OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING SUCH A COMPONENT

Abstract

Optoelectronic component (1) comprising: - at least one optoelectronic semiconductor chip (2) with a main surface (4) on which two electrical contacts (3) are arranged, - a control chip (7) for controlling the optoelectronic semiconductor chip (2) with a plurality of electrical connection points (8), - a housing (9) with a housing body (10), wherein - the optoelectronic semiconductor chip (2) is arranged with a mounting surface (5) which runs transversely to the main surface (4) in a first recess (20) of the housing body (10), - a side surface (22) of the first recess (20) with a bottom surface (23) of the first recess (20) forming an obtuse angle of inclination (24), - at least one of the electrical contacts (3) of the optoelectronic semiconductor chip (2) is electrically connected to an electrical connection point (8) of the control chip (7) via a conductor track (12), - the conductor track (12) is applied at least in places to the side surface (22) of the first recess (20).

Description

[0001] An optoelectronic component is specified. Furthermore, a method for producing an optoelectronic component is specified.

[0002] From the document DE 10 2013 225 552 A1 an optoelectronic component is known in which an optoelectronic semiconductor chip is arranged on a lead frame and is surrounded by a molded body connected to the lead frame.

[0003] From the document US 2017 / 0 285 281 A1 an electronic module is known in which an optoelectronic component is mounted on a circuit board in such a way that an optical transmission path is parallel to the circuit board.

[0004] One of the problems to be solved is to provide an optoelectronic component characterized by a particularly low overall height. Another problem to be solved is to provide a method for producing such an optoelectronic component.

[0005] These objects are achieved by a subject matter having the features of independent patent claim 1 and by a method having the features of independent patent claim 13, respectively. Advantageous embodiments and further developments are the subject matter of the respective dependent patent claims.

[0006] According to at least one embodiment of the optoelectronic component, it comprises an optoelectronic semiconductor chip with a main surface on which two electronic contacts are arranged. For example, this is a radiation-emitting semiconductor chip, preferably a light-emitting diode chip.

[0007] For example, an optoelectronic semiconductor chip is a flip-chip semiconductor chip. An optoelectronic semiconductor chip with a flip-chip design is also referred to here and below as a flip chip.

[0008] The optoelectronic semiconductor chip preferably comprises an epitaxial semiconductor layer sequence with a p-conducting region, an n-conducting region, and an active region arranged between the p-conducting and n-conducting regions. The active region is configured to generate electromagnetic radiation during operation. In particular, the active region has a main extension plane that extends parallel to the main surface of the optoelectronic semiconductor chip.

[0009] For example, the epitaxial semiconductor layer sequence of the optoelectronic semiconductor chip is based on a nitride compound semiconductor material, such as Al n In 1-n-m Gam N, where 0 ≤ n ≤ 1, 0 ≤ m ≤ 1, and m + n ≤ 1. Such a semiconductor layer sequence typically has an active region that generates electromagnetic radiation from the ultraviolet to blue spectral range. Furthermore, it is also possible for the epitaxial semiconductor layer sequence of the optoelectronic semiconductor chip to be based on a phosphide compound semiconductor material, such as Al. n In 1-n-m Ga m P, where 0 ≤ n ≤ 1, 0 ≤ m ≤ 1 and m + n ≤ 1. Such an epitaxial semiconductor layer sequence usually has an active region that generates electromagnetic radiation from the green to red spectral range.

[0010] Typically, the epitaxial semiconductor layer sequence is grown epitaxially on a growth substrate. The epitaxial semiconductor layer sequence is typically arranged on a carrier element for mechanical stabilization. For example, the growth substrate is used as a carrier element. Furthermore, it is also possible for the epitaxial semiconductor layer sequence to be transferred from the growth substrate to a carrier element. Preferably, the carrier element is transparent at least to the electromagnetic radiation generated in the active region of the epitaxial semiconductor layer sequence. The growth substrate or the carrier substrate each preferably comprises sapphire or carbide or consists of one of these two materials.

[0011] The optoelectronic semiconductor chip in flip-chip design preferably emits the electromagnetic radiation generated in the active region via a main outer surface of the carrier element and side surfaces of the carrier element. The main outer surface of the carrier element is located, in particular, opposite the epitaxial semiconductor layer sequence. The side surfaces of the carrier element run transversely to the main outer surface and connect the main outer surface of the carrier element to the surface of the carrier element facing the semiconductor layer sequence. In other words, the radiation exit surface of the carrier element and the side surfaces of the carrier element form a radiation exit surface of the flip-chip. Such a flip-chip is a so-called volume emitter. The radiation exit surface of the flip-chip is particularly preferably free of electrical contacts.Alternatively, the optoelectronic semiconductor chip emits electromagnetic radiation via a main outer surface of the semiconductor chip, which is opposite the carrier element. In particular, in this embodiment, the main outer surface forms a radiation exit surface of the flip chip. Such an optoelectronic semiconductor chip is, in particular, a so-called surface emitter.

