X-ray detector module and method for providing an X-ray detector module

Abstract

X-ray detector module comprising at least one substrate unit (1) with a planar extension and at least two evaluation units (3), each designed to process electrical signals fed in by a coupled converter unit (5), in a stack arrangement, wherein - the at least two evaluation units (3) are arranged next to one another at a distance along a first direction parallel to the planar extent of the substrate unit (1), - electrically conductive connections (7) from at least one of the two evaluation units (3) to the substrate unit (1) are arranged along the first direction between the two evaluation units (3), and - the electrically conductive connections (7) are formed by means of a preformed contacting element (9) comprising the electrically conductive connections (7), which is designed as a multi-layer contacting element (9), wherein the multi-layer contacting element (9) comprises a plurality of contacting layers comprising the electrically conductive connections (7) and insulating intermediate layers, which are arranged in a row along a second direction parallel to the planar extent and orthogonal to the first direction, or which is produced by means of an additive manufacturing technique.

Description

[0001] The invention relates to an X-ray detector module, an X-ray detector unit comprising an X-ray detector module, an X-ray detector unit, an associated medical imaging device and a method for providing an X-ray detector module.

[0002] X-ray detectors are used in many imaging applications. For example, X-ray detectors are used in computed tomography scanners in medical imaging to generate a tomographic X-ray image of a patient's examination area.

[0003] In X-ray imaging, for example, in computed tomography (CT), angiography, or radiography, either counting, direct-conversion X-ray detector devices or integrating, indirect-conversion X-ray detector devices can be used. The X-rays or photons can be converted into electrical pulses in direct-conversion X-ray detector devices using a suitable converter material. Examples of converter materials that can be used include CdTe, CZT, CdZnTeSe, CdTeSe, CdMnTe, InP, TlBr2, HgI2, GaAs, or others. The electrical pulses can be evaluated by electronic circuits of an evaluation unit, for example, in the form of an integrated circuit (Application Specific Integrated Circuit, ASIC).In counting X-ray detector devices, the incident X-ray radiation can be measured by counting the electrical pulses triggered by the absorption of X-ray photons in the converter material. The height of the electrical pulse is also usually proportional to the energy of the absorbed X-ray photon. This allows spectral information to be extracted by comparing the height of the electrical pulse with a threshold value. In indirect-converting X-ray detector devices, the X-ray radiation or photons can be converted into light by a suitable converter material and into electrical pulses by optically coupled photodiodes. Scintillators, such as GOS (Gd2O2S), CsJ, YGO, or LuTAG, are often used as converter materials. The generated electrical signals are further processed by an evaluation unit comprising electronic circuits.

[0004] To enlarge a detection area, several hybrids consisting of an evaluation unit and an associated converter unit are often arranged side by side, either in a row or in a matrix. A CT detector, for example, can consist of a large number of hybrids that are arranged in a row at least along the direction of rotation φ. Furthermore, a row can also be arranged along the axis of rotation in order to be able to image a larger examination area simultaneously. For efficient dose utilization, it is advantageous to keep non-active gaps within the detection area as small as possible. Therefore, for the design of large-area X-ray detectors, it can be advantageous to use components that can be arranged as closely as possible. However, this can be counteracted by the need to provide data lines and control lines to and from the evaluation units.

[0005] To ensure good handling and, at the same time, to provide sufficient space on the back of a carrier unit for connectors and a surface for good thermal coupling, the carrier unit should not be smaller than a certain minimum size. On the other hand, it is advantageous not to manufacture converter units and evaluation units as overly large individual parts. Therefore, it is common practice to install multiple evaluation units and / or converter units on one carrier unit.

[0006] One option for achieving the closest possible alignment along all four sides is through-silicon vias (TSV), which provide through-holes through the silicon substrate of the evaluation unit. However, this can involve complex and costly manufacturing.

[0007] Particularly in the field of direct-converting X-ray detectors, the use of so-called wire bonds is known for contacting the evaluation units. Wire bonding technology represents an established and cost-effective contacting option. Here, the evaluation unit of a hybrid extends laterally beyond the converter element at at least one edge. These surfaces are used to connect contact areas of the evaluation units to contact areas on a carrier unit via bond wires. The disadvantage is that, at least at the edge with the bond wires, additional space is required for the contact areas on the evaluation unit and the carrier unit, as well as for the path of the bond wire itself. Consequently, at least in this area, inactive areas in a detection area must be accepted if devices are arranged side by side.

[0008] When arranging two hybrids in combination with a carrier unit, a so-called back-to-back arrangement is common. The hybrids are arranged on the carrier unit such that the wire bonds are arranged along the respective outer edge of the evaluation units facing away from each other. This allows the two hybrids to be arranged with a small distance between the coupled converter units along a first direction and an equally dense arrangement in an orthogonal direction. The disadvantages, however, are particularly large inactive areas and particularly uneven pixel pitches when more than two hybrids are to be arranged on a carrier unit or several carrier units are to be arranged side by side along the first direction.

[0009] The document DE 10 2007 022 197 A1 discloses an X-ray detector for an X-ray device with a layered structure with a detection element, a re-contacting substrate and at least one electronic component, wherein a conductive connection between the electronic component and a rear substrate can be provided via contacts and the re-contacting substrate.

[0010] The document US 2016 / 0 154 124 A1 discloses a detector unit for an imaging modality, wherein electrical circuits can be provided embedded in a molding compound in an electronics subunit of the detector unit, wherein lines are guided through at least a part of the electronics subunit.

[0011] The document US 2017 / 0 194 375 A1 discloses the electrical connection of CMOS tiles via a lateral transition zone and a side wall of the CMOS tile to a substrate by means of metallic connections, which can be applied by 3D printing.

[0012] The document DE 10 2014 222 690 A1 discloses a detector module for an X-ray detector comprising a number of sensor boards arranged adjacent to one another on a module carrier, wherein each sensor board in a stack structure comprises a sensor layer with a sensor surface to which a bias voltage can be applied for detecting X-ray radiation, and wherein in the stack structure along a side surface of the stack structure of each sensor board a voltage supply line for applying the bias voltage is arranged.

[0013] The document US 2014 / 0 307 850 A1 discloses a detector tile for an X-ray detector, comprising a surface layer with a circuit arrangement on a front side of a substrate comprising a number of detector pixels forming a pixel array, wherein in the surface layer or the substrate at least one connection opening is provided on at least one edge in order to guide electrical connection elements from the front side to the back side of the substrate.

[0014] German patent document DE 602 25 916 T2 discloses a radiation detector with multiple readout electronics arranged along two directions on a carrier substrate. The object of the invention is to provide an X-ray detector module that allows cost-effective production and advantageous arrayability.

[0015] The problem is solved by the features of the independent patent claims. Further advantageous and partly inventive embodiments and developments of the invention are set forth in the subclaims and the following description.

[0016] The invention relates to an X-ray detector module comprising at least one substrate unit with a planar extension and at least two evaluation units, each designed to process electrical signals fed in by a coupled converter unit, in a stack arrangement, wherein the at least two evaluation units are arranged spaced apart from one another along a first direction parallel to the planar extension of the substrate unit, and electrically conductive connections from at least one of the two evaluation units to the substrate unit are arranged along the first direction between the two evaluation units.

[0017] A substrate unit, which can be comprised by the X-ray detector module according to the invention, can also be referred to as a carrier unit. Such a substrate unit has a planar extension, ie, a planar extent. The surface normal of such a substrate unit can preferably run substantially parallel to the direction of incidence of the X-ray radiation, ie, the stacking direction. A substrate unit can comprise, for example, glass, ceramic, or even a plastic.

[0018] A respective evaluation unit, which can be included in the X-ray detector module according to the invention, can in particular also have a planar extension. The surface normal of a respective evaluation unit can preferably run substantially parallel to the direction of incidence of the X-ray radiation. An evaluation unit can be designed as an integrated circuit. An evaluation unit can in particular be designed as an application-specific integrated circuit (ASIC).

[0019] An evaluation unit, which can be comprised by the X-ray detector module according to the invention, can in particular each comprise a plurality of pixel electronics, wherein a respective pixel electronics of the plurality of pixel electronics can be designed for pixel-by-pixel processing of the electrical signals fed into a pixel electronics by the converter unit into a digital pixel measurement signal. This means that such a pixel electronics of the plurality of pixel electronics can at least be designed to receive an electrical signal from a converter unit coupled to the evaluation unit via at least one signal input and to further process the fed-in electrical signal, in particular to digitize it, for example by means of an A / D converter (analog-to-digital converter). The pixel electronics can also have further switching elements, for example a signal amplifier or a comparator.

[0020] A respective evaluation unit can be coupled to the converter unit via electrically conductive connections. For example, each of the plurality of pixel electronics of an evaluation unit can each have a signal input which is designed to feed electrical signals from the converter unit into a pixel electronics unit when the evaluation unit is signal-coupled to the converter unit via electrically conductive connections. The electrically conductive connections between an evaluation unit, i.e. a respective signal input, and a converter unit can be designed, for example, as solder connections, e.g. so-called bump bonds, as so-called stud bumps, as conductive adhesive connections or in some other way. As a rule, a distance which corresponds to the height of the electrically conductive connection formed therebetween is formed between the evaluation unit and the converter unit.

[0021] A converter unit coupled to such an evaluation unit can be designed as a direct-converting converter unit comprising a direct-converting converter material. However, in other embodiments, the converter unit can also be designed as an indirect-converting converter unit. In this case, the converter unit can, for example, comprise a scintillator material and a number of photodiodes coupled thereto.

[0022] A converter unit coupled to such an evaluation unit can, in particular, be planar. The converter unit can, in particular, have a planar extension. The surface normal of the converter unit can preferably run substantially parallel to the operational direction of incidence of the X-ray radiation. A converter unit can also be coupled to a plurality of evaluation units.

