separately for connection to the electrically conductive surface element; instead, they are simply positioned in their respective receptacles. Only the electrically conductive surface element needs to be fixed relative to the mold, thus precisely defining the positions of all conductor elements and their connections to the electrically conductive surface element. Because the connection between the conductor elements and the electrically conductive surface element is established while the conductor elements are in the mold, relative movement between the conductor elements is eliminated.By eliminating the individual measurement processes for creating the connection of the conductor elements with the electrically conductive surface element, the productivity of the process for manufacturing the printed circuit board with at least one conductor element extending between connection points can be significantly increased.

[0010] It can be advantageous if step A includes at least one of the following sub-steps: - Sub-step A1: Providing a mold with a preferably flat first side and at least one recess opening towards the first side of the mold for a conductor element. - Sub-step A2: Arrange the shape so that the first side of the shape extends at least partially or completely into a horizontal plane.

[0011] The horizontal alignment of the mold in sub-step A1 / A2 facilitates the positioning of the conductor element in the mold's recess as well as the subsequent processing steps.

[0012] However, it can also be useful if step B includes at least one of the following sub-steps: - Sub-step B1: Providing a conductor element with at least two connecting element sections, which are preferably arranged and / or attached on the same side and / or at different ends of the conductor element. - Sub-step B2: Arranging the conductor element in the receptacle so that the conductor element is preferably positively fitted and / or without play in the receptacle with respect to the plane of extension of the mold, wherein the conductor element is preferably aligned parallel to the plane of extension of the mold. - Sub-step B3: Arrange the conductor element in the holder so that the side of the conductor element provided with the connecting sections is flush with the first side of the mold and the connecting sections protrude beyond the first side of the mold. - Sub-step B4: Arranging insulating material, preferably an insulating material surface element, which preferably has openings adapted to the positions and, if applicable, shapes of the connecting element sections, on the first side of the mold, preferably in such a way that a second side of the insulating material surface element lies flat on the first side of the mold as well as on the first side of the conductor element received in the recess of the mold, wherein the connecting element sections are particularly preferably flush with a first side of the insulating material surface element on their upper side.

[0013] Step B1 facilitates the connection of the conductor element to the electrically conductive surface element. It is particularly advantageous if the side of the conductor element where the connecting elements are attached is flat. This can be achieved, for example, by using a rectangular wire, cut to the appropriate length from a coil. Due to the preceding winding on the coil, the rectangular wire may not extend in a perfectly straight line. Applying a tensile force to both ends can straighten the conductor element. Other techniques for straightening the conductor element are also possible.

[0014] The connecting elements are, for example, plates made of silver or another suitable connecting material that can create a permanent electrically conductive connection between the conductor element and the electrically conductive surface element.

[0015] After the connecting element sections have been applied, the conductor element can be drawn to a corresponding length and shaped, preferably to fit exactly into a corresponding recess in the mold.

[0016] Sub-step B2 facilitates the fixing of the relative positions and alignment of the ladder elements to each other in the extension plane of the mold, since the ladder elements cannot move in their respective recesses.

[0017] Sub-step B3 enables the positioning of the conductor elements also in a direction perpendicular to the extension plane of the form.

[0018] Step B4 proves helpful for completely embedding the conductor element in insulating material. With the conventional method, a problem arises because insulating material must be pressed into the gap after connecting the conductor element to the electrically conductive surface element. This gap is difficult to access after the connection between the conductor element and the electrically conductive surface element has been made. In step B4, for example, a prepreg mat with pre-made openings at the locations of the connector sections can be positioned so that its underside lies flat against the top of the mold and the top of the conductor element, while the connector sections lie flush with the top of the prepreg mat in the same plane.In this case, each opening in the prepreg mat forms a shape that prevents the material of the attached connector section from spreading unhindered during the subsequent welding process. This also prevents unwanted contact between the conductor element and the electrically conductive surface element outside the designated connection points. Preferably, a prefabricated insulating surface element is used, eliminating the need for individual adjustments and further increasing the productivity of the process. The openings can be punched, for example, using a mask.

[0019] However, it can also be useful if step C includes at least one of the following sub-steps: - Sub-step C1: Arranging an electrically conductive surface element on the first side of the mold, optionally on the first side of the insulating surface element, preferably such that the electrically conductive surface element rests flat on the first side of the insulating surface element and / or flat on the connecting element sections. - Sub-step C2: Arranging a first electrode of a joining tool to produce an electrically conductive connection between the conductor element and the electrically conductive surface element on a first side of the mold, preferably such that the first electrode is in contact with the first side of the electrically conductive surface element. - Sub-step C3: Arranging a second electrode of the joining tool to produce an electrically conductive connection between the conductor element and the electrically conductive surface element on a second side of the mold, preferably such that the second electrode is in contact with the second side of the conductor element by passing through an opening in the mold. - Sub-step C4: Applying contact pressure between the first electrode and the second electrode. - Sub-step C5: Applying an electric current between the first electrode and the second electrode. - Sub-step C6: Heating of the connecting element section until the required operating temperature is reached, so that the conductor element and the electrically conductive surface element are inseparably connected via the connecting element section, preferably under the influence of a force between the electrodes, by melting and solidifying of the material of the connecting element section, by diffusion or in solid phase, preferably by welding. - Sub-step C7: Removing the first electrode from the first side of the electrically conductive surface element. - Sub-step C8: Removing the second electrode from the second side of the conductor element and taking the second electrode out of the opening in the mold. - Sub-step C9: Applying at least one reference mark to the electrically conductive surface element, preferably by producing at least one opening.