[0012] In particular, essentially all of the radiation emitted by the optoelectronic semiconductor chip is emitted via the radiation exit surface.

[0013] The electrical contacts of the flip-chip optoelectronic semiconductor chips are preferably arranged on a main surface of the optoelectronic semiconductor chip that faces away from the main outer surface.

[0014] According to at least one embodiment, the optoelectronic component comprises a control chip for controlling the semiconductor chip with a plurality of electrical connection points. In particular, during normal operation, the optoelectronic semiconductor chip is powered and operated in a controlled manner via the control chip. For example, the control chip is a microcontroller or an integrated circuit, in particular an application-specific integrated circuit (ASIC).

[0015] According to at least one embodiment, the optoelectronic component comprises a housing with a housing body. For example, the housing body comprises epoxy or is formed from it. In particular, reflective particles, for example, titanium dioxide particles, are embedded in a base material of the housing body, such as polyepoxide.

[0016] According to at least one embodiment of the optoelectronic component, the optoelectronic semiconductor chip is arranged in a first recess of the housing body with a mounting surface that runs transversely to the main surface. For example, the optoelectronic semiconductor chip is mounted in the first recess with a connecting means. The connecting means is, for example, an electrically insulating adhesive. The electrically insulating adhesive is based, for example, on silicone or epoxy. The adhesive is arranged in particular between the mounting surface of the semiconductor chip and the housing body and is in direct contact with both. An electrically insulating connecting means advantageously prevents a short circuit between the n-conducting region and the p-conducting region in the region of the mounting surface.

[0017] For example, the first recess is filled with a transparent encapsulant. For example, the transparent encapsulant is based on a silicone. In particular, the first encapsulant is transparent to the radiation emitted by the optoelectronic semiconductor chip. "Transparent" is understood here and below to mean that at least 90%, preferably at least 95%, more preferably at least 99%, of the radiation emitted by the optoelectronic semiconductor chip penetrates the transparent encapsulant unchanged.

[0018] According to at least one embodiment of the optoelectronic component, a side surface of the first recess forms an obtuse angle of inclination with a bottom surface of the first recess. Preferably, the side surface is reflective for the radiation emitted by the semiconductor chip. For example, at least 80%, or at least 90%, or at least 95% of the radiation incident on the side surface is reflected. Further preferably, all other inner surfaces of the first recess are also reflective.

[0019] For example, the first recess has an opening opposite the side surface. Electromagnetic radiation emitted via the radiation exit surface of the optoelectronic semiconductor chip can preferably exit the first recess through the opening.

[0020] According to at least one embodiment of the optoelectronic component, at least one of the electrical contacts of the optoelectronic semiconductor chip is electrically connected to an electrical connection point of the control chip via a conductor track. The conductor track preferably comprises one or more metals or is formed from one or more metals. The metals are, for example, copper, gold, or platinum.

[0021] According to at least one embodiment of the optoelectronic component, the conductor track is applied at least in places to the side surface of the first recess. In particular, the first conductor track is in direct contact with the side surface of the first recess in places. Preferably, the conductor track is in direct contact with the side surface of the first recess along its entire length. Further preferably, the conductor track is in direct contact with the housing, the optoelectronic semiconductor chip, and the control chip along its entire length.

[0022] In at least one embodiment, the optoelectronic component comprises at least one optoelectronic semiconductor chip having a main surface on which two electrical contacts are arranged, a control chip for controlling the semiconductor chip having a plurality of electrical connection points, and a housing having a housing body. The optoelectronic semiconductor chip is arranged with a mounting surface that runs transversely to the main surface on a first recess of the housing body. A side surface of the first recess forms an obtuse angle with a bottom surface of the first recess. At least one of the electrical contacts of the optoelectronic semiconductor chip is electrically conductively connected to an electrical connection point of the control chip via a conductor track, wherein the conductor track is applied at least in places to the side surface of the first recess.

[0023] The optoelectronic component described here is based, among other things, on the considerations outlined below. Conventionally, a radiation-emitting semiconductor chip is mounted on a lead frame, and the electrical contacts of the lead frame are bent to form an optoelectronic component in which radiation is emitted perpendicular to the component's mounting surface. If a control chip is to be integrated into the optoelectronic component, the overall height of the optoelectronic component is generally increased. Typically, the radiation-emitting semiconductor chip is then arranged on an additional carrier and connected to the control chip by means of bond wires.

[0024] An optoelectronic component described here utilizes, among other things, the idea of ​​mounting the optoelectronic semiconductor chip in a housing on a mounting surface that runs transversely to the main surface. Conductor tracks connecting the semiconductor chip to the control chip can be routed directly along the surface of the housing body and the control chip via a side surface of the recess in which the semiconductor chip is mounted, which forms an obtuse angle of inclination to the bottom surface of the first recess.

