Multi-branch connector for integrated circuit (IC) unit

Abstract

Integrated circuit unit, IC unit, (300) comprising: a chip (230); a first connection (110-1, 220-2) which is connected to the chip (230) via a first wire (225-2); a second terminal (110-2, 220-3) which is connected to the chip (230) via a second wire (225-4); and a multi-branch connection (110-3, 210), comprising: a first branch (120-2) which has an active connection to the chip (230), a second branch (120-3) which has a passive connection with the second terminal (110-2, 220-3), and a third branch (120-1) which is designed as part of a support structure of the IC unit (105); wherein the first and second branches (120-2, 120-3) each have a base connected to the third branch (102-1) and an end separated from the third branch (120-1) by a gap.

Description

BACKGROUND

[0001] An integrated circuit (IC) may include one or more components of an electronic circuit. The one or more components may be included in a semiconductor chip (e.g., a silicon chip). In some aspects, the IC may be integrated into one or more electronic circuits for various applications. The one or more electronic circuits may be implemented, configured, and / or built using a printed circuit board (PCB). US 2018 / 0 113 001 A1 discloses an integrated circuit device comprising a chip and a multi-branch terminal having a first branch with an active connection to the chip and a second branch with a passive connection to another terminal and, via this, to the chip. Further integrated circuit devices are disclosed in JP 2003-163 322 A, JP 2010-103 257 A, and JP 2003-243 595 A. SUMMARY

[0002] According to some implementations, a multi-branch terminal of an integrated circuit (IC) may include a first branch that may include an active connection to a die of the IC, where the active connection may include a wire connected to the die of the IC; and a second branch that may include a passive connection to the die of the IC, where the passive connection may include a capacitor connected to the second branch and a first terminal of the IC.

[0003] According to some implementations, an integrated circuit (IC) device may include a chip, a first terminal connected to the chip via a first wire, a second terminal connected to the chip via a second wire, and a multi-branch terminal. The multi-branch terminal may include a first branch with an active connection to the chip and a second branch with a passive connection to the second terminal.

[0004] According to some implementations, a circuit for an alternator may include an integrated circuit (IC). The IC may include a chip, a first terminal connected to the chip via a first wire, a second terminal connected to the chip via a second wire, and a multi-branch terminal. The multi-branch terminal may include a first branch including an active connection to the chip, the active connection including a third wire connected to the chip, and a second branch including a passive connection to the second terminal, the passive connection including an internal capacitor connected to the second branch and the second terminal. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram of an exemplary implementation described herein. Fig. 2 is a diagram of an integrated circuit in which the elements and / or circuits described herein may be implemented. Fig. 3 is a diagram of an exemplary implementation of the integrated circuit of Fig. 2. Fig. 4 is a flow diagram of an exemplary process associated with providing a multi-branch connector for an integrated circuit device. DETAILED DESCRIPTION

[0005] The following detailed description of the exemplary implementations refers to the accompanying drawings. The same reference numbers in different drawings may identify the same or similar elements.

[0006] In some cases, an integrated circuit (IC) unit is coupled to one or more components within a circuit. For example, within an alternator (e.g., a vehicle), a transistor (TO) outline package may be coupled to a capacitor within a circuit associated with the alternator. In such cases, both the capacitor and the TO package may need to be installed within an alternator housing, which may require the alternator housing to be large enough to accommodate the capacitor and the TO package. Furthermore, in such cases, the capacitor must be a custom capacitor designed specifically for the housing and / or for coupling with the TO package, resulting in the need for specialty capacitors and / or a more complex capacitor assembly process.Furthermore, there may be a relatively large distance between the capacitor and the TO package if they are installed separately within the circuit. The greater the distance between the capacitor and the TO package within the circuit, the more the noise immunity of a signal output from the TO package may be reduced and / or the higher the noise emission within the signal output may be.

[0007] Some of the implementations described herein provide a multi-branch connector for an IC device to enable an active connection and a passive connection to a die of the IC device. As described herein, to facilitate the passive connection within the IC device, a component (e.g., a capacitor) not contained on the die of the IC device may be integrated within a package of the IC device. Thus, when installing the IC device within a circuit and / or within a package (e.g., a package of a device that uses the circuit), the assembly process of the IC device may be simplified because only a single component is assembled rather than two separate components.

