Semiconductor module, power electronics system and method for manufacturing a semiconductor module and a power electronics system

Abstract

Semiconductor module (100, 200) that features: a printed circuit board (110) having a first side (111) and an opposite second side (112), a plurality of power semiconductor packages (120) arranged above and electrically connected to the first side (111) of the printed circuit board (110), wherein a first side (121) of the power semiconductor packages (120) faces the first side (111) of the printed circuit board (110) and an opposing second side (122) is configured to be connected to a heat sink, at least one busbar (130) which is arranged above the first side (111) of the printed circuit board (110) and electrically connected to it, wherein the busbar (130) is configured to carry a supply current and / or a ground current from at least some of the power semiconductor packages (120), and Pins and / or screws (131) that electrically connect the busbar (130) to vias of the printed circuit board (110).

Description

TECHNICAL AREA

[0001] This disclosure relates generally to a semiconductor module, a power electronics system, and to methods for manufacturing a semiconductor module and a power electronics system. BACKGROUND

[0002] Semiconductor modules can consist of a variety of power semiconductor packages arranged on a printed circuit board and electrically connected to it. During operation, these power semiconductor packages generate heat that must be dissipated. Furthermore, such semiconductor modules must be configured to handle high currents and / or high voltages. Meeting these requirements can significantly impact the overall cost and / or size of the semiconductor module. However, for many applications, it may be desirable to have a smaller and / or lower-cost semiconductor module without compromising its electrical and / or thermal properties. Improved semiconductor modules, as well as improved semiconductor manufacturing processes, can help address these and other challenges.DE 10 2008 045 409 A1 discloses a semiconductor module with a thermally conductive base, a busbar arranged on the base, and a plurality of semiconductor packages also arranged on the base. Further semiconductor modules are disclosed in CN 106 452 112 A, JP 2019-201 187 A, and US 2018 / 0 255 658 A1.

[0003] The problem underlying the invention is solved by the features of the independent claims. Further advantageous embodiments are described in the dependent claims. SUMMARY

[0004] Several aspects relate to a semiconductor module comprising: a printed circuit board having a first side and an opposing second side, a plurality of power semiconductor packages arranged above the first side of the printed circuit board and electrically coupled to it, wherein a first side of the power semiconductor packages faces the first side of the printed circuit board and an opposing second side is configured to be coupled to a heat sink, and at least one busbar arranged above the first side of the printed circuit board and electrically coupled to it, wherein the busbar is configured to carry a supply current and / or a ground current from at least some of the power semiconductor packages.

[0005] Several aspects relate to a method for manufacturing a semiconductor module, wherein the method comprises: providing a printed circuit board having a first side and an opposing second side; arranging a plurality of power semiconductor packages over the first side of the printed circuit board such that a first side of the power semiconductor packages faces the first side of the printed circuit board; electrically connecting the power semiconductor packages to the printed circuit board, wherein a second side of the power semiconductor packages, the second side facing the first side, is configured to be coupled to a heat sink; and arranging at least one busbar over the first side of the printed circuit board and electrically coupling the busbar to the printed circuit board, wherein the busbar is configuredto carry a supply current and / or a ground current from at least some of the power semiconductor packages. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The accompanying drawings show examples and, together with the description, serve to illustrate the principles of the revelation. Other examples and many of the intended benefits of the revelation will be readily apparent in light of the detailed description that follows. The elements in the drawings are not necessarily to scale with one another. Identical reference numbers denote corresponding similar parts. The Fig. 1A and Fig. 1B shows a top view ( Fig. 1A) and a side view ( Fig. 1B) of a semiconductor module in which at least one busbar is arranged across one side of a printed circuit board. The Fig. 2A and Fig. 2B shows a top view ( Fig. 2A) and a side view ( Fig. 2B) of a further semiconductor module in which at least one busbar is arranged over a plurality of power semiconductor packages. The Fig. 3A and Fig. 3B shows a top view ( Fig. 3A) and a side view ( Fig. 3B) of a detail of a semiconductor module. The Fig. 4A and Fig. 4B shows a top view ( Fig. 4A) and a sectional view ( Fig. 4B) a heat sink configured to be connected to a semiconductor module. Fig. Figure 5 shows a sectional view of a power electronics system comprising a semiconductor module and a heat sink connected to the semiconductor module. Fig. Figure 6 is a flowchart for an exemplary process for manufacturing a semiconductor module. Fig. Figure 7 is a flowchart of an exemplary process for manufacturing a power electronics system. DETAILED DESCRIPTION