[0020] Step C1 promotes the flat and regular layer structure of the printed circuit board. Preferably, a pre-cut electrically conductive surface element is used, thus eliminating the need for individual cutting of the electrically conductive surface element and further increasing the productivity of the process.

[0021] Step C2 creates a counter-bearing in the form of the first electrode for the contact pressure subsequently applied by the second electrode.

[0022] Sub-step C3 facilitates the exact positioning of the second electrode in relation to the respective connecting element section, via which the conductor element is to be connected to the electrically conductive surface element.

[0023] Steps C4 to C8 facilitate the creation of a connection between the conductor element and the electrically conductive surface element by means of resistance welding.

[0024] However, it can also be advantageous if step D includes at least one of the following sub-steps: - Sub-step D1: Removing the conductor element from the mold. - Sub-step D2: Arranging insulating material on the second side of the electrically conductive surface element connected to the conductor element, optionally on the second side of the insulating surface element arranged on the second side of the electrically conductive surface element, preferably as a mass or in the form of an insulating surface element, particularly preferably such that the insulating material completely surrounds the conductor element except for the positions of the provided connection points. - Sub-step D3: Applying pressure and, if necessary, heat to the insulating material in the direction of the electrically conductive surface element, so that the insulating material adapts to the contour of the conductor element and, if necessary, connects with an existing insulating material. - Sub-step D4: Smoothing the insulating material on the side facing away from the electrically conductive surface element to form a flat underside of the circuit board. - Sub-step D5: Curing of the insulating material.

[0025] Step D1 makes the conductor element accessible for the subsequent application of the insulating material. After the connection between the conductor element and the electrically conductive surface element has been established, their relative position and orientation are fixed, so the mold is no longer needed and can be removed.

[0026] Step D2 embeds the conductor element almost completely in insulating material. Preferably, a prefabricated insulating panel is used, eliminating the need for individual application of the insulating material and further increasing the productivity of the process. The insulating panel can have a corresponding recess for each conductor element.

[0027] Steps D3 and D4 are preferably carried out in a press under the influence of pressure and temperature.

[0028] It may prove helpful if step E includes the following sub-step: - Extraction of at least one conductive path by local removal of surrounding sections of the electrically conductive surface element, preferably by etching.

[0029] This step enables the creation of complex conductor patterns on the surface of the printed circuit board, in addition to the conductor elements extending between connection points. Preferably, the connection points and / or conductor tracks are created based on a previously created reference marking.

[0030] Another aspect of the present invention relates to an arrangement according to claim 7. The advantages mentioned above apply. Terms and Definitions Form

[0031] A mold within the meaning of this invention is an aid used for the manufacture of the printed circuit board. The mold has at least one recess for a conductor element.

[0032] The shape can have at least one of the following features: - The mold consists of a dielectric or electrically insulating material, for example a composite material consisting of epoxy resin and fiberglass fabric. - The form is designed as a plate. - The shape essentially extends in one plane. - The shape includes a top surface, which is preferably flat. - The shape includes a bottom surface, which is preferably flat. - The top and bottom of the mold are parallel to each other. - The mold has a thickness of 1 to 5 mm, preferably 1.5 to 3 mm, preferably 2 mm. - The shape has a polygonal, preferably rectangular or square outline. - The mold has an inner contour that is aligned with the outer contour of the conductor element. - The mold has an outer contour that is matched to the inner contour of the conductor element. - The depth of the recording is matched to the height / thickness of the conductor element. - The mold has a separate recess for each conductor element. - The recording extends from one side of the form into the form. - The recess is incorporated into the mold from a first side, preferably milled into the mold. - The first side of the mold forms the top of the mold. - The depth of the recording is in the range of 50 to 1000 µm, preferably in the range of 100 to 500 µm, preferably in the range of 300 to 400 µm, particularly preferably at 350 µm. - The mold has at least one opening designed as a passage and communicating with the receiving area for the insertion of a tool from the other side of the mold. - The passage extends essentially perpendicular to the plane of extension of the form. - The passage extends from the second side of the form into the respective recording. - Each receptacle is assigned at least one opening designed as a passage, preferably two openings designed as passages, which are preferably arranged at different ends of the receptacle. Circuit board

[0033] A printed circuit board (PCB) as defined in this invention is a carrier for electronic components. The PCB serves, for example, for the mechanical mounting and electrical connection of the electronic components. Almost every electronic device contains one or more PCBs. A PCB can also be called a circuit board, circuit board, or printed circuit and corresponds to what is known in English as a printed circuit board (PCB).

