PACKAGE SUBSTRATE PROCESSING PROCESS

Abstract

Packing substrate processing method for processing a packing substrate (11) having a division line (17), wherein an electrode (19) is formed at the division line (17), the packing substrate processing method comprising: a cutting step of cutting the packing substrate (11) along the division line (17) using a cutting blade (50); and a burr removal step of removing burrs produced by the electrode (19) in the cutting step by spraying a fluid onto the packing substrate (11) along the parting line (17) after performing the cutting step; wherein the cutting step includes a step of supplying a cutting fluid containing an organic acid and an oxidizing agent to a cutting area (11b) in which the packing substrate (11) is to be cut by the cutting blade (50).

Description

TECHNICAL BACKGROUND Technical field

[0001] The present invention relates to a packing substrate processing method for use in cutting a packing substrate. Description of the related technique

[0002] A packing substrate is formed by providing multiple component chips arranged on a substrate and covering the component chips with a plastic (moldable plastic) as a sealing material. Several division lines (roads) are formed on the packing substrate to separate the multiple component chips. By dividing the packing substrate along the division lines, multiple packing units, each containing the multiple component chips, are obtained. For example, the packing substrate is divided using a cutting device that has a clamping table for holding the packing substrate and an annular cutting blade for cutting the packing substrate, with the cutting blade mounted on a spindle. During operation, the packing substrate is held on the clamping table, and the cutting blade is rotated to cut the packing substrate along each division line.

[0003] There is a case where electrodes connected to each component chip are formed at each division line of the packing substrate. In this case, when the packing substrate is cut along each division line using the cutting blade, the rotating blade comes into contact with the electrodes formed at each division line, causing each electrode to be pulled off the blade and resulting in whisker-shaped burrs. These burrs can cause a short circuit between the electrodes or a faulty connection of each packing component resulting from the division of the packing substrate, thus reducing the quality of each component. Therefore, it is desirable to remove the burrs.A method for removing burrs by spraying water towards a cut area of ​​the packing substrate after cutting the substrate using a cutting blade has been proposed. For example, Japanese patent application JP 2016-157 722 A discloses a cutting device that has a burr removal nozzle positioned next to the cutting blade. In this cutting device, the packing substrate is cut using the cutting blade, and the burrs are subsequently removed by spraying water from the burr removal nozzle towards the packing substrate.

[0004] If water is sprayed towards the packing substrate being cut by the cutting blade, there is a possibility that part of the packing substrate will chip off due to the pressure of the sprayed water. Furthermore, if the packing substrate is attached to an adhesive strip, the cutting blade will completely cut the packing substrate while it is held against the clamping table by the adhesive strip. Consequently, the adhesive strip will be exposed opposite a cut area (cut groove) of the packing substrate. In this case, there is a possibility that the exposed adhesive strip will break due to the pressure of the water sprayed onto the cut area of ​​the packing substrate. Therefore, the pressure of the sprayed water is set within a range such that this disadvantage does not occur during processing of the packing substrate.However, if the water pressure is set to a low level to prevent the occurrence of disadvantages, the removal of the burrs tends to become insufficient.

[0005] On the other hand, Japanese patent application no. 2016-181569 discloses a method for removing burrs by spraying water onto the packing substrate in a state where the packing substrate is not fully cut. Specifically, this technique involves a first cutting operation of forming a cut groove with a depth less than the thickness of the packing substrate along each division line, thereby dividing each electrode. Water is then sprayed along each cut groove to remove the burrs. A second cutting operation is then performed to cut the packing substrate along each cut groove, i.e., along each division line, thereby fully cutting the packing substrate.According to this procedure, the water is sprayed onto the packing substrate in a state where the packing substrate is not completely cut, thus preventing chipping of part of the packing substrate or breakage of the adhesive tape due to the water spray. Accordingly, the pressure of the sprayed water can be increased to facilitate the removal of burrs.

[0006] Further prior art that is helpful for understanding the present invention can be found in the following documents: US 2015 / 0262881 A1 relates to a cutting method suitable for cutting a QFN substrate, a wafer with TEGs formed along designated parting lines, or the like. JP 2001-308037 A relates to a parting method capable of preventing an electrical short circuit of a component in a semiconductor chip by oxidizing a cut surface of a wafer. JP 2014-220459 A relates to a cutting device designed to hold a holding table for a workpiece during a cutting operation. PRESENTATION OF THE INVENTION

[0007] If the previously mentioned method of removing burrs by spraying water onto the packing substrate after completely cutting it is used, the water pressure must be set low to prevent problems associated with processing the packing substrate, which would result in insufficient burr removal. Furthermore, if the latter method involves performing the cutting operation twice along each parting line, the water pressure for burr removal can be increased compared to simply spraying water after completely cutting the packing substrate. However, this reduces processing efficiency because the cutting operation must be performed multiple times along each parting line.Additionally, during the second cutting process, the cutting blade comes into contact with each cut electrode and is exposed to each cut groove formed during the first cutting process, thus generating burrs again. It is therefore an objective of the present invention to provide a packing substrate machining method that can remove the burrs while suppressing the occurrence of the disadvantages associated with machining the packing substrate and also preventing a reduction in machining efficiency.

[0008] According to one aspect of the present invention, a packing substrate processing method is provided for processing a packing substrate having a parting line, wherein an electrode is formed at the parting line, the packing substrate processing method comprising a cutting step of cutting the packing substrate along the parting line using a cutting blade; and a burr removal step of removing burrs produced by the electrode in the cutting step by spraying a fluid onto the packing substrate along the parting line after the cutting step has been carried out. The cutting step includes a step of supplying a cutting fluid containing an organic acid and an oxidizing agent to a cutting area in which the packing substrate is to be cut by the cutting blade.

[0009] Preferably, the packing substrate processing method further comprises a tape application step of applying an adhesive tape to the packing substrate prior to performing the cutting step; and a holding step of holding the packing substrate by the adhesive tape on a holding unit after performing the tape application step and prior to performing the cutting step; wherein the cutting step is performed by completely cutting the packing substrate attached to the adhesive tape along the parting line to a depth at which the cutting blade reaches the adhesive tape, in a state in which the packing substrate is held by the adhesive tape on the holding unit; wherein the burr removal step is performed by spraying the fluid in a state in which the adhesive tape is attached to the packing substrate.

[0010] As an alternatively preferred embodiment, the packing substrate processing method further comprises a holding step of holding the packing substrate on a fixture table having a groove corresponding to the parting line, prior to performing the cutting step; wherein the cutting step is performed by completely cutting the packing substrate along the parting line to the depth at which the cutting blade reaches the groove of the fixture table, in a state in which the packing substrate is retained on the fixture table; wherein the burr removal step is performed by spraying the fluid onto the substrate held on the fixture table.