[0007] In the following detailed description, directional terms such as "above," "below," "left," "right," "upper," "lower," etc., are used in reference to the orientation of the described figure(s). Since the components of the revelation can be positioned in a number of different orientations, the directional terminology is used for illustrative purposes only.

[0008] Furthermore, although a particular feature or aspect of an example may be disclosed only in relation to one of several embodiments, such a feature or aspect may be combined with one or more other features or aspects of the other embodiments as is desirable and advantageous for a given or particular application, unless expressly stated otherwise or technical limitations apply. Where the terms "comprise," "have," "with," or other variants thereof are used in the detailed description or in the claims, these terms are to be understood in a similarly comprehensive manner as the term "have." The terms "coupled" and "connected," and their derivatives, may be used.It can be assumed that these terms can be used to indicate that two elements work together or interact with each other, regardless of whether they are in direct physical or electrical contact, or not; intermediate elements or layers may be provided between the "coupled," "attached," or "connected" elements. However, it is also possible for the "coupled," "attached," or "connected" elements to be in direct contact with each other. Furthermore, the term "exemplary" is meant merely as an example and not as the best or optimal solution.

[0009] An efficient semiconductor module and an efficient manufacturing process can, for example, reduce material consumption, ohmic losses, chemical waste, etc., and thus enable energy and / or resource savings. Improved semiconductor modules and improved manufacturing processes, as described here, can therefore contribute, at least indirectly, to green technology solutions—that is, climate-friendly solutions that provide a reduction in energy and / or resource consumption.

[0010] The Fig. 1A and Fig. Figure 1B shows a semiconductor module 100 comprising a printed circuit board (PCB) 110, a plurality of semiconductor packages 120 and at least one busbar 130. Fig. Figure 1A shows a top view of the semiconductor module 100 and Fig. Figure 1B shows a side view along arrow B.

[0011] The Semiconductor Module 100 can be a power semiconductor module configured for operation at high voltage and / or high current. The Semiconductor Module 100 can incorporate any suitable electrical circuitry, such as a converter circuit, an inverter circuit, a half-bridge circuit, etc. The Semiconductor Module 100 can be configured to be coupled with a heat sink, as described below.

[0012] The printed circuit board 110 has a first side 111 and an opposing second side 112. The semiconductor packages 120 and the power rail(s) 130 are arranged above the first side 111.

[0013] According to one example, no semiconductor packages 120 are arranged on the second side 112. According to another example, at least one semiconductor package 120 is arranged over the second side 112 (in other words, in the latter case, semiconductor packages 120 are arranged over both the first 111 and the second side 112).

[0014] According to one example, a plurality of electrical components 140 are arranged across the second side 112 of the printed circuit board 110. The electrical components 140 can, for example, include passive components such as capacitors and inductors and / or active components such as transistors and diodes. The electrical components 140 can be electrically coupled to the semiconductor packages 120 via the printed circuit board 110 and be part of the electrical circuit of the semiconductor module 100. One or more of the plurality of electrical components 140 can also be arranged on the first side 111, e.g., passive gate and snubber components.

[0015] The printed circuit board 110 can have any suitable shape and any suitable dimensions. For example, the printed circuit board 110 can have a substantially rectangular or a substantially square shape, as viewed from the first side 111. The circuit board 110 can, for example, have a length and / or a width, measured along an edge of the first side 111, of 3 cm or more, or 5 cm or more, or 10 cm or more, or 15 cm or more, or 20 cm or more, or 30 cm or more. The circuit board 110 can, for example, have a thickness, measured perpendicular to the first side 111, of 1 mm or more, or 2 mm or more, or 3 mm or more, or 5 mm or more, or 6 mm or more.