[0034] The printed circuit board preferably has at least one of the following features: - The printed circuit board comprises one or more layers, preferably several identical layers. - The printed circuit board is a printed circuit board according to EP 1 842 402 A2. - The printed circuit board is a printed circuit board according to DE 10 2011 102 484 A1. - The printed circuit board is a printed circuit board according to DE 10 2013 223 143 A1. - The circuit board extends in one plane. - The circuit board has parallel top and bottom surfaces. - There are at least two connection points on the top side of the circuit board. - There is at least one conductor track on the top side of the circuit board. - At least one conductor element is embedded in the circuit board, the conductor element being embedded in insulating material except at the connection points. conductor element

[0035] A conductor element within the meaning of this invention is an object for transporting electrical energy and / or heat and / or for signal transmission in wired communications technology and wired high-frequency technology. The conductor element can be part of an electrical circuit or power grid and thus connect a power source and a load. For transport, electrons flow through the conductor element as a current. To minimize voltage drop or transmission losses, the conductive material should have high electrical conductivity, for which some metals are particularly well suited. The cross-sectional area of ​​the conductor is preferably designed for the permissible current density.

[0036] The conductor element preferably has at least one of the following features: - The conductor element is a conductor wire, preferably a round wire with a round cross-section or a rectangular wire with a rectangular cross-section, wherein the conductor wire preferably has a cross-section that is constant over its length. The conductor element is preferably a conductor wire according to EP 1 842 402 A2. - The conductor element is a molded part, preferably a molded part according to DE 10 2011 102 484 A1. The molded part can, for example, have the following features: The molded part extends essentially in one plane. The molded part is made of metal, preferably copper. The molded part includes at least a concave contour in some sections and / or at least a convex contour in some sections. The molded part is embedded in the printed circuit board, at least partially, preferably completely. The top surfaces of the circuit board and the molded part are essentially aligned parallel to each other. The molded part is cut from a plate-shaped workpiece, preferably by punching, EDM or cutting, preferably by waterjet cutting. The molded part has a thickness in the range of 10 to 2000 µm, preferably in the range of 100 to 1000 µm, preferably in the range of 200 to 500 µm. o The length and / or width of the molded part is at least five times, preferably at least ten times, preferably at least twenty times, preferably at least fifty times or preferably at least one hundred times as large as the thickness of the molded part and / or the thickness of the printed circuit board. The molded part has a substantially rectangular cross-section. o The cross-sectional shape of the molded part is not constant over the width and / or length of the molded part. The thickness of the molded part is constant across its entire surface. ◯ The molded part includes a curvature in one, two, three or more planes of curvature. ◯ The molded part protrudes from the insulating material, at least in sections. ◯ The molded part cannot be produced or manufactured using the extrusion process. The molded part comprises at least one recess that is incorporated into the molded part starting from an edge of the molded part. Preferably, the recess is filled with insulating material, at least partially. ◯ The molded part comprises at least one opening that extends section by section from the top, bottom or edge of the molded part, wherein the opening preferably has a circular, oval, polygonal, preferably triangular, quadrilateral, pentagonal, preferably rectangular or square outline at least in the area of ​​its mouth, wherein the opening is preferably essentially groove-shaped and extends continuously or discontinuously along a straight or curved line, wherein this line particularly preferably runs at least section by section parallel to an edge of the molded part, wherein the opening is particularly preferably filled at least section by section with insulating material. ◯ The molded part comprises at least one opening extending transversely, preferably perpendicularly, to the top, bottom or an edge of the molded part through the molded part, wherein the opening preferably comprises a circular, oval, polygonal, preferably