[0023] A stack arrangement comprising an evaluation unit and a substrate unit is described in which a substrate unit can be provided in a first stack position and an evaluation unit in a second stack position parallel to the first stack position, wherein the stack direction of the stack arrangement runs, in particular, substantially parallel to the operational direction of incidence of the X-ray radiation, and the evaluation unit in the stack arrangement faces the operational direction of incidence of the X-ray radiation. A converter unit coupled to an evaluation unit is preferably arranged closest to an X-ray source in the stack arrangement, so that the X-ray radiation is incident, in particular, directly onto the converter unit.

[0024] In such a stacked arrangement, a substrate unit is mechanically connected to a stacked evaluation unit. An evaluation unit can be mechanically connected to the substrate unit, for example, by means of an adhesive bond. In advantageous variants, a substrate unit and a respective evaluation unit are connected, in particular, in a thermally conductive manner, thus advantageously enabling heat exchange between the evaluation unit and the substrate unit. This can enable effective heat dissipation from the evaluation unit.

[0025] In such a stacked arrangement, a substrate unit is also electrically connected to a stacked evaluation unit via the electrically conductive connections. At least some of these electrically conductive connections can be provided to transmit the processed signals from an evaluation unit to the substrate unit. The substrate unit can be designed to forward the processed electrical signals. Furthermore, signals can also be transmitted to the evaluation units via the electrically conductive connections, e.g. a reference voltage, a clock signal or a configuration signal. The substrate unit can have a connecting unit, for example a plug. By means of the connecting unit, the signals can be transmitted via the substrate unit to a stacked evaluation unit or the signals can be read out and forwarded, for example, to a processing unit of a medical device.Such a connection unit can, for example, be arranged on a side or surface of the substrate unit facing away from the incident X-ray radiation. The connection unit can be assigned to a plurality of evaluation units, in particular to all evaluation units assigned to a common substrate unit.

[0026] Each evaluation unit can have contact areas, also called contact pads. The substrate unit can have corresponding contact areas. An electrically conductive connection from an evaluation unit to the substrate unit can electrically connect a contact area on a stacked evaluation unit to a corresponding contact area on the substrate unit, thus enabling signal transmission. Electrically conductive connections can then be formed from the contact areas of the substrate unit to a possible connecting unit for forwarding the signals.

[0027] The contact regions of a stacked evaluation unit can be arranged on a top side of the evaluation unit, which faces away from the substrate unit and towards the incident X-ray radiation. The contact regions of the evaluation unit are generally arranged at an edge region of the evaluation unit. The edge region can extend, for example, along an edge of the evaluation unit. The edge, also referred to below as the contacting edge, can then extend in particular along a direction parallel to the planar extent of the evaluation unit. The edge region comprising the contact regions can be recessed from an overlap of a coupled converter unit. However, other designs can also exist, wherein the converter unit projects at least partially beyond the contact region.

[0028] The corresponding contact areas on the substrate unit can be arranged, in particular, on a side of the substrate unit facing the incident X-ray radiation. The contact areas on the substrate unit can be arranged, in particular, in a surface area of ​​the substrate unit that, in the stacked arrangement, does not overlap with the planar extent of a stacked evaluation unit. The contact areas of the substrate unit are generally located in the stacked arrangement in spatial proximity to the contact areas on the evaluation unit and, in the presence of the stacked arrangement, can be arranged, for example, mirror-symmetrically to the contact areas of the stacked evaluation unit.

[0029] In a particularly simple variant of such a stack arrangement, the electrically conductive connections can be formed, for example, as bonding wires, i.e., the electrically conductive connections can be formed using a so-called wire bonding technique. However, other designs of the electrically conductive connections can also be used. The use of bonding wires for creating electrically conductive connections between evaluation units and downstream units of an X-ray detector is well known in the field of technology and represents a widely established method for creating electrically conductive connections.

[0030] The X-ray detector module according to the invention has a stack arrangement as described above, wherein the second stack layer comprises at least two evaluation units. The second stack layer can also comprise more than two, for example, three or four, evaluation units. The at least two evaluation units of the X-ray detector module according to the invention are arranged next to one another in an evaluation plane parallel to the planar extension of the substrate unit. The surface normals of a plurality of evaluation units stacked with a substrate unit can, in particular, run essentially parallel to one another.

[0031] The at least two evaluation units of the X-ray detector module according to the invention are arranged next to one another, in particular along a first direction, which is parallel to the planar extension of the substrate unit. The first direction can, for example, preferably run parallel to a rotation axis of a computed tomography device if the X-ray detector module is comprised of a computed tomography device. The at least two evaluation units are arranged, in particular, at a distance from one another, such that a surface area of ​​the substrate unit between the first and second evaluation units of the at least two evaluation units is not covered by the first and second evaluation units.

[0032] According to the invention, electrically conductive connections from at least one of the two evaluation units to the substrate unit are arranged along the first direction between the two evaluation units. This may include only a portion of a respective electrically conductive connecting line being arranged between the two evaluation units. Another portion of a respective electrically conductive connecting line may also run over or parallel to a planar extension of a respective evaluation unit on a side of the evaluation unit facing away from the substrate unit.

[0033] Contact regions of the evaluation unit whose electrically conductive connections are arranged between the at least two evaluation units can then be arranged in particular in the edge region of this evaluation unit which is closest to the second evaluation unit along the first direction. The contacting edge of this evaluation unit consequently faces the second evaluation unit and extends along a second direction which is parallel to the planar extent and orthogonal to the first direction. The corresponding contact regions of the substrate unit which are provided for contacting the at least one evaluation unit of the evaluation units can be present in particular in the uncovered surface region of the substrate unit between the at least two evaluation units.

[0034] The electrically conductive connections from the second evaluation unit of the at least two evaluation units of the X-ray detector module according to the invention to the substrate unit can be arranged on a side of the second evaluation unit which faces away from the first evaluation unit of the at least two evaluation units along the first direction.

[0035] This means that a contacting edge of the second evaluation unit can face away from the first evaluation unit and extend on a side of the second evaluation unit opposite the first direction. However, in one embodiment of the X-ray detector module according to the invention, they can also be arranged between the first and second evaluation units. This means that the contacting edge of the second evaluation unit can face the first evaluation unit. In this embodiment, contact areas for both the first and second evaluation units can be provided in the surface area of ​​the substrate unit between the first and second evaluation units.

[0036] The dimensions of a distance between two evaluation units on a substrate unit are generally dependent at least on a positioning accuracy, i.e. a necessary mounting distance, when placing the evaluation units from one another on the substrate unit. In particular, the dimensions of a distance along the first direction in an arrangement of the evaluation units according to the invention are also dependent on the space required by the electrically conductive connections from the at least one evaluation unit to the substrate unit. The space required can depend on the type of design of the electrically conductive connections. The space required can depend on whether the electrically conductive connections of only one of the evaluation units or both evaluation units are arranged between the first and the second evaluation unit.

[0037] In particularly simple and cost-effective variants of an X-ray detector module, the electrically conductive connections can be formed as bonding wires. According to other embodiments, electrically conductive connections can also be produced, for example, lithographically or by means of a printed circuit board printing process. According to the invention, however, the electrically conductive connections are formed by means of a preformed contacting element. Formation by means of a lithographic process, a printed circuit board printing process, or a preformed contacting element can allow for optimized spacing and simplified handling or production.

[0038] In addition to an inventive arrangement of the at least two evaluation units, further evaluation units can also be arranged in a stacked arrangement with the substrate. For example, a third or fourth evaluation unit can be arranged in a stacked arrangement with the substrate unit along the first direction. For example, between two evaluation units arranged side by side along the first direction, electrically conductive connections from at least one of the adjacent evaluation units can be arranged between the adjacent evaluation units.

[0039] An arrangement of electrically conductive connections along a second direction that is parallel to the planar extent of the substrate unit and orthogonal to the first direction can advantageously be dispensed with. It can be provided that, along this second direction that is parallel to the planar extent of the substrate unit and orthogonal to the first direction, further evaluation units are arranged in a stacked arrangement with the substrate unit adjacent to the at least two evaluation units. The second direction can, for example, preferably run parallel to a direction of rotation of a computed tomography device if the X-ray detector module is comprised of a computed tomography device. Along such a second direction, a distance between adjacent evaluation units or converter units coupled thereto can be determined solely by a mounting distance.A uniformly small spacing along the rotational direction of a computed tomography device is particularly advantageous. Along the second direction, a plurality of X-ray detector modules, each comprising a substrate unit, can be arranged in series advantageously with a small spacing. The spacing between two adjacent evaluation units or coupled converter units on two adjacent substrate units can be minimized to any necessary mounting distance.

[0040] An arrangement according to the invention enables an advantageous arrangement in series of a plurality of X-ray detector modules according to the invention, i.e. a plurality of substrate units, each with at least two evaluation units along the first direction. In this case, an overall more uniform distribution of the distances and, in total, even smaller distances between the evaluation units or the converter units coupled thereto and thus the inactive regions within a detection area along the first direction can be achieved. This applies in particular in comparison to X-ray detector modules with at least two evaluation units along the first direction, in which the electrically conductive connections between the evaluation units and an associated carrier unit are each arranged on the outer, mutually remote edges of the evaluation units and not at least partially internally between the evaluation units.Although larger distances may be accepted along the first direction due to an at least partially internal arrangement of the electrically conductive connections of at least one evaluation unit between the evaluation units on a substrate unit, in return, in an area in which two substrate units are lined up next to one another, distances between adjacent evaluation units or converter units coupled thereto can be reduced. An arrangement of more than two evaluation units along the first direction in a stacked arrangement with a substrate unit is also made possible by the intermediate arrangement of the electrically conductive connections according to the invention, with an improved guarantee of uniform distances along the first direction, without having to forego a cost-effective provision of the electrically conductive connections.

[0041] Advantageously, a structure according to the invention with electrically conductive connections arranged between the first and second evaluation arrangements also enables the evaluation units to be applied to the substrate unit over their entire surface and in particularly good thermal contact, for example by means of a thermally conductive adhesive, in comparison to, for example, prior art arrangements with TSV connections or so-called interposer layers. This increases the thermal coupling and thus improves the possible thermal stabilization. Furthermore, the improved mechanical stabilization can make it possible to use thinner evaluation units, i.e. evaluation units based on thinner wafers, since the evaluation units rest on the substrate unit over their entire surface without, for example, intermediate, punctual solder connections.