[0008] Furthermore, some implementations described herein allow a device package including the IC device and / or the IC device circuitry to be formed to have a lower volume (or be smaller) than a device package not including implementations described herein. For example, the package would not need to have space for the IC device and a separate component because a multi-branch IC device terminal as described herein may allow for the installation of a smaller, standard component within the IC device. Therefore, some implementations may conserve materials and / or manufacturing resources by allowing more packages to be made from the same amount of material as with prior techniques.According to some implementations described herein, the ability to incorporate a capacitor into an IC package provides improved noise immunity and reduced noise emission within an output signal. This can improve the quality of the signal, allowing for the conservation of power supply resources and / or processing resources that may be associated with attempting to process output signals with relatively higher noise levels, as was the case with prior techniques.

[0009] Fig. 1 is a diagram of an exemplary implementation 100 described herein. The exemplary implementation 100 of Fig. 1 includes an IC device 105 having three terminals 110-1 through 110-3 (hereinafter collectively referred to as terminals 110 and individually as terminal 110). In some implementations, the IC device 105 may be configured to be integrated into a circuit (e.g., an alternator circuit) by inserting the terminals 110 into a substrate (e.g., a printed circuit board (PCB) and / or the like) associated with the circuit. The terminals 110 may be soldered and / or electrically connected to the vias of the substrate.

[0010] As in the exemplary implementation 100 of Fig. 1, the terminal 110-3 is a multi-branch terminal. Accordingly, the terminal 110-3 is referred to below as the multi-branch terminal 110-3. The multi-branch terminal 110-3 includes three branches 120-1 through 120-3 (hereinafter collectively referred to as branches 120 and individually as branch 120). The branches 120 may be formed from and / or attached to the terminal 110-3 of the IC device 105. In some implementations, the multi-branch terminal 110-3 may be a ground terminal of the IC device 105. A first branch 120-1 of the multi-branch terminal 110-3 may be connected to or formed as part of a frame or support structure of the IC device 105. In some implementations, the second branch 120-2 may be connected (e.g., via a wire) to a chip of the IC device 105 via an active connection 130. The active connection 130 may include a wire (or line) from the branch 120-2 to the chip of the IC device 105.

[0011] How to continue in Fig. 1, a third leg 120-3 of the multi-leg connector 110-3 includes a passive connection 140 to another leg 110-2 of the IC device 105. For example, the passive connection 140 may include a component, such as a capacitor (e.g., a surface mount capacitor). According to some implementations, the component may be a standard component with standard dimensions and / or standard characteristics. In some implementations, the component of the passive connection 140 may be installed during manufacture of the IC device 105. In some implementations, the second leg 110-2 may be connected (e.g., via a wire) to a chip of the IC device 105.

[0012] In Fig. 1, each branch 120 of the multi-branch terminal 110-3 is contained within the IC package 105 (e.g., within a package of the IC package 105). For example, each of the branches 120 from the base to the end of the branch may be enclosed within the IC package 105. Accordingly, as illustrated, the IC package 105 does not appear to contain a multi-branch terminal when viewed externally. Furthermore, the inclusion of branches 120 of the multi-branch terminal 110-3 enables a passive connection from one or more branches 120 to one or more terminals 110 of the IC package 105. Thus, each component used in the passive connection may be embedded within the IC package 105 so that the component can be as close as possible to the die of the IC package 105 to improve noise immunity and reduce noise emissions within an output signal of the IC package 105.

