Extraction mechanism and processing device

Abstract

Extraction mechanism (1) for a processing device (100) for processing a disk-shaped semiconductor wafer or a wafer for an optical device, comprising: a dust collection unit (40) having a suction passage (41) wherein one end is connected to a suction source (65) and another end opens into a suction area (210); and a tuft (70) arranged at a predetermined position in the dust collection unit (40), wherein the suction source is operated such that it removes powder dust from the suction area (210) and causes the tuft (70) to flutter in order to prevent the powder dust from accumulating in the suction passage (41) in the dust collection unit (40).

Description

BACKGROUND OF THE INVENTION Technical field The present invention relates to a suction mechanism and a processing device. Description of the related prior art To divide a workpiece, such as a semiconductor wafer, to form chips, a processing device is used in which a laser beam with a wavelength such that it is absorbed by the workpiece is applied along paths to the workpiece to cause ablation (see JP 2003-320466 A and JP 2014-036987 A). Documents US 2004 / 0131404 A1, US 2008 / 0006296 A1, US 2006 / 0257243 A1, and DE 102013216121 A1 represent further prior art. When a workpiece undergoes such ablation, machining dust in the form of fine powder dust, known as debris, is generated. If this debris redeposits on the workpiece, the properties of the components can be impaired. Therefore, the machining device is equipped with an extraction channel, such as a nozzle or a pipe, to extract and collect the debris. However, if such a machining device is used for an extended period, debris can accumulate, for example, on the inside of the nozzle or pipe, and this can lead to ignition, necessitating frequent cleaning.To solve this problem, a processing device has been proposed which includes a nozzle equipped with a cleaning mechanism or extinguishing agent and the like (see JP 2014-004495 A), but it requires additional equipment and energy, which leads to an increase in costs. PRESENTATION OF THE INVENTION Accordingly, it is an object of the present invention to provide a suction mechanism and a processing device that are able to prevent the occurrence of problems due to the accumulation of powder dust in a nozzle or a pipeline in advance, while simultaneously reducing costs. The present invention is defined by a suction mechanism for a processing device for processing a disk-shaped semiconductor wafer or a wafer for an optical device according to the features of independent claim 1, and a processing device for processing a disk-shaped semiconductor wafer or a wafer for an optical device according to the features of dependent claim 4. The dependent claims relate to preferred embodiments. According to one aspect of the present invention, a suction mechanism is provided comprising a dust collection unit having a suction passage, one end of which is connected to a suction source and the other end of which opens into a suction area; and a tuft arranged at a predetermined position in the dust collection unit, wherein the suction source is operated to remove powder dust from the suction area and causes the tuft to flap in order to prevent the powder dust from accumulating in the suction passage in the dust collection unit. Preferably, the dust collection unit includes a channel. Preferably, the brush is arranged on a mechanism for generating turbulent flow, which is provided on an inner surface of the dust collection unit. According to the extraction mechanism of the present invention, it is possible to prevent the occurrence of problems due to the accumulation of powder dust in a nozzle or a pipeline, while simultaneously reducing costs. The above and other objects, features and advantages of the present invention and the manner of its realization will become more apparent from, and the invention itself will be best understood by, a study of the following description and the attached claims with reference to the attached drawings, which show some preferred embodiments of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a configuration example of a machining device that includes a suction mechanism according to a first embodiment; Fig. 2 is a sectional view showing the suction mechanism according to the first embodiment and the surrounding area; Fig. 3 is a sectional view showing an example of a tuft arrangement position according to the first embodiment; Fig. 4 is a sectional view showing an example of a tuft arrangement position according to a second embodiment; Fig. 5 is a sectional view showing an example of a tuft arrangement position according to a third embodiment; Fig. 6 is a sectional view showing an example of a tuft arrangement position according to a fourth embodiment; Fig.Figure 7 is a sectional view showing an example of an arrangement position of a tuft according to a fifth embodiment; and Figure 8 is a sectional view showing a suction mechanism according to a sixth embodiment and the surroundings of the suction mechanism. DETAILED DESCRIPTION OF PREFERRED EXECUTION FORMS Embodiments of the present invention are described in detail below with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that are readily apparent to a person skilled in the art and those that are essentially identical. Moreover, the configurations described below can be combined as needed. In addition, various ways of omitting, replacing, or modifying the configurations can be made in such a way that the core of the present invention is not altered. [First embodiment] A suction mechanism 1 and a processing device 100 according to a first embodiment of the present invention are described with reference to the drawings. Fig. 1 is a perspective view showing an embodiment of the processing device 100, which includes the suction mechanism 1 according to the first embodiment. Fig. 2 is a sectional view showing the suction mechanism 1 according to the first embodiment and the area surrounding the suction mechanism 1. As shown in Fig. 1, the processing device 100 according to the first embodiment includes the suction mechanism 1 according to the first embodiment, a holding table 10, a processing unit 20, a protective unit 30, and a control unit 80. In the first embodiment, a workpiece 200, which is an object to be processed by the processing device 100, is, for example, a disk-shaped semiconductor wafer or a wafer for an optical device, the base material of which is silicon, sapphire, silicon carbide (SiC), gallium arsenide, glass, or the like. As shown in Fig. 1, the workpiece 200 