[0042] Furthermore, the electrically conductive connection, which is at least partially internal, i.e. arranged between two evaluation units, ensures partial protection of the connections against mechanical impairment and thus easier handling of the modules.

[0043] Electrically conductive connections can be formed using a lithographic process.

[0044] Using a lithographic process, conductor tracks can be applied to an evaluation unit or substrate unit, connecting the contact areas on an evaluation unit to the corresponding contact areas on the substrate unit via a side surface of the evaluation unit. The electrically conductive connections can extend from the contact areas on a top side of the evaluation unit, partially parallel to the planar extent of the evaluation unit, along the first direction on the evaluation unit.

[0045] Lithographic processes for providing conductor tracks are well known in semiconductor and microsystem technology. Lithographic methods advantageously allow for extremely precise formation of electrically conductive connections. Furthermore, electrically conductive connections can be created simultaneously over a relatively large surface area. Furthermore, the space required for forming the electrically conductive connections can be reduced, for example, compared to a wire bonding technique. This can affect both the space required for the electrically conductive connections themselves and the space required during the formation of the electrically conductive connections. A lithographic method for forming the electrically conductive connections can therefore allow smaller distances between two evaluation units arranged next to one another or converter units assigned to them on the substrate unit along the first direction.

[0046] In the case of a lithographic process, it can be advantageous if the height of an evaluation unit, and thus the height that must be bridged between the contact areas of the evaluation unit and the contact areas of the substrate unit by means of the lithographically applied conductor tracks, is not too large. The possibility of applying an evaluation unit over the entire surface of the substrate unit can advantageously ensure sufficient stability despite a smaller thickness of the evaluation unit.

[0047] In contrast to electrically conductive connections produced using a wire bonding process, conductor tracks can be applied directly to an evaluation unit using a lithographic process and, in particular, do not protrude significantly from the evaluation unit in the direction of the incident X-ray radiation. This can contribute to simplified handling. In particular, a conductor track applied using a lithographic process can have a smaller height than the distance between an evaluation unit and a converter unit coupled to it. This can advantageously make it possible for a converter unit coupled to the evaluation unit to protrude partially or completely beyond the area of ​​the evaluation unit in which the contact areas or the conductor tracks of the electrically conductive connections on the evaluation unit are formed.This means that the areal extent of the converter unit can at least partially overlap with the area of ​​the evaluation unit, comprising the contact areas of the evaluation unit or the conductor tracks. In this way, the distance between two converter units assigned to two adjacent evaluation units can be advantageously reduced, so that inactive areas of the detection area can be advantageously reduced.

[0048] In alternative variants, the electrically conductive connections can be formed by means of a conductor track printing process.

[0049] A conductive path printing process can, in particular, comprise a process for the additive manufacturing of conductive paths. An additive manufacturing process can comprise a 3D printing process. For example, a so-called surface direct write process can be used for the selective deposition of conductive paths. Such a process can, for example, comprise a droplet-based or an extrusion-based method. A surface direct write process can advantageously enable printing on a 3D surface.

[0050] Extrusion-based technologies use positive pressure to dispense the desired materials. The dispensed material is in the form of a liquid or paste and is extruded through a small nozzle. Extrusion-based technologies include, for example, robocasting or fused deposition modeling (also known as fused filament fabrication). Droplet-based technologies eject the desired material in the form of droplets onto the target substrate, in contrast to extrusion-based technologies, which form a continuous jet. Droplet-based technologies include, for example, inkjet printing (see, for example, DragonFly 2020 from Nano Dimension or Voltera V-One) or aerosol jet printing (see, for example, Aerosol Jet™ process from Optomec). Numerous conductive inks have been developed for effective dispensing, such as:Metal-based nanoparticle inks, organometallic inks, conductive polymers, carbon nanotubes, graphene oxide, sol-gel, polyelectrolyte inks, and conductive carbon pastes.

[0051] In this case, too, an arrangement is possible in which a converter unit coupled to the evaluation unit partially or completely overlaps the area of ​​the evaluation unit in which the contact areas or conductor tracks are formed. This means that, just as with lithographically produced electrically conductive connections, a converter unit can also be coupled to the evaluation unit whose planar extent overlaps at least with the area of ​​the evaluation unit containing the contact areas.

[0052] The formation of electrical conductors using an additive manufacturing process allows for the rapid production of microelectronic components. Complex processes such as lithographic masking steps, which can be time-consuming and expensive, can be avoided.

[0053] It may also be advantageous to design an X-ray detector module comprising a stack arrangement with a substrate unit and with only one evaluation unit, wherein the electrically conductive connections between the evaluation unit and the substrate unit are formed by means of a lithographic process or by means of a conductor track printing process, as described above. Such an advantageous stack arrangement can correspond to a stack arrangement described above in connection with an X-ray detector module according to the invention, wherein only at least one evaluation unit is arranged in a stack arrangement with a substrate unit. The substrate unit, the evaluation unit, and a converter unit that can be coupled to the evaluation unit can correspond in particular to a substrate unit, evaluation unit, and converter unit already described above. Such a stack arrangement can be comprised of an X-ray detector.An X-ray detector can, in particular, also comprise a plurality of such stack arrangements. Such an X-ray detector can be comprised by a medical imaging device, for example a computed tomography device. Such a stack arrangement can also comprise a converter unit with a planar extension, which is coupled to the evaluation unit. The converter unit coupled to the evaluation unit can partially or completely overlap with the region of the evaluation unit in which the contact regions or the electrically conductive connections are formed. This means that the planar extension of the converter unit can overlap at least with the region of the evaluation unit having the contact regions. Such a stack arrangement can be produced by providing a substrate unit and subsequently providing at least one evaluation unit in a stack arrangement with the substrate unit.Furthermore, electrically conductive connections between the evaluation unit and the substrate unit are produced by means of a lithographic process or by means of a conductor track printing process.

[0054] The advantages of forming electrically conductive connections using a lithographic process or a conductor track printing process, which were described in connection with an X-ray detector module comprising at least two evaluation units, can also be transferred to an X-ray detector module with a stack arrangement with at least one evaluation unit. The implementation of electrically conductive connections using a lithographic process or a conductor track printing process can, compared to, for example, electrically conductive connections formed using a wire bonding process, enable improved handling of such a stack arrangement without sacrificing cost-effective provision of the electrically conductive connections. Such a process can also, if necessary,The space required for the electrically conductive connections or for establishing the connections can be reduced. In particular, when the converter unit is arranged overlapping the contact areas of the evaluation unit, the inactive detection areas of a stacked arrangement can be reduced.

[0055] According to the inventive design of an X-ray detector module with at least two evaluation units, the electrically conductive connections are formed by means of a preformed contacting element comprising the electrically conductive connections.

[0056] A preformed contacting element can, for example, simultaneously establish all the required electrical connections between an evaluation unit and the substrate unit. The contacting element can, for example, have the electrically conductive connections arranged in an electrically insulating material, such as a plastic or rubber, in a suitable arrangement. The preformed contacting element can, in particular, be matched to the arrangement of the contact areas of the evaluation unit and the substrate unit and the existing stack arrangement. The preformed contacting element can, in particular, have mating contact areas corresponding to the contact areas on the evaluation unit and to the contact areas on the substrate unit.Such a preformed contacting element can be connected, for example, by means of friction / pressure (pressing in) and / or by means of a suitable, supporting adhesive connection or other type of contact mass, e.g.

[0057] Indium or by soldering. In particular, the electrically conductive contact areas on the substrate unit or the evaluation unit and the mating contact areas of the contacting element can be electrically contacted. In connection with press-fitting, a mechanically flexible design of the preformed contacting element can be advantageous, e.g., using a mechanically flexible material such as rubber. According to the invention, a preformed contacting element is designed as a multilayer contacting element or is also manufactured using an additive manufacturing technique.

[0058] Advantageously, preformed contact elements can be produced in advance in a simple, large-scale, and cost-effective manner. Furthermore, the insertion of the elements using one of the aforementioned methods is also technically simple and inexpensive. Furthermore, the handling of the X-ray detector modules can be improved, since the electrically conductive connections are arranged in a fixed relationship within the contact element, and the possibility of impairment or damage to the electrically conductive connections due to external influences is reduced. Advantageously, the space required for the electrically conductive connections or for the production of the electrically conductive connections can be reduced, particularly compared to a wire bonding process.

[0059] A preformed contacting element can be designed as a multi-layer contacting element, wherein the multi-layer contacting element comprises a plurality of contacting layers comprising the electrically conductive connections and insulating intermediate layers, which are arranged in a row along a second direction parallel to the planar extension and orthogonal to the first direction.

[0060] The layers of the multilayer contacting element can be stacked along the contacting edge so that the planes of the layers are parallel to the plane that would otherwise be spanned, for example, by bonding wires in a wire bonding process. The planes of the contacting layers comprising the electrically conductive connections are designed such that they connect a respective contact area of ​​an evaluation unit with the corresponding contact area on the substrate unit. The contacting layers are each separated by an insulating intermediate layer of suitable thickness so that the electrically conductive connections are separated from one another. The thickness of the individual contacting layers and the insulating intermediate layers is such that the sequence of the contacting layers is coordinated with the existing contact areas on the evaluation unit and the substrate unit.The conductive connections within a contact layer can be formed as conductor tracks on a contact layer. A contact layer can also be electrically conductive over its entire surface or part of its surface.

[0061] A preformed contacting element in the form of a multilayer contacting element represents an advantageously simple way of providing such a preformed contacting element. There may also be embodiments according to the invention of a preformed contacting element which is produced by means of an additive manufacturing method.

