WORKPIECE MANAGEMENT PROCEDURES AND FOIL CUTTING MACHINE

Abstract

exhibiting workpiece management procedures: a frame unit formation step (1001) for forming a frame unit (18) with a workpiece (1) having a front surface (3) wherein the front surface contains components (4) formed in respective areas defined by a plurality of intersecting roads (3) and which is held in an opening (16) of an annular frame (15) over a resin film (17); a printing step (1002) in which, after the frame unit formation step has been carried out, identification information (19) of the workpiece is printed onto the resin film in an area between an outer circumference of the workpiece (1) and an inner circumference of the ring-shaped frame (15); a machining step (1003) for machining the workpiece by a machining machine; a separation step (1004) for separating the machined workpiece from the resin film; and a storage step (1005) for storing the resin film (17) from which the workpiece has been separated, wherein the workpiece management procedure further comprises: an inspection result acquisition step (1006) in which, after carrying out the printing step (1002) and the separation step (1004), the processing conditions of a processing mark remaining on the resin film are inspected, the identification information (19) on the inspected resin film is read and the processing conditions of the workpiece are recorded in association with the identification information.

Description

BACKGROUND OF THE INVENTION Technical field

[0001] The present invention relates to a workpiece handling method and a foil cutting machine. Description of the related prior art

[0002] Various electronic devices are manufactured using component chips formed by dividing different plate-shaped workpieces such as semiconductor wafers, resin package substrates, glass substrates, and ceramic substrates. A frame unit is used to process a workpiece, in which the workpiece is held in an opening of an annular frame over a resin film, such as adhesive tape, to allow for handling the workpiece without damage during manufacturing (see, for example, JP H10-242 083 A). A frame unit is frequently used, particularly in a dividing step that includes a cutting step with a cutting blade or a processing step with a laser beam, a component inspection step, and a component separation (pickup) step.

[0003] The publications JP H04-146649 A and JP 2015-041747 A represent further state of the art. PRESENTATION OF THE INVENTION

[0004] In recent years, it has become necessary to document the circumstances of each processing step to determine the cause of a defective product when it occurs in manufactured electronic component chips. The processing circumstances of a workpiece on which a defect has occurred, at all processing steps, can be determined, for example, by creating a barcode or similar marking on the workpiece, reading the barcode in each processing machine or device, recording when and in which processing machines or devices the workpiece was processed, and checking the log date of all processing machines or devices.

[0005] If a large amount of residue remains after picking up component chips on a slicing belt, it is highly likely that many of the component chips on one side of the belt have been subjected to chipping. Therefore, the slicing belt can be stored after the picking step, and the processing of the workpiece can be recorded for a specific period.

[0006] However, it is not possible to determine which workpiece was fixed on the cutting belt, which makes a detailed investigation into the cause of such a large amount of residue difficult.

[0007] The object of the present invention is therefore to provide a workpiece management method and a foil cutting machine that can reduce the difficulties in investigating the cause of a defect in a component chip.

[0008] The present invention is defined by the workpiece handling method according to the features of independent claim 1 and the foil cutting machine according to the features of dependent claim 3. Dependent claim 2 describes a preferred embodiment.

[0009] According to one aspect of the present invention, a workpiece handling method is provided comprising: a frame unit formation step for forming a frame unit with a workpiece having a front surface, wherein the front surface contains components formed in respective areas defined by a plurality of intersecting roads, and which is held in an opening of an annular frame over a resin film; a printing step in which, after completion of the frame unit formation step, identification information (orThe process includes: printing identification information of the workpiece onto the resin film in an area between an outer circumference of the workpiece and an inner circumference of the ring-shaped frame; a processing step for machining the workpiece by a processing machine; a separation step for separating the machined workpiece from the resin film; and a storage step for storing the resin film from which the workpiece has been separated.

[0010] Preferably, the workpiece management procedure can further include an inspection result acquisition step in which, after the printing step and the separation step have been carried out, the machining conditions are inspected using a machining mark remaining on the resin film, the identification information on the inspected resin film is read and the machining conditions of the workpiece are recorded in association with the identification information.

[0011] Preferably, the identification information can include identification information of the workpiece, processing conditions in the processing step for the workpiece, or information about a date on which the processing step was carried out on the workpiece.

[0012] According to a further aspect of the present invention, a film cutting machine is provided comprising: a cassette mounting section configured to accommodate a cassette holding a frame unit, the frame unit being formed from an annular frame and a workpiece held in an opening of the annular frame over a resin film; after processing the workpiece, forming a processing mark on the resin film and separating the processed workpiece from the resin film; an unloading unit configured to unload the frame unit from the cassette attached to the cassette mounting section; a printing unit configured to print identification information of the separated workpiece onto the resin film of the frame unit unloaded from the cassette; and a resin film separating unit configured to separate the resin film from the annular frame.wherein the resin film remains on the frame unit and carries the identification information printed by the printing unit, and a resin film holding section configured to hold the resin film that has been separated from the annular frame by the resin film separating unit.