is formed with chip-sized components 203 in areas subdivided by a plurality of paths 202 formed in a grid pattern on a flat front surface 201. In the first embodiment, an adhesive tape 205 is attached to a rear surface 204 on the back of the front surface 201 of the workpiece 200, and an annular frame 206 is attached to an outer edge portion of the adhesive tape 205, although this is not a limitation within the scope of the present invention.Furthermore, the workpiece 200 in the present invention can be a rectangular packaging substrate, a ceramic plate, a glass plate or the like, comprising a plurality of components sealed by a resin. The holding table 10 comprises a disc-shaped frame body formed with a recess and a disc-shaped suction section inserted into the recess. The suction section of the holding table 10 is formed from a porous ceramic containing a plurality of pores or the like and is connected to a vacuum suction source (not shown) via a vacuum suction passage (not shown). As shown in Figures 1 and 2, an upper surface of the suction section of the holding table 10 is a holding surface 11 on which the workpiece 200 is mounted and which holds the workpiece 200 under suction. In the first embodiment, the workpiece 200 is mounted on the holding surface 11 with its front surface 201 facing upwards, and the workpiece 200 is held under suction by the holding surface 11 from the side of the rear surface 204 by the adhesive tape 205.The holding surface 11 and an upper surface of the frame body of the holding table 10 are arranged on the same plane and are formed such that they are parallel to an XY plane, which is a horizontal plane. The holding table 10 is designed to be moved by an X-axis motion unit (not shown) in an X-axis direction parallel to a horizontal direction, and is designed to be moved by a Y-axis motion unit (not shown) in a Y-axis direction that is parallel to a horizontal direction and orthogonal to the X-axis direction. The holding table 10 is moved by the X-axis motion unit along the X-axis direction, thereby moving it back and forth, as shown in Fig. 1, between an infeed and outfeed area 110, in which the workpiece 200 is fed in and out, and a machining area 120, in which the machining of the workpiece 200 is carried out by the machining unit 20. Furthermore, the holding table 10 is moved in the X-axis and Y-axis directions by the X-axis motion unit and the Y-axis motion unit, respectively.The Y-axis motion unit moves, thereby moving the application position of a laser beam 29 on the front surface 201 of the workpiece 200, which is held by the holding table 10 positioned in the machining area 120, in the X-axis direction and the Y-axis direction (in one direction opposite to the direction of movement of the holding table 10). The holding table 10 is designed to be rotatable about a Z-axis parallel to a vertical direction and orthogonal to the XY plane by a rotary drive source (not shown). In the first embodiment, as shown in Fig. 2, the processing unit 20 is a laser beam application unit that performs a so-called ablation, in which the laser beam 29, with a wavelength such that it is absorbed in the workpiece 200, is applied to the side of the front surface 201 of the workpiece 200, which is held by the holding table 10, which is positioned in the processing execution area 120, in order to effect ablation (sublimation or vaporization) by the laser beam 29 from the side of the front surface 201 of the workpiece 200. In the first embodiment, the processing unit 20 performs the ablation of the side of the front surface 201 of the workpiece 200 by means of a resin film 220 which coats the front surface 201 of the workpiece 200, but within the scope of the present invention this is not limiting, and the workpiece 200 which is not coated with the resin film 220 can be subjected to ablation.The processing unit 20 includes a laser oscillator (not shown) and a light focusing device 22 shown in Fig. 2. The laser oscillator sets a laser with a wavelength such that it is absorbed in the workpiece 200 and emits the laser beam 29. In the first embodiment, the laser oscillator emits a pulsed laser beam 29, which, however, does not constitute a limitation within the scope of the present invention. The light focusing device 22 is arranged on an optical path of the laser beam 29 emitted by the laser oscillator and focuses the concentrated laser beam 29 onto the side of the front surface 201 of the workpiece 200, which is held by the holding table 10 positioned in the machining area 120. In the first embodiment, as shown in Fig.As shown in Figure 2, the light focusing device 22 is configured to have a reflection mirror 23 which reflects the laser beam 29 emitted by the laser oscillator in order to direct the laser beam 29 to a condenser lens 24, wherein the condenser lens 24 focuses the laser beam 29 guided by the reflection mirror 23 and applies the concentrated laser beam 29 to the side of the front surface 201 of the workpiece 200, which is held by the holding table 10 positioned in the machining execution area 120, and a light focusing housing 25 which, together with the reflection mirror 23 and the condenser lens 24, covers the optical path of the laser beam 29 emitted by the laser oscillator until the laser beam 29 is directed to the condenser lens 24. In the first embodiment, the processing unit 20 is stationary. It should be noted that this does not constitute a limitation within the scope of the present invention, and the processing unit 20 can be provided to be movable in the X-axis or Y-axis direction by an X-axis motion unit (not shown) or a Y-axis motion unit (not shown), which may differ from those for the holding table 10. The processing unit 20 can move a light-bundling position of the laser beam 29 emitted by the laser oscillator and bundled by the light-bundling device 22 along the Z-axis direction. As shown in Fig. 2, the protective unit 30 includes a gas supply tube 31, one end of which is connected to the light focusing housing 25 on the side immediately downstream of the light focusing device 22, and a gas supply source 32. The gas supply tube 31 penetrates the inside and outside of the light focusing housing 25 and has a communication opening 33 at the end connected to the light focusing housing 25, providing communication with the interior of the light focusing housing 25. The gas supply source 32 delivers a high-pressure gas into the interior of the gas supply tube 31. The gas supplied by the gas supply source 32 is, for example, compressed air or an inert gas such as high-pressure nitrogen.In addition, the protective