triangular, quadrilateral, pentagonal, rectangular or square outline, wherein the opening is preferably substantially slit-shaped and extends continuously or discontinuously along a straight or curved line, wherein this line particularly preferably runs at least partially parallel to an edge of the molded part, wherein the opening is particularly preferably filled at least partially with insulating material. ◯ The molded part is essentially L-shaped, T-shaped, H-shaped, S-shaped, O-shaped, E-shaped, F-shaped, X-shaped, Y-shaped, Z-shaped, C-shaped, U-shaped or Ω-shaped. Several molded parts are arranged in the same plane or in different planes, preferably in planes parallel to each other within the printed circuit board. - The conductor element is a resistor, preferably a precision resistor, more preferably a precision resistor according to DE 10 2013 223 143 A1. The precision resistor can have the following features: ◯ The precision resistor comprises a resistance value in the range of 0.1 to 300 mOhm, preferably in the range of 1 to 100 mOhm. ◯ The precision resistance includes a variance of less than + / - 5%, preferably a variance of less than + / - 2%, preferably a variance of + / - 1% or less. ◯ The temperature coefficient of the electrical resistance of the precision resistor for the temperature range between 20 and 60 °C is in the range of 0.1 ppm / K to 200 ppm / K, preferably in the range of 0.5 ppm / K to 100 ppm / K, preferably in the range of 1 ppm / K to 50 ppm / K. ◯ The precision resistor consists of metal, preferably of at least one of the elements copper (Cu), manganese (Mn), nickel (Ni), chromium (Cr), aluminum (Al), silicon (Si) or tin (Sn), preferably of an alloy containing at least one of the elements copper (Cu), manganese (Mn), nickel (Ni), chromium (Cr), aluminum (Al), silicon (Si) or tin (Sn), for example of manganin, ceranin or isoohm. - The conductor element makes contact with the connection points. - The conductor element is welded to the connection points. - The conductor element is embedded in the printed circuit board, at least predominantly, preferably completely. - A top and / or a bottom and / or at least one of the edge sides of the conductor element, preferably all edge sides of the conductor element, is / are covered at least partially, preferably completely, with insulating material. - A top and / or a bottom and / or at least one of the edge sides of the conductor element runs at least partially, preferably completely, flush with a top and / or a bottom and / or at least one of the edge sides of an adjacent layer of insulating material. - The top surfaces and / or the bottom surfaces and / or at least one of the edge surfaces of the circuit board and the conductor element are aligned parallel to each other. - The conductor element can be manufactured or is manufactured using the extrusion process. - The conductor element is designed as a flat wire. - The conductor element extends essentially in one plane. - The conductor element comprises a rectangular cross-section, preferably with the side of the cross-section having the larger extent facing the surface of the printed circuit board. - The conductor element has a thickness in the range of 10 to 2000 µm, preferably in the range of 50 to 1000 µm, preferably in the range of 100 to 500 µm. - The conductor element comprises or consists of an electrically conductive material. - The conductor element comprises or consists of metal, preferably copper. The conductor element comprises at least one connecting element section, preferably made of a material different from that of the conductor element, preferably hard solder, particularly preferably silver. The connecting element section is connected to the conductor element, preferably by a metallurgical bond, for example by welding. The connecting element section is, for example, plate-shaped. - The conductor element includes an adhesion promoter to improve the bond to the insulating material. - The conductor element includes a roughened surface to improve adhesion to the insulating material, preferably with the following features: The surface of the conductor element is at least partially roughened before the conductor element comes into contact with insulating material, preferably before step B and / or before step C. The roughening of the surface of the conductor element is carried out by chemical etching, wherein the chemical etching is preferably carried out by immersing the conductor element in a liquid that corrosives the material of the conductor element or by spraying the conductor element with such a liquid. The surface of the conductor element is roughened by mechanical processing, for example by sandblasting or by spraying pumice or quartz flour under high pressure. Insulating material