[0013] The workpiece handling method and the foil cutting machine of the present invention have the advantageous effect of reducing the difficulties in investigating the cause of a defect in a component chip.

[0014] The above and further aims, features and advantages of the present invention and the way in which they are realized will become more apparent from, and the invention itself will be best understood by, a study of the following description and the attached claims with reference to the attached drawings which show preferred embodiments of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a perspective view that represents an example of a workpiece as an object of management by a workpiece management procedure according to a first embodiment; Fig. 2 is a flowchart showing the flow of the workpiece management procedure according to the first embodiment; Fig. 3 is a perspective view that represents a framework unit educational step in which in Fig. The workpiece management procedure shown in section 2 is illustrated; Fig. 4 is a perspective view representing a frame unit, which is part of the frame unit formation step in the Fig. The workpiece management procedures shown in section 2 were formed; Fig. 5 is a sectional view showing a printing step in which Fig. The workpiece management procedure shown in section 2 is illustrated; Fig. 6 is a perspective view showing the frame unit after the printing step in which Fig. The workpiece management procedure shown in section 2 is illustrated; Fig. 7 is a top view of the identification information of the in Fig. 6 shown frame unit; Fig. 8 is a side view that shows an editing step in the Fig. The workpiece management procedure shown in section 2 illustrates some elements in cross-section; Fig. Figure 9 is a perspective view showing the frame unit after the editing step in which it was created. Fig. The workpiece management procedure shown in section 2 is illustrated; Fig. 10 is a side view showing a separation step in the Fig. The workpiece management procedure shown in section 2 illustrates some elements in cross-section; Fig. Figure 11 is a perspective view that illustrates an example of a storage step in the [construction / project / etc.]. Fig. The workpiece management procedure shown in section 2 is illustrated; Fig. Figure 12 is a perspective view showing a cassette for use in another example of the storage step in the one described in Fig. The workpiece management procedure shown in section 2 is illustrated; Fig. Figure 13 is a flowchart illustrating the process of a workpiece management procedure according to a second embodiment; Fig. Figure 14 is a perspective view showing an inspection result recording step in the Fig. 13 workpiece management procedures are shown; Fig. Figure 15 is a view representing an image of a substantial part of a resin film, taken during the inspection result acquisition step in the Fig. The workpiece management procedures shown in section 13 were obtained; Fig. Figure 16 is a flowchart representing a flow of a workpiece management procedure according to a third embodiment; Fig. 17 is a perspective view showing a frame unit after a separation step in the Fig. The workpiece management procedures shown in section 16 are illustrated; Fig. Figure 18 is a top view schematically representing a configuration of a foil cutting machine, which includes a printing step in the Fig. 16 workpiece management procedures are carried out; Fig. 19 is a side view showing a state in which a resin film is positioned along an inner edge of an annular frame during the printing step in which Fig. The workpiece management process shown in 16 is cut, with some elements shown in cross-section; Fig. 20 is a side view depicting a state in which a resin film, which is in the printing step in the Fig. 16 shown workpiece handling procedures were cut, held, with some elements shown in cross-section; and Fig. 21 is a sectional view showing a state in which the resin film is in the printing step in which it is in Fig. The workpiece management procedures shown in 16 are held in a holder housing. DETAILED DESCRIPTION OF PREFERRED EXECUTION FORMS

[0015] With reference to the accompanying drawings, embodiments of the present invention are described in detail. However, the present invention is not limited by details described in the following embodiments. The elements of the configurations described below include those that are readily conceivable to a person skilled in the art and are essentially the same. Furthermore, the configurations described below can be combined in a suitable manner. In addition, various omissions, substitutions, and modifications of configurations can be made without departing from the spirit of the present invention. [First embodiment]

[0016] A workpiece management method according to a first embodiment of the present invention is described with reference to the Fig. 1 to 12 described.

[0017] Fig. Figure 1 is a perspective view that represents an example of a workpiece as an object of management by a workpiece management procedure according to a first embodiment. Fig. Figure 2 is a flowchart showing the flow of the workpiece management procedure according to the first embodiment.

[0018] The workpiece management method according to the first embodiment can, for example, be based on a Fig. The workpiece 1 shown in the first embodiment is used. The workpiece 1 is an object of management by the workpiece management method according to the first embodiment and is a disk-shaped wafer, such as a semiconductor wafer or a wafer for optical devices, containing a substrate 2 made of silicon (Si), sapphire (Al2O3), gallium arsenide (GaAs) or silicon carbide (SiC).

[0019] As in Fig. As shown in Figure 1, the workpiece 1 has a front surface 5 containing components 4 formed in corresponding areas defined by a multitude of intersecting dividing lines (hereinafter referred to as "roads") 3. The components 4 are, for example, integrated circuits (ICs) such as ICs or Large Scale Integrations (LSIs), or image sensors such as Charge Coupled Devices (CCDs) or Complementary Metal Oxide Semiconductors (CMOS).