[0016] The printed circuit board 110 can incorporate any suitable dielectric material, for example, an FR-4 laminate. The printed circuit board 110 can have a single electrically conductive layer embedded in or on top of the dielectric material, or multiple conductive layers. For example, the printed circuit board 110 can be relatively inexpensive and / or have relatively low thermal conductivity and / or relatively low electrical conductivity, as explained below.

[0017] The power semiconductor packages 120 can each comprise at least one power semiconductor chip mounted on a chip carrier, an encapsulation that encapsulates the power semiconductor chip, and external contacts that protrude from the encapsulation and are electrically connected to the printed circuit board 110. The encapsulation can, for example, be a molded body. The chip carrier and / or the external contacts can, for example, be conductor frames. The power transistor chips can, for example, comprise a transistor and / or a diode. The power semiconductor packages 120 can, for example, be suitable transistor outline (TO) packages.

[0018] The power semiconductor packages 120 can have a first side, an opposing second side, and lateral sides connecting the first and second sides. The first side of the power semiconductor packages 120 faces the first side 111 of the printed circuit board 110, and the second side of the semiconductor packages 120 is configured to be coupled to a heat sink. For this purpose, the second side of the semiconductor packages 120 can, for example, have an exposed metal pad. The external contacts can be exposed, for example, on the lateral sides and / or on the first side of the semiconductor packages 120.

[0019] The at least one busbar 130 is arranged above the first side 111 of the printed circuit board 110 and electrically coupled to it. In the Fig. 1A and Fig. In the example shown in Figure 1B, the semiconductor module 100 has two busbars 130. However, the semiconductor module 100 can have any suitable number of busbars 130.

[0020] As in Fig. 1A and Fig. As shown in Figure 1B, the busbar(s) 130 can, for example, be arranged laterally next to the semiconductor packages 120. The semiconductor packages 120 can, for example, be arranged in one or more rows across the first side 111 of the printed circuit board 110, and a busbar 130 can be arranged next to each of these rows. As shown in the Fig. 1A and Fig. As shown in Figure 1B, the busbars 130 can be arranged closer to the edge of the circuit board 110 than the rows of semiconductor packages 120. However, it is also possible that one or more of the busbars 130 are arranged closer to the center of the first side 111 of the circuit board 110 than the semiconductor packages 120.

[0021] The at least one busbar 130 can be made of or consist of any suitable metal or metal alloy. For example, the busbar 130 can be made of or consist of Al, Cu, or Fe. According to one example, the busbar 130 has a coating, e.g., a Ni coating. According to another example, the busbar 130 is a single-piece part, in particular a single-piece sheet.

[0022] According to one example, the busbar 130 is at least partially covered with an electrical insulating layer. The insulating layer can, for example, cover at least the sides of the busbar 130 facing away from the circuit board 110. The insulating layer can be configured, for example, to electrically isolate the busbar from a heat sink arranged above the semiconductor module 100. The busbar 130 can be covered with the insulating layer before or after it is arranged above the circuit board 110.

[0023] The 130 busbar can have any suitable shape and dimensions. As shown in Fig. As shown in Figure 1A, the busbar 130 can, for example, have an essentially rectangular shape. The length of the longer side of the busbar 130 can be, for example, 2 cm or more, or 4 cm or more, or 8 cm or more, or 12 cm or more, or 20 cm or more. The length of the shorter side of the busbar 130 can be, for example, 3 mm or more, or 6 mm or more, or 10 mm or more, or 15 mm or more. The thickness of the busbar 130 can be, for example, 0.5 mm or more, or 1 mm or more, or 1.5 mm or more, or 2 mm or more, or 3 mm or more.

[0024] The arrangement “above” the first side 111 of the circuit board 110 can mean that the busbar 130 is arranged on top of the first side 111 without being embedded in the circuit board 110 (cf. the in Fig. 1B (cross-section shown).

