Chip card module, chip card and method for manufacturing a chip card module

Abstract

Chip card module (200), comprising: • a carrier (107); • an integrated circuit (100) arranged on the carrier (107) by flip-chip technology; • a lid (114) comprising a polymer, which projects at least partially laterally over the integrated circuit (100), the integrated circuit (100) being arranged between the lid (114) and the support (107); and • Adhesive (110) between the lid (114) and the support (107) for attaching the lid (114) to the support (107); • wherein the adhesive (110) has a concave structure (126) at least along an edge region; • wherein a further adhesive (110) is arranged between the integrated circuit (100) and the carrier (107), and wherein the adhesive and the further adhesive (108) are made of the same material.

Description

[0001] The invention relates to a chip card module, a chip card and a method for producing a chip card module.

[0002] When manufacturing a chip card, a chip card module containing a chip is usually inserted, e.g. glued, into a cavity of a chip card body.

[0003] With flip-chip assembly of the chip onto a chip card module carrier (corresponding products are also referred to as FCOS products, which stands for "flip chip on substrate"), the chip card module can be very small. This means that a small cavity must be precisely milled to fit the module before it can be implanted into the card body.

[0004] Overall, this is only partially successful because it has several disadvantages, such as the fact that a customer who typically carries out the implantation has to adapt the implantation process for the FCOS products at great expense, that the systems used cannot achieve the required accuracy, and / or that small milling cutters have to be used due to the small cavities, which reduces throughput.

[0005] US 6 104 093 A discloses a manufacturing method for a flip-chip package which remains flat over a wide temperature range and enables good heat dissipation.

[0006] US 2014 / 0 104 133 A1 discloses a flip-chip chip card module which is integrated into a smart card.

[0007] Grundler, M., Derieth, T., and Heinzel, A.: Polymer compounds with high thermal conductivity. In: AIP Conference Proceedings 1779, 2016, they disclose a polymer with high thermal conductivity.

[0008] EP 2 738 714 A1 discloses a chip card with a chip module mounted by means of a ball grid array.

[0009] A chip card module according to claim 1, a chip card according to claim 9, and a method for manufacturing a chip card module according to claim 11 are provided. Further embodiments are described in the dependent claims.

[0010] In various embodiments, a chip card module is provided in which a plate is glued to a back side of the flip chip like a cover.

[0011] The plate and the adhesive used to attach it can be selected in such a way that a concave groove is created, which can also mean that the plate protrudes laterally.

[0012] This can increase the mechanical and thermal robustness of the chip card module. This can be particularly relevant for chip card modules used in security applications (also known as Digital Security Solutions (DSS)), as these types of chip card modules may need to meet specific requirements.

[0013] In addition, it is possible to use the same processes as for implanting chip card modules that do not use a flip chip.

[0014] In various embodiments, the same adhesive as used in flip-chip assembly (a previous process) can be used to bond the lid.

[0015] Embodiments of the invention are illustrated in the figures and are explained in more detail below.

[0016] It shows Fig. 1A to 1E illustrate a method for manufacturing a chip card module according to various embodiments; Fig. 2 a schematic cross-sectional view of a chip card module according to various embodiments; Fig. 3 shows a chip card according to various embodiments as a schematic plan view and schematic cross-sectional representation; Fig. 4 an illustration of a method for producing a chip card module according to various embodiments; and Fig. 5 a flowchart of a method for producing a chip card module according to various embodiments.

[0017] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology such as "top," "bottom," "front," "back," "fore," "rear," etc., will be used with reference to the orientation of the described figure(s). Since components of embodiments can be positioned in a number of different orientations, the directional terminology is for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention.It is understood that the features of the various exemplary embodiments described herein may be combined with one another unless specifically stated otherwise. The following detailed description is therefore not to be construed in a limiting sense, and the scope of the present invention is defined by the appended claims.

[0018] Throughout this description, the terms "connected," "attached," and "coupled" are used to describe both a direct and an indirect connection, a direct or indirect connection, and a direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference numerals where appropriate.

[0019] Fig. 1A to Fig. 1E show an illustration of a method for manufacturing a chip card module according to various embodiments, and Fig. Figure 2 shows a schematic cross-sectional view of a chip card module 200 according to various embodiments. The chip card module 200 can, for example, implement the result of the Fig. 1A to Fig. 1E shown procedure.