[0020] In workpiece 1, workpiece identification (ID) information 6 is encoded on the front surface 5 of the substrate 2. The workpiece ID information 6 identifies each workpiece 1; in other words, it is the ID information for each workpiece 1. In the first embodiment, workpiece 1 is cut (equivalent to "machined") along the paths 3 and divided into individual component chips 7. Each component chip 7 contains a portion of the substrate 2 and the component 4.

[0021] The workpiece management method according to the first embodiment includes, as shown in Fig. Figure 2 shows a frame unit formation step 1001, a printing step 1002, a processing step 1003, a separating step 1004 and a storage step 1005. (Framework unit-educational step)

[0022] Fig. 3 is a perspective view that represents a framework unit educational step in which in Fig. The workpiece management procedure shown in section 2 is illustrated. Fig. 4 is a perspective view representing a frame unit, which is part of the frame unit formation step in the Fig. The workpiece management process shown in Figure 2 was formed. Frame unit formation step 1001 forms a frame unit 18 with the workpiece 1, which is held in an opening 16 of an annular frame 15 over a resin film 17.

[0023] In the framework unit educational step 1001, as in Fig. As shown in Figure 3, the resin film 17, which has a larger diameter than the workpiece 1, is brought at an outer edge section of an adhesive layer thereof in opposition to the annular frame 15, which has an inner diameter larger than the outer diameter of the workpiece 1. This brings the workpiece 1 at a rear surface 8 on a back side of the front surface 5 thereof in opposition to a central section of the adhesive layer of the resin film 17. The outer edge section of the adhesive layer of the resin film 17 is then glued to the annular frame 15, followed by the bonding of the rear surface 8 of the workpiece 1 to the central section of the adhesive layer of the resin film 17. In the frame unit formation step 1001 in the first embodiment, the Fig. 4 frame unit 18 is formed, wherein the workpiece 1 is held within the opening 16 by the ring-shaped frame 15 over the resin film 17. (Pressure step)

[0024] Fig. 5 is a sectional view showing a printing step in which Fig. The workpiece management procedure shown in section 2 is illustrated. Fig. 6 is a perspective view showing the frame unit after the printing step in which Fig. The workpiece management procedure shown in section 2 is illustrated. Fig. 7 is a top view of the identification information of the in Fig. 6 shown frame unit. After carrying out the frame unit formation step 1001, in printing step 1002 the identification information 19 of the workpiece 1 is printed onto the adhesive layer of the resin film 17 in an area between an outer circumference of the workpiece 1 and an inner circumference of the ring-shaped frame 15.

[0025] In printing step 1002, a printing device 20 holds the resin film 17 of the frame unit 18 on one side of a base material layer thereon on a holding table (not illustrated) and reads the workpiece ID information 6 by a reading unit 21. The printing device 20 contains a control unit 23 in which the ID information of each workpiece 1, specified by the workpiece ID information 6 thus read, and the processing conditions in the processing step are pre-stored in association with each other.

[0026] The control unit 23 is a computer that includes a logical processing unit with a microprocessor, such as a central processing unit (CPU), a storage device with memory, such as read-only memory (ROM) or random access memory (RAM), and an input / output interface device, and is capable of executing computer programs. The control unit 23 controls individual elements that make up the printing device 20 and enables the printing device 20 to perform printing step 1002.

[0027] In printing step 1002, the control unit 23 of the printing device 20 extracts the machining conditions in the machining step that are associated with the ID information of the specific workpiece 1, which is indicated by the workpiece ID information 6 thus read out, and creates the identification information 19. In printing step 1002, the printing device 20, as in Fig. Figure 5 shows a printing unit 22 in the area between the outer circumference of the workpiece 1 and the inner circumference of the annular frame 15 in opposition to the adhesive layer of the resin film 17 and prints as shown in Fig. Figure 6 shows the identification information 19 generated by the control unit 23 being printed by the printing unit 22 onto the adhesive layer of the resin film 17 in the area described above. In the first embodiment, the printing unit 22 prints the identification information 19 by irradiating the adhesive layer of the resin film 17 with a laser beam 24. However, within the scope of the present invention, the printing method is not limited to such laser printing, and the identification information 19 can, for example, be printed by applying ink to the adhesive layer of the resin film 17.

[0028] In the first embodiment, the identification information 19 formed in printing step 1002 contains, as in Fig. Figure 7 shows the workpiece ID information (6, represented by open circles), the machining condition ID information (9, represented by open triangles), and the date information (10, represented by white squares). The workpiece ID information (6) identifies each workpiece (1), i.e., it is the ID information of the specific workpiece (1). The machining condition ID information (9) specifies the machining conditions in machining step 1003 and identifies each set of machining conditions, i.e., it is the ID information of the specific set of machining conditions.