[0011] In the packing substrate processing method according to the present invention, the cutting step is performed to process the packing substrate using the cutting blade while supplying the cutting fluid, which contains the organic acid and the oxidizing agent. Subsequently, the burr removal step is performed to remove the burrs by spraying the fluid. By supplying the cutting fluid containing the organic acid and the oxidizing agent, burr formation can be suppressed, and the burrs can then be easily removed in the next step. Accordingly, the pressure of the fluid used for burr removal can be reduced. Consequently, the burrs can be removed while suppressing the occurrence of this disadvantage in processing the packing substrate and preventing a reduction in processing efficiency.

[0012] The above and further aims, features and advantages of the present invention and the way in which they are realized will become more apparent, and the invention itself will best be understood by studying the following description and the attached claims with reference to the attached drawings, which show preferred embodiments of the invention. SHORT FIGURE DESCRIPTION Fig. 1A is a top view showing a packing substrate; Fig. 1B is a top view from below of the in Fig. 1A shown packing substrate; Fig. 2 is an enlarged top view showing a significant part of the Fig. 1A represents the packaging substrate shown; Fig. Figure 3 is a perspective view showing a cutting device for processing the packing substrate; Fig.Figure 4 is a top view showing a frame unit formed by carrying the packing substrate on an annular frame via an adhesive strip; Fig. 5 is a perspective view, which is in the Fig. The cutting unit shown in section 3 represents the cutting device contained within; Fig. Figure 6 is a partial section view showing a cutting step; Fig. 7 is a partial section view showing a burr removal step; Fig. 8 is one to Fig. 7 similar views, which represent a variation; Fig. Figure 9A is a top view showing a device table that can be used in the present invention; Fig. 9B is a sectional view of the in Fig. 9A device table shown; and Fig.10 is a partial section view, representing a cutting step that includes the in Fig. 9A and Fig. The processing table shown in 9B was used. DETAILED DESCRIPTION OF PREFERRED EXECUTION FORMS

[0013] A first preferred embodiment of the present invention will now be described with reference to the accompanying drawings. First, a packing substrate will be described that can be processed by a packing substrate processing method according to this preferred embodiment. Fig. 1A is a top view showing the front of a packing substrate 11, and Fig. 1B is a top view from below, showing the back of the item in Fig. 1A represents the packaging substrate 11. As shown in Fig. 1A and Fig.As shown in Figure 1B, the packing substrate 11 comprises a plate-shaped substrate 13 having a front side 13a and a back side 13b, the plate-shaped substrate 13 being rectangular in a top view. The packing substrate 11 further comprises several component chips (not shown) arranged on the back side 13b of the substrate 13, each component chip comprising a component such as an integrated circuit (IC). A plastic layer (molded plastic) 15 is also formed on the back side 13b of the substrate 13 for sealing the multiple component chips.

[0014] As in Fig.As shown in Figure 1A, several intersecting division lines (roads) 17 are formed on the packing substrate 11 to define several rectangular, separate areas 11a, each containing multiple component chips. The packing substrate 11 is not restricted with respect to material, shape, structure, size, etc. Furthermore, the component chips are not restricted with respect to type, number, shape, structure, size, form, etc. By cutting the packing substrate 11 along each division line 17, multiple packing units, each containing the multiple component chips, can be obtained. For example, a ring-shaped cutting blade can be used to cut the packing substrate 11. Several markings 21, indicating the positions of the division lines 17, are provided on the front face 13a of the substrate 13.Each marking 21 serves as a guide for use when performing the alignment between the packing substrate 11 and the cutting blade.

[0015] Furthermore, several metal electrodes 19 are arranged along each division line 17 on the front face 13a of the substrate 13. These electrodes 19 are connected by (not shown) metal wires to each component chip provided on the rear face 13b of the substrate 13. Thus, each electrode 19 is exposed to the front face 13a of the substrate 13. After the packing substrate 11 has been divided into the multiple packing components, these electrodes 19 serve as connecting electrodes when each packing component is attached to a different mounting substrate or the like.

[0016] Fig. Figure 2 is an enlarged top view showing a substantial part of the packing substrate 11. As shown in Fig.As shown in Figure 2, each of the multiple electrodes 19 formed at each division line 17 is provided with a recess 19a having a depth from the front 13a of the substrate 13 to the back 13b thereof. The recess 19a of each electrode is elliptical or oval in a plan view. The depth of each recess 19a is less than the thickness of each electrode 19. Accordingly, when the packing substrate 11 is cut along each division line 17 using a cutting blade, each of the multiple electrodes 19 formed at each division line 17 is also cut by the cutting blade. At this point, the cutting blade is positioned such that it passes through the interior of the recess 19a of each electrode 19, that is, that it passes through the recess 19a in its longitudinal direction along its entire length.Accordingly, the recess 19a of each electrode 19 is cut by the cutting blade in its lateral direction, thereby forming a space to be filled with a metallic material (e.g. a solder) for connecting each electrode 19 to another electrode (e.g. each connecting electrode on the mounting substrate).

[0017] When the packing substrate 11 is cut along each division line 17 using a cutting blade, the cutting blade comes into contact with each electrode 19. Consequently, there is a possibility that each electrode 19 will be pulled by the rotating cutting blade, resulting in the formation of whisker-shaped burrs. These burrs can cause a short circuit between the electrodes 19 or a faulty connection when inserting each packing element, so it is preferable to remove the burrs. For example, the burrs generated when cutting the packing substrate 11 can be removed by spraying a fluid such as water under pressure in the direction of the burrs, thereby blowing them away.Cutting the packing substrate 11 and spraying the fluid can be carried out using a cutting device that has a cutting unit for cutting the packing substrate 11 and a fluid spraying unit for spraying the fluid towards the packing substrate 11. Fig. Figure 3 shows a cutting device 2, which has such a cutting unit and a fluid spray unit, which are described in detail below.

[0018] Fig. Figure 3 is a perspective view showing the design of the cutting device 2. As in Fig. As shown in Figure 3, the cutting device 2 has a base 4 for supporting various components of the cutting device 2. A pair of parallel guide rails 6a and 6b are attached to the upper surface of the base 4 such that they align in the X-direction (feed direction), which is shown in Figure 3. Fig.The movable block 8, represented by an arrow X, extends along the X-direction. A movable block 8 is slidably mounted on the guide rails 6a and 6b. The movable block 8 is connected to a motion unit 10 for moving the movable block 8 in the X-direction. The motion unit 10 has a ball screw 12 and a pulse motor 14 for rotating the ball screw 12. The ball screw 12 extends in the X-direction. The movable block 8 has a nut section (not shown) that engages with the ball screw 12. The pulse motor 14 is connected to one end of the ball screw 12. Accordingly, when the ball screw 12 is rotated by the pulse motor 14, the movable block 8 is moved along the guide rails 6a and 6b in the X-direction.Furthermore, the motion unit 10 has a scale 16, which is provided at the base 4 along the guide rail 6a, wherein the scale 16 has coordinate values ​​that indicate the positions of the movable block 8, and a (not shown) read head for reading the coordinate values ​​of the scale 16. Accordingly, by actuating the read head to read the coordinate values ​​of the scale 16, the positions of the movable block 8 can be determined.