[0025] The busbar 130 is configured to carry a supply current and / or a ground current to at least some of the power semiconductor packages 120. The busbar 130 can, in particular, be electrically coupled to at least some of the semiconductor packages 120 via the printed circuit board 110. In other words, internal wiring of the printed circuit board 110 can be used to couple the semiconductor packages 120 and the busbar 130, both of which are external to the printed circuit board 110 (i.e., located above and coupled to the printed circuit board 110).

[0026] Arranging the busbar(s) 130 above the first side 111 of the printed circuit board 110, particularly above the same side of the printed circuit board 110 as the semiconductor packages 120, can offer several advantages. For example, the busbar(s) 130 occupy very little space on the second side 112 of the printed circuit board 110 (e.g., only the space required for the screws to fasten the busbar 130 to the printed circuit board 110). Furthermore, only a minimal number of vias may be required to connect the busbar 130 to the respective semiconductor packages 120. Since the busbar(s) 130 is / are used to conduct high currents through the semiconductor module 100, it may not be necessary for the printed circuit board 110 to carry these currents. Therefore, a comparatively less expensive printed circuit board can be used.The use of the busbar(s) 130 can also improve the heat dissipation capabilities of the semiconductor module 100, as explained below.

[0027] The Fig. 2A and Fig. Figure 2B shows another semiconductor module 200, which may be similar or identical to semiconductor module 100, except for the differences described below. Fig. Figure 2A shows a top view of the semiconductor module 200 and Fig. Figure 2B shows a side view along arrow B.

[0028] In particular, the busbar 130 is arranged above the second side of at least one part of the power semiconductor packages 120 and electrically coupled to it. In other words, in the semiconductor module 200, at least one busbar 130 is arranged not laterally next to the semiconductor packages 120, but above them. In this case, the second side of these semiconductor packages 120 can have an external contact, with the busbar 130 being coupled to this external contact.

[0029] In one example, the busbar 130 is coupled to the external contact on the second side of the semiconductor packages 120 via a soldered or adhesive connection. In another example, no such connection is used, and the busbar 130 is in direct contact with the external contacts of the semiconductor packages 120. In both cases, the busbar 130 can be mechanically connected to the circuit board 110 and / or the semiconductor packages 120, e.g., via screws, pins, or rivets.

[0030] As in Fig. 2A and Fig. As shown in Figure 2B, the semiconductor module 200 can, for example, have two busbars 130 arranged over two rows of semiconductor packages 120.

[0031] The arrangement of the busbar 130 on the semiconductor packages 120 can save space on the circuit board 110 and / or reduce the complexity of the electrical connections that the circuit board 110 must provide.

[0032] The Fig. 3A and Fig. Figure 3B shows a detailed view of the semiconductor module 100 according to a specific example. Fig. 3A shows a top view and Fig. Figure 3B shows a side view along arrow B.

[0033] In the Fig. 3A and Fig. In the example shown in Figure 3B, the busbar 130 is mechanically and / or electrically coupled to the circuit board 110 by screws 131. The screws 131 can, for example, be fastened to the circuit board 110 with nuts 132. The nuts 132 can, for example, be arranged on the second side 112 of the circuit board 110.

[0034] According to one example, instead of or in addition to the screws 131, rivets or pins, in particular press-fit pins, can also be used to connect the busbar 130 to the printed circuit board 110. The screws 131 and / or the rivets and / or the pins can extend through vias in the printed circuit board 110.

[0035] In one example, spacers 133 are arranged between the circuit board 110 and the busbar 130. These spacers 133 could, for example, be washers. Separating the busbar 130 from the circuit board 110 with the spacers 133 can, for example, help to counteract warping of the circuit board 110. In other words, the busbar(s) 130 can be used to straighten a warped circuit board 110.