[0025] This advantageously allows the overall height of the optoelectronic component to be reduced. In particular, since conductor tracks resting on the housing body are used to electrically contact the semiconductor chip instead of bonding wire connections, a component height of less than 0.4 millimeters or, preferably, less than 0.3 millimeters can be achieved. In addition, the electronic semiconductor chip can be controlled by the control chip. For example, the optoelectronic component described here can be used to operate a display or to illuminate a display.

[0026] According to at least one embodiment of the optoelectronic component, the angle of inclination between the side surface of the first recess and the bottom surface of the first recess has a value between 105° and 165° inclusive. Advantageously, the conductor track can be particularly easily routed along a side surface that is inclined at such an angle relative to the bottom surface.

[0027] According to at least one embodiment of the optoelectronic component, the housing body has a second recess in which the control chip is arranged. In particular, inner surfaces of the second recess completely surround the control chip in lateral directions. The term "lateral direction" is understood below to mean a direction that runs parallel to the main extension plane of the control chip. For example, the electrical connection points of the control chip are arranged on a common connection surface. The connection surface of the control chip is, for example, a surface of the control chip facing away from the housing. Preferably, the control chip is arranged in the housing such that the connection surface of the control chip runs transversely, in particular perpendicularly, to the main surface of the optoelectronic semiconductor chip.

[0028] For example, the second recess is filled with an electrically insulating encapsulation. For example, the side surfaces of the control chip that run perpendicular to the connection surface can be electrically conductive. In this case, routing the conductor track along the side surfaces of the control chip can lead to a short circuit. An electrically insulating encapsulation can advantageously prevent such a short circuit. For example, the electrically insulating encapsulation is based on a silicone or epoxy material or is formed from one of these materials.

[0029] In particular, the encapsulation does not extend beyond the control chip perpendicular to the lateral direction. Preferably, the control chip, the encapsulation, and the recess are flush with each other. This advantageously makes it particularly easy to route a conductor track from the housing body to the control chip.

[0030] According to at least one embodiment of the optoelectronic component, the bottom surface of the first recess is electrically insulated at least in the region of the mounting surface of the optoelectronic semiconductor chip. For example, the active region of the semiconductor chip extends parallel to the main surface. An electrically insulated bottom surface advantageously prevents a short circuit between the p- and n-conducting regions of the semiconductor chip.

[0031] According to at least one embodiment of the optoelectronic component, the housing comprises a lead frame with a plurality of contact surfaces, which is embedded in the housing body. The electrical connection points of the control chip are each electrically connected to a portion of the contact surfaces via conductor tracks, wherein the conductor tracks are applied at least partially to the housing body. For example, the control chip is supplied with power via the lead frame. In particular, during normal operation, electrical signals are transmitted via the lead frame to the control chip, on the basis of which the control chip controls and operates the optoelectronic semiconductor chip.

[0032] According to at least one embodiment of the optoelectronic component, the housing comprises a lead frame with a plurality of contact surfaces, which is embedded in the housing body. Electrical contacts of the optoelectronic semiconductor chip are electrically connected to some of the contact surfaces of the lead frame via conductor tracks, wherein the conductor tracks are each applied at least partially to the housing body. For example, the semiconductor chip has two electrical contacts on its main surface. In particular, one of the electrical contacts is electrically connected to the control chip, and the second electrical contact is electrically connected to the lead frame. For example, the optoelectronic semiconductor chip is powered via the lead frame.

[0033] According to at least one embodiment of the optoelectronic component, the contact surfaces of the leadframe are freely accessible through openings in the housing body, and the openings have side surfaces that form an obtuse angle of inclination with the contact surfaces of the leadframe. In particular, the angle of inclination is measured between the exposed regions of the contact surfaces and the side surface of an opening. For example, the angle of inclination of the side surfaces of the openings has a value in the same range as the angle of inclination of the side surface of the first recess relative to the bottom surface of the first recess.

[0034] According to at least one embodiment of the optoelectronic component, the conductor tracks that electrically connect the electrical connection points of the control chip to a portion of the contact surfaces are each applied to the side surfaces of the openings. Advantageously, the contact surfaces are particularly easily accessible through the openings. Furthermore, the conductor track can be routed particularly easily along the side surfaces of the openings due to the obtuse angle of inclination relative to the contact surfaces of the lead frame.

[0035] According to at least one embodiment of the optoelectronic component, the conductor tracks that electrically connect the electrical connection points of the optoelectronic semiconductor chip to the contact surfaces are applied to the side surfaces of the openings. The openings are preferably arranged in the region of the bottom surface of the first recess. Advantageously, the conductor track thus only needs to be routed over a short distance.