[0029] Furthermore, the machining condition ID information 9 of the identification information 19 indicates the set of machining conditions in the machining step associated with the ID information of the specific workpiece 1, as indicated by the workpiece ID information 6 read by the reading unit 21. The date information 10 is information relating to the date on which machining step 1003 was performed, or the date on which identification information 19 was printed, and in the first embodiment indicates the date on which machining step 1003 was performed.In the first embodiment, the control unit 23 of the printing device 20 therefore generates the identification information 19, which contains the workpiece ID information 6 read in this way, the machining condition ID information 9, which specifies the set of machining conditions in the machining step that is associated with the ID information of the specific workpiece 1 as specified by the workpiece ID information 6 read in this way, and the date information 10, which specifies the date on which the machining step 1003 was carried out.

[0030] In the present invention, the identification information 19 can also be a one-dimensional barcode or a two-dimensional barcode containing the workpiece ID information 6, the machining condition ID information, and the date information 10. In the case of a barcode, the identification information 19 can be the type of a cutting blade 35 (see Figure 1) instead of the machining condition ID information. Fig. 8), a blade height, which specifies the height of a lower end of a cutting edge 36, a Y-index, which specifies a distance over which the cutting blade 35 is moved in a Y-axis direction, a machining feed rate, which specifies a movement rate of a clamping table 31 (see Fig. 8), a spindle speed, which is a rotational speed of a spindle 34 (see Fig. 8) specifies, and include the like, all of which are specified in the set of processing conditions indicated by the processing condition ID information 9.

[0031] In the first embodiment, the identification information 19 contains the workpiece ID information 6, the machining condition ID information 9, and the date information 10. However, in the present invention, it is sufficient if the identification information 19 contains at least one of the workpiece ID information 6, the machining condition ID information 9, and the date information 10. In other words, within the scope of the present invention, the identification information 19 must contain either the workpiece ID information 6, the machining condition ID information 9, or the date information 10. (Processing step)

[0032] Fig. 8 is a side view that shows an editing step in the Fig. The workpiece management procedure shown in Figure 2 illustrates some elements in cross-section. Fig. Figure 9 is a perspective view showing the frame unit after the editing step in which it was created. Fig. Figure 2 shows the workpiece management procedure. Machining step 1003 is a step in which workpiece 1 is machined by a machining center 30.

[0033] In machining step 1003, the machining machine 30 holds the back surface 8 of the workpiece 1 over the resin film 17 on the clamping table 31 under suction, and clamping sections 32 clamp the annular frame 15. The machining machine 30 reads the identification information 19 by means of a reading unit 33 and thereby extracts the set of machining conditions specified by the machining condition ID information 9 in the identification information 19. While the cutting blade 35, which is rotated by the spindle 34 under the machining conditions extracted by the machining machine 30, and the workpiece 1 are moved sequentially relative to each other along the paths 3, the cutting edge 36 of the cutting blade 35 is positioned at the height at which the cutting edge 36 can cut into the resin film 17 and is then caused to cut into the paths 3, thereby dividing the workpiece 1 into the individual component chips 7.

[0034] In frame unit 18, after machining step 1003, cutting grooves 14 are formed as machining markings along the individual roads 3 on the workpiece 1, as shown in Fig. Figure 9 shows that in frame unit 18, after processing step 1003, the cutting grooves 14 extend as processing marks to the resin film 17, as shown in Fig. Figure 9 is shown. As described above, in the first embodiment the processing machine 30, which performs the processing step 1003, is a cutting machine that cuts the workpiece 1. (Separation step)

[0035] Fig. 10 is a side view showing a separation step 1004 in which Fig. Figure 2 shows the workpiece handling process, in which some elements are shown in cross-section. Separation step 1004 is a step that separates the machined workpiece 1 from the resin film 17.

[0036] In separation step 1004, as in Fig. Figure 10 shows that the component chips 7 on the workpiece 1 are successively separated from the adhesive layer of the resin film 17 by a known holding device 37, so that all component chips 7 are received. On the in Fig. In the frame unit 18 shown in 11, cut-off chips actually remain, although these are in Fig. The frame unit 18, from which the workpiece 1 was separated, is referred to below as reference numeral 18-1. (Storage step)

[0037] Fig. 11 is a perspective view that is an example of storage step 1005 in which in Fig. The workpiece management procedure shown in section 2 is illustrated. Fig. Figure 12 is a perspective view showing a cassette for use in another example of storage step 1005 in the [document / section]. Fig. Figure 2 shows the workpiece management procedure. Storage step 1005 is a step that stores or keeps the resin film 17 from which the workpiece 1 has been separated.

[0038] In storage step 1005, the frame unit 18-1, which contains the resin film 17 from which the workpiece 1 was separated, is stored in a coin-stack-like cassette 40 (or cassette 40 of the coin-stack type), wherein the ring-shaped frame 15, as in Fig. 11, shown, is still adhered to the outer edge section of the resin film 17 and is stored for a preset and predetermined period. In the Fig. The coin-stack-like cassette 40 shown in Figure 11 is a holding container that holds a large number of workpieces 1 in a vertically stacked arrangement. The coin-stack-like cassette 40 allows the workpieces 1 to be inserted and removed through an opening at the top end 42.