[0062] It may also be advantageous to design an X-ray detector module comprising a stack arrangement with a substrate unit and with only one evaluation unit, wherein the electrically conductive connections between the evaluation unit and the substrate unit are formed by means of a preformed contacting element, as described above. Such an advantageous stack arrangement can essentially correspond to a stack arrangement described above in connection with an X-ray detector module according to the invention, wherein only at least one evaluation unit is arranged in a stack arrangement with a substrate unit. The substrate unit, the evaluation unit, and a converter unit that can be coupled to the evaluation unit can in particular correspond to a substrate unit, evaluation unit, and converter unit already described above.Such an evaluation unit can have contact regions on an upper side of the evaluation unit, which is arranged facing away from the substrate unit in the stack arrangement. The contact regions can be arranged in particular along an edge region of an evaluation unit and along an edge, i.e. the contacting edge, of the evaluation unit. The electrically conductive connections provided by means of the pre-formed contacting element can be formed from the contact regions of the evaluation unit to corresponding contact regions on the substrate unit. The contact regions of the substrate unit can be arranged in particular on an upper side of the substrate unit, which faces the evaluation unit in the stack arrangement and in a region of the substrate unit which is not covered by the evaluation unit.Such a stack arrangement can also comprise a converter unit with a planar extension, which is coupled to the evaluation unit. Such a stack arrangement can be comprised by an X-ray detector. An X-ray detector can in particular comprise several such stack arrangements. Such an X-ray detector can be comprised by a medical imaging device, for example a computed tomography device. The advantages of forming electrically conductive connections by means of a preformed contacting element, which were described in connection with an X-ray detector module according to the invention comprising at least two evaluation units, can also be transferred to an X-ray detector module with a stack arrangement with at least one evaluation unit. Preformed contacting elements can advantageously be produced in advance in a simple manner, in large quantities and cost-effectively.Furthermore, the introduction of the elements using one of the aforementioned methods can be implemented in a technically simple and cost-effective manner. Advantageously, the handling of the X-ray detector modules can be improved and the space required for the electrically conductive connections or for producing the electrically conductive connections can be reduced, particularly compared to a wire bonding method. Such a stack arrangement with a contacting element can be produced by providing a substrate unit and subsequently providing at least one evaluation unit in a stack arrangement with the substrate unit. Furthermore, electrically conductive connections are produced by bringing a preformed contacting element comprising the electrically conductive connections into contact with at least the first evaluation unit and the substrate unit.Before connecting, the manufacturing step can therefore include providing a preformed contacting element. The establishment of electrical contact between the preformed contacting element can be achieved, for example, mechanically (e.g., by pressure), by means of a conductive adhesive bond or other contact compound, e.g., based on indium, or by soldering. In particular, the contact areas of an evaluation unit or the substrate unit can be brought into electrically conductive contact with mating contact areas of the contacting element.

[0063] According to a variant of the X-ray detector module according to the invention with at least two evaluation units, the electrically conductive connections from both evaluation units to the substrate unit are arranged along the first direction between the two evaluation units.

[0064] A central arrangement of the electrically conductive connections, and thus also of the contact areas, on the substrate unit can advantageously simplify the forwarding of signals via conductor tracks in the substrate unit to a common switching unit. Furthermore, this can ensure that sub-areas of the substrate unit, which are located, for example, beneath an evaluation unit, do not need to be used for forwarding signals to a switching unit, thus freeing up space for improved thermal coupling of the evaluation unit.

[0065] Furthermore, the internal arrangement of the contacts and electrically conductive connections of both evaluation units provides improved protection against mechanical influences when handling the X-ray detector modules.

[0066] An arrangement of the electrically conductive connections between the at least two evaluation units of the X-ray detector module can be achieved particularly advantageously by providing the electrically conductive connections using a lithographic process, a printed circuit board printing process, or a preformed contacting element. A wire bonding process may be hindered by the fact that sufficient space must be available for positioning the bonding wires. However, as soon as a second evaluation unit is placed along the first direction, this can disadvantageously conflict with the desirable short distances between the evaluation units.By providing the electrically conductive connections by means of a lithographic process, a printed circuit board printing process or with a preformed contacting element, an internal contacting can be achieved between the two evaluation units, whereby at the same time advantageously smaller distances between the evaluation units and thus also between the associated converter units can be ensured.

[0067] Even with such an internal arrangement of the electrically conductive connections of both evaluation units, a comparatively more uniform distribution of the distances between the evaluation units or the associated converter units overall along the first direction can be achieved when a plurality of substrates are arranged in a row along the first direction. Advantageously, it is possible to avoid the distance for the arrangement of the electrically conductive connections and the distance between two substrate units meeting at one point within a detection area. The distances can in particular be optimized independently of one another. In particular when two substrate units are arranged in a row, a particularly disadvantageous larger distance in the center of the detection area, i.e. an image center, which could under certain circumstances lead to image artifacts, can be avoided.

[0068] According to one embodiment variant thereof, the electrically conductive connections of the two evaluation units are arranged in an interlocking manner, so that in each case an electrically conductive connection of a first of the two evaluation units is arranged at least partially between two electrically conductive connections of the second of the two evaluation units along a second direction parallel to the planar extent and orthogonal to the first direction.

[0069] Advantageously, a distance between two evaluation units and thus also between two assigned converter units can be further reduced.

[0070] Furthermore, in a variant of an internal arrangement of the electrically conductive connections, at least some of the electrically conductive connections of the first and second evaluation units of the two evaluation units can be electrically conductively connected to one another.

[0071] For example, a suitable, for example partially symmetrical, arrangement of the signals to be supplied and discharged to and from the evaluation units and the associated contacts on the evaluation units can ensure that interconnectable connections of both evaluation units are located opposite one another and can be operated with a common electrically conductive connection to the substrate unit. For example, a contact area of ​​the first and a contact area of ​​the second evaluation unit are electrically connected to a common contact area on the substrate unit. In addition to interconnected connections, there are generally also non-interconnected connections. Interconnectable connections can include, for example, a ground signal, a reference voltage, a clock signal, or a configuration signal.This design is particularly advantageous for connections that are typically redundant, such as supply / ground connections. It can also be advantageous for differential clock signals.

[0072] Advantageously, space requirements can be reduced and complexity can be reduced.

[0073] In one embodiment of the X-ray detector module according to the invention, evaluation units are also arranged in a stacked arrangement with the substrate unit along a second direction that is parallel to the planar extent and orthogonal to the first direction. Advantageously, a larger detection area can be achieved in the second direction. Along the second direction, particularly small distances between two evaluation units or converter units assigned to them can then be achieved, which are dependent only on a positioning accuracy or a mounting distance between two evaluation units on a substrate unit. Furthermore, it is conceivable that a converter unit is assigned to a plurality of evaluation units along the second direction, so that inactive surface areas can be avoided.When arranging such an X-ray detector module in a computed tomography device, the second direction can, in particular, correspond to the direction of rotation. To achieve the highest possible image quality, avoiding inactive regions within a detection area, especially along the direction of rotation, is particularly advantageous.

[0074] The invention also relates to an X-ray detector unit comprising at least two X-ray detector modules according to one of the previously described embodiments, which are arranged next to one another along the first direction. In particular, the X-ray detector modules comprise converter units coupled to the evaluation units. Advantageously, the X-ray detector modules designed according to the invention can achieve a particularly uniform distribution of distances and, if appropriate, overall smaller distances between adjacent evaluation units or converter units assigned to them along the first direction.

[0075] In an advantageous variant, the distance between two converter units, which are assigned to two evaluation units adjacent along the first direction on two different substrate units arranged next to one another, is at most four times, preferably at most twice as large as the distance between two converter elements, which are assigned to two evaluation units adjacent along the first direction on the same substrate unit.

[0076] All design variants previously described in connection with the X-ray detector module according to the invention can also be implemented correspondingly in the X-ray detector unit. The description given with regard to the X-ray detector module and the advantages described above can also be applied accordingly to the X-ray detector unit.

[0077] The invention also relates to a medical imaging device comprising at least one X-ray detector module according to the invention or an X-ray detector unit according to the invention and an X-ray source arranged opposite thereto.

[0078] To acquire an X-ray image dataset, the object to be imaged can be placed between the X-ray source and the X-ray detector module or the X-ray detector unit and irradiated using the X-ray source.

[0079] In particular, the medical imaging device can be designed as a computed tomography device. The medical imaging device can also be designed as a SPECT or PET system. However, it can also be designed, for example, as a C-arm X-ray device and / or Dyna-CT, or in other ways.

[0080] All design variants previously described in connection with the X-ray detector module or X-ray detector unit according to the invention can also be implemented correspondingly in the medical imaging device. The description given with regard to the X-ray detector module or X-ray detector unit and the advantages described above can also be applied accordingly to the medical imaging device according to the invention.

[0081] The invention also relates to a method for providing an X-ray detector module according to the invention and the previously described embodiments. The method comprises the steps - Providing a substrate unit with a planar extension, - Providing at least one first evaluation unit in a stack arrangement with the substrate unit, - Providing a second evaluation unit in a stacked arrangement with the substrate unit, wherein the first and the second evaluation unit are arranged next to each other at a distance from each other along a first direction parallel to the planar extent of the substrate unit, - Producing electrically conductive connections between at least the first evaluation unit and the substrate unit, so that when the X-ray detector module is provided, electrically conductive connections from at least one of the two evaluation units to the substrate unit are arranged along the first direction between the two evaluation units.

[0082] In other embodiments, the step of establishing electrically conductive connections can be based on a wire bonding process, a lithographic process, or a printed circuit board printing process. According to the invention, the step of establishing electrically conductive connections is based on contacting by means of a preformed contacting element.

[0083] The method may further comprise the step of establishing electrically conductive connections between the second evaluation unit and the substrate unit.

[0084] The method may further comprise the step of applying a converter unit to the first and / or second evaluation unit. Alternatively, a converter unit may already be applied to the evaluation unit when the first and / or second evaluation unit is provided.

[0085] The method may further comprise providing, in addition to the first and second evaluation units, further evaluation units along the first direction in a stacked arrangement with the substrate unit.