[0036] According to at least one embodiment of the optoelectronic component, the mounting surface of the optoelectronic semiconductor chip forms an acute angle of inclination with the main surface of the optoelectronic semiconductor chip. This angle of inclination is measured in particular between sides of the mounting surface and the main surface that lie within the optoelectronic semiconductor chip. Thus, the main surface of the optoelectronic semiconductor chip forms an obtuse angle with the bottom surface of the first recess. Advantageously, such an obtuse angle makes it particularly easy to connect an electrical conductor track to the electrical contacts of the semiconductor chip.

[0037] According to at least one embodiment, the optoelectronic component comprises at least three optoelectronic semiconductor chips. The optoelectronic component has an optoelectronic semiconductor chip that emits light in the red spectral range, an optoelectronic semiconductor chip that emits light in the green spectral range, and an optoelectronic semiconductor chip that emits light in the blue spectral range. Preferably, each of the optoelectronic semiconductor chips is a flip chip. For example, the three optoelectronic semiconductor chips are arranged in the first recess along a line that runs parallel to the side surface of the first recess. Preferably, each of the three optoelectronic semiconductor chips is connected to a different electrical connection point of the control chip via a respective conductor track.For example, the control chip controls the optoelectronic semiconductor chips in such a way that the optoelectronic component emits mixed light of a selected color coordinate. For example, the mixed light is perceived by a human observer as white light.

[0038] For example, the optoelectronic semiconductor chip that emits light in the blue spectral range is based on a nitride compound semiconductor material. The optoelectronic semiconductor chips that emit light in the red and green spectral ranges, for example, are each based on a phosphide compound semiconductor material.

[0039] According to at least one embodiment, the optoelectronic component alternatively comprises three semiconductor chips that emit electromagnetic radiation in a first wavelength range. The first recess is divided into three separate sections, with an optoelectronic semiconductor chip arranged in each section. At least two sections comprise two different conversion materials that convert the electromagnetic radiation in a first wavelength range into electromagnetic radiation in different wavelength ranges. For example, the optoelectronic semiconductor chips emit light in a blue wavelength range. In particular, one of the conversion materials is configured to convert the light in the blue wavelength range into light in a red wavelength range.The other conversion material is then designed, for example, to convert the light of the blue wavelength range into light of a green wavelength range.

[0040] For example, separating surfaces that divide the first recess into three different sections run perpendicular to the side surface on which the conductor tracks are arranged. Preferably, the section not filled with a conversion material is filled with a clear encapsulant.

[0041] Furthermore, a method for producing an optoelectronic component is specified. The optoelectronic component described here can, in particular, be produced by such a method. This means that all features disclosed for the optoelectronic component are also disclosed for the method, and vice versa.

[0042] According to at least one embodiment of the method, a housing is provided with a housing body having a first recess. A side surface of the first recess forms an obtuse angle of inclination with a bottom surface of the first recess. The angle of inclination preferably has a value between 105° and 165°.

[0043] According to at least one embodiment of the method, a control chip with a plurality of electrical connection points is arranged on the housing body. For example, the housing body comprises a second recess in which the control chip is arranged.

[0044] According to at least one embodiment of the method, at least one optoelectronic semiconductor chip with a mounting surface is arranged in the first recess. The mounting surface runs transversely to a main surface of the semiconductor chip, on which two electrical contacts are arranged. In particular, the optoelectronic semiconductor chip is mounted in the first recess using an electrically insulating connecting means.

[0045] According to at least one embodiment of the method, electrically conductive connections between at least one of the electrical contacts and an electrical connection point of the control chip are established by a conductor track. For this purpose, the conductor track is applied at least partially to the side surface of the first recess.

[0046] According to at least one embodiment of the method, a photoresist is applied to the side surface of the first recess. For example, the photoresist is subsequently exposed and patterned, exposing the side surface of the first recess in regions. In particular, by exposing the photoresist, the photoresist is cured in regions of the side surfaces that are later to be free of the conductor track. During the patterning of the photoresist, the uncured regions of the photoresist are then removed.

[0047] Following exposure and structuring, a metal layer, for example, is applied to the photoresist and the exposed areas of the side surface of the first recess. For example, the metal layer is applied by sputtering. The metal layer comprises, for example, one of the following metals or is formed from one of the following metals or a mixture of the following metals: copper, gold, platinum. The photoresist is then removed to create the conductor track. In particular, after removal of the photoresist, the metal layer only remains in the areas where the conductor track runs. The metal layer thus forms the conductor track. Advantageously, the method for applying the conductor track described here allows the conductor track to be brought into direct contact with the side surface along its entire course on the side surface.

[0048] Using the method for applying a conductor track described here, conductor tracks can also be applied to other surfaces of the housing body. These surfaces preferably run parallel to the main extension plane of the housing or are inclined at an obtuse angle to it. The greater the angle of inclination, the more efficiently the conductor track can be formed using the method described here. In particular, all steps of the method for applying the conductor track described here are carried out from a direction perpendicular to the main extension plane of the housing.

[0049] According to at least one embodiment of the method, the conductor track is mechanically reinforced by electroplating a metal. For example, copper is electroplating.