[0020] The method for manufacturing the chip card module 200 comprises, as shown in Fig. 1A, the result is flip-chip mounting of an integrated circuit 100 onto a carrier 107. Flip-chip mounting is to be understood as meaning that contacts 100C of the integrated circuit 100 (e.g., a semiconductor chip) are brought into direct contact with contact pads 104C arranged on the carrier 107, e.g., as part of a metallization structure 104.

[0021] In various embodiments, essentially known methods for flip-chip assembly can be used, e.g., soldering, pressure welding, or gluing (e.g., using conductive adhesive, e.g., isotropic or anisotropic adhesive) of the contacts 100C to the contact pads 104C. If a space between the integrated circuit 100 and the carrier 107 is not already filled by the contacting method (usually, for example, assembly using anisotropic conductive adhesive leads to filling the space), in various embodiments, the space can be filled using an electrically insulating adhesive 108, also referred to as underfill. An epoxy adhesive, for example, can be used as the adhesive 108.

[0022] In various embodiments, the carrier 107 may comprise a substrate 102. The substrate 102 may be electrically insulating. The carrier 107 may be flexible. This may be achieved, for example, by a suitable combination of carrier material and thickness of the carrier 107.

[0023] The carrier 107, e.g., the substrate 102, can comprise or consist of polyimide, polyethylene terephthalate, polyethylene naphthalate, and / or epoxy in various embodiments. The carrier 107 (e.g., the substrate 102) can, for example, be formed as a laminate of one or more of the aforementioned materials and / or other suitable materials. Optionally, the substrate 102 can be fiber-reinforced (e.g., glass-fiber reinforced).

[0024] A thickness of the carrier 107 may, in various embodiments, be in a range from approximately 40 µm to approximately 200 µm, e.g., in a range from approximately 80 µm to approximately 150 µm, e.g., around 120 µm.

[0025] A thickness of the substrate 102 may, in various embodiments, be in a range from about 20 µm to about 100 µm, eg, in a range from about 30 µm to about 80 µm, eg, about 50 µm.

[0026] A thickness of the conductive layer 104 and / or a thickness of the further conductive layer 103 can, in various embodiments, be in a range from approximately 10 µm to approximately 50 µm, e.g., in a range from approximately 20 µm to approximately 40 µm, e.g., around 35 µm.

[0027] In various embodiments, the carrier 107 can have an electrically conductive layer 104, e.g., a structured conductive layer, for example, a rewiring metal layer. The contact areas 104C can be formed as part of the conductive layer 104. The conductive layer 104 can be formed in a substantially known manner. It can, for example, comprise or consist of copper or aluminum. For example, the conductive layer can be formed as an adhesively bonded, structured, and plated copper foil. The conductive layer 104 can be formed in one or more layers.

[0028] In various embodiments, the carrier 107 can have a further electrically conductive layer 103, e.g., a structured further conductive layer. The further electrically conductive layer 103 can be arranged on a side of the substrate 102 opposite the electrically conductive layer 104. The further electrically conductive layer 103 can form external contact areas, e.g., external contact areas according to ISO 7816, which can enable contact-based access to the integrated circuit 100. An electrically conductive connection between the external contact areas 103 and the electrically conductive layer 104 (and thus the integrated circuit 100 connected thereto) can be provided by means of a plurality of vias 106.

[0029] The method for manufacturing the chip card module 200 comprises, as shown in Fig. 1B to Fig. 1E, a cover 114 is bonded to the carrier 107, e.g., by means of an adhesive 110. The bonding is carried out in such a way that the cover 114 projects laterally beyond the integrated circuit 100, the integrated circuit 100 is arranged between the cover 114 and the carrier 107, and the adhesive 110 forms a concave structure 126 at least at one edge region (see Fig. 2).

[0030] As in Fig. 1B, the adhesive 110 can be applied in viscous form to the carrier 107 for bonding. For this purpose, an adhesive application device 112 that is variably positionable at least horizontally (typically also vertically) and has a metering valve can be designed (e.g., by means of nozzles and / or adhesive conducting structures) and arranged above the integrated circuit 100 such that a controlled application of the viscous adhesive 110 is enabled exclusively to designated locations on the carrier 107. The viscosity of the adhesive 110 can be set such that the adhesive 110 remains in the designated area until it has completely cured and does not flow into unintended areas of the carrier 107. The viscosity of the adhesive 110 can, for example, be in a range of approximately 10 Pa s to 1000 Pa s.If the viscosity of the adhesive 110 is not within the desired viscosity range at a typical application temperature, the temperature of the adhesive 110 can be adjusted during application so that the viscosity is within the desired range.