unit 30 contains an outlet tube 34 connected to the light bundling housing 25, which discharges the laser beam 29, which is bundled by the condenser lens 24, and the gas supplied by the gas supply source 32 in the direction of the workpiece 200, which is held by the holding table 10 arranged in the machining area 120. The laser beam 29, emitted by the laser oscillator and focused by the light focusing device 22, passes through the communication opening 33 and the interior of the gas supply tube 31 in that sequence and is directed from the outlet tube 34 onto a processing area 210 on the front surface 201 of the workpiece 200 on the holding table 10 in the processing execution area 120. The laser beam 29, which passes through the interior of the gas supply tube 31 and strikes the processing area 210 of the workpiece 200, ablates the processing area 210 of the workpiece 200, resulting in the formation of debris (fine powder dust) as processing dust in the vicinity of the processing area 210.The processing area 210 refers to an area of ​​the workpiece 200 that is processed by the processing unit 20, and in the first embodiment refers to an area positioned in the processing execution area 120 on the front side 201 of the workpiece 200, which is subjected to ablation by applying the laser beam 29, and is an area of ​​a fixed area with the application position of the laser beam 29 as its center. The gas supplied by the gas supply source 32 flows through the interior of the gas supply tube 31 and is discharged via the outlet tube 34, thereby forming a gas flow 39, which is a flow of gas within the gas supply tube 31. The gas flow 39 formed within the gas supply tube 31 prevents the debris formed near the processing area 210 from being scattered onto the side of the light focusing device 22 and deposited there. The extraction mechanism 1 according to the first embodiment comprises a dust collection unit 40 and a brush 70, as shown in Figs. 1 and 2. In the first embodiment, as shown in Fig. 2, the dust collection unit 40 comprises a debris outlet unit 50 and an extraction duct 60. The debris outlet unit 50 is formed integrally with the protective unit 30 and includes a suction passage 51 extending into its interior. The extraction duct 60 includes a suction passage 61 extending into its interior and communicating with the suction passage 51. In other words, the dust collection unit 40 is provided with a suction passage 41 formed by the suction passage 51 and the suction passage 61, which communicate with each other. The suction passage 51 communicates at one end with the suction passage 61 of the extraction duct 60 and at the other end is formed by a suction opening 52 open in the processing area 210. The suction passage 61 is connected at one end to the suction source 65 and communicates at the other end with the suction passage 51 of the debris outlet unit 50. In other words, the suction passage 41 is connected at one end on the side of suction passage 61 to the suction source 65 and opens at the other end on the side of suction passage 51 into the suction opening 52 in the processing area 210.It should be noted that the dust collection unit 40 is not limited to this embodiment within the scope of the present invention and, for example, a mode can be assumed in which the debris outlet unit 50 is not provided, one end of the extraction channel 60 is connected to the suction source 65, and the other end of the extraction channel 60 opens into the processing area 210. Thus, in the first embodiment, the suction opening 52, which is formed in the suction passage 41 of the dust collection unit 40, is directed towards the processing area 210, which is an example of a suction area within the meaning of the present invention. In the extraction duct 60, actuation of the suction source 65 creates a suction flow 69 in the suction passage 61, which runs from a connection side of the debris outlet unit 50 towards the suction source 65. In the debris outlet unit 50, actuation of the suction source 65 creates a suction flow 59 in the suction passage 51, which runs from the suction opening 52 towards a connection side of the extraction duct 60. In other words, in the dust collection unit 40, actuation of the suction source 65 creates a suction flow 49 in the suction passage 41, which runs from the suction opening 52 towards the suction source 65. It should be noted that the suction source 65 can be installed in the processing device 100, in a factory where the processing device 100 is located, or separately. In the dust collection unit 40, when the suction source 65 is activated, the debris generated near the processing area 210 is drawn in through the suction opening 52, together with air near the processing area 210 and the gas discharged from the outlet pipe 34, by the suction flow 49 formed in the suction passage 41. The drawn-in debris is then caused to flow in the suction passage 41 towards the suction source 65 in accordance with the suction flow 49, thereby removing it from the vicinity of the processing area 210. Thus, in the first embodiment, the debris, which is processing dust, is removed from the processing area 210 (suction area) by the dust collection unit 40 when the suction source 65 is activated, and is an example of powder dust according to the present invention. The Tuft 70 is an elongated or linear element that has the property of deforming and following the air or gas flow, fluttering along the air or gas flow. Specifically, the Tuft 70 is a thin and lightweight fibrous element, such as a thread-like element, a cord-like element, or a rope-like element, or a tuft-like element in which a thin and lightweight fibrous element is bundled in a tuft shape. Here, the cord-like element contains an element formed from intertwined thread-like elements, and the rope-like element contains an element formed from intertwined thread-like or cord-like elements. The shape, such as the length and thickness of the Tuft 70, can be adjusted as required. The tuft 70 is preferably formed from a material that is free from debris deposits on its surface and free from reactions with debris, or that has a surface treated to prevent debris deposits and reactions with debris. Examples of treatments to prevent debris deposition on the surface of the tuft 70 and the surface from reacting with debris include a coating treatment with Teflon (registered trademark), in which the surface of the tuft 70 is coated with Teflon. As shown in Fig. 2, the tuft 70 is arranged with one end in a predetermined position in the dust collection unit 40. In the first embodiment, the predetermined position