[0050] According to at least one embodiment of the method, the conductor track is applied at least partially to a bottom surface of the first recess. The conductor track is reinforced by galvanic deposition such that the metal is brought into direct contact with the electrical contacts of the semiconductor chip. In particular, the electrical contacts of the optoelectronic semiconductor chip are electrically conductively connected to the conductor track. Advantageously, this allows an electrically conductive connection to be established between the control chip and the optoelectronic semiconductor chip even if the main surface of the optoelectronic semiconductor chip, on which the electrical contacts are arranged, is arranged perpendicular to the bottom surface of the first recess.

[0051] According to at least one embodiment of the method, the mounting surface of the optoelectronic semiconductor chip forms an acute angle of inclination with the main surface of the optoelectronic semiconductor chip, on which the electrical contacts are arranged, and the conductor track is applied at least in places to the bottom surface of the first recess and the main surface of the optoelectronic semiconductor chip. Due to the acute angle of inclination between the main surface of the optoelectronic semiconductor chip and its mounting surface, the main surface has an obtuse angle with respect to the bottom surface of the first recess. In particular, the method described here can thus be used to apply the conductor track to the main surface of the optoelectronic semiconductor chip. Advantageously, this makes it particularly easy to establish an electrically conductive connection between the optoelectronic semiconductor chip and the control chip.

[0052] Further advantages and advantageous embodiments and developments of the optoelectronic semiconductor chip and the method emerge from the following exemplary embodiments shown in conjunction with schematic drawings.

[0053] Identical, similar, or functionally identical elements are provided with the same reference numerals in the figures. The figures and the relative sizes of the elements depicted in the figures are not to scale. Rather, individual elements may be exaggerated for clarity and / or clarity. They show: Fig. 1A and Fig. 1B perspective views of an optoelectronic component according to an embodiment, Fig. 2A to 2F show various process stages of a process for producing the optoelectronic component according to an embodiment, Fig. 3A and Fig. 3B sectional views of an optoelectronic component according to an embodiment, Fig. 4A, Fig. 4B and Fig. 6 schematic views of a first recess of an optoelectronic component according to three embodiments, Fig. 5A to 5E show various process stages of a method for applying a conductor track according to an embodiment.

[0054] The optoelectronic component 1 according to the embodiment of the Fig. 1A and Fig. 1B comprises a housing 9 with a housing body 10 in which a lead frame 11 is embedded. The housing body 10 comprises a first recess 20, a second recess 21, and a plurality of openings 18. A red optoelectronic semiconductor chip 13, a green optoelectronic semiconductor chip 14, and a blue optoelectronic semiconductor chip 15 are arranged in the recess 20. The term "red semiconductor chip" refers here and below to a semiconductor chip that emits electromagnetic radiation in the red spectral range. The term "green semiconductor chip" refers here and below to a semiconductor chip that emits electromagnetic radiation in the green spectral range. The term "blue semiconductor chip" refers here and below to a semiconductor chip that emits electromagnetic radiation in the blue spectral range.

[0055] For example, the blue semiconductor chip 15 is based on a nitride compound semiconductor material. The red and green semiconductor chips 13, 14, for example, are each based on a phosphide compound semiconductor material.

[0056] The optoelectronic semiconductor chips 13, 14, 15 each have a mounting surface 5, on which they are arranged in the first recess. The first recess has a side surface 22 and a bottom surface 23. The side surface 22 and the bottom surface 23 form an obtuse angle of inclination. Opposite the side surface 22, the first recess 20 has an opening through which, during normal operation, electromagnetic radiation generated by the semiconductor chips 13, 14, 15 exits the optoelectronic component 1. Preferably, the side surface 22 and other inner surfaces of the first recess 20 are formed with a reflective material. For example, the reflective material comprises a matrix material such as polyepoxide, in which reflective particles, such as titanium dioxide particles, are embedded. More preferably, the entire housing body 10 is made of such a material.

[0057] A control chip 7 is arranged in the second recess 21 of the housing body 10. The control chip 7 comprises a plurality of electrical connection points 8 on a connection surface facing away from the housing 9. The second recess 21 is filled with an electrically insulating encapsulation 16. The control chip 7, the electrically insulating encapsulation 16, and the housing body 10 are preferably flush with one another. For example, the control chip 7 is an application-specific integrated circuit. In particular, the control chip 7 is configured, during intended operation, to control and operate the optoelectronic semiconductor chips 13, 14, 15. For this purpose, each of the optoelectronic semiconductor chips 13, 14, 15 is connected to at least one electrical connection point 8 of the control chip 7. The electrically conductive connection is established by a conductor track 12.The conductor track 12 is at least partially in direct contact with the side surface 22 of the first recess 20.