[0019] A cylindrical support element 18 is provided on the movable block 8, and a clamping table 20 is attached to the upper end of the support element 18. The clamping table 20 corresponds to a holding unit (holding device) for holding the packing substrate 11. The clamping table 20 is connected to a rotary drive source (not shown), such as a motor, for rotating the clamping table 20. This means that the clamping table 20 has an axis of rotation that is essentially parallel to the Z-direction (vertical direction), which is in Fig.3, represented by an arrow Z, such that the clamping table 20 is rotated about its vertical axis by actuating the rotary drive source. Furthermore, the X-position of the clamping table 20 in the X-direction is controlled by the motion unit 10. The clamping table 20 has an upper surface as a holding surface 20a for holding the packing substrate 11. The holding surface 20a is, for example, made of a porous ceramic. The holding surface 20a is essentially oriented towards the X-direction and the Y-direction (index direction), which is shown in Fig. 3 is represented by an arrow Y, parallel, where the Y-direction is in a horizontal plane perpendicular to the X-direction. Furthermore, the clamping table 20 is connected via an intake port (not shown) to a vacuum source (not shown), such as an ejector, wherein the intake port is formed within the clamping table 20.

[0020] When cutting the packing substrate 11, the packing substrate 11 is carried on an adhesive strip on a ring-shaped frame and the packing substrate 11, thus carried on the ring-shaped frame, is held on the clamping table 20. Fig. Figure 4 is a top view showing a frame unit 23 formed by supporting the packing substrate 11 on an annular frame 27 via a circular adhesive strip 25. The circular adhesive strip 25 has a diameter sufficient to cover the entire packing substrate 11. That is, the diameter of the circular adhesive strip 25 is larger than the longitudinal length of the rectangular packing substrate 11. The adhesive strip 25 is attached to the plastic layer 15 of the packing substrate 11 (see Figure 4). Fig.1B), that is, attached to the rear side 13b of the substrate 13. The adhesive tape 25 is a soft film consisting of a base film and an adhesive layer formed on the base film. The base film can be made of a plastic such as polyolefin, polyvinyl chloride, or polyethylene terephthalate. The adhesive layer can be made of a rubber-like adhesive or an acrylic adhesive. The annular frame 27 is attached to a circumferential section of the adhesive tape 25, and the packing substrate 11 is attached to a central section of the adhesive tape 25 in the position where the front side 13a of the substrate 13 is exposed. Thus, the frame unit 23 consists of the packing substrate 11, the adhesive tape 25, and the annular frame 27, which are connected to one another.This means that the packing substrate 11 is carried on the ring-shaped frame 27 via the adhesive tape 25 in the state in which the front side 13a of the substrate 13 is exposed upwards.

[0021] As in Fig.As shown in Figure 3, four clamps 22 are provided for clamping the annular frame 27 to the outer circumference of the clamping table 20. The four clamps 22 are arranged at equal intervals. Furthermore, a transfer unit (not shown) is provided near the clamping table 20 for transferring the packing substrate 11 (the frame unit 23). When processing the packing substrate 11, it is first placed on the holding surface 20a of the clamping table 20 via the adhesive strip 25, and the annular frame 27 is then secured by the clamps 22. A vacuum generated by the vacuum source is then applied to the holding surface 20a to hold the packing substrate 11 on the holding surface 20a of the clamping table 20 via the adhesive strip 25.

[0022] Above the clamping table 20, a cutting unit 24 with an annular cutting blade for cutting the packing substrate 11 (the cutting blade is described below) and a fluid spray unit 26 for spraying a liquid towards the packing substrate 11 are provided. A double-column support structure 28 for supporting the cutting unit 24 and the fluid spray unit 26 is provided on the upper surface of the base 4 such that it spans the clamping table 20.

[0023] On the front surface of the upper section of the support structure 28, a motion unit 30a for moving the cutting unit 24 in the Y and Z directions and a motion unit 30b for moving the fluid spray unit 26 in the Y and Z directions are provided. The motion unit 30a has a movable plate 34a and the motion unit 30b has a movable plate 34b. A pair of parallel guide rails 32 is attached to the front surface of the support structure 28 such that they extend in the Y direction. The movable plates 34a and 34b are slidably mounted on the guide rails 32. A nut section (not shown) is provided on the rear (back surface) of the movable plate 34a, and a ball screw 36, which extends substantially parallel to the guide rails 32, engages in threaded engagement with this nut section of the movable plate 34a.Similarly, a nut section (not shown) is provided on the rear (back surface) of the movable plate 34b, and a ball screw spindle 36b, extending substantially parallel to the guide rails 32, engages with this nut section of the movable plate 34b. A pulse motor (in . Fig. A motor 38b (not visible) is connected to the other end of the ball screw 36a, and a pulse motor 38b is connected to one end of the ball screw 36b. Accordingly, the movable plate 34a can be moved along the guide rails 32 in the Y-direction by actuating the pulse motor to rotate the ball screw 36a. Similarly, the movable plate 34b can be moved along the guide rails 32 in the Y-direction by actuating the pulse motor 38b to rotate the ball screw 36b.

[0024] A pair of parallel guide rails 40a is attached to the front surface of the movable plate 34a such that they extend in the Z-direction. Similarly, a pair of parallel guide rails 40b is attached to the front surface of the movable plate 34b such that they extend in the Z-direction. A movable plate 42a is slidably mounted on the guide rails 40a, and a movable plate 42b is slidably mounted on the guide rails 40b.

[0025] A nut section (not shown) is provided on the rear surface of the movable plate 42a, and a ball screw 44a, extending substantially parallel to the guide rails 40a, engages with this nut section of the movable plate 42a. A pulse motor 46a is connected to one end of the ball screw 44a. Accordingly, the movable plate 42a can be moved along the guide rails 40a in the Z-direction by actuating the pulse motor 46a to rotate the ball screw 44a. Similarly, a nut section (not shown) is provided on the rear surface of the movable plate 42b, and a ball screw 44b, extending substantially parallel to the guide rails 40b, engages with this nut section of the movable plate 42b. A pulse motor 46b is connected to one end of the ball screw 44b.Accordingly, the movable plate 42b can be moved along the guide rails 40b in the Z direction by actuating the pulse motor 46b to rotate the ball screw spindle 44b.