in the dust collection unit 40 where the tuft 70 is arranged is on an inner surface 48 of the suction passage 41 of the dust collection unit 40. Specifically, it includes a position on an inner surface 58 of the suction passage 51 of the debris outlet unit 50, a position on an inner surface 68 of the suction passage 61 of the extraction duct 60, and a position located on both inner surfaces 58 and 68. The number of tufts 70 to be arranged can be adjusted as required. Since the tuft 70 is connected at one end to the inner surface 48 of the suction passage 41 of the dust collection unit 40, the other end of the tuft 70 is caused by the suction flow 49, which is generated by the actuation of the suction source 65, to flow relative to the first end and flutters along the inner surface 48 of the suction passage 41 along the suction flow 49. The tuft 70 thus flutters along the inner surface 48 of the suction passage 41 along the suction flow 49 in order to dislodge any debris deposited or accumulated on the inner surface 48 of the suction passage 41, thereby preventing the debris flowing along the suction flow 49 in the suction passage 41 from being deposited or accumulated there. Fig. 3 is a sectional view showing an example of an arrangement position of the tuft 70 in the extraction device according to the first embodiment. The tuft 70 is preferably arranged in a position where it flutters in accordance with the suction flow 49, so that it covers an area on the inner surface 48 of the suction passage 41 of the dust collection unit 40 in which debris can settle or accumulate. In the first embodiment, the area on the inner surface 48 of the suction passage 41 of the dust collection unit 40 in which the debris can settle or accumulate is, for example, as shown in Fig. 3, a curved area 43. As shown in Fig. 3, the curved region 43 refers to a region in which the direction of the suction flow 49, which carries the debris, has a curvature equal to or greater than a fixed value because the inner surface 48 of the dust collection unit 40 is curved or corrugated in the direction of the suction flow 49 along which the debris flows. The curved region 43 is a region in which the direction of the suction flow 49 along which the debris flows is varied and is a region in which the debris can be deposited or accumulated according to the change in direction. The control unit 80 controls the operation of each component of the processing device 100, thereby causing the processing device 100 to perform a processing treatment (ablation treatment) on the workpiece 200. For example, the control unit 80 controls the operation and suction pressure (pressure of a vacuum) of the suction source 65, thereby controlling the suction flow 49 formed in the suction passage 41 of the dust collection unit 40, controlling the fluttering of the tuft 70 on the inner surface 48 of the suction passage 41, and controlling the treatment for removing and discharging debris through the dust collection unit 40. In the first embodiment, the control unit 80 contains a computer system. The computer system contained in the control unit 80 has an arithmetic processing unit with a microprocessor, such as a central processing unit (CPU), a storage device with memory, such as read-only memory (ROM) or random access memory (RAM), and an input / output interface. The arithmetic processing unit of the control unit 80 performs arithmetic processing according to a computer program stored in the storage device of the control unit 80 and outputs control signals for controlling the processing device 100 to the components of the processing device 100 via the input / output interface of the control unit 80. As shown in Fig. 1, the processing device 100 also includes a display unit 91. The display unit 91 shows a screen for setting the processing conditions (ablation conditions) of the processing device 100, a screen displaying the results of the ablation treatment performed by the processing device 100, such as the quality of the laser-processed grooves. In the first embodiment, the display unit 91 is formed from a liquid crystal display device or the like. The display unit 91 is provided with an input unit, which is used when the operator enters information about the processing conditions of the processing device 100 and the like. In the first embodiment, the input unit provided in the display unit 91 consists of at least one touch panel provided on the display unit 91, a keyboard, and the like. As shown in Fig. 1, the processing device 100 further comprises a treatment unit 92, a cassette mounting base 93, a pair of guide rails 94, and a first, second, and third conveying unit 95, 96, and 97. The treatment unit 92 forms the resin film 220, which coats the front surface 201 of the workpiece 200 before ablation, and removes the resin film 220 from the front surface 201 of the workpiece 200, or cleans the front surface 201 after ablation. The resin film 220 acts as a protective film, preventing the debris generated by the ablation in the processing area 210 from adhering to the components 203 on the front surface 201 of the workpiece 200. The cassette mounting base 93 is a mounting base on which a cassette 99 is mounted, which is a receiving vessel for receiving a variety of workpieces 200 and raises and lowers the mounted cassette 99 in the Z-axis direction.The pair of guide rails 94 is provided on the observer side of an opening of the cassette 99 mounted on the cassette mounting base 93 in such a way that they can be moved towards and away from each other, and the workpiece 200 is temporarily placed on them. The first conveying unit 95 conveys the workpiece 200 from the cassette 99 to the pair of guide rails 94 before ablation, and conveys the workpiece 200 after ablation and cleaning from a position on the pair of guide rails 94 back to the cassette 99. The second conveying unit 96 conveys the workpiece 200 before ablation from a position on the pair of guide rails 94 to the treatment unit 92, and conveys the workpiece 200 after ablation and cleaning from the treatment unit 92 back to the pair of guide rails 94.The third conveying unit 97 conveys the workpiece 200, coated with the resin film 220 on the front surface 201 before ablation, from the treatment unit 92 to the holding surface 11 of the holding table 10 positioned in the infeed and outfeed area 110, and conveys the workpiece 200 after ablation and before cleaning from a position on the holding surface 11 of the holding table 10 positioned in the infeed and outfeed area 110 to the treatment unit 92. The extraction mechanism 1 and the processing device 