[0058] The openings 18 of the housing body 10 each have a side surface 19. Contact surfaces 25 of the lead frame 11 are preferably accessible through the openings 18. Conductor tracks 12 run along the side surfaces 19 of the openings 18, electrically connecting the electrical connection points 8 of the control chip 7 to the contact surfaces 25 of the lead frame 11. The conductor tracks 12 are applied directly to the side surfaces 19 of the openings 18 and to the housing body 10.

[0059] The optoelectronic component according to the embodiment of the Fig. 1, for example, has a height perpendicular to the main extension plane between 0.30 millimeters and 0.35 millimeters inclusive. Side surfaces of the housing that run perpendicular to the main extension plane and delimit the housing have a length of approximately 2 millimeters, for example.

[0060] How Fig. 1B shows, a main surface 4 of the optoelectronic semiconductor chips 13, 14, 15 each runs transversely to the mounting surface 5. Two electrical contacts 3 of the semiconductor chips 13, 14, 15 are each attached to the main surface 4. One of the electrical contacts 3 is electrically connected to an electrical connection point 8 of the control chip 7 via a conductor track 12. The first recess 20 further has two openings 18. Contact surfaces 25 of the lead frame 11 are accessible through the openings 18. The electrical contact 3 of each optoelectronic semiconductor chip 13, 14, 15 that is not electrically connected to the control chip 7 is electrically connected to one of the contact surfaces 25 of the lead frame 11 via a conductor track 12. This conductor track 12 runs along side surfaces 19 of the openings 18 of the first recess 20.The side surfaces 19 of the openings 18 of the first recess 20 each form an obtuse angle of inclination with respect to the contact surfaces 25 of the lead frame 11.

[0061] In the method according to the embodiment of the Fig. 2A to 2F, a housing 9 is first provided with a housing body 10 and a lead frame 11 embedded therein ( Fig. 2A). The housing body 10 has essentially the same features as the housing body 10 of the Fig. 1A.

[0062] In a next step, three optoelectronic semiconductor chips 2 are arranged in the first recess 20 ( Fig. 2B). The optoelectronic semiconductor chips 2 have a mounting side 5, with which they are arranged in the first recess 20. For example, the optoelectronic semiconductor chips are arranged in the recess 20 using an electrically insulating adhesive. Furthermore, a control chip 7 with a plurality of electrical connection points 8 is arranged in the second recess 21.

[0063] In a next step, the control chip 7 is encapsulated in the first recess 21 with an electrically insulating encapsulation 16 ( Fig. 2C). The electrically insulating potting 16 has in particular the same features as the potting 16 of the Fig. 1A.

[0064] In a further step, the contact surfaces 25 of the lead frame 11 are electrically connected to the electrical connection points 8 of the control chip 7 via conductor tracks 12 ( Fig. 2D). Furthermore, an electrical contact 3 of the optoelectronic semiconductor chip 2 is electrically connected to an electrical connection point 8 of the control chip 7 via conductor tracks 12. The conductor tracks 12 run in direct contact with the side surfaces 19 of the openings 18 or the side surface 22 of the first recess 20.

[0065] In a next step, the first recess 20 is filled with a casting 17 ( Fig. 2E). Preferably, the encapsulation 17 of the semiconductor chips is transparent to the electromagnetic radiation emitted by the semiconductor chips 2.

[0066] In a next process step, the housing 9 is closed with a cover surface 26 ( Fig. 2F). The cover surface 26 comprises, for example, the same material as the housing body.

[0067] The optoelectronic component according to the embodiment of the Fig. 3A and Fig. 3B has essentially the same features as the optoelectronic component 1 of Fig. 1A. A conductor track 12, which connects an electrical contact of an optoelectronic semiconductor chip 2 to an electrical connection point 8 of the control chip 7, is in direct contact with the housing body 10 along its entire length and in particular with the side surface 22 of the first recess 20. In particular, the conductor track 12 is in direct contact with the encapsulation 16 of the first recess 21 and the control chip 7.

[0068] How Fig. 3B shows, the second electrical contact 3 of the optoelectronic semiconductor chip 2 is in electrically conductive contact with a contact surface 25 of the lead frame 11 via a conductor track 12. The conductor track 12 runs on a side surface 19 of an opening 18 which is arranged in the first recess 20.

[0069] The Fig. 4A shows a sectional view of an optoelectronic semiconductor chip 2, which is arranged on a bottom surface 23 of a first recess 20 of an optoelectronic component 1 described here. The optoelectronic semiconductor chip 2 comprises a mounting surface 5, which is in contact with the bottom surface 23, and a main surface 4, on which an electrical contact 3 is arranged. In the present case, the main surface 4 runs perpendicular to the mounting surface 5. A conductor track 12 is arranged on the bottom surface 23 and a side surface 22 of the first recess. The bottom surface 23 forms an obtuse angle of inclination 24 with the side surface 22. In the region of the bottom surface 23, the conductor track 12 has a thickness, measured perpendicular to the bottom surface 23, which is sufficient for the conductor track 12 to be in direct contact with the electrical contact 3 of the optoelectronic semiconductor chip 2.Advantageously, the optoelectronic semiconductor chip 2 can thus be electrically contacted via the conductor track 12.

