SEMICONDUCTOR MODULE

Abstract

Semiconductor module (100) comprising: a semiconductor chip (40) with a semiconductor substrate (110) and a metal electrode (52) arranged over the semiconductor substrate (110); a protective film (150) arranged over the metal electrode (52); a plating layer (36) arranged over the metal electrode (52), at least a part of which has the same height as the protective film (150); a solder layer (32) arranged over the plating layer (36); and a conductor frame (60) arranged above the solder layer (32), wherein: the plating layer (36) is arranged in an area that does not touch the protective film (150), the solder layer (32) is arranged between the plating layer (36) and the protective film (150), and the solder layer (32) is configured to cover a corner section (37) of the plating layer (36) that touches the solder layer (32).

Images