100 according to the first embodiment, which is configured as described above, contain neither a nozzle equipped with a cleaning mechanism nor extinguishing agent. On the other hand, by actuating the suction source 65, the suction flow 49 from the processing area 210 to the suction source 65 is formed in the suction passage 41 of the dust collection unit 40, whereby the debris generated in the processing area 210 is set in motion and removed in accordance with the suction flow 49. Furthermore, the tuft 70 fluttering along the suction flow 49 on the inner surface 48 of the suction passage 41 of the dust collection unit 40 throws off the debris that could settle or accumulate on the inner surface 48 of the suction passage 41, thus preventing the debris flowing in the suction passage 41 in accordance with the suction flow 49 from settling or accumulating on the inner surface 48 of the suction passage 41.Therefore, the suction mechanism 1 according to the first embodiment offers the advantageous effect of being able to prevent in advance the generation of a problem due to the accumulation of debris in the nozzle or a pipeline (dust collection unit 40) and at the same time reduce the cost of installing the nozzle which is equipped with a cleaning mechanism and the extinguishing agent. Furthermore, in the extraction mechanism 1 and the processing device 100 according to the first embodiment, in a case where the tuft 70 is arranged on the inner surface 68 of the extraction channel 60, and where the tuft 70 is positioned so that it flutters along the suction flow 49 in such a way as to cover an area (curved area 43) on the inner surface 68 of the extraction channel 60 where debris can settle or accumulate, the tuft 70 prevents the debris from settling or accumulating in this area. This more clearly highlights the advantageous effect of being able to prevent the generation of a problem due to debris accumulation in the nozzle or the piping (dust collection unit 40) from the outset, while simultaneously reducing costs. [Second embodiment] A suction mechanism 1 and a processing device 100 according to a second embodiment of the present invention are described with reference to the drawings. Fig. 4 is a sectional view showing an example of the arrangement position of a tuft 70 according to the second embodiment. In the second embodiment, the same parts as in the first embodiment are designated by the same reference numerals used above, and descriptions thereof are omitted. The extraction mechanism 1 and the processing device 100 according to the second embodiment have a configuration in which the area in which the debris can settle or accumulate, and in which the tuft 70 is arranged in the first embodiment, is changed, for example, as shown in Fig. 4, to an area with an enlarged diameter 44 instead of the curved area 43 in the first embodiment. The extraction mechanism 1 and the processing device 100 according to the second embodiment, as well as the dust collection unit 40 and the tuft 70 that form the extraction mechanism 1, are similar in other aspects of their configuration to those of the first embodiment. As shown in Fig. 4, the area with the enlarged diameter 44 refers to a region in which the cross-sectional area of ​​the suction passage 41 of the dust collection unit 40 is enlarged orthogonally to the direction of the suction flow 49 along the direction of the suction flow 49. The area with the enlarged diameter 44 is a region in which the velocity of the suction flow 49 is varied so that it is lower, and correspondingly, the velocity at which the debris passes is varied so that it is lower, allowing the debris to be deposited or accumulated in that region. The extraction mechanism 1 and the processing device 100 according to the second embodiment, which are configured as described above, have a configuration in which the area in which the debris can be deposited or accumulated and in which the tuft 70 is arranged is changed from the curved area 43 in the first embodiment to the area with an enlarged diameter 44, and they therefore achieve an advantageous effect similar to that of the first embodiment. [Third embodiment] A suction mechanism 1 and a processing device 100 according to a third embodiment of the present invention are described with reference to the drawings. Fig. 5 is a sectional view showing an example of the arrangement position of a tuft 70 according to the third embodiment. In the third embodiment, the same parts as in the first and second embodiments are designated by the same reference numerals used above, and descriptions thereof are omitted. The extraction mechanism 1 and the processing device 100 according to the third embodiment have a configuration in which the area in which the debris can settle or accumulate, and in which the tuft 70 is arranged in the first embodiment, is changed, for example, as shown in Fig. 5, to an area with a reduced diameter 45 instead of the curved area 43 in the first embodiment. The extraction mechanism 1 and the processing device 100 according to the third embodiment, as well as the dust collection unit 40 and the tuft 70 that form the extraction mechanism 1, are similar in other aspects of their configuration to those of the first embodiment. As shown in Fig. 5, the reduced-diameter region 46 refers to an area where the cross-sectional area of ​​the suction passage 41 of the dust collection unit 40 is reduced orthogonally to the direction of the suction flow 49 along the direction of the suction flow 49. The reduced-diameter region 45 becomes an area where debris can settle or accumulate, since the probability of debris impacting the inner surface 48 of the suction passage 41 is increased due to the reduction in cross-sectional area. The extraction mechanism 1 and the processing device 100 according to the third embodiment, which are configured as described above, have a configuration in which the area in which the debris can be deposited or accumulated and in which the tuft 70 is arranged is changed from the curved area 43 in the first embodiment to the area with reduced diameter 45, and they therefore achieve an advantageous effect similar to that of the first embodiment. [Fourth embodiment] A suction mechanism 1 and a processing device 100 according to a fourth embodiment of the present invention are described with reference to the drawings. Fig. 6 is a sectional view showing an example of the arrangement position of a tuft 70 according to the fourth embodiment. In the fourth embodiment, the same parts as in the first to third embodiments above are designated by the same reference numerals used