[0031] The adhesive 110 can be selected so that it has an adhesive strength to the carrier 107 and the cover 114.

[0032] The adhesive 110 is positioned on the carrier 107 such that after the cover 114 has been glued on, it is located between the cover 114 and the carrier 107.

[0033] Dosing of the adhesive 110 can be carried out in such a way that during the bonding and in particular after the curing of the adhesive 110, the adhesive is completely or at least substantially completely located between the cover 114 and the carrier 107. This is in Fig. 1C to Fig. 1E and in Fig. 2. Excessive dosing of the adhesive 110, which may, for example, result in the adhesive 110 swelling out from under the cover 114 by 10 µm or more (e.g., several dozen µm), may result in an edge of the adhesive 110 solidifying into a bead and causing the carrier 107 to bend / warp upon solidification (edge ​​regions of the carrier 107 are then bent upwards toward the adhesive 110).

[0034] The method for manufacturing the chip card module 200 may include gluing the cover 114 as shown in Fig. 1C, may include disposing the lid 114 on the adhesive 110.

[0035] This can be done in different versions, such as Fig. 1C, by means of a positioning tool 120, which may include a movable punch 118 and a holder 116 for picking up and placing the cover 114. For example, a pick-and-place tool commonly used for chip positioning may be used.

[0036] In various embodiments, the cover 114 can be arranged centered over the integrated circuit 100. In other words, the cover 114 can be arranged such that its center of surface is located above a center of surface of the integrated circuit 100.

[0037] The cover 114 can be designed to completely cover the integrated circuit 100. The cover 114 can protrude laterally beyond the integrated circuit 100 in any direction. For example, the cover can protrude laterally beyond the integrated circuit by at least 0.5 mm, e.g., at least 1 mm, in any direction. When using an integrated circuit 100 with typical dimensions of approximately 1.5 mm x 2 mm, this means that the cover 114 can have a size of at least 2.5 mm x 3 mm.

[0038] The cover 114 can have essentially any shape, provided that complete coverage of the circuit 100 and the adhesive 110 arranged between the cover 114 and the carrier 107 (and, if applicable, a desired minimum projection) is ensured. With regard to its lateral configuration, the cover 114 can be, for example, rectangular (e.g., square), oval (e.g., round), or generally polygonal, e.g., round or rectangular with one or more projections. A round cover 114 can make it possible to form a round cavity in a chip card body for inserting the chip card module, which is particularly quick and easy to manufacture.

[0039] In various embodiments, e.g., to replicate currently common chip card module sizes or to be able to fit into common cavities (openings) in a chip card body, the cover 114 can have a maximum size of 8.2 mm x 8.2 mm.

[0040] A lid size that is favorable with regard to manufacturing tolerances (e.g. dosage of the adhesive 110, positioning of the lid 114 relative to the previously arranged adhesive 110 and / or to the carrier 107, etc.) can, in various embodiments, have a side length in a range from approximately 4 mm to approximately 8.2 mm, e.g. 5 mm, for a rectangular lid 114 (e.g. a square lid 114 with a size of 5 mm x 5 mm), and for a round lid 114, e.g. a diameter in a range from approximately 4 mm to approximately 8.2 mm, e.g. 5 mm.

[0041] The cover 114 may have a maximum thickness in a range of about 200 µm, eg a thickness in a range of about 50 µm to about 200 µm, eg from about 80 µm to about 150 µm, eg around 110 µm.

[0042] In various embodiments, the cover 114 may comprise or consist of a polymer, metal, and / or ceramic. In other words, the cover 114 may consist of a single material, e.g., a polymer, a metal, or a ceramic material, or the cover 114 may comprise several different materials, e.g., as a laminate of different materials, e.g., different metals, different polymers, different ceramic materials, one or more metals and one or more polymers, one or more metals and one or more ceramic materials, one or more polymers and one or more ceramic materials, one or more metals, one or more polymers, and one or more ceramic materials, etc.

[0043] In various embodiments, the lid 114 can be punched or sawn out of a film of lid material.

[0044] In various embodiments, the cover can be designed such that it fulfills a further function in addition to its stabilizing function, e.g. a shielding function for shielding the integrated circuit 100 against electromagnetic radiation or the like.