[0013] Accordingly, the exemplary implementation 100 provides an IC device 105 with a multi-branch connector 110-3 to enable an active connection 130 and a passive connection 140 between the multi-branch connector 110-3 and a chip of the IC device. Thus, the multi-branch connector 110-3 provides additional surface area for the active connection 130 and the passive connection 140 to be incorporated into the IC device 105 (rather than externally). Accordingly, the multi-branch connector 110-3 enables a component (e.g., a capacitor) of the passive connection 140 to be embedded into the IC device 105. Therefore, the multi-branch connector 110-3 and / or the IC device 105 of the exemplary implementation 100 may enable ease of handling during installation and / or creation of a circuit to include the IC device 105 and the component.For example, the multi-branch connector 110-3 may facilitate the design of the circuit within a printed circuit board, the installation of a component within a package of the IC device 105, the installation of a circuit within a device (e.g., an alternator) intended to include the IC device 105, and / or the like. Furthermore, by allowing an internal component (e.g., an internal capacitor) to be incorporated into the IC device 105, a multi-branch connector 110-3 and / or the IC device 105 may save materials, costs, and / or the like by avoiding the need for additional space (or volume) within a package to accommodate an additional component (which may be a non-standard component) along with the IC device 105. For example, the space of the package may be smaller by a percentage corresponding to the size of an external component replaced by the internal component.Accordingly, the external component (e.g., an external, non-standard capacitor) may not be able to be placed in conjunction with a previously used TO package, but the IC package 105, including the internal component, may have the same or equivalent functionality as if the external component could be integrated with a previously used TO package.

[0014] As stated above, Fig. 1 is shown only as an example. Other examples are possible and may differ from what is stated in relation to Fig. 1 was described.

[0015] Fig. 2 is a diagram of an integrated circuit (IC) 200 in which elements (e.g., connections, wires, leads, terminals, and / or the like) and / or components described herein may be implemented. As shown in Fig. 2, IC 200 may include a multi-branch terminal 210, connections 215, terminals 220, wires 225, and an IC chip 230.

[0016] The multi-branch terminal 210 includes a terminal that has multiple branches (e.g., at least two branches). For example, the multi-branch terminal 210 may include two or more branches, three or more branches, four or more branches, and / or the like. The multi-branch terminal 210 may be formed from and / or include any suitable conductive material, such as metal (e.g., aluminum, copper, and / or the like). The multi-branch terminal 210 may facilitate a connection between the IC chip 230 and a circuit including the IC 200. The multi-branch terminal 210 may include a plurality of branches that provide additional surface area to enable active connection and / or passive connection to the terminals 220 in a package of the IC 200. In some implementations, at least one of the branches of the multi-branch terminal 210 may be connected to a frame of a package of the IC 200.Additionally or alternatively, at least one of the branches of the multi-branch connector 210 may not be connected to a frame of the package of the IC 200.

[0017] As in Fig. 2, the multi-branch terminal 210 is connected to one or more of the terminals 220 via connections 215. The connections 215 may include one or more active connections and / or one or more passive connections. For example, a first leg of the multi-branch terminal 210 may be connected to a first terminal 220 via an active connection (e.g., with an aluminum wire), and a second leg of the multi-branch terminal 210 may be connected to a second terminal 220 that is different from the first terminal via a passive connection (e.g., with a capacitor). In some implementations, the multi-branch terminal 210 may be a ground terminal of the IC 200. In some implementations, more than one multi-branch terminal 210 may be integrated into the IC 200.

[0018] Terminals 220 may enable one or more connections between IC chip 230 and a circuit including IC 200. Terminals 220 may be formed of and / or include any suitable conductive material, such as metal (e.g., aluminum, copper, and / or the like). In some implementations, terminals 220 may be connected to multi-branch terminal 210 via active connections and / or passive connections (e.g., depending on the design of a circuit including IC 200).

[0019] IC chip 230 may be made of any material that can be used to enclose circuitry. For example, IC chip 230 may be formed of a semiconductor material (e.g., silicon) and may include one or more components and / or one or more circuits. For example, IC chip 230 may be a TO package that includes one or more transistors and / or one or more circuits including one or more transistors.

[0020] The Fig. The number and arrangement of elements and / or components shown in Figure 2 is provided as an example. In practice, there may be additional elements and / or components, fewer elements and / or components, different elements and / or components, or differently arranged elements and / or components than in Fig. 2. In addition, two or more in Fig. 2 elements and / or components may be implemented within a circuit, or a single element or component in Fig. 2 may be implemented as multiple, distributed elements or components. Additionally or alternatively, a set of circuits (e.g., one or more circuits) of IC 200 may perform one or more functions described as being performed by another set of circuits of IC 200.