[0039] As in Fig. As shown in Figure 11, the coin-stack-like cassette 40 comprises a cylindrical wall 41 with an opening 42 at its upper end, a cutout 43 formed in the cylindrical wall 41, and a base plate 44. The cylindrical wall 41 is formed in a cylindrical shape and can accommodate frame units 18-1 inside. The opening 42 at the upper end is formed in the upper end of the cylindrical wall 41 and allows the frame units 18-1 to enter. The cutout 43 is formed by cutting out a portion of the cylindrical wall 41 along an axis of the cylindrical wall 41. The base plate 44 is formed in a square plate shape, is located at a lower end of the cylindrical wall 41, and closes off the lower end of the cylindrical wall 41.

[0040] The coin-stack-like cassette 40 holds resin films 17 with annular frames 15, which are glued to the outer edge sections thereof, inside the cylindrical wall 41. These frames 18-1 and separating films 12 are made of a material softer than the workpiece 1, such as paper or synthetic resin, and are stacked alternately. In other words, the frame units 18-1 and the separating films 12 are held together in the coin-stack-like cassette 40 in a stacked arrangement. Furthermore, the frame units 18-1 and the separating films 12 are removed from or inserted into the coin-stack-like cassette 40 through the opening at the upper end 42 by moving the frame units 18-1 and the separating films 12 upwards or downwards.

[0041] In the present invention, the frame units 18-1, from which the workpieces 1 have been separated, can also be arranged in a manner that is Fig. The cassette 50 shown in Figure 12 is used to hold and store a plurality of frame units 18-1 at intervals in an up-down direction. As shown in Figure 12. Fig. As shown in Figure 12, the cassette 50 comprises a bottom wall 51, a pair of side walls 52 extending vertically and opposite each other from opposite ends of the bottom wall 51, an upper wall 53 extending to the upper ends of the paired side walls 52 and oriented vertically opposite the bottom wall 51, and a rear wall 54 extending to the paired side walls 52, the bottom wall 51, and the upper wall 53. Support rails 55 are formed on a plurality of planes on opposite inner surfaces of the side walls 52, such that the annular frames 15 of the frame units 18-1 are mounted and supported on the support rails 55 at opposite end sections thereof. The support rails 55 are arranged linearly in the horizontal direction and at intervals in the vertical direction.

[0042] The cassette 50 also contains an opening 56, which is surrounded by the paired side walls 52, the bottom wall 51, and the top wall 53. The frame units 18-1 are inserted and removed horizontally through the opening 56 onto their respective support rails 55. The cassette 50 holds the frame units 18-1 on the support rails 55 of the respective levels at intervals in the up-down direction, with the ring-shaped frames 15 being supported at their opposite end sections on the support rails 55 of the respective levels. Furthermore, each frame unit 18-1 is removed from or inserted into the cassette 50 through the opening 56 by moving each frame unit 18-1 horizontally.

[0043] By printing the identification information 19 on each resin film 17, the workpiece management method according to the first embodiment described above allows the identification of the workpiece 1 attached to the resin film 17 even after the workpiece 1 has been separated from the resin film 17. The workpiece management method according to the first embodiment therefore has the advantageous effect that the machining conditions can be determined based on the machining marks 14 remaining on the resin film 17, and the machining states of the workpiece 1 and the component chips 7 can be specifically determined. In particular, chipping of the back surface 8 and wobble of the cutting blade 35 can be detected with the workpiece management method because contamination fragments (machining residues) and the machining marks 14 remain on the resin film 17.The workpiece management method according to the first embodiment thus has the advantageous effect that the difficulties in investigating the cause of the defects in the component chips 7 can be reduced. [Second embodiment]

[0044] A workpiece management method according to a second embodiment of the present invention is described with reference to the Fig. Described in sections 13 to 15. Fig. Figure 13 is a flowchart illustrating the process of the workpiece management procedure according to a second embodiment.

[0045] Fig. Figure 14 is a perspective view showing an inspection result recording step in the Fig. 13 workpiece management procedures are shown. Fig. Figure 15 is a view representing an image of a substantial part of a resin film, taken during the inspection result acquisition step in the Fig. The workpiece management procedures shown in section 13 were obtained. Fig. Elements 13 to 15 are the same as in the first embodiment, characterized by the same reference numerals, and their description is omitted here.

[0046] As in Fig. As shown in Figure 13, the workpiece management method according to the second embodiment is the same as that of the first embodiment, except that it includes an inspection result acquisition step 1006. The inspection result acquisition step 1006 is a step which, after the execution of the printing step 1002 and the cutting step 1004, inspects the machining conditions based on the cut grooves 14 remaining on the resin film 17, reads the identification information 19 on the inspected resin film 17, and acquires the machining conditions of the corresponding workpiece 1.