[0026] The cutting unit 24 and the fluid spray unit 26 are located on the lower section of the movable plate 42b. The Y-position and Z-position of the cutting unit 24 are controlled by the motion unit 30a. Similarly, the Y-position and Z-position of the fluid spray unit 26 are controlled by the motion unit 30b. This means that the positions of the cutting unit 24 and the fluid spray unit 26 are controlled independently.

[0027] Fig. Figure 5 is a perspective view showing the cutting unit 24. As in Fig.As shown in Figure 5, the cutting unit 24 has a spindle (not shown) with an axis that is substantially parallel to the holding surface 20a of the clamping table 20. In particular, the axis of the spindle extends in the Y direction. An annular cutting blade 50 is attached to the front end section of the spindle. The spindle is connected to a rotary drive source, such as a motor. Accordingly, the cutting blade 50 attached to the spindle is rotated by a force transmitted from the rotary drive source. The cutting blade 50 is formed by bonding abrasive grains, such as abrasive diamond grains, with a binder, such as a metal binder, a plastic binder, or a glass-like binder.

[0028] The cutting unit 24 further comprises a blade cover 52 for covering the cutting blade 50. The blade cover 52 has a first nozzle block 54 for supplying cutting fluid to the cutting blade 50. The first nozzle block 54 has a first connecting section 56 for supplying the cutting fluid to the cutting blade 50, which is connected to a hose (not shown), and a pair of blade cooling nozzles 58a and 58b, which are connected to the first connecting section 56 for supplying the cutting fluid to the cutting blade 50. The blade cooling nozzles 58a and 58b are arranged such that the cutting blade 50 is positioned between them. That is, the blade cooling nozzle 58a faces one side surface 50a of the cutting blade 50, and the blade cooling nozzle 58b faces the other side surface of the cutting blade 50.Each of the blade cooling nozzles 58a and 58b has several nozzle openings (not shown) directed towards the cutting blade 50 to supply the cutting fluid to the cutting blade 50. Accordingly, the cutting fluid supplied to the first connecting section 56 is introduced into the blade cooling nozzles 58a and 58b and then sprayed from the nozzle openings of the blade cooling nozzles 58a and 58b towards the opposite side surfaces 50a and 50b of the cutting blade 50.

[0029] The knife cover 52 further comprises a second nozzle block 60 for supplying the cutting fluid to the cutting blade 50 and the packing substrate 11 held on the clamping table 20. The second nozzle block 60 has a second connecting section 62 and a third connecting section 64, which are connected to hoses (not shown) for supplying the cutting fluid. The second connecting section 62 is connected to a shower nozzle (not shown) provided within the second nozzle block 60. The shower nozzle has a front end that opens towards the outer circumferential section of the cutting blade 50. Accordingly, the cutting fluid supplied to the second connecting section 62 is introduced into the shower nozzle and then sprayed from the front end of the shower nozzle towards the outer circumferential section of the cutting blade 50.Furthermore, the cutting fluid is supplied to a contact area between the cutting blade 50 and the packing substrate 11 by the rotation of the cutting blade 50. The third connecting section 64 is connected to a pair of spray nozzles 66 for supplying the cutting fluid to the packing substrate 11, which is held on the clamping table 20. The spray nozzles 66 have front ends that open towards the holding surface 20a of the clamping table 20. Accordingly, the cutting fluid supplied to the third connecting section 64 is introduced into the spray nozzles 66 and then sprayed from the front ends of the spray nozzles 66 towards the upper surface of the packing substrate 11 held on the clamping table 20.

[0030] When the packing substrate 11 is cut using the cutting blade 50, the cutting fluid is supplied to the cutting blade 50 and the packing substrate 11 by the blade cooling nozzles 58a and 58b, the shower nozzle, and the spray nozzles 66. Supplying the cutting fluid cools the contact area between the cutting blade 50 and the packing substrate 11 and washes away any dust (cutting dust) generated during cutting. Furthermore, an imaging unit 70 is provided next to the cutting unit 24 for imaging the packing substrate 11 held on the clamping table 20. The alignment between the cutting unit 24 and the clamping table 20 is carried out according to an image obtained from the imaging unit 70.

[0031] The in Fig.Figure 3 shows a fluid spray unit 26 with a spray nozzle 72 for spraying a fluid towards the packing substrate 11 held on the clamping table 20. After the packing substrate 11 has been cut using the cutting unit 24, the fluid is sprayed from the spray nozzle 72 onto the packing substrate 11, thereby removing the burrs produced during the cutting process. The fluid to be sprayed from the spray nozzle 72 is not limited to the prerequisite that the burrs can be removed by the fluid. For example, a liquid such as water can be sprayed from the spray nozzle 72 under pressure. Furthermore, an imaging unit (not shown) for imaging the packing substrate 11 held on the clamping table 20 is provided next to the fluid spray unit 26. The alignment between the fluid spray unit 26 and the clamping table 20 is carried out according to an image obtained from this imaging unit.

[0032] The components, including the motion unit 10, the clamping table 20, the cutting unit 24, the fluid spray unit 26 and the motion units 30a and 30b, are connected to a (not shown) control unit located in the cutting device 2, so that the operation of each component is controlled by this control unit.

[0033] The pressure of the fluid sprayed from the spray nozzle 72 is set so that the burrs produced by cutting the packing substrate 11 are adequately removed. If the fluid pressure is increased, there is a possibility that some of the packing substrate 11 cut by the cutting blade 50 may chip off. Furthermore, the adhesive tape 25 (see Fig.4) by completely cutting the packing substrate 11, so that there is a possibility that the high-pressure fluid could be sprayed onto such an exposed area of ​​the adhesive tape 25, leading to a break in the adhesive tape 25. Accordingly, the pressure of the fluid is set in the range where the above disadvantage does not occur when machining the packing substrate 11. However, the removal of burrs tends to become insufficient if the pressure of the fluid is set to a low pressure to prevent the above disadvantage when machining the packing substrate 11.

[0034] Alternatively, the packing substrate 11 can be cut halfway to its depth by the cutting blade 50, so that the packing substrate 11 is not completely cut. The burrs produced by cutting the packing substrate 11 are then removed by spraying the fluid. In this case, the fluid is sprayed onto the packing substrate 11 in a state where it is not completely cut, so that even if the fluid pressure is increased, the aforementioned disadvantage, such as chipping of part of the packing substrate 11 and breakage of the adhesive tape 25, is less likely to occur. However, if this method is used, the packing substrate 11 must be cut again by the cutting blades 50 until it is completely cut.This means that the cutting process along each division line 17 must be performed several times, which leads to a reduction in processing efficiency for the packing substrate 11. Furthermore, when performing the cutting process along each division line 17 a second time, there is a possibility that the cutting blade 50 will come into contact with the electrode 19 exposed opposite a groove formed during the first cutting process, thus potentially regenerating the burrs.