above, and descriptions thereof are omitted. The extraction mechanism 1 and the processing device 100 according to the fourth embodiment have a configuration in which the area in which the debris can settle or accumulate and in which the tuft 70 is arranged, for example, as shown in Fig. 6, is changed to a connection area 46 instead of the curved area 43 in the first embodiment. The extraction mechanism 1 and the processing device 100 according to the fourth embodiment, as well as the dust collection unit 40 and the tuft 70 that form the extraction mechanism 1, are similar in other aspects of their configuration to those of the first embodiment. As shown in Fig. 6, the connection area 46 refers to an area with a step that provides a variation in height of equal to or greater than a fixed value in the direction of the suction flow 49, because the two dust collection units 40 are connected. Due to this step, the connection area 46 becomes an area in which the cross-sectional area of ​​the suction passage 41 of the dust collection unit 40 is varied orthogonally to the direction of the suction flow 49, namely, an area in which the velocity of the suction flow 49 is varied. Thus, because of this step, the connection area 46 becomes an area in which debris can settle or accumulate. The extraction mechanism 1 and the processing device 100 according to the fourth embodiment, which are configured as described above, have a configuration in which the area in which the debris can be deposited or accumulated and in which the tuft 70 is arranged is changed from the curved area 43 in the first embodiment to the connection area 46, and they therefore achieve an advantageous effect similar to that of the first embodiment. [Fifth embodiment] A suction mechanism 1 and a processing device 100 according to a fifth embodiment of the present invention are described with reference to the drawings. Fig. 7 is a sectional view showing an example of the arrangement position of a tuft 70 according to the fifth embodiment. In the fifth embodiment, the same parts as in the first to fourth embodiments above are designated by the same reference numerals used above, and descriptions thereof are omitted. The extraction mechanism 1 and the processing device 100 according to the fifth embodiment have a configuration in which the tuft, as shown, for example, in Fig. 7, is arranged on a projection 47 provided on the inner surface 48 of the suction passage 41 of the dust collection unit 40, instead of the area in which the debris can be deposited or accumulated on the inner surface 48 of the suction passage 41 of the dust collection unit 40 in the first embodiment. The extraction mechanism 1 and the processing device 100 according to the fifth embodiment, as well as the dust collection unit 40 and the tuft 70 forming the extraction mechanism 1, are similar in other aspects of their configuration to those of the first embodiment. The projection 47 is provided on the inner surface 48 of the suction passage 41 of the dust collection unit 40 and is an example of a mechanism for generating turbulent flow, which creates turbulent flow by disturbing the suction flow 49 in the suction passage 41. The tuft 70 is connected at one end to a tip portion on the projection 47, which is the mechanism for generating turbulent flow provided on the inner surface 48 of the suction passage 41. The projection 47 is formed in such a shape and size that a turbulent flow can be generated, allowing the tufts 70 to flutter in accordance with the suction flow 49. The mechanism for generating turbulent flow can include a plurality of projections 47. The tufts 70 can be provided on each of the plurality of projections that form the mechanism for generating turbulent flow, or they can be provided on some of the projections 47. In other words, it is sufficient that the tuft 70 is arranged on at least one projection 47 of the plurality of projections 47. The plurality of projections 47 that form the mechanism for generating turbulent flow are arranged in such a number and at such a distance that a turbulent flow can be generated by which the tufts 70 on the projections 47 can flutter in accordance with the suction flow 49. The mechanism for generating a turbulent flow can be provided on the inner surface 48 of the suction passage 41 by a method in which, for example, a foil-shaped element formed on a surface with one or a plurality of projections 47 is placed on the inner surface 48 of the suction passage 41, wherein the surface side on which the projections 47 are formed is oriented towards the inner circumferential side of the suction passage 41. In the dust collection unit 40, which is provided with such a mechanism for generating a turbulent flow, the tuft 70 can flutter more safely along the suction flow 49 due to the turbulent flow generated by the mechanism for generating a turbulent flow, and in the area where the mechanism for generating a turbulent flow is formed, the debris that could be deposited or accumulated on the inner surface 48 of the suction passage 41 can be more preferably ejected, thereby further preferably preventing the debris flowing in the suction passage 41 according to the suction flow 49 from being deposited or accumulating on the inner surface 48 of the suction passage 41. The extraction device 1 and the processing device 100 according to the fifth embodiment, which is configured as described above, produce an advantageous effect as follows. The dust collection unit 40 is provided on the inner surface 48 of the suction passage 41 with the mechanism for generating turbulent flow (the projection 47, a projection and depression mechanism, or the like), which generates turbulent flow by disturbing the suction flow 49 in the suction passage 41. The tuft 70 is arranged on the mechanism for generating turbulent flow, which is provided on the inner surface 48 of the suction passage 41 of the dust collection unit 40, wherein the tuft 70 can flutter more securely along the suction flow 49 due to the turbulent flow generated by the mechanism for generating turbulent flow, and the debris that might settle or accumulate on the inner surface 48 of the suction passage 41 is thus removed.are further preferably dropped into the area in which the mechanism for generating a turbulent flow is formed, so that the debris flowing in the suction passage 41 according to the suction flow 49 can be further preferably prevented from settling or accumulating on the inner surface 48 of the suction passage 41. Furthermore, taking advantage of the aforementioned beneficial effect generated by the extraction mechanism 1 and