[0045] In various embodiments, the cover 114 may be designed to have a flexural rigidity that is so great that it does not bend, or does not bend significantly, when the adhesive 110 cures.

[0046] A sufficient bending stiffness, which can be influenced by the material, the thickness and the size of the cover 114, can be present, for example, if when the cover is held at a point (e.g. mounted on a point below the center of gravity of the cover 114) no deflection of the cover 114 occurs under the influence of gravity.

[0047] In various embodiments, a square cover made of an epoxy glass fiber fabric with a thickness of 110 µm and an edge length of 5 mm or a round cover 114 made of an epoxy glass fiber fabric with a thickness of 110 µm and a diameter of 5 mm can be used.

[0048] The method for manufacturing the chip card module 200 can be as in Fig. 1D and Fig. 1E, a curing of the adhesive 110.

[0049] In various embodiments, the curing of the adhesive 110 may involve heating or irradiation with UV light, which is illustrated by the sun symbols 122.

[0050] In various embodiments, the adhesive 110 can be electrically insulating, e.g., an epoxy adhesive. In various embodiments in which the integrated circuit 100 is bonded to the carrier 107 by means of the adhesive 108, which represents a further adhesive, the adhesive 110 comprises the same material as the adhesive 108. For example, both the adhesive 108 and the adhesive 110 can be an epoxy, e.g., an adhesive typically used for die bonding.

[0051] In various embodiments, for example, in a case where the flip-chip assembly comprises attaching (e.g., soldering, pressure welding, or bonding using an isotropic conductive adhesive) the contacts 100C of the integrated circuit 100 to the contact pads 104C, and the space between the integrated circuit 100 and the carrier 107 is to be filled as an underfill using the adhesive 108, the application of the adhesive 108 may occur during the bonding of the lid 114. In other words, after attaching the integrated circuit 100, the application of the adhesive 108 and the application of the adhesive 110 may occur in a single operation.

[0052] In various embodiments, the adhesive 110 may decrease in volume upon solidification. As a result, the adhesive 110 may, as shown in Fig. 1E is illustrated by the arrows and in Fig. 2 is shown in the result, along an edge region, e.g. along its entire side edge, form a concave structure 126, also referred to as a groove.

[0053] The reduction in volume may mean that the adhesive 110 may have a modulus of elasticity (e.g., at 20°C) which may be, for example, between about 1.5 GPa and about 5 GPa, for example, between about 3.5 GPa and about 5 GPa, for example, around 4 GPa.

[0054] Illustratively, due to the elastic modulus of the adhesive 110 and the flexural rigidity of the carrier 107, a “force equilibrium” can be established between a tensile force of the adhesive 110 and a restoring force of the carrier 107 and lead to the formation of the concave structure 126.

[0055] The formation of the concave structure 126 can prevent or at least reduce bending / warping of the carrier 107 when the adhesive 110 solidifies, as described above in connection with the bead formation of the adhesive 110 at the edge, which can better ensure that (e.g. by means of a card reader) simultaneous contacting of all required external contact surfaces 103 can take place, and thus improve the functionality of the chip card module 200.

[0056] In various embodiments, a portion of the adhesive 110 may be located between the integrated circuit 100 and the lid 114. This is shown in the enlarged view of Fig. 2. This ensures optimal adhesion of the cover 114 to the integrated circuit 100. In various embodiments, the adhesive 110 between the cover 114 and the integrated circuit 100 can be omitted, for example, if the cover 114 is significantly larger than the integrated circuit 100.

[0057] In various embodiments, an overall height of the chip card module 200 is easily controllable (e.g., due to easily controllable tolerances).

[0058] In various embodiments, mechanical and thermal robustness can be increased in a flip-chip card module 200.

[0059] In various embodiments, a simple process is provided in which tools already used elsewhere (e.g., the adhesive application device 112 and / or the positioning tool 120) can be used to provide a chip card module 200 with increased robustness and improved functionality.

[0060] Fig. 3 shows a chip card 300 according to various embodiments as a schematic plan view (top) and as a schematic cross-sectional view along the line AA' (bottom).

[0061] The chip card 300 can be formed according to various embodiments by forming an opening 332 in a chip card body 330 and arranging a chip card module 200, which was formed according to one of the above embodiments, in the opening 332.