[0035] In the packing substrate processing method according to this preferred embodiment, a cutting fluid containing an organic acid and an oxidizing agent is supplied during the cutting of the packing substrate 11. After the packing substrate 11 has been completely cut, the burrs produced by the cutting process are removed by spraying the fluid. By supplying this cutting fluid, which contains an organic acid and an oxidizing agent, during the cutting of the packing substrate 11, the electrodes 19 are modified by the organic acid and oxidized by the oxidizing agent, thus reducing the conductivity of the electrodes 19. Consequently, the electrodes 19 become more resistant to drawing, thereby suppressing the formation of burrs. Furthermore, the burrs can be easily removed in the next step by spraying the fluid.Accordingly, the pressure of the fluid can be reduced when spraying the fluid to remove the burrs, so that the occurrence of the aforementioned disadvantage due to spraying the fluid can be suppressed.

[0036] Furthermore, the burrs can be removed without repeating the cutting process along each division line 17, thus reducing the reduction in machining efficiency.

[0037] For example, a compound can be used as the organic acid if it has at least one carboxyl group and at least one amino group in its molecule. If this compound has two or more amino groups in its molecule, it is preferred that at least one of the amino groups is a secondary or tertiary amino group. Additionally, the compound that can be used as the organic acid can have a substituent group.

[0038] Amino acids can be used as the organic acid. Examples of amino acids that can be used here include glycine, dihydroxyethylglycine, glycylglycine, hydroxyethylglycine, N-methylglycine, β-alanine, L-alanine, L-2-aminobutyric acid, L-norvaline, L-valine, L-leucine, L-norleucine, L-alloisoleucine, L-isoleucine, L-phenylalanine, L-proline, sarcosine, L-ornithine, L-lysine, taurine, L-serine, L-threonine, L-allothreonine, L-homoserine, L-thyroxine, L-tyrosine, 3,5-diiodo-L-tyrosine, β-(3,4-dihydroxyphenyl)-L-alanine, 4-hydroxy-L-proline, L-cysteine, and L-methionine. L-Ethionine, L-Lanthionine, L-Cystathionine, L-Cystine, L-Cystic Acid, L-Glutamic Acid, L-Aspartic Acid, S-(Carboxymethyl)-L-Cysteine, 4-Aminobutyric Acid, L-Asparagine, L-Glutamine, Azaserine, L-Canavanine, L-Citrulline, L-Arginine, δ-Hydroxy-L-Lysine, Creatine, L-Kynurenine, L-Histidine, 1-Methyl-L-Histidine, 3-Methyl-L-Histidine, L-Tryptophan, Actinomycin C1, Ergothioneine, Apamin, Angiotensin I, Angiotensin II, Antipain, etc.Particularly preferred substances include glycine, L-alanine, L-proline, L-histidine, L-lysine and dihydroxyethylglycine.

[0039] Aminopolyacids can also be used as organic acids. Examples of polyamino acids usable here include iminodiacetic acid, nitrilotriacetic acid, diethylenetriaminepentaacetic acid, ethylenediaminetetraacetic acid, hydroxyethyliminodiacetic acid, nitrilotrismethylenephosphonic acid, ethylenediamine-N,N,N',N'-tetramethylenesulfonic acid, 1,2-diaminopropanetetraacetic acid, glycoletherdiaminetetraacetic acid, transcyclohexanediaminetetraacetic acid, ethylenediamineorthohydroxyphenylacetic acid, ethylenediaminisuccinic acid (SS isomer), β-alaninediaacetic acid, N-(2-carboxylatoethyl)-L-aspartic acid, N,N'-bis(2-hydroxybenzyl)ethylenediamine-N,N'-diaacetic acid, etc.

[0040] Furthermore, carboxylic acids can be used as organic acids. Examples of carboxylic acids that can be used here include saturated carboxylic acids such as formic acid, glycolic acid, propionic acid, acetic acid, butyric acid, valeric acid, hexanoic acid, oxalic acid, malonic acid, glutaric acid, adipic acid, malic acid, succinic acid, pimelic acid, mercaptoacetic acid, glyoxylic acid, chloroacetic acid, pyruvic acid, acetoacetic acid, etc.; unsaturated carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, fumaric acid, maleic acid, mesaconic acid, citraconic acid, aconitic acid, etc.; and cyclic unsaturated carboxylic acids such as benzoic acid, toluene acid, phthalic acid, naphthoic acid, pyromellitic acid, naphthalic acid, etc.

[0041] Examples of oxidizing agents that can be used include: hydrogen peroxide, peroxides, nitrates, iodates, periodates, hypochlorites, chlorites, chlorates, perchlorates, persulfates, dichromates, permanganates, cerates, vanadates, ozonated water, silver (II) salts, iron (III) salts and their organic complex salts.

[0042] In addition, an anti-corrosive agent can be mixed into the cutting fluid. Mixing in the anti-corrosive agent prevents corrosion (elution) of the metal contained in the packing substrate 11. Preferably, the anti-corrosive agent is a heterocyclic aromatic ring compound having at least three nitrogen atoms and a connected ring structure in its molecule, or a heterocyclic aromatic ring compound having at least four nitrogen atoms in its molecule. Furthermore, the aromatic ring compound preferably has a carboxyl group, a sulfur group, a hydroxyl group, or an alkoxyl group. Particularly preferred examples of the aromatic ring compound include tetrazole derivatives, 1,2,3-triazole derivatives, and 1,2,4-triazole derivatives.

[0043] Examples of tetrazole derivatives that can be used as the anticorrosive include those that do not have a substituent group on the nitrogen atoms forming the tetrazole ring and that have a substituent group at the 5-position of the tetrazole selected from the group consisting of a sulfur group, an amino group, a carbamoyl group, a carbonamide group, a sulfamonyl group and a sulfonamide group, or an alkyl group substituted with at least one substituent group selected from the group consisting of a hydroxyl group, a carboxyl group, a sulfur group, an amino group, a carbamoyl group, a carbonamide group, a sulfamonyl group and a sulfonamide group.

[0044] Examples of 1,2,3-triazole derivatives that can be used as the anticorrosive include those that do not have a substituent group on the nitrogen atoms forming the 1,2,3-triazole ring and that have a substituent group at the 4-position and / or the 5-position of the 1,2,3-triazole, selected from the group consisting of a hydroxyl group, a carboxyl group, a sulfo group, an amino group, a carbamoyl group, a carbonamide group, a sulfamoyl group and a sulfonamide group, or a substituted alkyl or aryl group with at least one substituent group selected from the group consisting of a hydroxyl group, a carboxyl group, a sulfo group, an amino group, a carbamoyl group, a carbonamide group, a sulfamoyl group and a sulfonamide group.