[0037] An insulating material within the meaning of this invention is a non-conductive material, meaning it has extremely low and therefore negligible electrical conductivity. Insulating materials are used in electrical engineering to limit the flow of electric current to live parts. The insulating material is preferably applied in a plastic or flowable state and cured after achieving the desired shape. Insulating material can be applied, for example, as a mass or as a prepreg mat. The prepreg mat comprises a fabric layer that provides internal cohesion and already offers a basic structure, wherein the fabric layer is impregnated with flowable or plastic resin, thus enabling adaptation to the desired shape. Electrically conductive surface element or foil

[0038] The electrically conductive surface element within the meaning of the invention is a planar element such as a sheet made of an electrically conductive material.

[0039] The electrically conductive surface element preferably has at least one of the following features: - The electrically conductive surface element comprises or consists of an electrically conductive material. - The electrically conductive surface element comprises or consists of metal, preferably copper. - The electrically conductive surface element is designed as a foil. - The electrically conductive surface element has a thickness in the range of 10 to 1000 µm, preferably in the range of 15 to 200 µm, preferably in the range of 18 to 105 µm, particularly preferably at 35 µm.

[0040] Further preferred embodiments of the invention result from combinations of the features disclosed herein. Brief description of the characters

[0041] They show: Fig. 1 in view (a) a perspective representation of a form with several views for the arrangement of ladder elements and in view (b) a schematic sectional view, wherein one view in longitudinal section and one view in cross section through each through opening are shown. Fig. 2 a perspective view of a conductor element with connecting element sections applied at the ends on a top surface, wherein the conductor element is designed as a conductor wire with a rectangular cross-sectional area. Fig. 3a the in Fig. 1b shows a schematic sectional view of the shape. Fig. 3b an arrangement comprising the in Fig. 1b and Fig. 3a shown form and two in Fig. 2 ladder elements shown in schematic sectional view, wherein the ladder elements are arranged in the longitudinal section or cross-sectional views of the mold such that the tops of the ladder elements are flush with the top of the mold and the connecting element sections projecting from the tops of the ladder elements protrude above the top of the mold. Fig. 3c the arrangement according to Fig. 3b, wherein, in addition, an insulating surface element in the form of a prepreg mat is arranged on the top surface of the form over which the connecting sections protrude, the insulating surface element having several openings adapted to the positions and shapes of the connecting sections, so that the top surfaces of the connecting sections are arranged flush with the top surface of the insulating surface element in one plane. Fig. 3d the arrangement according to Fig. 3c, wherein an electrically conductive surface element is additionally applied to the top surface of the insulating surface element, which is arranged flush with the top surfaces of the connecting element sections in one plane. Fig. 3e the order according to Fig. 3d, wherein on each connecting element section of a conductor element to be joined two contact electrodes are arranged on different sides of the mold to produce an electrically conductive connection between a conductor element and the electrically conductive surface element, wherein the lower contact electrode extends through the opening formed as a passage in the underside of the mold to the conductor element received in the respective receptacle, so that the respective contact electrode can directly contact the conductor element to be joined. Fig. 4 in view (a) a perspective view and in view (b) a schematic sectional view of a printed circuit board produced according to the inventive method. Fig. 5 a flowchart of the inventive method for manufacturing a printed circuit board. Detailed description of preferred embodiments

[0042] The preferred embodiment of the invention is described in detail below with reference to the accompanying drawings.

[0043] A mold 3 for manufacturing a printed circuit board 1 is shown in perspective view (a) of the Fig. Figure 1 shows the form 3. The form 3 comprises a total of six recesses 3c for a total of six conductor elements 2 designed as rectangular wires. Each recess 3c comprises a substantially cuboid cavity that opens towards a first side 3a of the form 3, designated as the top. Extending from a second side 3b of the form 3, designated as the bottom, are two openings 3d, designed as passages, into each recess 3c. The first and second sides 3a, 3b of the form 3 diverge from each other and extend in parallel planes. The form 3 can have different recesses 3c for differently designed conductor elements 2. These different recesses 3c can be located on different sides 3a, 3b of the form 3. The form 3 is made, for example, of an electrically insulating material, such as FR4 (a composite sheet consisting of epoxy resin and fiberglass fabric).The recesses 3c are milled, for example, starting from the first side 3a of the form 3. The openings 3d, designed as passageways, are preferably manufactured after the recesses 3c have been formed, for example by drilling.

[0044] In view (b) of the Fig. Figure 1 is a mold 3 for manufacturing a printed circuit board 1, shown schematically and in simplified sectional view to describe the method according to the invention. This mold 3 has only two recesses 3c, which extend along different edges of the mold 3 that are arranged perpendicular to each other. It can be seen how the recesses 3c open towards the first side 3a of the mold and how the openings 3d, designed as passageways, lead from the second side 3b of the mold 3 into the respective recess 3c. The openings 3d can widen in a funnel shape towards the second side 3b of the mold 3 to facilitate the insertion of tools 6b.

[0045] Fig. Figure 2 shows in perspective a conductor element 2, which is designed as a cuboid-shaped conductor wire 2 with a rectangular cross-sectional area and is inserted into each of the images 3c of the in Fig. The form shown in Figure 1 fits. The two largest surfaces of the cuboid conductor element 2 form the top surface 2a and the bottom surface 2b of the conductor element 2. Rectangular or plate-shaped connecting sections 2c are applied to the top surface 2a of the conductor element 2 at opposite ends, e.g., welded. In a state shown in Figure 3c, the top surface 2a of the conductor element 2 extends in a plane with the top surface 3a of the form 3 and is flush with it, with the connecting sections 2c projecting beyond the top surface 3a of the form 3. This differs from the representation in Figure 1. Fig. 2. The conductor element 2 can have a different shape. In particular, the conductor element 2 can also be, for example, a molded part, a round wire, or a precision resistor. The receptacle 3c of the form 3 then usually needs to be adapted accordingly.

[0046] The inventive method for manufacturing a printed circuit board 1 with at least one conductor element 2 extending in the printed circuit board 1 between connection points 1d, which is described below in particular with reference to the Fig. The step described in section 3 includes the following steps: Step A: Provide a form 3 with at least one receptacle 3c for a conductor element 2.

[0047] Substep A1 involves providing the in Fig. 1 (b) as shown in form 3.

[0048] As in Fig. As shown in 3 (b), the form 3 is arranged so that the top (first side) 3a of the form 3 extends in a horizontal plane (partial step A2). Step B: Arranging a conductor element 2 in the recess 3c of the shape 3.

[0049] Partial step B1 comprises the provision of conductor elements 2. In the present embodiment, each conductor element 2 is designed as a cuboid conductor wire 2 with connecting element sections 2c applied to the ends and top, as shown in Fig. 2 is shown.