[0070] In the Fig. 4B shows a schematic sectional view of an optoelectronic semiconductor chip 2 in a first recess 20. In contrast to the embodiment of Fig. 4A, the mounting surface 5 and the main surface 4 form an acute angle of inclination 6. This results in the mounting surface 5 and the base surface 23 forming an obtuse angle. This obtuse angle allows the conductor track 12 to be applied directly to the main surface 4 of the optoelectronic semiconductor chip 2. This allows for particularly easy electrical contact with the electrical contact 3 of the optoelectronic semiconductor chip 2 and thus with the optoelectronic semiconductor chip 2.

[0071] In the method for applying the conductor tracks 12 according to the embodiment of the Fig. 5A to 5E, a housing body 10 is coated with a photoresist 27 ( Fig. 5A). In the Fig. 5A to 5E, the housing body is shown in the region of a side surface 22 and a bottom surface 23 of a first recess 20. The Fig. 5A to 5E can be used, for example, in the Fig. 2D according to an embodiment of the method for producing an optoelectronic component.

[0072] In a next step, the photoresist 27 is exposed and structured so that areas of the side surface 22, the bottom surface 23 and the housing body 10 are exposed, along which the conductor tracks 12 are to run ( Fig. 5B).

[0073] In a further process step, a metal layer 28, such as copper, is then applied by sputtering onto the photoresist 27 and the areas where the housing body 10 was exposed ( Fig. 5C).

[0074] After subsequent removal of the photoresist 27, the areas of the housing body 10 on which the metal layer 28 was applied then form the conductor tracks 12 ( Fig. 5D).

[0075] In a further optional process step, the conductor track 12 is mechanically reinforced by galvanic deposition of a metal ( Fig. 5E).

[0076] In contrast to the optoelectronic component of the Fig. 1A shows the first recess 20 of the embodiment of the optoelectronic component according to the Fig.6 has three sections. The sections are separated by separating surfaces 29, each of which runs perpendicular to the side surface 22. An optoelectronic semiconductor chip 2 is arranged in each section. For example, each of the optoelectronic semiconductor chips 2 is a blue semiconductor chip 15.

[0077] One of the sections is filled with a transparent encapsulant 17, which covers all surfaces of the semiconductor chip 2 except for the mounting surface 5. The other two sections are each filled with a conversion material 30, 31. One of the latter sections is filled with a green conversion material 30, the other with a red conversion material 31. The term "green conversion material" here and below refers to a conversion material that converts incident radiation of a first wavelength range into radiation in the green wavelength range. The term "red conversion material" here and below refers to a conversion material that converts incident radiation of a first wavelength range into radiation in the red wavelength range.

[0078] The invention is not limited to the embodiments by the description. Rather, the invention encompasses any novel feature and any combination of features, including, in particular, any combination of features in the patent claims, even if this feature or combination itself is not explicitly stated in the patent claims or embodiments. List of reference symbols 1 Optoelectronic component 2 Optoelectronic semiconductor chip 3 electrical contacts 4 Main area 5 Mounting surface 6 Inclination angle of the main surface 7 Control chip 8 electrical connection point 9 housings 10 housing body 11 ladder frame 12 conductor tracks 13 red semiconductor chip 14 green semiconductor chip 15 blue semiconductor chip 16 Potting of the control chip 17 Encapsulation of the semiconductor chip 18 Breakthrough 19 Side surface of the opening 20 first recess 21 second recess 22 Side surface of the first recess 23 Bottom surface of the first recess 24 Angle of inclination of the side surface 25 Contact surface of the lead frame 26 deck area 27 Photoresist 28 metal layer 29 Separation surface 30 green conversion material 31 red conversion material