[0045] In addition, examples of 1,2,4-triazole derivatives that can be used as the anticorrosive include those that have no substituent group on the nitrogen atoms forming the 1,2,4-triazole ring and that have a substituent group at the 2-position and / or the 5-position of the 1,2,4-triazole, selected from the group consisting of a sulfo group, a carbamoyl group, a carbonamide group, a sulfamoyl group and a sulfonamide group, or a substituted alkyl or aryl group substituted with at least one substituent group selected from the group consisting of a hydroxyl group, a carboxyl group, a sulfo group, an amino group, a carbamoyl group, a carbonamide group, a sulfamoyl group and a sulfonamide group.

[0046] The cutting fluid, which contains the aforementioned organic acid and oxidizing agent, is supplied by the blade cooling nozzles 58a and 58b, the shower nozzle (not shown) and the spray nozzles 66, which are located in the Fig. The cutting fluid is supplied to the cutting blade 50 and the packing substrate 11, as shown in Figure 5, and is contained within the cutting unit 24. However, it is sufficient that the cutting fluid is supplied from at least one of these nozzles.

[0047] The packing substrate processing method using the cutting device 2 according to this preferred embodiment is now described. First, the adhesive tape 25 is prepared as shown in Fig.4 shown attached to the packing substrate 11 (tape application step). At this point, the adhesive tape 25 is attached to the side of the plastic layer 15 of the packing substrate 11 in such a way that the front side 13a of the substrate 13 is exposed. The packing substrate 11 is then held by the adhesive tape 25 on a holding unit (holding step). In the Fig. The cutting device 2 shown in section 3 corresponds to the clamping table 20 of this holding unit.

[0048] The packing substrate 11 is then cut using the cutting blade 50 (cutting step). Fig. Figure 6 is a partial sectional view, which illustrates the cutting step. In the cutting step, the cutting blade 50 is positioned such that the lower end 50a of the cutting blade 50 is as shown in Fig.6, which has a lower height than the lower surface of the plastic layer 15. Furthermore, the cutting blade 50 is rotated by turning the spindle. The clamping table 20 is then moved in the direction (feed direction) which is substantially parallel to the holding surface 20a and substantially perpendicular to the axis of the spindle on which the cutting blade 50 is mounted. At this point, the cutting blade 50 is aligned with a predetermined parting line 17 extending in the X-direction. Accordingly, the rotating cutting blade 50 and the packing substrate 11 held on the clamping table 20 are moved relative to each other in the X-direction, such that the packing substrate 11 is completely cut by the cutting blade 50 to the depth at which the lower end 50a of the cutting blade 50 reaches the adhesive strip 25. That is, the packing substrate 11 is completely cut along the predetermined parting line 17. As in Fig.As shown in Figure 6, the thickness of the cutting blade 50 is less than the length of the oval recess 19a of each electrode 19 in its longitudinal direction, with the multiple electrodes 19 arranged at each division line 17. Accordingly, the cutting blade 50 is able to pass through the interior of each recess 19a when cutting the packing substrate 11 along each division line 17.

[0049] During the cutting step, when the packing substrate 11 is cut, a cutting fluid 74, which contains the organic acid and the above-mentioned oxidizing agent, is supplied by the blade cooling nozzles 58a and 58b, the shower nozzle (not shown) and the spray nozzles 66 (see Fig. 5) in the direction of the cutting blade 50 and the packing substrate 11, as shown in Fig. Figure 6 shows the process. At this point, the cutting fluid 74 is sprayed towards the cutting blade 50 and the packing substrate 11. In particular, the cutting fluid 74 is supplied as shown in Figure 6. Fig. Figure 6 shows that the cutting fluid 74 is supplied to a cutting area 11b where the packing substrate 11 is to be cut by the cutting blade 50. When the cutting fluid 74 is supplied to the cutting area 11b of the packing substrate 11, each electrode 19 is modified by the organic acid contained in the cutting fluid 74, and the surface of each electrode 19 is oxidized by the oxidizing agent contained in the cutting fluid 74. Consequently, the ductility of each electrode 19 is reduced, thereby suppressing the formation of burrs due to the cutting of each electrode 19.

[0050] Even though burr formation can be suppressed by supplying the cutting fluid 74, there is a case in which burr formation cannot be completely avoided. In this case, a fluid is sprayed along each parting line 17 to remove the burrs generated during the cutting step (burr removal step). Fig. Figure 7 is a partial section view showing the burr removal step.

[0051] The burr removal step is performed as described in Fig. Figure 7 shows that the process is carried out by spraying a liquid 76 from the spray nozzle 72, which is contained in the fluid spray unit 26, towards the cutting area 11b of the packing substrate 11. The spray nozzle 72 has a nozzle opening 72a for spraying the fluid 76, such as water, under pressure, thereby blowing away burrs 19b generated by each electrode 19. Removing the burrs 19b prevents a reduction in the quality of the packing elements obtained by cutting the packing substrate 11. The nozzle opening 72a of the spray nozzle 72 is, for example, circular in a top view. As shown in Fig.As shown in Figure 7, the spray nozzle 72 is arranged in such a position that the center of the nozzle opening 72a coincides with the center of the cutting area 11b, i.e., that the center of the nozzle opening 72a coincides with the center of a cut groove formed along each parting line 17. Accordingly, when the fluid 76 is sprayed from the nozzle opening 72 positioned above and the clamping table 20 is moved in the feed direction, it is sprayed along each parting line 17 to remove the burrs 19b.

[0052] As a modification, the spray nozzle 72 can be positioned directly above each electrode 19 in the burr removal step, since the burrs 19b are generated by each electrode 19. Fig. Figure 8 is a partial section view illustrating this modification.

[0053] As in Fig.As shown in Figure 8, the spray nozzle 72 can be arranged in such a position that the center of the nozzle opening 72a is aligned with each electrode 19 cut by the cutting blade 50. In particular, the spray nozzle 72 is positioned such that the center of the nozzle opening 72a is aligned with each recess 19a cut by the cutting blade 50, since the burrs 19b tend to remain in each recess 19a. With this configuration, the fluid 76 can be forcefully sprayed onto the burrs 19b to easily remove them. In the cutting area 11b of the packing substrate 11, the cut groove is formed along each parting line 17 by the cutting blade 50, the cut groove having a pair of opposing side walls 11c and 11d.For example, the spray nozzle 72 is positioned such that the distance D from the side wall 11c of the cut groove to the center (center line) of the nozzle opening 72a is 20 µm or less in a horizontal direction. However, the value for the distance D can be determined, for example, according to the size of each electrode 19 and each recess 19a.