[0021] Fig. 3 is a diagram of an exemplary implementation 300 of IC 200 as shown in Fig. 2. The exemplary implementation 300 of Fig. 3 includes a multi-branch connector 210, connectors 220-1 through 220-4 (collectively, connectors 220), an IC chip 230, a package 340, and wires 225-1 through 225-5 (collectively, wires 225). The IC chip 230 may include variously configured connectors according to the circuitry on the IC chip 230. Thus, the wires 225 may be connected to the IC chip 230 at various locations.

[0022] As in Fig. As shown in Figure 3, multi-branch connector 210 has three branches, similar to multi-branch connector 110-3. A first branch of multi-branch connector 210 is connected to the chip via an active connection, and a second branch of multi-branch connector 210 is connected to connector 220-3 via a passive connection.

[0023] As in Fig. 3, the IC chip 230 is connected to the multi-branch terminal 210 and terminals 220 via wires 225. The multi-branch terminal 210 is connected to the IC chip 230 via wire 225-3. As shown, wire 225-3 is connected to a leg of the multi-branch terminal 210 that includes an active connection to terminal 220-2, according to a circuit design of the IC chip 230 and / or a circuit design to include the IC device of the exemplary implementation 300.

[0024] As in Fig. 3, the IC chip 230 and the legs of the multi-leg connector 210 are contained within the package 340. Furthermore, the passive connection between one leg of the multi-leg connector 210 and the connector 210-3 includes a capacitor, which is also located within the package 340 of the exemplary implementation 300. Accordingly, the multi-leg connector 210 enables both the IC chip 230 and a component to be incorporated into the package 340.

[0025] As stated above, Fig. 3 is shown only as an example. Other examples are possible and may differ from what is stated in relation to Fig. 3 was described.

[0026] Fig. Figure 4 is a flow diagram of an exemplary process 400 associated with integrating a multi-branch connector into an integrated circuit device. In some implementations, one or more process blocks of Fig. 4 be carried out by a machine associated with the manufacture of an integrated circuit unit incorporating a multi-branch terminal.

[0027] As in Fig. 4, the process 400 may include positioning an integrated circuit (IC) chip within a package of an IC device (block 410). For example, the IC chip 230 may be installed within the package 340. The IC chip 230 may be installed into the package 340 during a manufacturing process. In some implementations, the package 340 is configured to receive the IC chip 230. In some implementations, the package is shaped and / or configured to be installed within a circuit board and / or a housing of a particular device (e.g., an alternator).

[0028] How to continue in Fig. 4, the process 400 may include configuring a plurality of terminals to extend from the housing, wherein at least one of the plurality of terminals includes a multi-branch terminal, and wherein branches of the multi-branch terminal are contained within the housing (block 420). For example, the multi-branch terminal 210 and the terminals 220 may be configured to extend from the housing 340. Thus, branches of the multi-branch terminal (e.g., branches 120) may be configured to be fully integrated or embedded within the housing 340. In some implementations, the multi-branch terminal 210 may be formed and / or manufactured before being positioned within the housing 340.

[0029] How to continue in Fig. 4, process 400 may include connecting a first leg of the multi-leg connector to a first of the plurality of connectors via a passive connection (block 430). For example, one of the legs of multi-leg connector 210 may be connected to one of the connectors 220 using a component such as a capacitor.

[0030] Although Fig. 4 shows exemplary blocks of the process 400, in some implementations the process 400 may include additional blocks, fewer blocks, different blocks, or differently arranged blocks than in Fig. 4. Additionally or alternatively, two or more of the blocks of process 400 may be executed in parallel.

[0031] Accordingly, some of the implementations described herein represent a multi-branch terminal within an IC that enables active contacting and passive contacting with an IC chip from the multi-branch terminal. The multi-branch terminal may enable a component, such as a capacitor, to be incorporated into a package of the IC. Because the component would not need to be integrated externally to the IC, space for a circuit including such a component and the IC may be saved. This may conserve materials associated with parts, packages, circuits, and / or the like. Furthermore, bringing the component closer to the IC (relative to the position of an external component) may improve noise immunity and reduce noise emission at a signal output of the IC.