[0036] The spacers 133 can have any suitable thickness, measured perpendicular to the first and second sides 111, 112 of the printed circuit board 110. For example, the thickness of the spacers 133 can be 0.5 mm or more, 1 mm or more, 1.5 mm or more, 2 mm or more, 3 mm or more, or 5 mm or more. In other words, the busbar 130 can be positioned at a distance from the first side 111 of the printed circuit board 110 corresponding to this thickness value.

[0037] As in Fig. As shown in Figure 3B, the semiconductor packages 120 can have a first side 121, an opposing second side 122, and lateral sides 123 that connect the first and second sides 121, 122. The first side 121 faces the PCB 110, and the second side 122 faces away from the PCB 110.

[0038] According to one example, external contacts 124 can be exposed by an encapsulation of the semiconductor packages 120 on one or more of the lateral sides 123, e.g., on two opposite lateral sides 123. As in the Fig. 3A and Fig. As shown in Figure 3B, the external contacts 124 can, for example, have a hinged-wing configuration. However, it is also possible that the semiconductor packages 120 have other types of external contacts and / or that the external contacts are not (only) located on the lateral sides 123, but (also) on the first side 121. For example, the semiconductor packages 120 can have external contacts that do not extend beyond the perimeter of the first and second sides 121, 122 (“non-leaded package”), “ball grid array” type contacts, “land grid array” type contacts, etc.

[0039] A primary heat dissipation path for the semiconductor packages 120 can point upwards from the second side 122 (i.e., towards a heat sink). Only a comparatively small percentage of the heat generated by the semiconductor packages 120 could be dissipated towards the circuit board 110 (for example, via the external contacts 124).

[0040] The Fig. 4A and Fig. Figure 4B shows a heat sink 400 configured to be coupled with the semiconductor module 100. Fig. Figure 4A shows a top view of the 400 heat sink and Fig. Figure 4B shows a section view along line B-B'.

[0041] The heat sink 400 has a first side 401 and an opposing second side 402, the first side 401 being designed to face the semiconductor module 100. The second side 402 can have a variety of cooling structures 403, e.g., cooling fins. According to one example, the heat sink 400 is configured to be coupled to a fluid channel so that the cooling structures 403 are in contact with a cooling fluid. According to another example, the heat sink 400 is configured to be in contact with air.

[0042] As in Fig. 4A and Fig. As shown in Figure 4B, the first side 401 of the heat sink can have one or more first trenches 404 and / or one or more second trenches 405. The one or more first trenches 404 can be configured to accommodate the semiconductor packages 120, and the one or more second trenches 405 can be configured to accommodate the one or more power rails 130.

[0043] The first and second trenches 404, 405 can have any suitable depth, for example, a depth of 1 mm or more, 2 mm or more, 3 mm or more, 5 mm or more, or 10 mm or more. The first trench(s) 404 can have the same or a different depth than the second trench(s) 405.

[0044] The one or more second trenches 405 may optionally have depressions 406 at the bottom of the trench(s) 405, the depressions 406 being configured to accommodate the screws 131 (or rivets or pins).

[0045] A heat sink similar to heat sink 400 can be connected to the semiconductor module 200. However, in this case, no second grooves 405 are arranged laterally next to the first grooves 404. Instead, the heat sink could only have the first grooves 404. The first grooves 404 can, however, have a stepped cross-section, with the first step designed to accommodate the semiconductor packages 120 and the second step designed to accommodate the busbar 130.

[0046] Fig. Figure 5 shows a sectional view of a power electronics system 500, which includes the semiconductor module 100 and the heat sink 400. A similar power electronics system can include the semiconductor module 200 and a corresponding heat sink.

[0047] In one example, the power electronics system 500 includes an adhesive material 501 that connects the busbar 130 to the heat sink 400. The adhesive material 501 also electrically insulates the busbar 130 from the heat sink 400. In another example, the adhesive material 501 is located in the second grooves 405, but not in the first grooves 404. The adhesive material 501 can, for example, be made of or consist of epoxy. The adhesive material 501 can, for example, connect the busbar 130 to the heat sink 400 in such a way that the busbar 130 remains attached to the heat sink 400 when the nuts 132 are removed.