[0086] An X-ray detector module according to the invention can advantageously be provided. Such an X-ray detector module can advantageously be used in an X-ray detector unit according to the invention.

[0087] According to one method variant, the step of establishing the electrically conductive connections between at least the first evaluation unit and the substrate unit takes place before the step of providing the second evaluation unit.

[0088] This process variant comprises a sequential application of the evaluation units or the electrically conductive connections, whereby only the electrically conductive connections of the first evaluation unit are arranged between the first and second evaluation units. This means that the first evaluation unit is applied first along the first direction, and is then electrically connected to the substrate unit. This is followed by the provision of the second evaluation unit in the stack arrangement along the first direction next to the first evaluation unit, which can then in turn be electrically connected to the substrate unit.

[0089] The sequential arrangement and connection of the evaluation units along the first direction enables the use of a wire bonding process while maintaining the smallest possible distances between the evaluation units or the converter units coupled to them. In a wire bonding process, wherein the electrically conductive connections are arranged at an edge region of the first evaluation unit on one side along the first direction, more space is required for the placement of the connections, i.e. for the formation of the connections, than is required by the connections themselves once they are formed. By arranging the second evaluation unit along the first direction after the first has already been electrically conductively connected, a distance can advantageously be minimized.

[0090] According to an alternative embodiment, the step of establishing the electrically conductive connections between at least the first evaluation unit and the substrate unit takes place after the step of providing the second evaluation unit.

[0091] In this process variant, before electrically conductive connection, i.e., before establishing the electrically conductive connections between an evaluation unit and the substrate unit, the at least two evaluation units are first placed next to one another along the first direction in a stacked arrangement to form the substrate unit. In a subsequent step, the electrically conductive connections of at least one evaluation unit are established. In a further step, or even simultaneously, the electrically conductive connections between the second evaluation unit and the substrate unit can be established.

[0092] This process variant can be implemented particularly advantageously in combination with a lithographic process, a printed circuit board printing process or a preformed contact element, since advantageously small distances between the evaluation units or the converter elements coupled thereto along the first direction can be realized even during subsequent contacting.

[0093] According to one variant of the method, in the step of establishing the electrically conductive connections, electrically conductive connections are established simultaneously between the first evaluation unit and the substrate unit and between the second evaluation unit and the substrate unit. Advantageously, a process can be accelerated.

[0094] According to the invention, the step of producing comprises connecting a preformed contacting element comprising the electrically conductive connections to at least the first evaluation unit and the substrate unit, wherein the preformed contacting element comprises a plurality of contacting layers comprising the electrically conductive connections and insulating intermediate layers, which are arranged in a row along a second direction parallel to the planar extent and orthogonal to the first direction, or which is produced by means of an additive manufacturing technique.

[0095] In other process variants, the step of producing the electrically conductive connections can be based on a lithographic process.

[0096] Lithographic processes for providing conductor tracks are known in semiconductor and microsystem technology. A lithographic method can, for example, comprise the application of a lithographic resist layer to at least one evaluation unit or to both evaluation units and the substrate. A lithographic method can further comprise the exposure of the lithographic resist layer with a suitable exposure mask which is matched to the electrically conductive connections to be formed between a respective evaluation unit and the substrate unit. A lithographic method can further comprise the development of the lithographic resist layer so that a preliminary structure, i.e. the lithographic mask, is provided for forming the electrically conductive connections. In this case, the exposed (when using a positive resist) orAlternatively, the unexposed areas of the lithographic resist layer (when using a negative resist) are dissolved. A lithographic process may further comprise depositing a conductive metal into the pre-structure, for example, by means of a physical vapor deposition process, so that electrically conductive connections are formed. A lithographic process may comprise dissolving the pre-structure, for example, by means of a wet-chemical process.

[0097] In a lithographic process, in advantageous embodiments, the electrically conductive connections are produced in particular before coupling the associated converter units to an evaluation unit, which is to be electrically conductively connected to the substrate by means of the electrical lines.

[0098] For example, all electrically conductive connections of an evaluation unit are established simultaneously. The electrically conductive connections of a plurality of evaluation units arranged along the first direction can also be established simultaneously.

[0099] In other process variants, the manufacturing step can be based on a circuit track printing process.

[0100] For example, the manufacturing step can include a so-called surface direct write process. For example, the printed circuit board printing process can be based on an inkjet printing process or an aerosol jet printing process. Another additive manufacturing process for printed circuit boards can also be used, which can bridge a vertical height difference between contact areas on the evaluation unit and the substrate unit.

[0101] According to the invention, the manufacturing step comprises connecting a preformed contacting element to at least the first evaluation unit and the substrate unit. Prior to connecting, the manufacturing step can therefore comprise providing a preformed contacting element. Electrical contact between the preformed contacting element can be established, for example, mechanically (e.g., by pressure), by means of a conductive adhesive bond or other contact compound, e.g., based on indium, or by soldering. In the case of a soldering connection, a reflow soldering process can further achieve a robust and / or optimized alignment of the contacting element and its position relative to the contact regions.

[0102] Furthermore, in combination with these methods, it is particularly advantageous to produce the electrically conductive connections compared to a wire bonding method, wherein the electrically conductive connections of both evaluation units are arranged between the first and the second evaluation unit.

[0103] The method may further comprise arranging further evaluation units in a stacked arrangement with the substrate unit along a second direction parallel to the planar extension and orthogonal to the first direction.

[0104] The evaluation units arranged along the second direction can be arranged before the electrically conductive connections are established. They can also be arranged after the electrically conductive connections are established. Electrically conductive connections can be established simultaneously for a plurality of evaluation units arranged along the second direction.

[0105] Within the scope of the invention, features described in relation to different embodiments of the invention and / or different claim categories (method, use, device, system, arrangement, etc.) can also be combined to form further embodiments of the invention. For example, a claim relating to a device can also be developed with features described or claimed in connection with a method, and vice versa. Functional features of a method can, for example, be implemented by appropriately designed physical components. In addition to the embodiments of the invention expressly described in this application, a wide variety of further embodiments of the invention are conceivable, which the person skilled in the art can arrive at without departing from the scope of the invention as defined by the claims.

[0106] The use of the indefinite articles "ein" or "eine" does not preclude the feature in question from being present multiple times. The use of the term "aufeinander" (to have) does not preclude the concepts linked by the term "aufeinander" (to have) from being identical. For example, the medical imaging device comprises the medical imaging device. The use of the term "einheit" does not preclude the object to which the term "einheit" refers from having multiple components that are spatially separated from one another.

[0107] In the context of the present application, the expression "based on" can be understood in particular in the sense of the expression "using." In particular, a formulation according to which a first feature is generated (alternatively: determined, determined, etc.) based on a second feature does not exclude the possibility that the first feature can be generated (alternatively: determined, determined, etc.) based on a third feature.

[0108] The invention is explained below using exemplary embodiments with reference to the accompanying figures. The representation in the figures is schematic, highly simplified, and not necessarily to scale. The same reference numerals are used for the same features in different figures. They show: Fig. 1 an exemplary embodiment of an X-ray detector module from the prior art, Fig. 2 a schematic representation of a design of an X-ray detector module, Fig. 3 a schematic representation of a section of an X-ray detector unit with at least two X-ray detector modules, Fig. 4 a schematic representation of a stack arrangement comprising a substrate and an evaluation unit with electrically conductive connections produced by means of a lithographic process, Fig. 5 a schematic representation of a stack arrangement comprising a substrate and an evaluation unit with a prefabricated contacting element, Fig. 6. a schematic sectional view through a prefabricated contacting element in a first embodiment for arrangement on an evaluation unit, Fig. 7 a schematic sectional view through a prefabricated contacting element in a second embodiment for arrangement on an evaluation unit, Fig. 8 an alternative sectional view through a prefabricated contacting element according to the second embodiment, Fig. 9 to Fig. 11 schematic top views of X-ray detector modules to illustrate the arrangement of the electrically conductive connections according to different design variants, Fig. 12 to Fig. 13 schematic sectional views of X-ray detector modules in further design variants, Fig. 14 to Fig. 16 schematic process sequences for providing an X-ray detector module in different design variants, and Fig. 17 is a schematic diagram of a medical imaging device.

[0109] Fig. Figure 1 shows an exemplary sectional view of a prior art module. The module shown here comprises a substrate 11 and, in a stacked arrangement, at least two evaluation units 13 along a first direction, here along a z-axis, each coupled to a converter element 15. An evaluation unit with a converter unit is also referred to below as a hybrid. A distance p0 is intended to denote an average pixel pitch within a hybrid.

[0110] Each hybrid is connected to the substrate 11 along an edge of a respective evaluation unit 11 via electrically conductive connections 17. The electrically conductive connections 17 are designed as wire bond connections.

[0111] The hybrids are arranged on the substrate 11 such that the electrically conductive connections 17 are arranged along the opposite outer edge of the evaluation units 13 along the first direction. This allows the hybrids to be arranged with a small distance C between the coupled converter units 15, which essentially corresponds to a mounting distance, and thus possibly also a small pixel pitch p1 between the pixels on two adjacent hybrids arranged on a substrate 11.

[0112] However, a disadvantage of such a module design, particularly when several substrates 11, i.e. several modules, are arranged side by side along the first direction, is that the space requirement A of the electrically conductive connections 17 and the associated contact areas on the evaluation unit 13 and substrate 11 and a mounting distance B now meet at the respective outer areas of the substrates 11 and thus there is a particularly large inactive area 2A+B in the detection area and a large distance p2 between two pixels on two substrates arranged next to one another in this area.

[0113] For efficient dose utilization in X-ray detectors, it is advantageous for the non-active spaces between the pixels to be as small as possible compared to the active area of ​​the individual pixels. Furthermore, a uniform pixel arrangement, i.e., pixel spacing as uniform as possible, is advantageous even in a quadrilateral array. However, this can only be inadequately achieved with the arrangement described above.