[0062] The chip card module 200 can be arranged, e.g., secured, in the opening 332 using essentially known methods. For example, the chip card module 200 can be glued into the opening 332 using a further adhesive 334, e.g., an electrically insulating adhesive.

[0063] The opening may have a depth large enough to completely accommodate the chip card module 200.

[0064] Fig. 4 is an illustration of a method for manufacturing a chip card module 200 according to various embodiments, in which, in contrast to the method described with reference to Fig. 1A to Fig. 1E and Fig. 2, the cover 114 is glued to the carrier 107 when a plurality of chip card modules 200, each of which has an integrated circuit 100, has not yet been separated but is still in a module assembly 400.

[0065] In contrast to the pick-and-place method described above for arranging the cover 114 on the adhesive 110, here a plurality of covers 114 can be arranged simultaneously on the plurality of integrated circuits 100 on which the adhesive 110 has already been arranged substantially as described above.

[0066] The simultaneous arrangement of the covers 114 can be carried out, for example, by, as in Fig. 4, the plurality of covers 114 are connected to one another by means of connecting structures 440, e.g. by means of webs 440 or similar.

[0067] In various embodiments, the connecting structures 440 may comprise the same material as the covers 114 and may be produced in a common structuring process when producing the covers 114.

[0068] In another embodiment, the lids 114 can be or will be arranged on a lid carrier, e.g. a carrier film, which can be removed after the lids 114 have been arranged together.

[0069] After the covers 114 have been arranged together and the adhesive 110 has hardened, the module assembly 400 can be separated into the chip card modules 200 in a substantially known manner, e.g. along the dashed lines 442 in Fig. 4. If necessary, the connecting structures 440 can be severed.

[0070] Fig. 5 a flowchart 500 of a method for producing a chip card module according to various embodiments.

[0071] The method includes flip-chip mounting of an integrated circuit onto a carrier (at 510).

[0072] The method further comprises adhering a cover to the carrier such that the cover projects laterally beyond the integrated circuit, the integrated circuit is arranged between the cover and the carrier, and the adhesive has a concave structure at least at one edge region (at 520).

[0073] Some examples of implementation are summarized below.

[0074] Embodiment 1 is a chip card module. The chip card module comprises a carrier, an integrated circuit arranged on the carrier using flip-chip technology, a cover that projects at least partially laterally beyond the integrated circuit, wherein the integrated circuit is arranged between the cover and the carrier, and adhesive between the cover and the carrier for attaching the cover to the carrier, wherein the adhesive has a concave structure at least along an edge region.

[0075] Embodiment 2 is a chip card module according to embodiment 1, wherein the cover completely covers the integrated circuit.

[0076] Embodiment 3 is a chip card module according to embodiment 1 or 2, wherein the cover projects laterally beyond the integrated circuit in every direction.

[0077] Embodiment 4 is a chip card module according to one of the preceding embodiments, wherein the cover projects laterally beyond the integrated circuit by at least 1 mm in every direction.

[0078] Embodiment 5 is a chip card module according to one of the preceding embodiments, wherein the cover has a maximum size of 8.2 mm x 8.2 mm.

[0079] Embodiment 6 is a chip card module according to one of the preceding embodiments, wherein the cover has a maximum thickness in a range of 50 µm to 200 µm.

[0080] Embodiment 7 is a chip card module according to one of the preceding embodiments, wherein the cover comprises at least one material from a group of materials, the group comprising: Polymer; metal; and Ceramics.

[0081] Embodiment 8 is a chip card module according to one of the preceding embodiments, wherein the cover has a flexural rigidity which is so great that when held at a point under the influence of gravity, no deflection of the cover occurs.

[0082] Embodiment 9 is a chip card module according to one of the preceding embodiments, wherein the cover is round or oval.

[0083] Embodiment 10 is a chip card module according to one of the preceding embodiments, wherein the cover shields the integrated circuit from electromagnetic radiation.

[0084] Embodiment 11 is a chip card module according to one of the preceding embodiments, wherein the adhesive is located entirely beneath the cover.

[0085] Embodiment 12 is a chip card module according to one of the preceding embodiments, wherein the adhesive has a modulus of elasticity that is between 1.5 GPa and 5 GPa.

[0086] Embodiment 13 is a chip card module according to one of the preceding embodiments, wherein the adhesive is electrically insulating.

[0087] Embodiment 14 is a chip card module according to one of the preceding embodiments, wherein part of the adhesive is located between the integrated circuit and the cover.