[0050] As in Fig. As shown in 3 (b), each conductor element 2 is arranged in the receptacle 3c such that the conductor element 2 is aligned parallel to the extension plane of the shape 3 and is received in the receptacle 3c in a nearly form-fitting and play-free manner with respect to the extension plane of the shape 3 (partial step B2).

[0051] Subsequently, each conductor element 2 is inserted into the corresponding receptacle 3c in such a way that the side 2a of the conductor element 2 provided with the connecting element sections 2c is essentially flush with the top (first side) 3a of the form 3 and only the connecting element sections 2c protrude beyond the top (first side) 3a of the form 3 (partial step B3).

[0052] As in Fig. As shown in Figure 3(c), an insulating surface element 4, which has openings 4c adapted to the positions and, if applicable, shapes of the connecting element sections 2c, for example in the form of a prepreg mat with openings, can be arranged on the first side 3a of the form 3. This makes it possible to completely surround each conductor element, with the exception of the connecting element sections 2c, with insulating material and thus to completely decouple it electrically from the environment. The insulating surface element 4 preferably rests with its underside (second side) 4b flat on the top (first side) 3a of the form 3 and on the top (first side) 2a of the conductor element 2 received in the receptacle 3c of the form 3, wherein the connecting element sections 2c are flush with a top (first side) 4a of the insulating surface element 4 (partial step B4). Step C: Connecting the conductor element 2 arranged in the recess 3c of the form 3 to an electrically conductive surface element 5 at the positions of the provided connection points 1d.

[0053] First, an electrically conductive surface element 5, e.g., in the form of a copper foil, is arranged on the top (first side) 3a of the shape 3, so that it completely covers the top (first side) 4a of the insulating surface element 4 and the flush connecting sections 2c (partial step C1). Air inclusions can be eliminated by pressing the electrically conductive surface element 5 against the top (first side) 4a of the insulating surface element 4.

[0054] Subsequently, electrically conductive connections are established between the conductor element 2 and the electrically conductive surface element 5 at the positions of the designated connection points 1d via the connecting element sections 2c. This is done, for example, by welding, in particular by resistance welding, ultrasonic welding, or by brazing or the like.

[0055] In an exemplary resistance welding process, a first electrode 6a of a resistance welding tool is positioned on the top surface (first side) 3a of the shape 3, such that the first electrode 6a is in contact with the top surface (first side) 5a of the electrically conductive surface element 5. The position of the first electrode 6a is aligned with the position of a designated connection point 1d or the position of a connecting element section 2c (sub-step C2).

[0056] Subsequently, a second electrode 6b of the connecting tool is arranged on the underside (second side) 3b of the shape 3 such that the second electrode 6b, passing through an opening 3d in the underside (second side) 3b of the shape 3, is in contact with the second side 2b of the conductor element 2 (partial step C3).

[0057] Subsequently, contact pressure is applied between the first electrode 6a and the second electrode 6b (sub-step C4) and an electric current is applied (sub-step C5), which leads to the heating of the respective connector section 2c. Each connector section 2c is heated until the required operating temperature is reached, so that the conductor element 2 and the electrically conductive surface element 5 are permanently joined via the connector section 2c under the influence of force and by melting / solidifying the material of the connector section 2c, by diffusion, or in the solid phase by welding (sub-step C6).

[0058] Electrodes 6a and 6b are then removed (partial steps C7 and C8). Step D: Embedding the conductor element 2 connected to the electrically conductive surface element 5 in insulating material 4, 7.

[0059] First, the conductor element 2 is removed from the form 3 (partial step (D1)).

[0060] Subsequently, insulating material 7 in a malleable state, in the form of an insulating material sheet 7, such as a prepreg mat, is applied to the underside (second side) 5b of the electrically conductive sheet 5, which is connected to the conductor element 2. The insulating material 7 is preferably bonded to the underside (second side) 4b of the insulating material sheet 4 already attached to the underside (second side) 5b of the electrically conductive sheet 5. However, the insulating material 7 can also be applied as a flowable mass. The insulating material 7 is preferably applied in such a way that it completely surrounds the conductor element 2, except for the positions of the intended connection points 1d (partial step D2), and thus almost completely embeds the conductor element 2.

[0061] The optional application of pressure and, if necessary, heat to the insulating material 4, 7 in the direction of the electrically conductive surface element 5 can cause the insulating material 4, 7 to conform closely to the conductor element 2 (sub-step D3). If an insulating surface element 4 is already present between the conductor element 2 and the electrically conductive surface element 5, the application of pressure and, if necessary, heat to the subsequently applied insulating surface element 7 can improve the connection between the two insulating surface elements 4, 7.

[0062] This is done, for example, in a press. The insulating material 4, 7 is smoothed (partial step D4) and hardened (partial step D5) on the side facing away from the electrically conductive surface element 5 to form a flat underside 1b of the circuit board 1.