Claims

[1] Optoelectronic component (1) comprising: - at least one optoelectronic semiconductor chip (2) with a main surface (4) on which two electrical contacts (3) are arranged, - a control chip (7) for controlling the optoelectronic semiconductor chip (2) with a plurality of electrical connection points (8), - a housing (9) with a housing body (10), wherein - the optoelectronic semiconductor chip (2) is arranged with a mounting surface (5) which runs transversely to the main surface (4) in a first recess (20) of the housing body (10), - a side surface (22) of the first recess (20) with a bottom surface (23) of the first recess (20) forming an obtuse angle of inclination (24), - at least one of the electrical contacts (3) of the optoelectronic semiconductor chip (2) is electrically connected to an electrical connection point (8) of the control chip (7) via a conductor track (12), - the conductor track (12) is applied at least in places to the side surface (22) of the first recess (20). [2] Optoelectronic component (1) according to claim 1, wherein the angle of inclination (24) has a value between 105° and 165° inclusive. [3] Optoelectronic component (1) according to one of the preceding claims, wherein - the housing body (10) has a second recess (21), and - the control chip (7) is arranged in the second recess (21). [4] Optoelectronic component (1) according to one of the preceding claims, wherein the bottom surface (23) of the first recess (20) is designed to be electrically insulating at least in the region of the mounting surface (5) of the optoelectronic semiconductor chip (2). [5] Optoelectronic component (1) according to one of the preceding claims, wherein - the housing (9) comprises a lead frame (11) with a plurality of contact surfaces (25) which is embedded in the housing body (10), - electrical connection points (8) of the control chip (7) are electrically conductively connected to a part of the contact surfaces (25) via conductor tracks (12) which are applied at least in places to the housing body (10). [6] Optoelectronic component (1) according to one of the preceding claims, wherein - the housing (9) comprises a lead frame (11) with a plurality of contact surfaces (25) which is embedded in the housing body (10), - electrical contacts (3) of the optoelectronic semiconductor chip (2) are electrically conductively connected to a part of the contact surfaces (25) via conductor tracks (12) which are applied at least in places to the housing body (10). [7] Optoelectronic component (1) according to one of the preceding claims, wherein - the contact surfaces (25) of the lead frame (11) are freely accessible through openings (18) of the housing body (10), and - the openings (18) have side surfaces (19) which form an obtuse angle of inclination with the contact surfaces (25) of the lead frame (11). [8] Optoelectronic component (1) according to the preceding claim, wherein the conductor tracks (12) which electrically connect the electrical connection points (8) of the control chip (7) to a part of the contact surfaces (25) are applied to the side surfaces (19) of the openings (18). [9] Optoelectronic component (1) according to one of claims 7 to 8, wherein the conductor tracks (12) which electrically connect the electrical contacts (3) of the optoelectronic semiconductor chip (2) to a part of the contact surfaces (25) are applied to the side surfaces (19) of the openings (18). [10] Optoelectronic component (1) according to one of the preceding claims, in which the mounting surface (5) of the optoelectronic semiconductor chip (2) forms an acute angle of inclination (6) with the main surface (4) of the optoelectronic semiconductor chip (2) on which the electrical contacts are arranged. [11] Optoelectronic component (1) according to one of the preceding claims, which - an optoelectronic semiconductor chip (13) which emits red light, - has an optoelectronic semiconductor chip (14) which emits green light, and - an optoelectronic semiconductor chip (15) which emits blue light. [12] Optoelectronic component (1) according to one of claims 1 to 10, which - has three optoelectronic semiconductor chips (2) which emit electromagnetic radiation of a first wavelength range, wherein - the first recess (20) is divided into three separate sections, - an optoelectronic semiconductor chip (2) is arranged in each section, and - at least two sections comprise two different conversion materials (30, 31) which convert the electromagnetic radiation of a first wavelength range into electromagnetic radiation of different wavelength ranges. [13] Method for producing an optoelectronic component (1) comprising the following steps: - Providing a housing (9) with a housing body (10) having a first recess (20), wherein a side surface (22) of the first recess (20) forms an obtuse angle of inclination (24) with a bottom surface (23) of the first recess (20), - arranging a control chip (7) with a plurality of electrical connection points (8) on the housing body (10), - applying at least one optoelectronic semiconductor chip (2) with a mounting surface (5) in the first recess (20), wherein the mounting surface (5) extends transversely to a main surface (4) of the optoelectronic semiconductor chip (2), on which two electrical contacts (3) are arranged, - Producing an electrically conductive connection between at least one of the electrical contacts (3) and an electrical connection point (8) of the control chip (7) by means of a conductor track (12) which is applied at least in places to the side surface (22) of the first recess (20). [14] Method according to claim 13, wherein the application of the conductor track (12) comprises the following steps: - applying a photoresist (27) to the side surface (22) of the first recess (20), - exposing and structuring the photoresist (27), whereby the side surface (22) of the first recess (20) is partially exposed, - applying a metal layer (28) to the photoresist (27) and the exposed areas of the side surface (22) of the first recess (20), - Remove the photoresist (27) to create the conductor track (12). [15] Method according to the preceding claim, in which the conductor track (12) is mechanically reinforced by the galvanic deposition of a metal. [16] Method according to one of claims 13 to 15, in which - the conductor track (12) is applied at least in places to a bottom surface (23) of the first recess (20), - the conductor track (12) is reinforced by the galvanic deposition of a metal in such a way that the metal is brought into direct contact with an electrical contact (3) of the optoelectronic semiconductor chip (2). [17] Method according to one of claims 13 to 15, in which the mounting surface (5) of the optoelectronic semiconductor chip (2) forms an acute angle of inclination (6) with the main surface (4) of the optoelectronic semiconductor chip (2) on which the electrical contacts (3) are arranged, and the conductor track (12) is applied at least in places to the bottom surface (23) of the first recess (20) and the main surface (4) of the optoelectronic semiconductor chip (2).

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