[0048] According to one example, the power electronics system 500 has a coupling material 502 that thermally couples the semiconductor packages 120 to the heat sink 400. The coupling material 502 can be a dielectric material. For example, the coupling material 502 can be a thermal interface material (TIM). The coupling material 502 can, for example, be located in the first grooves 404, but not in the second grooves 405. The adhesive material 501 and the coupling material 502 can be different materials or the same materials. According to one example, the coupling material 502 is not a special adhesive material. According to another example, a further dielectric material 503 can be located between the circuit board 110 and the heat sink 400. The additional dielectric material 503 can, for example, be arranged on surfaces outside the first and / or second trenches 404, 405.The additional dielectric material 503 can be made of the same or a different material as the coupling material 502. For example, screws 131 can be used to mechanically connect the circuit board 110 to the heat sink 400.

[0049] In the Fig. In the example of the power electronics system 500 shown in Figure 5, a heat sink 400 is arranged on only one side (the first side 111) of the printed circuit board 110. However, it is also possible for a second heat sink to be arranged on the opposite side (second side 112) of the printed circuit board 110. In other words, the power electronics system 500 can be configured for double-sided cooling (DSC). In this case, the power semiconductor packages 120 can, for example, be arranged on both sides 111, 112 of the printed circuit board.

[0050] Fig. Figure 6 is a flowchart for process 600 for manufacturing a semiconductor module. Process 600 can be used, for example, to manufacture semiconductor modules 100 and 200.

[0051] Method 600 comprises, in 601, a process of providing a printed circuit board with a first side and an opposing second side; in 602, a process of arranging a plurality of power semiconductor packages over the first side of the printed circuit board such that a first side of the power semiconductor packages faces the first side of the printed circuit board, and of electrically coupling the power semiconductor packages to the printed circuit board, wherein a second side of the power semiconductor packages, the second side being opposite the first side, is configured to be coupled to a heat sink; and in 603, a process of arranging at least one busbar over the first side of the printed circuit board and of electrically coupling the busbar to the printed circuit board using pins and / or screws, wherein the busbar is configured toto carry a supply current and / or a ground current from at least some of the power semiconductor packages.

[0052] According to an example of Method 600, the busbar is at least partially covered with an insulating layer configured to electrically isolate the busbar from the heat sink.

[0053] Fig. Figure 7 is a flowchart for process 700 for manufacturing a power electronics system. Process 700 can be used, for example, to manufacture the power electronics system 500.

[0054] Method 700, as set out in 701, comprises a process for providing a semiconductor module comprising a printed circuit board with a first side and an opposing second side, and a plurality of power semiconductor packages arranged above and electrically connected to the first side of the printed circuit board, wherein a first side of the power semiconductor packages faces the first side of the printed circuit board and an opposing second side is configured to be coupled to a heat sink, and at least one busbar arranged above and electrically coupled to the first side of the printed circuit board, wherein the busbar is configured to carry a supply current and / or a ground current from at least some of the power semiconductor packages, and pins and / or screws.which electrically connect the busbar to vias of the printed circuit board; and in 702 a process of arranging the heat sink over the first side of the printed circuit board so that the power semiconductor packages and the busbar are covered by the heat sink. EXAMPLES

[0055] The following section explains the semiconductor module, the power electronics system, and the methods for manufacturing a semiconductor module or a power electronics system in more detail using specific examples.

[0056] Example 1 is a semiconductor module comprising: a printed circuit board having a first side and an opposite second side, a plurality of power semiconductor packages arranged above the first side of the printed circuit board and electrically coupled to it, wherein a first side of the power semiconductor packages faces the first side of the printed circuit board and an opposite second side is configured to be coupled to a heat sink, and at least one busbar arranged above the first side of the printed circuit board and electrically coupled to it, wherein the busbar is configured to carry a supply current and / or a ground current from at least some of the power semiconductor packages.

[0057] Example 2 is the semiconductor module from Example 1, where the busbar is arranged laterally next to the power semiconductor packages.