[0114] An alternative arrangement, in which the substrate of a module has only one evaluation unit 13 along the first direction, results in a smaller inactive area of ​​width A+B (instead of the above 2A+B) when modules are arranged side by side. However, it is disadvantageous that this doubles the number of substrates 11 and thus also the number of necessary connectors for conducting electrical signals to or from the substrate 11. Furthermore, less space is available for such a connector and significantly less space for a thermal connection of the evaluation units 13.

[0115] Fig. 2 shows a schematic sectional view of an embodiment of an X-ray detector module.

[0116] The X-ray detector module comprises at least one substrate unit 1 with a planar extension and at least two evaluation units 3, each designed to process electrical signals fed in by a coupled converter unit 5, in a stack arrangement.

[0117] The at least two evaluation units 3 are arranged spaced apart from one another along a first direction parallel to the planar extent of the substrate unit 1. Furthermore, electrically conductive connections 7 from at least one of the two evaluation units 3 to the substrate unit 1 are arranged along the first direction between the two evaluation units 3. The electrically conductive connections 7 are separated by contact areas (in Fig. 2 not shown) on a top side of the evaluation unit 3 to contact areas on the substrate unit 1 (in Fig. 2 (not shown). The contact areas of the substrate unit 1 are arranged between the at least two evaluation units 3. The contact areas are arranged along the contacting edge of the evaluation unit 3 and substantially symmetrically to the contact areas of the evaluation unit 3.

[0118] The X-ray detector module shown also comprises a connection unit 21, for example a connector, which is arranged on a side or surface of the substrate unit 1 facing away from the evaluation units 3. By means of such a connection unit 21, signals can be transmitted to evaluation units 1 of an X-ray detector module, or the signals from the evaluation units 3 of the X-ray detector module can be read out and forwarded, for example, to a processing unit 45 of a medical device 32.

[0119] In the variant shown, the electrically conductive connections 7 are indicated as electrically conductive connections produced by a wire bonding process. In alternative embodiments, the electrically conductive connections 7 can also be formed by a lithographic process or by a printed circuit board printing process. According to the invention, the electrically conductive connections 7 are formed by a preformed contacting element 9 comprising the electrically conductive connections 7.

[0120] In the embodiment shown, the electrically conductive connections 7 of the second evaluation unit 3 to the substrate unit 1 are arranged on a side of the second evaluation unit 3 that faces away from the first evaluation unit 3 along the first direction. This means that in the embodiment shown, only the electrically conductive connections 7 of one of the at least two evaluation units 3 are arranged between the two evaluation units 3. In alternative embodiments, the electrically conductive connections of the second evaluation unit 3 can also be arranged between the evaluation units 3.

[0121] In the embodiment shown, a distance between the two evaluation units 3 depends accordingly on the space required by the electrically conductive connections 7 from the first evaluation unit 3 to the substrate unit 1 and, if necessary, an additional mounting distance. The achievable distance A between the two converter units 5 coupled to the evaluation units 3 and thus also a pixel pitch p4 between two pixels of adjacently arranged hybrids is, in the variant shown, generally greater than a distance C or a pixel pitch p1 from Fig. 1. However, such an X-ray detector module allows for improved arranging of X-ray detector modules along the first direction with more uniform pixel pitches. Furthermore, an at least partially internal arrangement of electrically conductive connections can, for example, facilitate handling.

[0122] Furthermore, such an X-ray detector module can also have a third evaluation unit 3 in a stack arrangement with the substrate unit 1, which is arranged along the first direction next to the first and second evaluation units 3, wherein electrically conductive connections 7 of at least one of the adjacent evaluation units 3 are formed between the second and the third evaluation unit 3. In a further development of the Fig. 2 with a third evaluation unit 3, at least the electrically conductive connections 7 of a central, second evaluation unit 3 would be arranged between the second and the third evaluation unit 3. By means of such a configuration, uniform distances can advantageously be ensured between two converter units 5, which are assigned to two evaluation units 3 adjacent along the first direction on the same substrate unit 1. This, however, cannot be achieved with a back-to-back arrangement according to Fig. 1 cannot be achieved. Accordingly, an X-ray detector module as described above also allows for improved arranging of evaluation units 3 along the first direction, while at the same time not having to forego a cost-effective provision of the electrically conductive connections.

[0123] Fig. 3 shows a schematic sectional view of a section of an X-ray detector unit with at least two X-ray detector modules, which are arranged next to one another along the first direction to illustrate the achievable, more uniform distances.

[0124] The distance between two converter units 5, which are assigned to two evaluation units 3 adjacent along the first direction on two different substrate units 1 arranged next to one another, comprises a distance A+B (with a mounting distance B between two substrate units 1 and the distance A, which reflects the necessary space requirement for the electrically conductive connections 7 from the evaluation unit 3 to the substrate unit 1). In contrast, in areas in which two substrates 11 are arranged in an embodiment according to Fig. 1 collide, a significantly larger distance 2A+B occurs.

[0125] Although there may be a larger distance A (compared to a distance C in Fig. 1) between two converter units 5, which are assigned to two evaluation units 3 adjacent along the first direction on the same substrate unit 1, however, by means of the X-ray modules shown here, a much more uniform distribution of the size of the distances between two converter units 1 adjacent along the first direction can be achieved than in a variant according to Fig. 1. In summary, when arranged in series with such an X-ray detector module, even smaller distances between the evaluation units or the converter units coupled to them along the first direction can be achieved.

[0126] In particularly advantageous variants, the distance between two converter units 5, which are assigned to two evaluation units 3 adjacent along the first direction on two different substrate units 1 arranged next to one another, is at most twice as large as the distance between two converter elements 5, which are assigned to two evaluation units 3 adjacent along the first direction on the same substrate unit 1.

[0127] Furthermore, distances can also be optimized by producing electrically conductive connections 7 based on a lithographic process, a conductor track printing process or by means of a preformed contacting element 9.

[0128] Fig. 4 shows a schematic representation of a stack arrangement comprising a substrate unit 1 and an evaluation unit 3. The stack arrangement also comprises a converter unit 3 coupled to the evaluation unit 3.

[0129] The module has electrically conductive connections 7 from the evaluation unit 3 to the substrate unit 1, which are produced using a lithographic process. Lithographic processes for providing conductor tracks are known in semiconductor and microsystem technology. Using a lithographic process, conductor tracks can be applied to the evaluation unit 3 or substrate unit 1, which connect the contact areas on an evaluation unit 3 to the corresponding contact areas on the substrate unit 1. The electrically conductive connections 7 can be led from contact areas of the evaluation unit 3 via a side surface of the evaluation unit 3 to contact areas of the substrate unit 1. As an alternative to forming the electrically conductive connections 7 using a lithographic process, the electrically conductive connections can also be formed using a conductor track printing process.

[0130] In contrast to electrically conductive connections 7, which are produced by means of a wire bonding process, conductor tracks can be applied directly to an evaluation unit 3 by means of a process described above and, in particular, do not protrude from an evaluation unit 3 in the direction of the incident X-ray radiation. This can advantageously make it possible to allow a converter unit 5 coupled to the evaluation unit 3 to protrude partially or completely beyond the area of ​​the evaluation unit 3 in which the electrically conductive connections on the evaluation unit 3 are formed. This is indicated by the dashed line in Fig. 4. This means that the planar extent of the converter unit 5 can be arranged at least overlapping with the area of ​​the evaluation unit 3 having the electrically conductive connections. In this way, inactive areas of a detection surface can be advantageously reduced.

[0131] If an X-ray detector module comprises at least two evaluation units 3 arranged next to one another along the first direction (here z-direction) according to a design as described in connection with Fig. 2 and the electrically conductive connections are formed by means of a lithographic process or by means of a conductor track printing process, a distance between two converter units assigned to two adjacent evaluation units 3 can be advantageously optimized, so that inactive regions of the detection area between two evaluation units 3 or converter units 5 assigned to these can be advantageously reduced. In particular, in combination with a converter unit 5 projecting beyond the electrically conductive connections 7, distances formed between two adjacent evaluation units 3 assigned to converter units 5 can be particularly advantageously reduced. This also advantageously applies to an X-ray detector unit comprising at least two substrate units 1 according to an embodiment in Fig. 3. By means of electrically conductive connections produced lithographically or by means of a conductor track printing process between a respective evaluation unit 3 and the associated substrate unit 1, the distances between evaluation units 3 adjacent along the first direction or converter units 5 assigned to them can be advantageously further optimized.

[0132] Fig. Figure 5 shows a schematic representation of a stack arrangement comprising a substrate unit 1 and an evaluation unit 3 in a further embodiment. The stack arrangement also includes a converter unit 3 coupled to the evaluation unit 3.

[0133] The module shown here has electrically conductive connections between the evaluation unit 3 and the substrate unit 1, which are formed by means of a preformed contacting element 9 comprising the electrically conductive connections 7. The preformed contacting element is preformed such that it is adapted to an existing stack arrangement comprising the evaluation unit 3 with the substrate unit 1. The contacting element 9 is designed to bridge a height difference between an upper side of the evaluation unit 3 facing the incident X-ray radiation (here, the y-direction) and an upper side of the substrate unit 1 facing the incident X-ray radiation.

[0134] The contacting element 9 can extend over the entire length of a contacting edge of the evaluation unit 3. A preformed contacting element 9 can simultaneously establish all required electrical connections 7 between an evaluation unit 3 and the substrate unit 1. The contacting element 9 can have the electrically conductive connections 7 in an electrically insulating material, for example, a plastic or rubber, in a suitable arrangement. The preformed contacting element 9 can, in particular, be matched to the arrangement of contact areas on the evaluation unit 3 and the substrate unit 1 and can electrically connect corresponding contact areas by means of the included electrically conductive connections.The preformed contacting element 9 can in particular have counter-contact areas corresponding to the contact areas on the evaluation unit 3 and to the contact areas on the substrate unit 1.