[0047] To investigate the cause of a defect or the like when a defect or the like occurs on one or more of the individual component chips 7 produced by parting the workpiece 1, the inspection result acquisition step 1006 in the second embodiment performs an inspection around the cut grooves 14 on the resin film 17. Thus, the inspection result acquisition step 1006 is not performed on all workpieces 1.

[0048] In inspection result acquisition step 1006, the frame unit 18-1, with the one or more component chips 7 that are glued onto the resin film 17 as an object or objects of inspection, is removed from the coin-stack-like cassette 40 in which the frame unit 18-1 was stored in storage step 1005, and an inspection device 60 holds the resin film 17 on the side of its base material layer on a holding table (not shown). In inspection result acquisition step 1006, the inspection device 60, as shown in Fig. Figure 14 shows that the resin film 17 of the frame unit 18-1 is cut by an imaging device 61 at a location where one or more component chips 7 are glued as the object or objects of inspection, and captures an image 62, which is shown by way of example in Fig. 15 is shown. If fragments 1-1 of workpiece 1 are located at the edges of some cutting grooves 14 in Figure 62, as in Fig. As shown in Figure 15, it is noted in inspection result recording step 1006 that back chipping (the edges of the cut grooves 14 have chipped off on the back surface 8) has occurred on the component chips 7 which were glued to the resin film 17 where the fragments 1-1 were present.

[0049] In inspection result acquisition step 1006, the inspection device 60 reads the identification information 19 through a reading unit (not shown) and acquires the workpiece ID information 6 and the machining condition ID information 9. In inspection result acquisition step 1006, the inspection device 60 acquires the machining conditions of workpiece 1, which are specified by the workpiece ID information 6.

[0050] By printing the identification information 19 onto each resin film 17, the workpiece management method according to the second embodiment can determine the machining conditions based on the cut grooves 14 remaining on the resin film 17 and specify the machining states of the workpiece 1 and the component chips 7. Consequently, the workpiece management method according to the second embodiment, similar to that of the first embodiment, has the advantageous effect of reducing the difficulties in investigating the cause of defects in the component chips 7. [Third embodiment]

[0051] A workpiece management method according to a third embodiment of the present invention is described with reference to the Fig. Described in sections 16 to 21. Fig. Figure 16 is a flowchart that represents a flow of a workpiece management procedure according to the third embodiment. Fig. 17 is a perspective view showing a frame unit after a separation step in the Fig. The 16 workpiece management procedures shown are illustrated. Fig. Figure 18 is a top view schematically representing a configuration of a foil cutting machine, which includes a printing step in the Fig. 16 workpiece management procedures are carried out. Fig. 19 is a side view showing a state in which a resin film is positioned along an inner edge of an annular frame during the printing step in which Fig. The workpiece management process shown in 16 is cut, with some elements shown in cross-section. Fig. 20 is a side view depicting a state in which a resin film, which is in the printing step in the Fig. The workpiece management process shown in section 16 was cut and is held, with some elements shown in cross-section. Fig. 21 is a sectional view showing a state in which the resin film is in the printing step in which it is in Fig. The workpiece handling procedure shown in section 16 is held in a holder housing. Fig. Elements 16 to 21 are the same as in the first and second embodiments and are identified by the same reference numerals, and their description is omitted here.

[0052] As in Fig. As shown in Figure 16, the workpiece handling method according to the third embodiment comprises the frame unit formation step 1001, the machining step 1003, the separating step 1004, the pressure step 1002, the storage step 1005, and the inspection result acquisition step 1006. After the frame unit formation step 1001 has been carried out, the machining step 1003, the separating step 1004, the pressure step 1002, the storage step 1005, and the inspection result acquisition step 1006 are carried out sequentially. In the workpiece handling method according to the third embodiment, the frame unit formation step 1001, the machining step 1003, and the separating step 1004 are carried out as in the first embodiment.

[0053] In the workpiece management method according to the third embodiment, the identification information (ID information) of the frame 11 is applied to the annular frame 15 of the frame unit 18-1, as shown in Fig. Figure 17 shows the frame ID information. The frame ID information 11 is information for identifying each frame unit 18, in other words, ID information of the specific frame unit 18.

[0054] In the workpiece handling method according to the third embodiment, the printing step 1002 is performed by a foil cutting machine 70, which is located in Fig. Figure 18 shows the film cutting machine 70 cutting the resin film 17 of the frame unit 18-1 after the separation step 1004, wherein the frame unit 18-1 is in Fig. 17 is shown, along the inner edge of the ring-shaped frame 15 and holds the cut resin film 17 in a holder housing 75.

[0055] As in Fig. As shown in Figure 18, the film cutting machine 70 includes a cassette application section 71, an unloading unit 80, a printing unit 72, a cutting unit (equivalent to a "resin film separator unit") 73, a transfer unit 74, a film application section 76 to which the holding housing 75 (equivalent to a "resin film holding section") is attached, a separator film supply section 77 which stores the separator films 12 in a stacked relationship, and a control unit 78.