the processing device 100 according to the fifth embodiment, the mechanism for generating turbulent flow (projection 47) is formed in the area where it is desired to prevent in advance the generation of a problem due to the accumulation of debris on the inner surface of a pipe forming the suction passage of an existing dust collection unit, and the tuft 70 is arranged on the mechanism for generating turbulent flow thus formed, thereby improving the existing dust collection unit to the extraction mechanism 1 and the processing device 100 according to the fifth embodiment, thereby preventing in advance the generation of a problem due to the accumulation of debris in the nozzle or a pipe (the dust collection unit 40).while the costs at the time of installation of a nozzle equipped with a cleaning mechanism and an extinguishing agent are suppressed. [Sixth embodiment] A suction mechanism 1-2 and a processing device 100-2 according to a sixth embodiment of the present invention are described with reference to the drawings. Fig. 8 is a sectional view showing the suction mechanism 1-2 according to the sixth embodiment and the surroundings of the suction mechanism 1-2. In the sixth embodiment, the same parts as in the first to fifth embodiments are identified by the same reference numerals used above, and their descriptions are omitted. The processing device 100-2 according to the sixth embodiment is the processing device 100 equipped with the extraction mechanism 1 according to the first to fifth embodiments, wherein, corresponding to the change from the protective unit 30 to a protective unit 30-2, the extraction mechanism 1 is changed to the extraction mechanism 1-2. The extraction device 1-2 according to the sixth embodiment is the extraction device 1 according to the first to fifth embodiments, wherein the dust collection unit 40 is changed to a dust collection unit 40-2. The dust collection unit 40-2 is the dust collection unit 40 modified to include a debris outlet unit 50-2 instead of the debris outlet unit 50. As shown in Fig. 8, the protective unit 30-2 is the protective unit 30, which further includes a gas supply nozzle 35 and a transparent plate 36. The gas supply nozzle 35 introduces a high-pressure gas supplied from a gas supply source 32 into the interior of a gas supply tube 31, thus forming a gas flow 39. The transparent plate 36 is provided on the immediately downstream side of the communication port 33 and on the upstream side of the gas supply nozzle 35 to close a space within the gas supply tube 31 and to stop debris from the processing area 210 and gas from the gas supply nozzle 35, while allowing the laser beam 29 from the light focusing device 22 to pass through. As shown in Fig. 8, the debris discharge unit 50-2 is the debris discharge unit 50, modified to include a partition 54, an air curtain blow jet section 56, and a blow gas supply source 57. The partition 54 is arranged on the underside of the discharge pipe 34 and surrounds the perimeter of a scattering area of ​​the debris generated in the opposite processing area 210. The air curtain blow jet section 56 is located on the front side (in Fig. 8 on the side corresponding to the X1 direction) of the outlet pipe 34, which is the side corresponding to the relative direction of movement of the machining unit 20 with respect to the workpiece 200, in a state in which it penetrates the partition 54 substantially horizontally. The air curtain blow jet section 56 emits a high-pressure gas, supplied by the blow gas supply source 57, towards the suction opening 52, which is located on the rear side (on the side opposite the X1 direction) of the outlet pipe 34. This creates an air curtain of emitted high-pressure gas that covers the immediate underside of the outlet pipe 34 and prevents debris from entering the protective unit 30 from the outlet pipe 34. The blow gas supply source 57 supplies the air curtain blow jet section 56 with high-pressure gas.The gas supplied by the blow gas supply source 57 is, for example, compressed air or an inert gas such as high-pressure nitrogen. By actuating the suction source 65, the dust collection unit 40-2 draws in the debris generated near the processing area 210 via the suction opening 52 together with the gas emitted by the air curtain blow jet section 56 towards the suction opening 52, in addition to the air near the processing area 210 and the gas discharged from the outlet pipe 34, through the suction flow 49 formed in the suction passage 41 of the dust collection unit 40-2, and allows the debris thus drawn in to flow in the suction passage 41 in accordance with the suction flow 49 towards the suction source 65, thereby removing the debris from the vicinity of the processing area 210. Like the tuft 70 of the suction mechanism 1 according to the first to fifth embodiments, the tuft 70 of the suction mechanism 1-2 according to the sixth embodiment is an elongated or linear element that has the property of being deformed and fluttering along the air or gas flow. In the sixth embodiment, as in the first to fifth embodiments, the tuft 70 is connected at one end to a position on the inner surface 48 of the suction passage 41 in the dust collection unit 40-2, which is a predetermined position, namely a position that includes a position on the inner surface 58 of the suction passage 51 of the debris outlet unit 50-2, a position on the inner surface 68 of the suction passage 61 of the suction duct 60, and a position that extends along the inner surface 58 and the inner surface 68.As in the first to fourth embodiments, in the sixth embodiment the tuft 70 is preferably arranged in a position where it flutters in accordance with the suction flow 49, so that it covers the area in which debris can be deposited or accumulated. Furthermore, in the sixth embodiment, as in the fifth embodiment, it is preferred that a mechanism for generating turbulent flow, which creates turbulent flow by disturbing the suction flow 49 in the suction passage 41, is provided on the inner surface 48 of the suction passage 41, and that the tuft 70 is arranged on the mechanism for generating turbulent flow that is provided on the inner surface 48 of the suction passage 41 of the dust collection unit 40-2. The extraction mechanism 1-2 and the processing device 100-2 according to the sixth embodiment, which are configured as mentioned above, have a configuration in which the debris outlet unit 50 of the dust collection unit 40 is changed to the debris outlet unit 50-2 of the dust collection unit 40-2, corresponding to the change of the guard unit 30 to the guard unit 30-2 in the first