[0054] Furthermore, the fluid 76 sprayed by the spray nozzle 72 tends to remain in each recess 19a. Accordingly, according to this modification, the fluid 76 can simply be supplied to each recess 19a where the burrs 19 tend to remain, so that the burrs 19b can be effectively removed.

[0055] After removing the burrs 19b left in each recess 19a next to the side wall 11c, the spray nozzle 72 is repositioned to remove the burrs 19 left in each recess 19a next to the outer side wall 11d. In this way, the fluid 76 is sprayed to the burrs 19b left in the recesses 19a next to both side walls 11c and 11d, ensuring reliable removal of the burrs 19b. The cutting and burr removal steps are performed along all intersecting division lines 17 of the packing substrate 11, thereby dividing the packing substrate 11 into the multiple packing elements.

[0056] The movement of the cutting unit 24 and the movement of the fluid spray unit 26 are controlled separately by the movement units 30a and 30b respectively, which are located in Fig.Figure 3 illustrates this. Accordingly, the timing for spraying the fluid 76 onto the packing substrate 11 can be freely determined. For example, the packing substrate 11 can be cut by the cutting unit 24 while the clamping table 20 moves in a first direction (forward direction). Subsequently, the burrs can be removed by the fluid spray unit 26 while the clamping table 20 moves in a second feed direction (reverse direction) opposite to the first feed direction. In this way, the cutting step and the burr removal step can be performed along each division line 17 in both the forward and reverse directions. However, the timing for burr removal is not limited to the above. For example, burr removal can be performed after cutting the packing substrate 11 along all division lines 17.Alternatively, the removal of the burrs can be carried out simultaneously with the cutting of the packing substrate 11 along a predetermined section line 17, following the previous section line 17 that has already been cut. In this case, the cutting of the packing substrate 11 and the removal of the burrs can be performed simultaneously.

[0057] While the position of the cutting unit 24 and the position of the fluid spray unit 26 are controlled independently of each other in the preferred embodiment above, the cutting unit 24 and the fluid spray unit 26 can be integrally formed. For example, the spray nozzle 72 is attached to the Fig.The blade cover 52 shown in Figure 5 is attached in such a way that it forms a unit which performs cutting and spraying of the fluid. In this case, the cutting blade 50 and the spray nozzle 72 move integrally, so that after the cutting of the packing substrate 11 by the cutting blade 50, the removal of the burrs is carried out by the spray nozzle 72.

[0058] As described above, the cutting step in the packing substrate processing method according to this preferred embodiment is carried out to cut the packing substrate 11 using the cutting blade 50 while the cutting fluid 74, which contains the organic acid and the oxidizing agent, is supplied. Subsequently, the burr removal step is carried out to remove the burrs by spraying the fluid 76. Supplying the cutting fluid 74 suppresses the formation of burrs, and the burrs can then be easily removed in the next step. Accordingly, the pressure of the fluid 76 for burr removal can be reduced. Consequently, the burrs can be removed while suppressing the occurrence of this disadvantage in processing the packing substrate 11 and also preventing a reduction in processing efficiency.

[0059] While in the preferred embodiment above the packing substrate 11 is held by suction via the adhesive strip 25 on the clamping table 20 as the holding unit, a device table can be used as the holding unit for holding the packing substrate 11. Fig. 9A and Fig. Figure 9B shows such a device table 80 for holding the packing substrate 11 according to a second preferred embodiment. Fig. 9A is a top view of the fixture table 80, and Fig. 9B is a sectional view of the fixture table 80.

[0060] As in Fig. 9A and Fig. As shown in Figure 9B, the fixture table 80 has a fixture base 82 which has a rectangular shape in a top view. The fixture base 82 is designed to be replaced by exchanging the clamping table 20 at the Fig.The device base 82 is to be placed on the movable block 8 shown in Figure 3. The device base 82 is connected to a rotary drive source (not shown), such as a motor. The device base 82 has an axis of rotation that is essentially parallel to a vertical direction. Accordingly, the device base 82 is rotated about its vertical axis by actuating the rotary drive source. The device base 82 has an upper surface 82a for the removable attachment of a retaining element 84. The retaining element 84 has a shape that corresponds to the shape of the packing substrate 11.

[0061] The retaining element 84 is a plate-shaped element that has a rectangular form in a top view. The retaining element 84 has an upper surface, a retaining surface 84a, for holding the packing substrate 11 under suction. Several intersecting grooves 84c, each corresponding to the several intersecting division lines 17 of the packing substrate 11, are formed on the retaining surface 84a of the retaining element 84. That is, the upper end of each groove 84c opens to the retaining surface 84a. Accordingly, the several rectangular separate areas, each corresponding to the several rectangular separate areas 11a (see Fig.1A) of the packing substrate 11, defined by these grooves 84c on the holding surface 84a. Each separate area defined by the grooves 84c has a suction hole 84d extending from the upper surface of the holding element 84 to its lower surface. A first passage 82b is formed on the upper surface 82a of the device base 82 at its central section. When the holding element 84 is as shown in Fig. As shown in Figure 9B, each intake hole 84d of the retaining element 84 is attached to the upper surface 82a of the device base 82, and is connected to the first passage 82b of the device base 82.

[0062] The first passage 82b is connected to a vacuum source 88 via a valve 86a. Accordingly, when the valve 86a is open in the state in which the packing substrate 11 is positioned on the holding surface 84a of the holding element 84 and each division line 17 of the packing substrate 11 is vertically aligned with the corresponding groove 84c of the holding element 84, the packing substrate 11 can be held against the device table 80 by suction. Furthermore, a second passage 82c for attaching the holding element 84 to the device base 82 is formed in an outer section of the device base 82. The second passage 82c is connected to the vacuum source 88 via a valve 86b.Accordingly, when the valve 86b is open in the state in which the lower surface 84b of the holding element 84 is in contact with the upper surface 82a of the device base 82, the retaining element 84 is fixed to the upper surface 82a of the device base 82 by the vacuum applied by the vacuum source 88.

[0063] In this preferred embodiment, the cutting step and the burr removal step can be carried out in the state in which the packing substrate 11 is held on the device table 80. Fig.Figure 10 is a partial sectional view illustrating the cutting step using the fixture table 80. When the packing substrate 11 is held on the fixture table 80, the division lines 17 of the packing substrate 11 are each vertically aligned with the grooves 84c of the holding element 84. The cutting blade 50 is then positioned such that its lower end is lower than the upper opening of each groove 84c. In this state, the fixture table 80 is moved in the feed direction, thereby cutting the packing substrate 11 along each division line 17 with the rotating cutting blade 50. That is to say, as shown in Figure 10, the cutting blade 50 is rotated. Fig. Figure 10 shows that the packing substrate 11 is cut by the cutting blade 50 along each division line 17 to the depth at which the lower end of the cutting blade 50 reaches the corresponding groove 84c of the retaining element 84 of the fixture table 80.