[0063] Step E: Extracting the connection points 1d from the electrically conductive surface element 5.

[0064] After completion of step D, the surface of the circuit board 1 is completely covered with the electrically conductive surface element 5, with the conductor element 2 extending inside the circuit board 1 and embedded in insulating material 4, 7.

[0065] At the positions of the intended connection points 1d, where the conductor element 2 is connected to the electrically conductive surface element 5 via the connecting element sections 2c, the connection points 1d are subsequently formed by locally removing surrounding sections of the electrically conductive surface element 5 (partial step E1). This is preferably accomplished by etching.

[0066] For example, for signal transmission, conductor tracks can also be created by locally removing surrounding sections of the electrically conductive surface element 5. This is also preferably accomplished by etching (partial step E2). A conductor track 1e is preferably in electrically conductive connection with at least one terminal 1d.

[0067] Fig. 4 shows one using the in Fig. The printed circuit board 1, manufactured in form 3 as shown in Figure 1, is shown in perspective view (view a) and in schematic sectional view (view b). The printed circuit board 1 has essentially a rectangular outline and a cuboid shape. The cuboid conductor element 2 extends between two connection points 1d arranged on the top surface 1a of the printed circuit board 1, which are formed, for example, by etching from a copper foil (5), and is completely embedded in insulating material 1c (4, 7) except for the positions of the connection points 1d.

[0068] In the schematic sectional view according to Fig.Figure 4(b) clearly shows the structural arrangement of the printed circuit board 1. The top surface 1a of the printed circuit board 1 is formed by the first insulating sheet element 4, which was applied to the top surface of the mold 3 in step B (substep B4). The bottom surface 1b of the printed circuit board 1 is formed by the second insulating sheet element 7, which was applied to the underside of the first insulating sheet element 4 only after the connection between the conductor element 2 and the electrically conductive sheet element 5 had been established via the connecting sections 2c, in order to embed the conductor element almost completely in insulating material 1c. The connection points 1d and conductor tracks 1e arranged on the top surface 1a of the printed circuit board 1 are made of the material of the electrically conductive sheet element (5), which was placed on the top surface of the first insulating sheet element 4 in step C (substep C1). Reference symbol list 1 circuit board 1a Top side of the circuit board 1b Underside of the circuit board 1c Insulating material 1d Interchange 1e conductor 2 conductor element 2a Top side of the conductor element 2b Underside of the conductor element 2c Fastener section 3 Form 3a Top of the mold 3b Underside of the mold 3c recording 3D passage / opening 4 Insulating material (electrically insulating surface element or insulating material surface element) 4a Top side of the insulating material surface element 4b Underside of the insulating material surface element 4c Passage / Opening 5 Electrically conductive surface element (conductor surface element or foil) 5a Top side of the electrically conductive surface element 5b Underside of the electrically conductive surface element 6a Electrode (top) of the joining tool 6b Electrode (bottom) of the joining tool 7 Insulating material (electrically insulating surface element or insulating material surface element)