[0032] The above disclosure is for purposes of illustration and description, but is not intended to be exhaustive or to limit implementation to the precise form. Changes and variations may be made in light of the above disclosure or may be adopted by practice of implementation.

[0033] As used herein, the term component is broadly understood to mean hardware, firmware, or a combination of hardware and software.

[0034] Although certain combinations of features are recited in the claims and / or disclosed in the specification, these combinations are not intended to limit the disclosure of possible implementations. Indeed, many of these features may be combined in ways not specifically recited in the claims and / or disclosed in the specification. Although each dependent claim listed below may directly depend on only one claim, the disclosure of possible implementations includes each dependent claim in combination with every other claim in the set of claims.

[0035] No element, act, or instruction used herein should be considered critical or essential unless specifically described as such. As used herein, the term "a" is intended to include one or more elements and may be used interchangeably with "one or more." Furthermore, the term "set," as used herein, is intended to include one or more elements (e.g., related elements, unrelated elements, a combination of related and unrelated elements, etc.) and may be used interchangeably with "one or more." When only one item is contemplated, the term "single" or similar language is used. As used herein, the terms "has," "having," "comprising," or the like are also intended to be open-ended terms.In addition, the term “based on” shall mean “based, at least in part, on” unless expressly stated otherwise.

Claims

[1] Integrated circuit unit, IC unit, (300) comprising: a chip (230); a first terminal (110-1, 220-2) connected to the chip (230) via a first wire (225-2); a second terminal (110-2, 220-3) connected to the chip (230) via a second wire (225-4); and a multi-branch connection (110-3, 210) comprising: a first branch (120-2) having an active connection to the chip (230), a second branch (120-3) having a passive connection to the second terminal (110-2, 220-3), and a third branch (120-1) formed as part of a support structure of the IC unit (105); wherein the first and second branches (120-2, 120-3) each have a base connected to the third branch (102-1) and an end spaced from the third branch (120-1) by a gap. [2] The IC device (300) of claim 1, wherein the passive connection comprises a capacitor (140) connected to the second branch (120-3) and the second terminal (110-2, 220-3). [3] IC unit (300) according to claim 2, wherein the capacitor (140) and the chip (230) are housed in a same housing (340) of the IC unit (300). [4] The IC device (300) of any preceding claim, wherein the active connection comprises a third wire (225-3) connected to the first branch (120-2) and the chip (230). [5] The IC unit (300) according to any one of the preceding claims, wherein the first branch (120-2), the second branch (120-3) and the third branch (120-1) of the multi-branch terminal (110-3) are embedded in a housing (340) of the IC unit (300). [6] The IC unit (300) according to any one of the preceding claims, wherein the multi-branch terminal (110-3, 210) comprises a ground terminal of the IC unit (300). [7] Circuit for an alternating current generator, comprising: an integrated circuit unit, IC unit, (300) comprising: a chip (230); a first terminal (110-1, 220-2) connected to the chip (230) via a first wire (225-2); a second terminal (110-2, 220-3) connected to the chip (230) via a second wire (225-4); and a multi-branch connection (110-3, 210) comprising: a first branch (120-2) having an active connection to the chip (230), wherein the active connection comprises a third wire (225-3) connected to the chip (230), a second branch (120-3) having a passive connection to the second terminal (110-2, 220-3), wherein the passive connection comprises an internal capacitor (140) connected to the second branch (120-3) and the second terminal (110-2, 220-3), and a third branch (120-1) formed as part of a support structure of the IC unit (300); wherein the first and second branches (120-2, 120-3) each have a base connected to the third branch (120-1) and an end spaced from the third branch (120-1) by a gap. [8] The circuit of claim 7, wherein the circuit does not include an external capacitor located outside the IC device (300) and connected to the second branch (120-3) and the second terminal (110-2, 220-3). [9] A circuit according to claim 7 or 8, wherein the internal capacitor (140) is located in a same housing (340) as the IC unit (300). [10] The circuit of any one of claims 7 to 9, wherein the IC device (300) comprises a transistor outline package.

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