[0064] After performing this cutting step, the burr removal step is carried out by spraying the fluid onto the packing substrate 11 held on the device table 80. The other steps in the second preferred embodiment are similar to those in the first preferred embodiment.

[0065] The packing substrate 11, processed using the packing substrate processing method according to the first preferred embodiment, was evaluated. The result of this evaluation is now described. In this evaluation, the packing substrate 11 was held on the clamping table 20 by the adhesive strip 25, and the cutting step was then performed while the cutting fluid containing the organic acid and the oxidizing agent was supplied. The burr removal step was then carried out by spraying the fluid under a predetermined pressure. Afterward, it was observed whether the adhesive strip 25, which was attached to the processed packing substrate 11, had broken or not, and whether burrs remained on the packing substrate 11 or not.

[0066] The packing substrate 11 was a quad flat non-lead (QFN) packing substrate with a width of 65 mm, a length of 75 mm, and a thickness of 0.55 mm. The adhesive tape 25 was a tape (D-218) manufactured by Lintec Corporation, having a base film made of polyethylene terephthalate (PET) with a thickness of 200 µm. With the packing substrate 11 held over the adhesive tape 25 on the clamping table 20, the cutting step was performed by positioning the cutting blade 50 at the depth reached by the adhesive tape 25 and then completely cutting the packing substrate 11 along each division line 17. During cutting of the packing substrate 11, the cutting fluid, which contains the organic acid and the oxidizing agent, was supplied.The burr removal step was then performed by spraying the fluid from the spray nozzle 72 in the direction of each division line 17. Water was used as the fluid in the burr removal step. Furthermore, the pressure of the fluid sprayed from the spray nozzle 72 was varied to 25 MPa, 30 MPa, 35 MPa, and 40 MPa. Under these conditions, it was observed whether the adhesive strip 25 attached to the packing substrate 11, which had been treated by the burr removal step, was broken or not. It was also observed whether the burrs remained on the packing substrate 11 or not.

[0067] The result of an evaluation of the packing substrate 11 is given in Table 1. Table 1 also shows the result of a comparison, whereby the comparison was carried out by using pure water as the cutting fluid and by setting the pressure of the fluid to be sprayed from the spray nozzle 72 to 35 MPa. [Table 1] Fluid (water) pressure Cutting fluid observed object 25 MPa 30 MPa 35 MPa 40 MPa organic acid + oxidizing agent Ligament broken No No No Yes Ridges remained Yes No No No Pure water Ridges remained Yes

[0068] As shown in Table 1, when pure water was used as the cutting fluid and the fluid pressure was set to 35 MPa for burr removal, it was confirmed that burrs remained on the packing substrate 11. This result demonstrates that when pure water is used as the cutting fluid and the fluid pressure is set to 35 MPa, burr removal is insufficient. Accordingly, when pure water is used as the cutting fluid, the fluid pressure is usually set to approximately 70 MPa. In comparison, when the cutting fluid containing the organic acid and the oxidizing agent according to the present invention was used and the fluid pressure was set to 30 MPa, 35 MPa, and 40 MPa, burrs were not noticeably observed on the packing substrate 11.This result demonstrates that the fluid pressure required for burr removal is reduced compared to the use of pure water as the cutting fluid. This is assumed to be due to the fact that the supply of the cutting fluid, which contains the organic acid and the oxidizing agent, can suppress burr formation and facilitate their removal. However, when the fluid pressure was set to 25 MPa, it was observed that burrs remained slightly attached to the packing substrate 11. Therefore, to reliably remove the burrs, the fluid pressure is preferably set to a value greater than 25 MPa, and more preferably to 30 MPa or more.

[0069] Furthermore, when the cutting fluid containing the organic acid and the oxidizing agent was used and the fluid pressure was set to 40 MPa, breakage of the adhesive strip 25 was observed. Accordingly, the fluid pressure is preferably set to a value of less than 40 MPa, and more preferably to 35 MPa or less, in order to prevent breakage of the adhesive strip 25 during the burr removal step. In this way, the pressure of the fluid to be sprayed during the burr removal step is preferably set to a value such that the burrs can be removed and the occurrence of the disadvantage during machining of the packing substrate 11 (e.g., breakage of the adhesive strip 25 and spalling of part of the packing substrate 11) can be suppressed.

[0070] In summary, the above result confirms that when the cutting fluid containing the organic acid and the oxidizing agent according to the present invention is used for cutting the packing substrate 11, the pressure of the fluid to be sprayed when removing burrs can be reduced, so that the occurrence of the disadvantage when machining the packing substrate 11 can be suppressed and burrs can be removed.

Claims

[1] Packing substrate processing method for processing a packing substrate (11) having a division line (17) wherein an electrode (19) is formed at the division line (17) and the packing substrate processing method comprises: a cutting step of cutting the packing substrate (11) along the division line (17) using a cutting blade (50); and a burr removal step of removing burrs produced by the electrode (19) in the cutting step by spraying a fluid onto the packing substrate (11) along the parting line (17) after performing the cutting step; wherein the cutting step includes a step of supplying a cutting fluid containing an organic acid and an oxidizing agent to a cutting area (11b) in which the packing substrate (11) is to be cut by the cutting blade (50). [2] Packaging substrate processing method according to claim 1, further comprising: a tape application step of applying an adhesive tape (25) to the packing substrate (11) prior to performing the cutting step; and a holding step of holding the packing substrate (11) over the adhesive tape (25) on a holding unit (20) after performing the tape application step and before performing the cutting step; wherein the cutting step is carried out in a state in which the packing substrate (11) is held on the holding unit (20) via the adhesive strip (25) by completely cutting the packing substrate (11) attached to the adhesive strip (25) along the parting line (17) to a depth at which the cutting blade (50) reaches the adhesive strip (25); wherein the burr removal step is carried out by spraying the fluid in a state in which the adhesive tape (25) is attached to the packing substrate (11). [3] Packaging substrate processing method according to claim 1, further comprising: a holding step of holding the packing substrate (11) on a device table (80) which has a groove corresponding to the division line (17) before performing the cutting step; wherein the cutting step is carried out in a state in which the packing substrate (11) is held on the device table (80) by completely cutting the packing substrate (11) along the parting line (17) to the depth at which the cutting blade (50) reaches the groove of the device table (80); wherein the burr removal step is carried out by spraying the fluid onto the packing substrate (11) held on the device table (80).

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