[0135] Such a preformed contacting element 9 can be brought into contact with the evaluation unit 3 and the substrate unit 1, for example, by means of friction / pressure (pressing) and / or by means of a suitable, supporting adhesive bond or a different type of contact compound, e.g., indium, or by soldering, such that the electrically conductive connections electrically contact corresponding contact areas of the evaluation unit 3 and the substrate unit 1. In connection with the press-in process, a mechanically flexible design of the preformed contacting element 9 can be advantageous, e.g., using a mechanically flexible material such as rubber as the insulating material.

[0136] Such a contacting element 9 can be preformed in such a way that it is adapted to the evaluation unit 3 or the substrate unit 1. For example, the contacting element 9 can have an L-shaped configuration, as in Fig. 5, wherein one leg is in contact with the evaluation unit 3, in particular resting on the evaluation unit 3, and the second leg is in contact with the substrate unit 1. The first leg can extend parallel to the planar extent of the evaluation unit 1. The second leg can extend along a side surface of the evaluation unit 3. The second leg then has in particular a length which corresponds to the thickness of an evaluation unit 1 or to the height difference between a top side of the evaluation unit 3 facing the incident X-radiation and a top side of the substrate unit 1 facing the incident X-radiation.

[0137] A preformed contacting element 9 can in particular be designed as a multi-layer contacting element 9, wherein the multi-layer contacting element 9 comprises a plurality of contacting layers comprising the electrically conductive connections 7 and insulating intermediate layers, which are arranged in a row along a second direction parallel to the planar extent of the evaluation unit 3 or substrate unit 1 and orthogonal to the first direction. The second direction extends along the contacting edge, along which the contact regions of the evaluation unit 2 are arranged, which are to be contacted by means of the electrically conductive connections 7. The layers of the multi-layer contacting element 9 can therefore be stacked along the contacting edge, so that the planes of the layers are parallel to the plane that would otherwise be spanned, for example, by bonding wires in a wire bonding process.The levels of the contacting layers comprising the electrically conductive connections 7 are designed such that they connect a respective contact area of ​​an evaluation unit 3 with the corresponding contact area on the substrate unit 1. The contacting layers can each be separated by an insulating intermediate layer of suitable thickness, so that the electrically conductive connections are separate from one another. The thickness of the individual contacting layers and the insulating intermediate layers is such that the sequence of the contacting layers is coordinated with the existing contact areas on the evaluation unit and the substrate unit. The conductive connections within a contacting layer can be in the form of conductor tracks, as in . Fig. 5. A contact layer can also be electrically conductive over its entire surface or part of it.

[0138] In other design variants, a preformed contacting element can also be manufactured using an additive manufacturing process, for example.

[0139] The Fig. 6 and Fig. 7 show schematic sectional views of a contacting element 9 and a section of an evaluation unit 3 in an unconnected state to illustrate exemplary embodiments of a preformed contacting element 9.

[0140] On the evaluation unit 3, contact areas 6 are indicated, which are arranged in an edge area of ​​the evaluation unit 3 along the contacting edge.

[0141] In Fig. 6, the contacting element has the electrically conductive connections 7 in the form of introduced conductor tracks, as already shown in Fig. 5 indicated.

[0142] The conductor tracks can be applied, for example, to the contacting layers of a multilayer contacting element using conventional manufacturing methods in printed circuit board production, for example, using a printing process or a lithographic process. Insulating intermediate layers can be arranged between the contacting layers containing the conductor tracks. The contacting element 9 can also have mating contact regions 8, which are connected to the conductor tracks and which, for contacting the contact element 9 with the evaluation unit 3, are arranged overlappingly (indicated by the dashed arrow) and brought into electrically conductive contact with one another. Contacting of contact regions on a substrate unit 1 can be carried out in the same way.

[0143] In Fig. 7, the contacting element has the electrically conductive connections 7 within a contacting layer in the form of fully or partially electrically conductive contacting layers. The contacting layers, which form the electrically conductive connections 7, are separated from one another along the contacting edge by insulating intermediate layers of suitable thickness.

[0144] To illustrate such a contacting element 9, Fig. 8 shows a further sectional view of an L-shaped contacting element, which shows one of the formed contacting layers in a full-surface configuration.

[0145] To form a contact, the contact layers with contact areas 6 on the evaluation unit can be arranged overlapping and brought into electrically conductive contact with each other. Contacting of contact areas on a substrate unit 1 can be carried out in the same way.

[0146] Forming the electrically conductive connections of an X-ray detector module according to the invention with at least two evaluation units or of an X-ray detector unit according to the invention comprising at least two X-ray detector modules by means of a preformed contacting element, as described here in connection with a single evaluation unit, can advantageously contribute to optimizing the spacing along the first direction. Furthermore, a preformed contacting element can simplify handling of the X-ray detector modules by providing improved protection against mechanical damage.

[0147] Fig. 9 to Fig. 11 show schematic top views of X-ray detector modules having at least two evaluation units 3 to illustrate the arrangement of the electrically conductive connections according to various further embodiments.

[0148] Fig. 9 shows a variant in which electrically conductive connections 7 from both evaluation units 3 to the substrate unit 1 are arranged along the first direction between the two evaluation units 3. A central arrangement of the electrically conductive connections 7 and thus also of the contact areas on the substrate unit 1 between two evaluation units 3 can advantageously simplify the forwarding of signals through conductor tracks in the substrate unit 1 to a common switching unit 21. Furthermore, this can ensure that sub-areas of the substrate unit 1, which are located, for example, below an evaluation unit 3, do not have to be used for forwarding signals to a switching unit 21 and are thus free for improved thermal coupling of the evaluation unit 3.For example, thermally conductive inserts, for example comprising a material with improved thermal conductivity such as a metal, can be provided in these regions, which can contribute to improved heat exchange. It is conceivable that these inserts can also be used simultaneously as connections, i.e., supply lines ("vias"), for a supply voltage or reference voltage for an evaluation unit 3.

[0149] Furthermore, the internal arrangement of the contacts and electrically conductive connections 7 of both evaluation units 3 provides improved protection against mechanical influences when handling the X-ray detector modules.

[0150] Fig. 10 shows a variant, wherein electrically conductive connections 7 from both evaluation units 3 to the substrate unit 1 are arranged along the first direction between the two evaluation units 3 and the electrically conductive connections of the two evaluation units 3 are arranged in an interlocking manner, so that in each case an electrically conductive connection 7 from a first of the two evaluation units 3 is arranged at least partially between two electrically conductive connections 7 of the second of the two evaluation units 3 along a second direction parallel to the planar extent and orthogonal to the first direction.

[0151] Fig. 11 shows a variant, wherein electrically conductive connections 7 from both evaluation units 3 to the substrate unit 1 are arranged along the first direction between the two evaluation units 3 and at least a part of the electrically conductive connections 7 of the first and the second evaluation unit 3 of the two evaluation units 3 are electrically conductively connected to one another.

[0152] An arrangement of the electrically conductive connections 7 between the at least two evaluation units 3 of the X-ray detector module can be particularly advantageously enabled, in particular, by providing the electrically conductive connections 7 using a lithographic process, a conductor track printing process, or a preformed contacting element. Advantageously, by providing the electrically conductive connections using a lithographic process, a conductor track printing process, or a preformed contacting element, an internal contact can be achieved between the two evaluation units, while at the same time advantageously ensuring smaller distances between the evaluation units and thus also between the associated converter units. Furthermore, an interlocking arrangement of the electrically conductive connections can also be particularly advantageously enabled.Advantageously, electrically conductive connections are possible, wherein at least some of the electrically conductive connections 7 of the first and second evaluation units 3 of the two evaluation units 3 are electrically conductively connected to one another.

[0153] Fig. 12 illustrates a variant of an X-ray detector module with internal electrically conductive connections 7, which were produced using a lithographic process or a conductor track printing process, in a sectional view. A particularly small distance F between two converter units 5, or a particularly small pixel pitch p7, can be achieved if the converter units 5 coupled to the evaluation units 3 are also arranged to partially or completely protrude beyond the area in which the contact areas or the conductor tracks 7 are formed.This is possible in these variants because, in contrast to electrically conductive connections 7, which are produced by means of a wire bonding process, the conductor tracks can be applied directly to an evaluation unit 3 and, in particular, do not protrude from an evaluation unit 3 in the direction of the incident X-ray radiation, which would prevent an overlapping arrangement.

[0154] Fig. 13 illustrates a further variant of an X-ray detector module with internal electrically conductive connections 7 in a sectional view, wherein the electrically conductive connections are formed by means of a preformed contacting element 9 comprising the electrically conductive connections 7.

[0155] The preformed contacting element 9 is arranged between the at least two evaluation units. The contacting element 9 can be used as in connection with the Fig. 5 to 8. In this variant, the preformed contacting element 9 is also designed such that it simultaneously provides the electrically conductive connections 7 from the two adjacent evaluation units 3 to the substrate unit 1. By introducing a contacting element designed in this way, all required connections between the two evaluation units and the substrate are established simultaneously. Instead of an L-shaped design, as in connection with Fig. 5, the preformed contacting element in this case has a T-shaped design, wherein the preformed contacting element 9 rests on both sides of the evaluation units 3 with one leg each and the third leg is in contact with the substrate unit 1. By means of such a T-shaped contacting element, both evaluation units 3 can be electrically conductively connected to the substrate unit 1 by means of a contacting element 9. In this way, particularly small distances G between the coupled converter units or pixel distances p8 can be achieved. In addition, an arrangement of the electrically conductive connections 7 according to the Fig. 10 and Fig. 11 in conjunction with a preformed contacting element 9 can be provided in a simple manner.

[0156] The Fig. 14 to Fig. 16 each show a schematic process flow for providing an X-ray detector module according to different embodiments.