[0056] The cassette mounting section 71 is arranged in a corner region of a main body 79 of the film cutting machine 70. The cassette 50, containing the frame units 18-1 after the cutting step 1004, is attached to an upper surface of the cassette mounting section 71. The cassette mounting section 71 supports the cassette 50 so that it can be moved up and down vertically. The cassette 50 thus holds each frame unit 18-1 with the cutting grooves 14 formed on the resin film 17 after the workpiece 1, which is supported in the opening 16 of the annular frame 15 above the resin film 17, has been cut and the cut workpiece 1 has been separated from the resin film 17. On the upper surface of the cassette mounting section 71, the cassette 50 is mounted such that its opening 56 faces the center of the main body 79.

[0057] The unloading unit 80 unloads the frame unit 18-1 from the cassette 50 attached to the cassette mounting section 71 and places the frame unit 18-1 on a holding table of the printing unit 72 (not shown).

[0058] The printing unit 72 prints the identification information 19 of the separated workpiece 1 onto the resin film 17 of the frame unit 18-1, which is unloaded from the cassette 50 by the unloading unit 80. The printing unit 72 is arranged on the main machine body 79 at a location adjacent to the cassette mounting section 71, extends along one direction of movement of the frame unit 18-1 when the frame unit 18-1 is unloaded from the cassette 50 attached to the cassette mounting section 71, and includes the holding unit, which holds the frame unit 18-1 over the resin film 17, a reading unit 721, which reads the frame ID information 11 of the frame unit 18-1 held on the holding table, and a printhead 722, which prints the identification information 19 onto the resin film 17 of the frame unit 18-1. The printhead 722 prints the identification information 19 by irradiating the adhesive layer of the resin film 17 with a laser beam.However, within the scope of the present invention, the printing method is not limited to such laser printing, and the identification information 19 can, for example, be printed by applying ink to the adhesive layer of the resin film 17.

[0059] The cutting unit 73 cuts the resin film 17, onto which the identification information 19 has been printed by the printing unit 72, of the frame unit 18-1 along the inner edge of the annular frame 15, thereby separating the resin film 17 of the frame unit 18-1 from the annular frame 15. The cutting unit 73 is arranged on the main machine body 79 at a location adjacent to the printing unit 72 and extends in a direction that is relevant to the direction of movement of the frame unit 18-1 when the frame unit 18-1 is unloaded from the cassette 50 mounted on the cassette attachment section 71. As shown in Fig. As shown in Figure 19, the cutting unit 73 includes a film holding table 731 which holds the resin film 17 of the frame unit 18-1 on one side which is located inside the inner edge of the annular frame 15, a frame holding table 732 which holds the annular frame 15 of the frame unit 18-1, a cutting head 733 which cuts the resin film 17, and a motion unit not shown.

[0060] The cutting unit 73 holds the resin film 17 of the frame unit 18-1 on the film holding table 731 at the side that is located inside the annular frame 15, holds the annular frame 15 of the frame unit 18-1 on the frame holding table 732, moves the cutting head 733 by the movement unit (not shown) relative to the frame unit 18-1 along the inner edge of the annular frame 15 and thus cuts the resin film 17 of the frame unit 18-1 along the inner edge of the annular frame 15. In the third embodiment, the cutting head 733 of the cutting unit 73 cuts the resin film 17 by shining a laser beam 734 onto the adhesive layer of the adhesive film 17. However, within the scope of the present invention, the cutting method is not limited to such laser cutting, and the resin film 17 can be cut by causing a cutting edge to cut into the adhesive layer of the resin film 17.In the third embodiment, the cutting unit 73 is also configured such that the frame holding table 732 can pivot downwards and outwards about its outer edge, so that the ring-shaped frame 15 held on the frame holding table 732 is dropped and held in a housing (not shown) arranged below the frame holding table 732.

[0061] The transfer unit 74 transfers the frame unit 18-1 from the holding table (not shown) of the printing unit 72 to the holding tables 731 and 732 of the cutting unit 73, transfers the cut resin film 17 from the film holding table 731 of the cutting unit 73 to the holder housing 75, and transfers the release film 12 from the release film supply section 77 to the holder housing 75. As shown in Fig. Figure 20 shows that the transfer unit 74 comprises suction grippers 741, a holding element 742 that holds the suction grippers 741, and a motion unit (not shown) that moves the holding element 742 in a vertical and a horizontal direction. The suction grippers 741 are non-contact Bernoulli suction grippers that expel pressurized gas and, under a vacuum created by the gas, alternately hold the resin film 17 and the release film 12 without making contact with them.