[0088] Embodiment 15 is a chip card module according to one of the preceding embodiments, wherein the adhesive reduces its volume upon solidification.

[0089] Embodiment 16 is a chip card module according to one of the preceding embodiments, wherein the adhesive is an epoxy adhesive.

[0090] Embodiment 17 is a chip card module according to one of the preceding embodiments, wherein the integrated circuit is arranged on the carrier by means of a further adhesive, and wherein the adhesive and the further adhesive comprise the same material.

[0091] Embodiment 18 is a chip card module according to one of the preceding embodiments, wherein the carrier is flexible.

[0092] Embodiment 19 is a chip card module according to one of the preceding embodiments, wherein the carrier comprises at least one material from a group of materials, the group consisting of polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate and epoxy.

[0093] Embodiment 20 is a chip card module according to one of the preceding embodiments, wherein the carrier comprises a laminate.

[0094] Embodiment 21 is a chip card module according to one of the preceding embodiments, wherein the carrier has an electrically conductive layer.

[0095] Embodiment 22 is a chip card module according to one of the preceding embodiments, wherein the carrier has a thickness in a range of 40 µm to 200 µm.

[0096] Embodiment 23 is a chip card. The chip card comprises a chip card body with a cavity and a chip card module according to one of embodiments 1 to 22, wherein the chip card module is arranged in the cavity.

[0097] Embodiment 24 is a chip card according to embodiment 23, wherein lateral dimensions of the cover are smaller than lateral dimensions of the cavity, so that the cover can be arranged completely in the cavity.

[0098] Embodiment 25 is a chip card according to embodiment 24, wherein a thickness of the chip card module is smaller than a depth of the cavity, so that the chip card module can be arranged completely within the cavity.

[0099] Embodiment 26 is a method for manufacturing a chip card module. The method comprises flip-chip mounting of an integrated circuit onto a carrier and adhesively bonding a cover to the carrier such that the cover projects laterally beyond the integrated circuit, the integrated circuit is arranged between the cover and the carrier, and the adhesive has a concave structure at least at one edge region.

[0100] Embodiment 27 is a method according to embodiment 26, wherein the bonding comprises disposing the adhesive in viscous form between the lid and the carrier and curing the adhesive.

[0101] Embodiment 28 is a method according to Embodiment 27, wherein the curing comprises heating or irradiating with UV light.

[0102] Embodiment 29 is a method according to any one of embodiments 26 to 28, wherein the lid completely covers the integrated circuit.

[0103] Embodiment 30 is a method according to any one of embodiments 26 to 29, wherein the lid projects laterally beyond the integrated circuit in any direction.

[0104] Embodiment 31 is a method according to any one of embodiments 26 to 30, wherein the lid protrudes laterally beyond the integrated circuit by at least 1 mm in each direction.

[0105] Embodiment 32 is a method according to any one of embodiments 26 to 31, wherein the lid has a maximum size of 8.2 mm x 8.2 mm.

[0106] Embodiment 33 is a method according to any one of embodiments 26 to 31, wherein the lid has a maximum thickness in a range of 50 µm to 200 µm.

[0107] Embodiment 34 is a method according to any one of embodiments 26 to 33, wherein the lid comprises at least one material from a group of materials comprising the group: polymer, metal and ceramic.

[0108] Embodiment 35 is a method according to any one of embodiments 26 to 34, wherein the lid has a flexural rigidity that is so great that when held at a point under the influence of gravity, no deflection of the lid occurs.

[0109] Embodiment 36 is a method according to any one of embodiments 26 to 35, wherein the lid is round or oval.

[0110] Embodiment 37 is a method according to any one of embodiments 26 to 36, wherein the cover shields the integrated circuit from electromagnetic radiation.

[0111] Embodiment 38 is a method according to any one of embodiments 26 to 37, wherein the adhesive is located entirely beneath the lid.

[0112] Embodiment 39 is a method according to any one of embodiments 26 to 38, wherein the adhesive has a modulus of elasticity between 1.5 GPa and 5 GPa.

[0113] Embodiment 40 is a method according to any one of embodiments 26 to 39, wherein the adhesive is electrically insulating.

[0114] Embodiment 41 is a method according to any one of embodiments 26 to 40, wherein a portion of the adhesive is located between the integrated circuit and the lid.

[0115] Embodiment 42 is a method according to any one of embodiments 26 to 41, wherein the adhesive reduces its volume upon solidification.