[0058] Example 3 is the semiconductor module from Example 1, in which the busbar is arranged over the second side of at least some of the power semiconductor packages and electrically coupled to them.

[0059] Example 4 is the semiconductor module of one of the previous examples, which further comprises: pins and / or screws that electrically connect the busbar to vias of the printed circuit board.

[0060] Example 5 is the semiconductor module according to one of the preceding examples, wherein a primary heat dissipation path of the power semiconductor packages is arranged on the second side of the power semiconductor packages.

[0061] Example 6 is the semiconductor module of one of the previous examples, where the printed circuit board is free of an internal power rail.

[0062] Example 7 is the semiconductor module of one of the previous examples, where the power rail is configured to be removable from the printed circuit board.

[0063] Example 8 is the semiconductor module according to one of the preceding examples, which further comprises: spacers arranged between the printed circuit board and the busbar.

[0064] Example 9 is the semiconductor module according to one of the preceding examples, which further features: an insulating layer that at least partially covers the busbar.

[0065] Example 10 is a power electronics system comprising: the semiconductor module of one of Examples 1 to 9 and a heat sink arranged over the first side of the printed circuit board such that the power semiconductor packages and the busbar are covered by the heat sink, the busbar being thermally coupled to the heat sink.

[0066] Example 11 is the power electronics system according to Example 10, which further comprises: an adhesive material that connects the busbar to the heat sink, wherein the adhesive material electrically insulates the busbar from the heat sink.

[0067] Example 12 is the power electronics system according to Example 10 or 11, wherein the power semiconductor packages and the busbar are arranged within one or more trenches in the heat sink.

[0068] Example 13 is a method for manufacturing a semiconductor module, the method comprising: providing a printed circuit board having a first side and an opposing second side; arranging a plurality of power semiconductor packages over the first side of the printed circuit board such that a first side of the power semiconductor packages faces the first side of the printed circuit board; electrically connecting the power semiconductor packages to the printed circuit board, wherein a second side of the power semiconductor packages, the second side being opposite the first side, is configured to be coupled to a heat sink; and arranging at least one busbar over the first side of the printed circuit board and electrically coupling the busbar to the printed circuit board, wherein the busbar is configured toto carry a supply current and / or a ground current from at least some of the power semiconductor packages.

[0069] Example 14 is the method according to Example 13, wherein the electrical coupling of the busbar to the printed circuit board includes the use of pins and / or screws to electrically couple the busbar to vias of the printed circuit board.

[0070] Example 15 is the method according to Example 13 or 14, which further features: at least partial covering of the busbar with an insulating layer.

[0071] Example 16 is a method for manufacturing a power electronics system, wherein the method comprises: providing the semiconductor module according to one of Examples 1 to 9 and arranging a heat sink over the first side of the printed circuit board such that the power semiconductor packages and the busbar are covered by the heat sink.

[0072] Example 17 is the method according to Example 16, which further comprises: connecting the busbar to the heat sink with an adhesive material, such that the adhesive material electrically insulates the busbar from the heat sink.

[0073] Example 18 is the method according to Example 16 or 17, wherein the power semiconductor packages and the busbar are arranged in one or more trenches in the heat sink.

[0074] Example 19 is a device comprising means for carrying out the method according to one of Examples 13 to 18.

[0075] While the disclosure has been illustrated and described with respect to one or more implementations, changes and / or modifications may be made to the illustrated examples without departing from the spirit and scope of the accompanying claims. In particular, with regard to the various functions performed by the components or structures (arrangements, devices, circuits, systems, etc.) described above, the terms (including references to a "means") used to describe such components, unless otherwise specified, shall correspond to any component or structure that performs the stated function of the described component (e.g., that is functionally equivalent), even if it is not structurally equivalent to the disclosed structure that performs the function in the exemplary implementations of the disclosure presented herein.