[0062] The release film storage section 77 is located on the main machine body 79 at a position adjacent to the cutting unit 73, and the film application section 76 is located on the main machine body 79 at a position adjacent to the cassette application section 71 and the cutting unit 73. The holder housing 75 mounted on the film application section 76 has a similar configuration to the coin-stack-like cassette 40 mentioned above. Therefore, sections identical to those of the coin-stack-like cassette 40 are designated with the same reference numerals, and their description is omitted here. The holder housing 75 has a cutout 43 formed such that it is larger than the outer diameter of the resin film 17 cut by the cutting unit 73 and is opposite the cutting unit 73. The resin film 17 and the release film 12 are inserted into the holder housing 75 from the transfer unit 74 through the cutout 43.The holder housing 75 thus holds the resin film 17, which was separated from the ring frame 15 by the cutting unit 73.

[0063] The control unit 78 is a computer that includes a logical processing unit with a microprocessor, such as a CPU, a storage device with memory, such as a ROM or RAM, and an input / output interface device, and is capable of executing computer programs. The control unit 78 controls individual elements that make up the printing unit 72 and enables the foil cutting machine 70 to perform printing step 1002.

[0064] In the control unit 78, each frame ID information 11 read by the reading unit 721, the ID information of the corresponding workpiece 1, which is glued onto the resin film 17 from which the reading unit 721 read the frame ID information 11, the frame unit 18-1 and the corresponding set of machining conditions in machining step 1003 have previously been stored together in association with each other.

[0065] In printing step 1002 of the workpiece handling procedure according to the third embodiment, the film cutting machine 70 removes one of the frame units 18-1 from the cassette 50 after the cutting step 1004 by the unloading unit 80 and holds the frame unit 18-1 on the holding table (not shown) of the printing unit 72. The film cutting machine 70 reads the frame ID information 11 by the reading unit 721 of the printing unit 72, and the control unit 78 extracts the workpiece ID information 6, which indicates the ID information of the specific workpiece 1 associated with the frame ID information 11, and the processing condition ID information 9, which indicates the set of processing conditions in processing step 1003, wherein the set of processing conditions is associated with the frame ID information 11.The control unit 78 of the foil cutting machine 70 generates the identification information 19, which contains the workpiece ID information 6, the processing condition ID information 9 and the date information 10, which indicates the date on which the processing step 1003 was carried out.

[0066] The foil cutter 70 positions the printhead 722 in opposition to an area of ​​the resin foil 17, with the area located on one side within the inner edge of the annular frame 15, and prints the generated identification information 19 onto the resin foil 17 by the printhead 722. The foil cutter 70 transfers the frame unit 18-1, which contains the resin foil 17 with the printed identification information 19, by the transfer unit 74 to the cutting unit 73, and holds the frame unit 18-1 on the holding tables 731 and 732. As in Fig. As shown in Figure 19, the foil cutting machine 70 cuts the resin foil 17 along the inner edge of the ring-shaped frame 15 through the cutting head 733 and holds, as in Fig. 20 shows the cut resin film 17 through the transfer unit 74. As shown in Fig. As shown in Figure 21, the film cutting machine 70 holds the cut resin film 17 in the holder housing 75 by means of the transfer unit 74. In the third embodiment, the holder housing 75 holds the resin films 17 and the release films 12 alternately in a stacked arrangement. The resin films 17, which are held in the holder housing 75, are stored in storage step 1005 for a predetermined time.

[0067] In the workpiece management method according to the third embodiment, the inspection result acquisition step 1006 is performed as in the second embodiment. Due to the printing of the identification information 19 onto the resin film 17, the workpiece management method according to the third embodiment can determine the machining conditions based on the cut grooves 14 remaining on the resin film 17 and specify the machining conditions of the workpiece 1 and the component chips 7. Consequently, the workpiece management method according to the third embodiment, similar to that of the first embodiment, has the advantageous effect of reducing the difficulties in investigating the cause of defects in the component chips 7.

[0068] The present invention is not limited to the embodiments described above. In other words, the present invention can be carried out with various modifications or adaptations within its scope that do not depart from the spirit of the present invention. In the embodiments described above, the processing machine 30, which performs processing step 1003, is the cutting machine that cuts the workpiece 1. However, in the present invention, the processing machine 30 is not limited to such a cutting machine, and the processing machine 30 can be a laser processing machine that projects a laser beam of a wavelength with transmittance or absorption into the workpiece 1, a grinding machine that grinds the workpiece 1, or a polishing machine that polishes the workpiece 1.In the laser processing machine, the grinding machine that grinds the workpiece 1, or the polishing machine that polishes the workpiece 1, a processing defect can lead to discoloration of the resin film 17 due to heating or the like, resulting in a burn mark, also known as a processing mark. When these processing machines perform processing step 1003, a burn mark can be detected as a processing mark on the resin film 17 in the inspection result acquisition step 1006. In the embodiments described above, the resin film 17 is cut to separate it from the ring frame 15. However, in the present invention, the resin film 17 can also be separated by peeling it off the ring-shaped frame 15.

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