Claims

[1] Method for manufacturing a printed circuit board (1) with at least one conductor element (2) extending in the printed circuit board (1) between connection points (1d), comprising the steps: a. Step A: Provide a form (3) with at least one recess (3c) for a conductor element (2). b. Step B: Arranging a conductor element (2) in the receptacle (3c) of the mold (3). c. Step C: Connecting the conductor element (2) arranged in the recess (3c) of the mold (3) to an electrically conductive surface element (5) at the positions of the provided connection points (1d). d. Step D: Embedding the conductor element (2) connected to the electrically conductive surface element (5) in insulating material (7) to form the printed circuit board (1). e. Step E: Extracting the connection points (1d) from the electrically conductive surface element (5) by locally removing surrounding sections of the electrically conductive surface element (5), preferably by etching. [2] Method according to claim 1, characterized by , that step A includes at least one of the following sub-steps: a. Partial step A1: Providing a form (3) with a preferably flat first side (3a) and at least one recess (3c) opening towards the first side (3a) of the form (3) for a conductor element (2). b. Sub-step A2: Arrange the shape (3) so that the first side (3a) of the shape (3) extends at least partially or completely in a horizontal plane. [3] Method according to any of the preceding claims, characterized by , that step B includes at least one of the following sub-steps: a. Partial step B1: Providing a conductor element (2) with at least two connecting element sections (2c) which are preferably arranged and / or attached on the same side (2a) and / or at different ends of the conductor element (2). b. Partial step B2: Arranging the conductor element (2) in the receptacle (3c) such that the conductor element (2) is preferably positively fitted and / or without play in the receptacle (3c) with respect to the plane of extension of the form (3), wherein the conductor element (2) is preferably aligned parallel to the plane of extension of the form (3). c. Sub-step B3: Arrange the conductor element (2) in the receptacle (3c) so that the side (2a) of the conductor element (2) provided with the connecting element sections (2c) is flush with the first side (3a) of the form (3) and the connecting element sections (2c) protrude beyond the first side (3a) of the form (3). d. Sub-step B4: Arranging insulating material (4), preferably an insulating material surface element (4), which preferably has openings (4c) adapted to the positions and, if applicable, shapes of the connecting element sections (2c), on the first side (3a) of the form (3), preferably such that a second side (4b) of the insulating material surface element (4) lies flat on the first side (3a) of the form (3) and on the first side (2a) of the conductor element (2) received in the receptacle (3c) of the form (3), wherein the connecting element sections (2c) are particularly preferably flush with a first side (4a) of the insulating material surface element (4). [4] Method according to any of the preceding claims, characterized by , that step C includes at least one of the following sub-steps: a. Partial step C1: Arranging the electrically conductive surface element (5) on the first side (3a) of the shape (3), optionally on the first side (4a) of the insulating surface element (4), preferably such that the electrically conductive surface element (5) lies flat on the first side (4a) of the insulating surface element (4) and / or flat on the connecting element sections (2c). b. Partial step C2: Arranging a first electrode (6a) of a connecting tool to produce an electrically conductive connection between the conductor element (2) and the electrically conductive surface element (5) on a first side (3a) of the shape (3), preferably such that the first electrode (6a) is in contact with the first side (5a) of the electrically conductive surface element (5). c. Sub-step C3: Arranging a second electrode (6b) of the connecting tool to produce an electrically conductive connection between the conductor element (2) and the electrically conductive surface element (5) on a second side (3b) of the form (3), preferably such that the second electrode (6b) is in contact with the second side (2b) of the conductor element (2) by passing through an opening (3d) in the form (3). d. Sub-step C4: Applying contact pressure between the first electrode (6a) and the second electrode (6b). e. Substep C5: Applying an electric current between the first electrode (6a) and the second electrode (6b). f. Partial step C6: Heating of the connecting element section (2c) until the required operating temperature is reached, so that the conductor element (2) and the electrically conductive surface element (5) are inseparably connected via the connecting element section (2c), preferably under the influence of a force between the electrodes (6a, 6b), by melting and solidifying of the material of the connecting element section (2c), by diffusion or in solid phase, preferably by welding. g. Sub-step C7: Removal of the first electrode (6a) from the first side (5a) of the electrically conductive surface element (5). h. Sub-step C8: Removing the second electrode (6b) from the second side (2b) of the conductor element (2) and taking the second electrode (6b) out of the opening (3d) in the shape (3). i. Sub-step C9: Applying at least one reference mark to the electrically conductive surface element (5), preferably by producing at least one opening. [5] Method according to any of the preceding claims, characterized by , that step D includes at least one of the following sub-steps: a. Sub-step D1: Removing the conductor element (2) from the mold (3). b. Partial step D2: Arranging insulating material (7) on the second side (5b) of the electrically conductive surface element (5) connected to the conductor element (2), optionally on the second side (4b) of the insulating surface element (4) arranged on the second side (5b) of the electrically conductive surface element (5), preferably as a mass or in the form of an insulating surface element (7), particularly preferably such that the insulating material (7) completely surrounds the conductor element (2) except for the positions of the provided connection points (1d). c. Sub-step D3: Applying pressure and, if necessary, heat to the insulating material (7) in the direction of the electrically conductive surface element (5), so that the insulating material (7) adapts to the contour of the conductor element (2) and, if necessary, connects with an existing insulating material (4). d. Sub-step D4: Smoothing the insulating material (7) on the side facing away from the electrically conductive surface element (5) to form a flat underside (1b) of the circuit board (1). e. Substep D5: Curing of the insulating material (7). [6] Method according to any of the preceding claims, characterized by , that step E includes the following sub-step: a. Extraction of conductive pathways (1e) by local removal of surrounding sections of the electrically conductive surface element (5), preferably by etching. [7] Arrangement comprising a mold (3) for manufacturing a printed circuit board (1), preferably by the method according to any one of claims 1 to 6, and at least one conductor element (2), wherein the mold (3) comprises at least one receptacle (3c) for the conductor element (2) in a first side (3a) of the mold (3) and at least one opening (3d) communicating with the receptacle (3c) for introducing a connecting tool in a second side (3b) of the mold (3), wherein the conductor element (2) is provided with at least two connecting element sections (2c) which are preferably arranged and / or attached to the same side and / or to different ends of the conductor element (2), and the conductor element (2) is arranged in the receptacle (3c) such that the conductor element (2) is positively engaged and / or without play in the receptacle (3c) with respect to the plane of extension of the mold (3),wherein the conductor element (2) is aligned parallel to the extension plane of the form (3) and the side of the conductor element (2) provided with the connecting element sections (2c) is flush with the first side (3a) of the form (3) and the connecting element sections (2c) protrude beyond the first side (3a) of the form (3).

Images