Claims

[1] Semiconductor module (100, 200) comprising: a printed circuit board (110) having a first side (111) and an opposite second side (112), a plurality of power semiconductor packages (120) arranged above and electrically connected to the first side (111) of the printed circuit board (110), wherein a first side (121) of the power semiconductor packages (120) faces the first side (111) of the printed circuit board (110) and an opposing second side (122) is configured to be connected to a heat sink, at least one busbar (130) which is arranged above the first side (111) of the printed circuit board (110) and electrically connected to it, wherein the busbar (130) is configured to carry a supply current and / or a ground current from at least some of the power semiconductor packages (120), and Pins and / or screws (131) that electrically connect the busbar (130) to vias of the printed circuit board (110). [2] Semiconductor module (100) according to claim 1, wherein the busbar (130) is arranged laterally next to the power semiconductor housings (120). [3] Semiconductor module (200) according to claim 1, wherein the busbar (130) is arranged over the second side (122) of at least some of the power semiconductor housings (120) and is electrically coupled to it. [4] Semiconductor module (100, 200) according to one of the preceding claims, wherein a primary heat dissipation path of the power semiconductor housings (120) is arranged on the second side (122) of the power semiconductor housings (120). [5] Semiconductor module (100, 200) according to one of the preceding claims, wherein the printed circuit board (110) is free of an internal busbar. [6] Semiconductor module (100, 200) according to one of the preceding claims, wherein the busbar (130) is configured to be removable from the printed circuit board (110). [7] Semiconductor module (100, 200) according to one of the preceding claims, further comprising: Spacers (133) are arranged between the printed circuit board (110) and the busbar (130). [8] Semiconductor module (100, 200) according to one of the preceding claims, further comprising: an insulating layer that at least partially covers the busbar (130). [9] Power electronics system (500), comprising: the semiconductor module (100, 200) according to one of claims 1 to 8, and a heat sink (400) arranged above the first side (111) of the printed circuit board (110) such that the power semiconductor housings (120) and the busbar (130) are covered by the heat sink (400), the busbar (130) is thermally coupled to the heat sink (400). [10] Power electronics system (500) according to claim 9, further comprising: an adhesive material (501) that connects the busbar (130) to the heat sink (400), wherein the adhesive material (501) electrically insulates the busbar (130) from the heat sink (400). [11] Power electronics system (500) according to claim 9 or 10, wherein the power semiconductor housings (120) and the busbar (130) are arranged in one or more grooves (404, 405) in the heat sink (400). [12] Method (600) for manufacturing a semiconductor module, wherein the method (600) comprises: Providing (601) a printed circuit board (110) having a first side (111) and an opposite second side (112), Arranging (602) a plurality of power semiconductor packages (120) above the first side (111) of the printed circuit board (110), such that a first side (121) of the power semiconductor packages (120) faces the first side (111) of the printed circuit board (110), and electrically coupling the power semiconductor packages (120) to the printed circuit board (110), wherein a second side (122) of the power semiconductor packages (120), which faces the first side (121), is configured to be coupled to a heat sink, and Arranging (603) at least one busbar (130) over the first side (111) of the printed circuit board (110) and electrically coupling the busbar (130) to vias of the printed circuit board (110) using pins and / or screws (131), wherein the busbar (130) is configured to carry a supply current and / or a ground current from at least some of the power semiconductor packages (120). [13] Method (600) according to claim 12, further comprising: at least partially covering the busbar (130) with an insulating layer. [14] Method (700) for manufacturing a power electronics system, wherein the method comprises: Providing (701) the semiconductor module (100, 200) according to one of claims 1 to 8, and Arranging (702) a heat sink (400) over the first side of the printed circuit board (110) such that the power semiconductor housings (120) and the busbar (130) are covered by the heat sink (400). [15] Method (700) according to claim 14, further comprising: Connecting the busbar (130) to the heat sink (400) with an adhesive material (501) such that the adhesive material (501) electrically insulates the busbar (130) from the heat sink (400). [16] Method (700) according to claim 14 or 15, wherein the power semiconductor housings (120) and the busbar (130) are arranged in one or more grooves (404, 405) in the heat sink (400).

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