[0157] Fig. 14 shows an exemplary method for providing an X-ray detector module comprising at least the steps of providing S1 a substrate unit 1, providing S2 at least one first evaluation unit 5 in a stack arrangement with the substrate unit 1, providing S3 a second evaluation unit 3 in a stack arrangement with the substrate unit 1, wherein the first and the second evaluation unit 3 are arranged next to one another at a distance from one another along a first direction parallel to the planar extent of the substrate unit 1, and producing S4 electrically conductive connections 7 between at least the first evaluation unit 3 and the substrate unit 1, so that when the X-ray detector module is provided, electrically conductive connections 7 from at least one of the two evaluation units 3 to the substrate unit 1 are arranged along the first direction between the two evaluation units 3.

[0158] In this exemplary variant shown, the step S4 of establishing the electrically conductive connections 7 between at least the first evaluation unit 3 and the substrate unit 1 takes place before the step S3 of providing the second evaluation unit 3.

[0159] Furthermore, the method comprises the step S5 of establishing the electrically conductive connections between the second evaluation unit 3 and the substrate unit 1. In the variant shown, the establishment of the electrically conductive connections S5 between the second evaluation unit 3 and the substrate unit 1 takes place separately from the step S4 of establishing electrically conductive connections 7 between at least the first evaluation unit 3 and the substrate unit 1.

[0160] The method may include the evaluation units 3 already being coupled to a converter unit 5 upon provision S2, S3. However, there may also be method variants wherein coupling to a converter unit 7 only occurs after provision of one or both evaluation units 3 in a stacked arrangement with the substrate unit 1 or even after establishment of the electrically conductive connections 7.

[0161] The Fig. The method variant shown in Figure 14 describes a step-by-step, ie sequential, construction of the X-ray detector module along the first direction, wherein an electrically conductive connection of a first evaluation unit is first made before a second evaluation unit is provided along the first direction. This embodiment variant advantageously allows, as also in Fig. 14, a production S4 of electrically conductive connections 7 by means of a wire bonding process while achieving the smallest possible distances between two evaluation units 3 or converter units 5 coupled thereto.

[0162] However, in this method variant, it is also possible to produce electrically conductive connections 7 S4 based on a lithographic process, a printed circuit board printing process, or even by means of a preformed contacting element 9. This means that the production step S4 can comprise connecting a preformed contacting element 9 to at least the first evaluation unit 3 and the substrate unit 1. The production step S4 can comprise producing electrically conductive connections 7 by means of a lithographic process or by means of a printed circuit board printing process.

[0163] The method may further comprise providing, in addition to a first and a second evaluation unit 3, a third evaluation unit 3 along the first direction in a stacked arrangement with the substrate unit 1.

[0164] The Fig. 15 and Fig. 16 show further method variants of a method for providing an X-ray detector module, wherein the step S4 of producing the electrically conductive connections 7 between at least the first evaluation unit 3 and the substrate unit 1 takes place after the step S3 of providing the second evaluation unit 3.

[0165] In particular, the Fig. 15 and Fig. 16 process variants, wherein the electrically conductive connections of both evaluation units are established between the two evaluation units 3. However, there may also be variants wherein only the electrically conductive connections of one evaluation unit 7 are established between the evaluation units 3. The electrically conductive connections 7 of the second evaluation unit 3 to the substrate unit 1 can also be established on a side of the second evaluation unit 3 that faces away from the first evaluation unit 3 along the first direction.

[0166] In particular, in the Fig. 15 and Fig. 16 in the step S4 of establishing the electrically conductive connections 7, electrically conductive connections are established simultaneously between the first evaluation unit 3 and the substrate unit 1 and the second evaluation unit 3 and the substrate unit 1.

[0167] The step of producing S4 the electrically conductive connections 7 between the evaluation units 3 and the substrate unit 1 takes place in Fig. 15 in particular based on a lithographic process or on a conductor track printing process.

[0168] The step of producing S4 the electrically conductive connections 7 between the evaluation units 3 and the substrate unit 1 comprises Fig. 16, a preformed contacting element 9 having the electrically conductive connections 7 to connect to the evaluation units 3 and the substrate unit 1.

[0169] The production of an electrical contact between the preformed contacting element 9 can be carried out, for example, mechanically (e.g. by means of pressure), by means of a conductive adhesive connection or other contact mass, e.g. based on indium, or by means of a solder connection.

[0170] Fig.17 shows an exemplary embodiment of a medical imaging device 32 with a detection unit 36 ​​comprising at least one X-ray detector module according to the invention or at least one X-ray detector unit according to the invention and an X-ray source 37 in opposition to the detection unit 36. The X-ray source 37 is designed to expose the detection unit 36 ​​with X-ray radiation. The medical imaging device 32 shown is designed in particular as a computed tomography device. The computed tomography device comprises a gantry 33 with a rotor 35. The rotor 35 comprises the X-ray source 37 and the detection unit 36. The rotor 35 is rotatable about the rotation axis 43. The examination object 39, here a patient, is mounted on the patient couch 41 and is movable along the rotation axis 43 by the gantry 33. In general, the object 39 can comprise, for example, an animal patient and / or a human patient.The computing unit 45 is provided for controlling the medical imaging device and / or for generating an X-ray image data set based on signals detected by the detection unit.

[0171] In the case of a computed tomography device, a (raw) X-ray image dataset of the object is typically acquired from a variety of angular directions using the detection unit. This dataset is based on processed electrical pixel measurement signals from the pixel electronics 5 of the evaluation units. Subsequently, a final X-ray image dataset can be reconstructed based on the (raw) X-ray image dataset using a mathematical method, for example, comprising a filtered backprojection or an iterative reconstruction method.

[0172] The computing unit 45 may include a control unit for controlling the medical imaging device 32 and a generation unit for generating an X-ray image data set based on pixel measurement signals.

[0173] Furthermore, an input device 47 and an output device 49 are connected to the computing unit 45. The input device and the output device can, for example, enable interaction by a user or the display of a generated X-ray image data set.

Claims

[1] X-ray detector module comprising at least one substrate unit (1) with a planar extension and at least two evaluation units (3), each designed to process electrical signals fed in by a coupled converter unit (5), in a stack arrangement, wherein - the at least two evaluation units (3) are arranged next to one another at a distance along a first direction parallel to the planar extent of the substrate unit (1), - electrically conductive connections (7) from at least one of the two evaluation units (3) to the substrate unit (1) are arranged along the first direction between the two evaluation units (3), and - the electrically conductive connections (7) are formed by means of a preformed contacting element (9) comprising the electrically conductive connections (7), which is designed as a multi-layer contacting element (9), wherein the multi-layer contacting element (9) comprises a plurality of contacting layers comprising the electrically conductive connections (7) and insulating intermediate layers, which are arranged in a row along a second direction parallel to the planar extent and orthogonal to the first direction, or which is produced by means of an additive manufacturing technique. [2] X-ray detector module according to claim 1, wherein electrically conductive connections (7) from both evaluation units (3) to the substrate unit (1) are arranged along the first direction between the two evaluation units (3). [3] X-ray detector module according to claim 2, wherein the electrically conductive connections (7) of the two evaluation units (3) are arranged in an interlocking manner, so that in each case an electrically conductive connection (7) of a first of the two evaluation units (3) is arranged along a second direction parallel to the planar extent and orthogonal to the first direction at least partially between two electrically conductive connections (7) of the second of the two evaluation units (3). [4] X-ray detector module according to claim 2, wherein at least a part of the electrically conductive connections (7) of the first and the second evaluation unit (3) of the two evaluation units (3) are electrically conductively connected to one another. [5] X-ray detector module according to one of the preceding claims, wherein evaluation units (3) are also arranged in a stack arrangement with the substrate unit (1) along a second direction parallel to the planar extent and orthogonal to the first direction. [6] X-ray detector unit further comprising at least two X-ray detector modules according to one of the preceding claims, which are arranged next to one another along the first direction. [7] X-ray detector unit according to claim 6, wherein the distance between two converter units (5) which are assigned to two evaluation units (3) adjacent along the first direction on two different substrate units (1) arranged next to one another is at most four times, preferably at most twice, as large as the distance between two converter elements (5) which are assigned to two evaluation units (3) adjacent along the first direction on the same substrate unit (1). [8] Medical imaging device (32) comprising an X-ray detector module according to one of claims 1 to 5 or an X-ray detector unit according to claim 6 or 7 and an X-ray source (37) arranged opposite thereto. [9] Method for providing an X-ray detector module according to one of claims 1 to 5 comprising at least the steps - Providing (S1) a substrate unit (1) with a planar extension, - Providing (S2) at least one first evaluation unit (3) in a stack arrangement with the substrate unit (1), - Providing (S3) a second evaluation unit (3) in a stacked arrangement with the substrate unit (1), wherein the first and the second evaluation unit (3) are arranged next to one another at a distance along a first direction parallel to the planar extent of the substrate unit (1), - Producing (S4) electrically conductive connections (7) between at least the first evaluation unit (3) and the substrate unit (1), so that when the X-ray detector module is provided, electrically conductive connections (7) from at least one of the two evaluation units (3) to the substrate unit (1) are arranged along the first direction between the two evaluation units (3), wherein the step of producing (S4) comprises connecting a preformed contacting element (9) comprising the electrically conductive connections (7) to at least the first evaluation unit (3) and the substrate unit (1), wherein the preformed contacting element (9) comprises a plurality of contacting layers comprising the electrically conductive connections (7) and insulating intermediate layers, which are arranged in a row along a second direction parallel to the planar extent and orthogonal to the first direction, or which is produced by means of an additive manufacturing technology. [10] Method according to claim 9, wherein the step of producing (S4) the electrically conductive connections (7) between at least the first evaluation unit (3) and the substrate unit (1) takes place before the step of providing (S3) the second evaluation unit (3). [11] Method according to claim 9, wherein the step of producing (S4) the electrically conductive connections (7) between at least the first evaluation unit (3) and the substrate unit (1) takes place after the step of providing (S3) the second evaluation unit (3). [12] Method according to one of claims 9 or 11, wherein in the step of producing (S4) the electrically conductive connections (7), electrically conductive connections are produced simultaneously between the first evaluation unit (3) and the substrate unit (1) and the second evaluation unit (3) and the substrate unit (1).

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