to fifth embodiments, and therefore they produce an advantageous effect similar to those of the first to fifth embodiments.Furthermore, as in the fifth embodiment, in the extraction mechanism 1-2 and the processing device 100-2 according to the sixth embodiment, it is preferred that the dust collection unit 40-2 has the mechanism for generating a turbulent flow in order to generate a turbulent flow by disturbing the suction flow 49 in the suction passage 41, which is provided on the inner surface 48 of the suction passage 41, and that the tuft 70 is arranged on the mechanism for generating a turbulent flow. Furthermore, taking advantage of the fact that the extraction mechanism 1-2 and the processing device 100-2 according to the sixth embodiment produce an advantageous effect similar to that of the fifth embodiment, the mechanism for generating turbulent flow is formed in the area where it is desired to prevent in advance the generation of a problem due to the accumulation of debris on the inner surface of a pipe forming the suction passage of an existing dust collection unit, as in the fifth embodiment, and the tuft 70 is arranged on the mechanism for generating turbulent flow thus formed, thereby improving the existing dust collection unit to the extraction mechanism 1-2 and the processing device 100-2 according to the sixth embodiment.This prevents the creation of a problem due to the accumulation of debris in the nozzle or a pipeline (the dust collection unit 40-2) in advance, while suppressing the costs at the time of installing a nozzle equipped with a cleaning mechanism and an extinguishing agent. It should be noted that the present invention is not limited to the embodiments described above. In other words, the present invention can be carried out with various modifications in such areas that they do not deviate from the core of the invention.In the above embodiments, the extraction mechanism 1 or 1-2 is provided in the laser processing device (processing device 100 or 100-2), which performs ablation by applying the laser beam 29 to the workpiece 200 by the laser beam application unit (processing unit 20) and extracts the debris (processing dust) generated in the processing area 210 by the ablation; however, this is not a limitation of the present invention, and, for example, the extraction mechanism can be provided in a cutting device (processing device) for cutting a workpiece 200 by a cutting unit (processing unit) with a cutting blade, and can extract the cutting chips (processing dust) generated in the processing area by the cutting.The extraction device can be provided in a grinding device (machining device) for grinding a workpiece 200 by a grinding unit (machining unit) with a grinding wheel and can extract the grinding chips (machining dust) generated in the machining area by the grinding process. The extraction mechanism can be provided in a polishing device (machining device) for polishing a workpiece 200 by a polishing unit (machining unit) with a polishing pad and can extract the polishing chips (machining chips) generated in the machining area by the polishing process. Furthermore, in the above embodiments, the extraction mechanism 1 or 1-2 is provided in the machining device 100 or 100-2 and extracts the machining dust generated in the machining area 210 via the suction opening 52 opening into the machining area 210 and removes the machining dust; however, this is not a limitation of the present invention. The extraction mechanism can be provided not in the machining device 100 or 100-2 and can also extract and remove other powder dust besides the machining chips in a suction area other than the machining area 210.For example, the extraction mechanism 1 or 1-2 can include a dust collection unit 40 or 40-2, which consists of an extraction channel 60 provided with a suction passage 61 connected at one end to a suction source 65 and at the other end formed with a suction opening that opens into the suction area, and a brush 70 arranged on the inner surface 48 of the suction passage 41 of the dust collection unit 40 or 40-2, and can extract the powder dust in the suction area via the suction opening to remove the powder dust. Furthermore, the extraction mechanism 1 or 1-2 can be configured by incorporating a mechanism for generating turbulent flow, such as...Projections 47 and the tuft 70, which is arranged on the mechanism for generating a turbulent flow, are newly provided in an area where it is desired to prevent in advance the generation of a problem due to the accumulation of powder dust on the inner surface of a pipe forming the suction passage of an existing dust collection unit. The present invention is not limited to the details of the preferred embodiments described above. The scope of the invention is defined by the appended claims, and all changes and modifications that fall within the equivalence range of the claims are therefore included in the invention.

Claims

Extraction mechanism (1) for a processing device (100) for processing a disk-shaped semiconductor wafer or a wafer for an optical device, comprising: a dust collection unit (40) having a suction passage (41) wherein one end is connected to a suction source (65) and another end opens into a suction area (210); and a tuft (70) arranged at a predetermined position in the dust collection unit (40), wherein the suction source is operated such that it removes powder dust from the suction area (210) and causes the tuft (70) to flutter in order to prevent the powder dust from accumulating in the suction passage (41) in the dust collection unit (40). Extraction mechanism (1) according to claim 1, wherein the dust collection unit (40) is a channel. Suction mechanism (1) according to claim 1 or 2, wherein the tuft (70) is arranged on a mechanism (47) for generating a turbulent flow, which is provided on an inner surface (48) of the dust collection unit (40). A processing device (100) for processing a disk-shaped semiconductor wafer or a wafer for an optical device, comprising: a suction mechanism (1) containing a dust collection unit (40) with a suction passage (41) wherein one end is connected to a suction source (65) and another end opens into a suction area (210), and a tuft (70) arranged at a predetermined position in the dust collection unit (40); and a processing unit processing the disk-shaped semiconductor wafer or the wafer for an optical device, wherein the suction mechanism (1) removes processing dust generated by the processing of the disk-shaped semiconductor wafer or the wafer for an optical device.

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