[0116] Embodiment 43 is a method according to any one of embodiments 26 to 42, wherein the adhesive is an epoxy adhesive.

[0117] Embodiment 44 is a method according to any one of embodiments 26 to 43, wherein the method further comprises bonding the integrated circuit to the carrier by means of a further adhesive, wherein the adhesive and the further adhesive comprise the same material.

[0118] Embodiment 45 is a method according to any one of embodiments 26 to 44, wherein the carrier is flexible.

[0119] Embodiment 46 is a method according to any one of embodiments 26 to 45, wherein the carrier comprises at least one material from a group of materials, the group consisting of polyimide, polyethylene terephthalate, polyethylene naphthalate and epoxy.

[0120] Embodiment 47 is a method according to any one of embodiments 26 to 46, wherein the carrier comprises a laminate.

[0121] Embodiment 48 is a method according to any one of embodiments 26 to 47, wherein the carrier has an electrically conductive layer.

[0122] Embodiment 49 is a method according to any one of embodiments 26 to 48, wherein the carrier has a thickness in a range of 40 µm to 200 µm.

[0123] Embodiment 50 is a method for producing a chip card. The method may include arranging a chip card module according to one of embodiments 1 to 21 in a cavity of a chip card body.

[0124] Embodiment 51 is a method according to embodiment 50, wherein lateral dimensions of the cover are smaller than lateral dimensions of the cavity, so that arranging the chip card module in the cavity comprises at least completely arranging the cover in the cavity.

[0125] Embodiment 52 is a method according to embodiment 51, wherein arranging the chip card module in the cavity comprises arranging the chip card module completely within the cavity.

[0126] Further advantageous embodiments of the method emerge from the description of the device and vice versa.

Claims

[1] Chip card module (200), comprising: • a carrier (107); • an integrated circuit (100) arranged on the carrier (107) using flip-chip technology; • a cover (114) comprising a polymer and projecting at least partially laterally beyond the integrated circuit (100), wherein the integrated circuit (100) is arranged between the cover (114) and the carrier (107); and • Adhesive (110) between the lid (114) and the support (107) for fixing the lid (114) to the support (107); • wherein the adhesive (110) has a concave structure (126) at least along an edge region; • wherein a further adhesive (110) is arranged between the integrated circuit (100) and the carrier (107), and wherein the adhesive and the further adhesive (108) comprise the same material. [2] Chip card module (200) according to claim 1, wherein the cover (114) completely covers the integrated circuit (100). [3] Chip card module (200) according to claim 1 or 2, wherein the cover (114) projects laterally beyond the integrated circuit (100) in any direction. [4] Chip card module (200) according to one of the preceding claims, wherein the cover (114) further comprises at least one further material from a group of materials, the group comprising: metal; and Ceramics. [5] Chip card module (200) according to one of the preceding claims, wherein the cover (114) has a flexural rigidity which is so great that when held at a point under the influence of gravity, no deflection of the cover (114) occurs. [6] Chip card module (200) according to one of the preceding claims, wherein the adhesive (110) has a modulus of elasticity that is between 1.5 GPa and 5 GPa. [7] Chip card module (200) according to one of the preceding claims, wherein the adhesive (110) reduces its volume upon solidification. [8] Chip card module (200) according to one of the preceding claims, wherein the adhesive and the further adhesive (108) are arranged during a single operation. [9] Chip card (300), comprising • a chip card body (330) with a cavity (332); and • a chip card module (200) according to one of claims 1 to 8, wherein the chip card module (200) is arranged in the cavity (332). [10] Chip card (300) according to claim 9, wherein lateral dimensions of the cover (114) are smaller than lateral dimensions of the cavity (332), so that the cover (114) can be arranged completely in the cavity (332). [11] A method for producing a chip card module, the method comprising: • Flip-chip mounting of an integrated circuit onto a carrier (510); • Arranging a further adhesive (110) between the integrated circuit (100) and the carrier (107), wherein the adhesive and the further adhesive (108) comprise the same material; and • Adhering a cover comprising a polymer to the carrier in such a way that the cover projects at least partially laterally beyond the integrated circuit, the integrated circuit is arranged between the cover and the carrier and the adhesive has a concave structure at least at one edge region (520). [12] The method of claim 11, wherein the lid completely covers the integrated circuit. [13] A method according to claim 11 or 12, wherein the adhesive reduces its volume upon solidification.

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